Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A fan-out wafer level chip package structure and the manufacturing method thereof are provided. The method includes the steps of providing a supporting plate having a removable tape formed on the supporting plate, placing a plurality of chips on the removable tape, applying an adhesive layer on a back surface of each of the chips, providing a conductive cover for covering all chips and isolating the chips from each other by a plurality of partitions, injecting a molding compound into an inside of the conductive cover and curing the molding compound for forming an encapsulation, separating the encapsulation from the supporting plate, forming a connection layer on an active surface of each of the chips to establish electrical connections, and performing a cutting process to divide the encapsulation into a plurality of the package structures.

Abstract: A manufacturing method is applied to set a stackable chip package. The manufacturing method includes encapsulating a plurality of chips stacked with each other, disposing a lateral surface of the stacked chips having conductive elements onto a substrate, disassembling the substrate from the conductive elements when the stacked chips are encapsulated, and disposing a dielectric layer with openings on the stacked chips to align the openings with the conductive elements for ball mounting process.

Abstract: Compact camera modules that may be used in small form factor devices. The camera module may include a lens holder configured to receive one or more lens elements and a photosensor. In some embodiments, the lens holder may define a first recess for receiving the lens elements and a second recess for receiving one or more other components, such as the photosensor. In some embodiments, the photosensor may be configured to communicate with a flex circuit board without coupling the photosensor to a substrate to form a flip chip that communicates with the flex circuit board. The photosensor may be optically aligned with the lens elements and bonded to the lens holder such that the photosensor is fixed in an aligned position and at least partially enclosed by the lens holder.

Abstract: An optical lens assembly includes at least two lens elements and at least one light blocking sheet. Each of the lens elements includes a connecting structure for aligning the two lens elements. Each of the connecting structures includes a connecting surface and a circular conical surface, and a receiving space is formed between the two lens elements. A vertical distance between the receiving space and an optical axis is shorter than a vertical distance between each circular conical surface and the optical axis. The light blocking sheet is received in the receiving space and has a polygonal opening, and an outside diameter of the light blocking sheet is smaller than or equal to a minimum diameter of each circular conical surface.

Abstract: A lens driving module is provided which includes a movable portion, a base, a housing, a plastic substrate, and a 3D circuit. The base is adjacent to the movable portion, and the housing is connected to the base and surrounds the movable portion. The plastic substrate is disposed between the housing and the movable portion. At least a portion of the 3D circuit is disposed on the plastic substrate and is configured to transmit the signals or power for the operation of the lens driving module. The 3D circuit has an inner connecting portion and an outer connecting portion positioned on different planes and arranged to be parallel to each other.

Abstract: An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two substrates, such as wafers, dies, or a wafer and a die, are bonded together. A first mask is used to form a first opening extending partially to an interconnect formed on the first wafer. A dielectric liner is formed, and then another etch process is performed using the same mask. The etch process continues to expose interconnects formed on the first substrate and the second substrate. The opening is filled with a conductive material to form a conductive plug.

Abstract: A stacked package has plurality of chip packages stacked on active surfaces of each other, a dielectric layer, a redistribution layer and a plurality of external terminals. Each chip package has an exterior conductive element formed on the active surface. Each exterior conductive element has a cut edge exposed on at least one of the lateral side of the chip package. The dielectric layer, the redistribution layer and the external terminals are formed in sequence on the lateral side with the exposed cut edges to form the electrical connection between the cut edges, the redistribution layer and the external terminals. Therefore, the process for forming the electrical connections is simplified to enhance the reliability and the UPH for manufacturing the stacked package.

Abstract: A stacked package has plurality of chip packages stacked on a base. Each chip package has an exterior conductive element formed on the active surface. Each exterior conductive element has a cut edge exposed on a lateral side of the chip package. The lateral trace is formed through the encapsulant and electrically connects to the cut edges of the chip packages. The base has an interconnect structure to form the electrical connection between the lateral trace and the external terminals. Therefore, the process for forming the electrical connections is simplified to enhance the reliability and the UPH for manufacturing the stacked package.

Abstract: A stacked package has plurality of chip packages stacked on active surfaces of each other, a dielectric layer, a redistribution layer and a plurality of external terminals. Each chip package has an exterior conductive element formed on the active surface. Each exterior conductive element has a cut edge exposed on at least one of the lateral side of the chip package. The dielectric layer, the redistribution layer and the external terminals are formed in sequence on the lateral side with the exposed cut edges to form the electrical connection between the cut edges, the redistribution layer and the external terminals. Therefore, the process for forming the electrical connections is simplified to enhance the reliability and the UPH for manufacturing the stacked package.

