Patents by Inventor Wen Hsu

Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacture
    Patent number: 10483108
    Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: November 19, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jian-Jou Lian, Yao-Wen Hsu, Neng-Jye Yang, Li-Min Chen, Chia-Wei Wu, Kuan-Lin Chen, Kuo Bin Huang
  • Wide-angle linear LED lighting device
    Patent number: 10473279
    Abstract: A wide-angle linear LED lighting device includes a polygonal lampshade, a base and at least two LED modules. The polygonal lampshade includes at least two lateral parts and an installation part. The base is disposed within the polygonal lampshade and disposed on an inner surface of the installation part. There is an included angle between the base and the inner surface of the installation part. The at least two LED modules are disposed on the base. The light beams emitted by the at least two LED modules are outputted from different lateral parts of the polygonal lampshade. The light-outputting characteristics of the wide-angle linear LED lighting device are correlated with the included angle and the at least two LED modules.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: November 12, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Ting Chien, Chia-Wen Hsu
  • OPTICAL SYSTEM
    Publication number: 20190339477
    Abstract: An optical system includes a base, a first lens driving module, and a second lens driving module. The first lens driving module includes a first lens holder, a first magnet, and a first coil. The first lens holder is configured to hold a first optical element. The first coil corresponding to the first magnet is configured to drive the first lens holder to move relative to the base. The second lens driving module includes a second lens holder, a second magnet, and a second coil. The second lens holder is configured to hold a second optical element. The second coil corresponding to the second magnet is configured to drive the second lens holder to move relative to the base. The first magnet is disposed between the first and second lens holders, and no other magnet is disposed between the first and second lens holders except the first magnet.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Inventors: Fu-Yuan WU, Kuo-Chun KAO, Nai-Wen HSU, Shih-Ting HUANG, Shao-Chung CHANG, Sin-Jhong SONG
  • RECOMBINANT POLYPEPTIDES, COMPOSITIONS, AND METHODS THEREOF
    Publication number: 20190336645
    Abstract: The present disclosure provides recombinant polypeptides, homodimeric and heterodimeric proteins comprising the recombinant polypeptides, nucleic acid molecules encoding the recombinant polypeptides, and vectors and host cells comprising the nucleic acid molecules. The present disclosure also provides compositions comprising the recombinant polypeptides and methods of making and using the recombinant polypeptides.
    Type: Application
    Filed: December 29, 2017
    Publication date: November 7, 2019
    Applicants: BioGend Therapeutics Co., Ltd., Osteopharma Inc.
    Inventors: DA-WEI SUN, PEI-WEN HSU, CHIEN-PEI CHEN
  • Antenna structure and wireless communication device using same
    Patent number: 10461424
    Abstract: An antenna structure includes a metallic member and a first feed source. The metallic member includes a front frame, a backboard, and a side frame. The side frame is positioned between the front frame and the backboard. The first feed source is electrically connected to the front frame. The side frame includes at least a top portion, a first side portion, and a second side portion. The first side portion and the second side portion are respectively connected to two ends of the top portion. The side frame defines a slot and the slot is defined on the top portion. The front frame defines a gap. The gap communicates with the slot and extends across the front frame.
    Type: Grant
    Filed: June 18, 2017
    Date of Patent: October 29, 2019
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Cheng-Han Lee, Yi-Wen Hsu, Wei-Xuan Ye
  • OPTICAL MEMBER DRIVING MODULE
    Publication number: 20190324228
    Abstract: A moving mechanism for holding a lens is provided, including a carrier having an accommodating space, a coil, a sensing object, a base, at least one magnetic member, and a position detector, wherein the lens is disposed in the accommodating space. The coil and the sensing object are disposed on the carrier, and the coil surrounds the accommodating space. At least a portion of the coil is disposed between the sensing object and the accommodating space. The magnetic member and the position detector are disposed on the base, and the position detector is adjacent to the sensing object. When a current flows through the coil, the carrier moves relative to the base.