Abstract: A crank apparatus includes a crank arm having at least one cavity on one of the surfaces of the crank arm, at least one thin material layer embedded within the at least one cavity and having an exposed outer surface, and at least one sensing element attached to the outer surface of the thin material layer. The crank arm is manufactured of a material with non-uniform strain characteristics, the thin material layer is manufactured of a material with uniform strain characteristics, the crank arm is adapted to be deformed by a force, the thin material layer is adapted to be deformed correspondingly with the deformation of the crank arm, the at least one sensing element is adapted to measure the corresponding strain of the thin material layer to measure the force applied on the crank arm. A bicycle and a stationary exercise bicycle equipped with the crank apparatus are further provided.

Abstract: A switch device includes a common terminal and a selection circuit. The selection circuit includes a primary switch, a first secondary switch, and a second secondary switch. The primary switch includes a plurality of primary transistors coupled in series and is coupled to the common terminal. The first secondary switch is coupled to the primary switch and a first transmission terminal. The first secondary switch includes a plurality of first secondary transistors coupled in series. The second secondary switch is coupled to the primary switch and a second transmission terminal. The second secondary switch includes a plurality of second secondary transistors coupled in series. The number of the first secondary transistors and the number of the second secondary transistors are both greater than or equal to the number of the primary transistors.

Abstract: An antenna structure includes a metal housing, a first feed source, a first ground portion, and a first switching circuit. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a first gap and a second gap. The metal housing is divided into at least a first portion by the slot, the first gap, and the second gap. The first feed source is electrically connected to the first portion for supplying current to the first portion. The first ground portion is electrically connected to the first portion for grounding the first portion. One end of the first switching circuit is electrically connected to the first portion. Another end of the first switching circuit is grounded.

Abstract: An apparatus with two anchors including a housing, a movable element, and a rotary element is provided. The housing includes a first expansion unit, a second expansion unit, and a linkage. First alignment structures are disposed in the movable element and anti-rotation structures are disposed in the linkage. When the movable element and the rotary element enter the housing from two ends and are coupled along an axis, the movable element and the rotary element can approach each other to expand the first expansion unit and the second expansion unit to fonn two anchors. The apparatus :with two anchors secures a sensor in a variety of environments such as walls or machines. When the apparatus with two anchors fixes a sensor in a hole of a stamping machine, the impact force does not cause stress concentration on the sensor so as to improve the reliability of the sensor.

Abstract: In some examples, a computing device includes a first display in a first housing and a second display in a second housing. The computing device may determine an angle between the first display device and the second display device, determine a first temperature map of the first housing based on the angle and first temperature data received from a first set of temperature sensors in the first housing, and determine a second temperature map of the second housing based on the angle and second temperature data received from a second set of temperature sensors in the second housing. The computing device may determine a temperature difference between the first display device and the second display device, determine a remedial action, and perform the remedial action to reduce the temperature, color, and/or color intensity difference between the first display device and the second display device.

Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.

Abstract: A pointer includes a casing, a first electromagnetic unit, a second electromagnetic unit, a first elastic member, and a pen point. The casing has an accommodation space and a port in communication with the accommodation space. The first electromagnetic unit includes a first magnet and a coil winding around the first magnet. The first magnet is fixedly disposed in the accommodation space. The second electromagnetic unit is movably disposed in the accommodation space along an axial direction, where the second electromagnetic unit includes a second magnet and a protection member wrapping the second magnet, and the second magnet is relatively away from or close to the first magnet. The elastic member is disposed in the casing and can provide an elastic force to the second electromagnetic unit along the axial direction. The pen point is movably disposed at the port and connected to the protection member.

Abstract: A speaker module includes a bracket, a plurality of first cushion members, a speaker and a plurality of second cushion members. The bracket includes a plurality of first pillars. Each of the first cushion members is disposed on one of the first pillars. The speaker is connected to the first cushion members. The second cushion members are connected to a periphery of the bracket.

Abstract: An electronically commutated motor driving module for driving a motor includes a voltage detector, an electronically commutated motor driver, a current detector, a voltage converter, and a controller. The voltage detector detects supply voltage to generate a voltage detection signal. The electronically commutated motor driver is supplied by the supply voltage to generate, according to an electronically commutated signal, an operating current for driving the motor. The current detector detects the operating current to generate a current detection signal. The voltage converter converts the supply voltage into an internal voltage. The controller is supplied by the internal voltage and generates the electronically commutated signal according to a plurality of control parameters. When the controller determines that a specific event has happened according to the control parameters, the controller stops generating the electronically commutated signal and then stores the control parameters.

Abstract: A semi-aqueous wet clean system and method for removing carbon-containing silicon material (e.g., plasma residue) or nitrogen-containing silicon material (e.g., plasma residue) includes a hydroxyl-terminated organic compound, a diol, and a fluoride ion donor material. The system is configured to protect silicon oxide and amorphous silicon during a post-dry-etch wet clean. The wet clean system is configured to selectively remove carbon-containing or nitrogen-containing plasma residue. pH of the wet clean system can be modified to tune selectivity for removal of carbon-containing or nitrogen-containing plasma residues. As a result, positive TEOS recession of less than about 3 nanometers may be achieved. Additionally, the wet clean system can be adapted for reclamation and subsequent reuse.