    Type: Application
    Filed: July 3, 2019
    Publication date: October 24, 2019
    Inventor: Nai-Wen HSU
  • Optical lens assembly, imaging lens module and electronic apparatus
    Patent number: 10444411
    Abstract: An optical lens assembly includes at least two lens elements and at least one light blocking sheet. Each of the lens elements includes a connecting structure for aligning the two lens elements. Each of the connecting structures includes a connecting surface and a circular conical surface, and a receiving space is formed between the two lens elements. A vertical distance between the receiving space and an optical axis is shorter than a vertical distance between each circular conical surface and the optical axis. The light blocking sheet is received in the receiving space and has a polygonal opening, and an outside diameter of the light blocking sheet is smaller than or equal to a minimum diameter of each circular conical surface.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: October 15, 2019
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chih-Wen Hsu, Ming-Ta Chou
  • Trench power semiconductor device and manufacturing method thereof
    Patent number: 10446658
    Abstract: A trench power semiconductor device and a manufacturing method thereof are provided. The trench power semiconductor device includes a substrate, an epitaxial layer disposed on the substrate, and a gate structure. The epitaxial layer has at least one trench formed therein, and the gate structure is disposed in the trench. A gate structure includes a lower doped region and an upper doped region disposed above the lower doped region to form a PN junction. The concentration of the impurity decreases along a direction from a peripheral portion of the upper doped region toward a central portion of the upper doped region.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: October 15, 2019
    Assignee: SUPER GROUP SEMICONDUCTOR CO., LTD.
    Inventor: Hsiu-Wen Hsu
  • Interaction force detection apparatus
    Patent number: 10436654
    Abstract: An interaction force detection apparatus includes a sensor, a driving element, a moving element, and a connecting element. The connecting element is connected to the driving element and the sensor. The driving element is adapted to interact with the moving element, so as to generate a pair of forces. The pair of forces includes a first force and a second force, and a magnitude of the first force is equal to that of the second force. The sensor detects the first force exerted on the driving element, and the second force is exerted on the moving element to generate a movement.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: October 8, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Chung-Yuan Su, Chih-Yuan Chen, Chao-Ta Huang, Yu-Wen Hsu
  • OPTICAL ELEMENT DRIVING MODULE
    Publication number: 20190285828
    Abstract: An optical element driving module is provided, including a housing, a movable portion configured to support an optical element, a driving assembly, a positioning sensor, and a non-metallic substrate disposed on a side of the movable portion. The movable portion is movable relative to the housing, the driving assembly is configured to drive movement of the movable portion relative to the housing, and the positioning sensor is configured to detect the movement of the movable portion relative to the housing. Specifically, the non-metallic substrate forms a recess for receiving the positioning sensor, wherein a depth of the recess is greater than a height of the positioning sensor.
    Type: Application
    Filed: June 6, 2019
    Publication date: September 19, 2019
    Inventors: Shang-Yu HSU, Nai-Wen HSU
  • ABSORPTION ENHANCEMENT STRUCTURE FOR IMAGE SENSOR
    Publication number: 20190288027
    Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a substrate and an image sensing element disposed within the substrate. The substrate has sidewalls defining a plurality of protrusions over the image sensing element. A first one of the plurality of protrusions including a first sidewall having a first segment. A line that extends along the first segment intersects a second sidewall of the first one of the plurality of protrusions that opposes the first sidewall.
    Type: Application
    Filed: May 23, 2019
    Publication date: September 19, 2019
    Inventors: Ching-Chung Su, Hung-Wen Hsu, Jiech-Fun Lu, Shih-Pei Chou
  • Optical system
    Patent number: 10416409
    Abstract: An optical system includes a base, a first lens driving module, and a second lens driving module. The first lens driving module includes a first lens holder, a first magnet, and a first coil. The first lens holder is configured to hold a first optical element. The first coil corresponding to the first magnet is configured to drive the first lens holder to move relative to the base. The second lens driving module includes a second lens holder, a second magnet, and a second coil. The second lens holder is configured to hold a second optical element. The second coil corresponding to the second magnet is configured to drive the second lens holder to move relative to the base. The first magnet is disposed between the first and second lens holders, and no other magnet is disposed between the first and second lens holders except the first magnet.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: September 17, 2019
    Assignee: TDK TAIWAN CORP.
    Inventors: Fu-Yuan Wu, Kuo-Chun Kao, Nai-Wen Hsu, Shih-Ting Huang, Shao-Chung Chang, Sin-Jhong Song
  • Semiconductor Device and Method
    Publication number: 20190279876
    Abstract: A method of manufacturing a semiconductor device includes exposing a material to a semi-aqueous etching solution. The semi-aqueous etching solution comprises a solvent which chelates with the material and acts as a catalyst between the etching driving force and the material. As such, the etching driving force may be used to remove the material.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 12, 2019
    Inventors: Yao-Wen Hsu, Jian-Jou Lian, Neng-Jye Yang, Chia-Wei Wu, Kuan-Lin Chen, Kuo Bin Huang, Li-Min Chen
  • Compensating for temperature induced differences in a computing device having dual-displays or a foldable display
    Patent number: 10403189
    Abstract: In some examples, a computing device includes a first display in a first housing and a second display in a second housing. The computing device may determine an angle between the first display device and the second display device, determine a first temperature map of the first housing based on the angle and first temperature data received from a first set of temperature sensors in the first housing, and determine a second temperature map of the second housing based on the angle and second temperature data received from a second set of temperature sensors in the second housing. The computing device may determine a temperature difference between the first display device and the second display device, determine a remedial action, and perform the remedial action to reduce the temperature, color, and/or color intensity difference between the first display device and the second display device.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: September 3, 2019
    Assignee: Dell Products L.P.
    Inventors: Deeder M. Aurongzeb, Joohyun Woo, Claire Hao Wen Hsu
  • Micro-electromechanical apparatus for thermal energy control
    Patent number: 10393718
    Abstract: A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: August 27, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Wen Hsu, Ying-Che Lo, Chao-Ta Huang, Li-Tao Teng
  • Method for forming a thin semiconductor-on-insulator (SOI) substrate
    Patent number: 10395974
    Abstract: Various embodiments of the present application are directed to a method for forming a thin semiconductor-on-insulator (SOI) substrate at low cost and with low total thickness variation (TTV). In some embodiments, an etch stop layer is epitaxially formed on a sacrificial substrate. A device layer is epitaxially formed on the etch stop layer and has a different crystalline lattice than the etch stop layer. The sacrificial substrate is bonded to a handle substrate, such that the device layer and the etch stop layer are between the sacrificial and handle substrates. The sacrificial substrate is removed. An etch is performed into the etch stop layer to remove the etch stop layer. The etch is performed using an etchant comprising hydrofluoric acid, hydrogen peroxide, and acetic acid.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: August 27, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Pei Chou, Hung-Wen Hsu, Jiech-Fun Lu, Yu-Hung Cheng, Yung-Lung Lin, Min-Ying Tsai
  • Manufacturing of semiconductor fin structure and manufacturing method of semiconductor device
    Patent number: 10388763
    Abstract: A semiconductor device includes a substrate, a fin structure protruding from the substrate, a gate insulating layer covering a channel region formed of the fin structure, a gate electrode layer covering the gate insulating layer, and isolation layers disposed on opposite sides of the fin structure. The fin structure includes a bottom portion, a neck portion, and a top portion sequentially disposed on the substrate. A width of the neck portion is less than a width of the bottom portion and a width of a portion of the top portion.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: August 20, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Wei Chang, Chiung Wen Hsu, Yu-Ting Weng
  • Moving mechanism
    Patent number: 10386597
    Abstract: A moving mechanism for holding a lens is provided, including a carrier having an accommodating space, a coil, a sensing object, a base, at least one magnetic member, and a position detector, wherein the lens is disposed in the accommodating space. The coil and the sensing object are disposed on the carrier, and the coil surrounds the accommodating space. At least a portion of the coil is disposed between the sensing object and the accommodating space. The magnetic member and the position detector are disposed on the base, and the position detector is adjacent to the sensing object. When a current flows through the coil, the carrier moves relative to the base.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: August 20, 2019
    Assignee: TDK TAIWAN CORP.
    Inventor: Nai-Wen Hsu
  • CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20190252325
    Abstract: A chip package structure including a first circuit structure, a chip, an electronic device, a first encapsulant, a second encapsulant, a plurality of through pillars, and an electromagnetic interference (EMI) shielding layer is provided. The chip has an active surface facing the first circuit structure. The electronic device has a connection surface facing the first circuit structure. The chip and the electronic device are disposed on opposite sides of the first circuit structure respectively. The first encapsulant encapsulates the chip. The second encapsulant encapsulates the electronic device. The through pillars penetrate the first encapsulant and are electrically connected to the first circuit structure. The EMI shielding layer covers the first encapsulant and the second encapsulant. The chip or the electronic device is grounded by the EMI shielding layer.
    Type: Application
    Filed: July 16, 2018
    Publication date: August 15, 2019
    Applicant: Powertech Technology Inc.
    Inventors: Yu-Wei Chen, Hsuan-Chih Chang, Yuan-Fu Lan, Hsien-Wen Hsu
  • EDGE-EXPOSURE TOOL WITH AN ULTRAVIOLET (UV) LIGHT EMITTING DIODE (LED)
    Publication number: 20190250513
    Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 15, 2019
    Inventors: Ying-Hao Wang, Chia-Chi Chung, Han-Chih Chung, Yu-Xiang Lin, Yu-Shine Lin, Yu-Hen Wu, Han Wen Hsu