Patents by Inventor Wen Hsu

Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180284387
    Abstract: A driving mechanism is provided and configured to drive an optical element. The driving mechanism includes a holding unit, a base unit, an elastic element, a driving assembly, and a sensing assembly. The holding unit holds the optical element. The elastic element connects the holding unit to the base unit. The driving assembly drives the optical element to move relative to the base unit. The sensing assembly is disposed between the holding unit and the base unit for detecting the position of the holding unit relative to the base unit, wherein when observed in an optical axis direction of the optical element, the elastic element and the sensing assembly at least partially overlap.
    Type: Application
    Filed: March 26, 2018
    Publication date: October 4, 2018
    Inventors: Chien-Lun HUANG, Yu-Cheng LIN, Nai-Wen HSU
  • Publication number: 20180287478
    Abstract: An electromagnetic driving mechanism is provided, including a housing, a circuit unit, an electromagnetic driving assembly, and a sensing element. The circuit unit is connected to the housing, and has a plastic material and a circuit element. The plastic material is formed on and covers an outer surface of the circuit element by insert molding. The electromagnetic driving assembly is disposed in the housing for forcing an optical element to move relative to the circuit unit. The sensing element is disposed on the circuit unit, and electrically connected to the circuit element for detecting the displacement of the optical element relative to the circuit unit.
    Type: Application
    Filed: March 26, 2018
    Publication date: October 4, 2018
    Inventors: Kuo-Chun KAO, Nai-Wen HSU, Shih-Ting HUANG, Yi-Hsin NIEH, Meng-Ting LIN
  • Publication number: 20180286907
    Abstract: Structures and formation methods of an image sensor structure are provided. The image sensor structure is provided. The image sensor structure includes a substrate, a photodiode component in the substrate, and a grid structure over the substrate. The grid structure includes a bottom dielectric element over the substrate, a reflective element over the bottom dielectric element, and an upper dielectric element over the reflective element. The reflective element has a sidewall which is anti-corrosive in a basic condition and an acidic condition. The image sensor structure also includes a color filter element over the substrate and surrounded by the grid structure. The color filter element is aligned with the photodiode component.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Chung SU, Hung-Wen HSU, Wei-Chuang WU, Wei-Lin CHEN, Jiech-Fun LU
  • Publication number: 20180278203
    Abstract: The present disclosure relates to a modular solar power generation apparatus comprising a base plate, a light guiding unit, a plurality of connection units and a plurality of solar panels wherein: the light guiding unit is installed on the base plate; all connection units are circlewise mounted on the base plate and encircling the light guiding unit; each the solar panel, which is connected to one of the connection units, and the base plate form an angle of inclination by which each the solar panel features upward broadened widths such that any two neighboring solar panels allow their corresponding edges to be adjacent to each other and a gap in between to be narrowed for development of solar panels easily installed and maintained.
    Type: Application
    Filed: December 10, 2015
    Publication date: September 27, 2018
    Applicant: BEE SPACE CO., LTD.
    Inventors: Yi-Wen Hsu, Po-Chung Liu, Chan-Yu Kuo
  • Publication number: 20180276168
    Abstract: Example implementations relate to computing devices with movable input/output (I/O) connectors. For example, a computing device may include a chassis of the computing device and an I/O connector to connect an I/O device to the computing device. The I/O connector may be movable about an axis relative to the chassis by at least 180 degrees such that the I/O connector is accessible from multiple sides of the chassis.
    Type: Application
    Filed: December 11, 2015
    Publication date: September 27, 2018
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Shih Chuan HUANG, Yu Cheng WU, Chih Sheng LIAO, Hsin Wen HSU, Benjiman WHITE, William E. HERTLING, Mike WHITMARSH
  • Patent number: 10084056
    Abstract: A method of manufacturing a semiconductor structure is provided. An interlayer dielectric layer is formed conformally over protruding structures formed over a silicon substrate and a surface of the silicon substrate. Next, a vaporized chemical etching operation is performed to the interlayer dielectric layer, so as to form a gap between two adjacent protruding structures. The gap has a target aspect ratio of at least 4, a top portion of the interlayer dielectric layer above an upper portion of each of the at least two protruding structures is trimmed at a first etching rate, and a bottom portion of the interlayer dielectric layer above a base portion of each of the at least two protruding structures is etched at a second etching rate smaller than the first etching rate, for enlarging the deposition process window and preventing voids from remaining inside a gap filling material in the gap.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: September 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Wen Hsu, Hung-Ling Shih, Jiech-Fun Lu
  • Publication number: 20180269299
    Abstract: A method of manufacturing a semiconductor structure is provided. An interlayer dielectric layer is formed conformally over protruding structures formed over a silicon substrate and a surface of the silicon substrate. Next, a vaporized chemical etching operation is performed to the interlayer dielectric layer, so as to form a gap between two adjacent protruding structures. The gap has a target aspect ratio of at least 4, a top portion of the interlayer dielectric layer above an upper portion of each of the at least two protruding structures is trimmed at a first etching rate, and a bottom portion of the interlayer dielectric layer above a base portion of each of the at least two protruding structures is etched at a second etching rate smaller than the first etching rate, for enlarging the deposition process window and preventing voids from remaining inside a gap filling material in the gap.
    Type: Application
    Filed: March 20, 2017
    Publication date: September 20, 2018
    Inventors: Hung-Wen Hsu, Hung-Ling Shih, Jiech-Fun Lu
  • Patent number: 10070279
    Abstract: Network apparatuses and a message providing method are provided. A network apparatus includes a processor, network interface, and display screen. The processor executes a message transmission application. The network interface transceives at least one message of the message transmission application. The display screen displays a window of the message transmission application. The window includes at least one icon and the at least one message. The processor determines that a selected icon of the at least one icon corresponds to a selected message of the at least one message. The processor derives at least one keyword by analyzing the selected message according to a semantic analysis rule corresponding to the selected icon. The processor derives at least one recommended message by searching a database according to the at least one keyword. The display screen displays the at least one recommended message.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: September 4, 2018
    Assignee: Institute For Information Industry
    Inventors: Yu-Hao Chen, Bo-Jiun Hsu, Ya-Wen Hsu
  • Publication number: 20180246260
    Abstract: A light blocking sheet having a central axis includes a central hole and a plurality of inner extended portions. The central axis passes through the central hole, which is enclosed by a hole inner surface. The hole inner surface has a first corresponding circle and a second corresponding circle, wherein a diameter of the first corresponding circle is greater than a diameter of the second corresponding circle. The inner extended portions are adjacent to and surround the central hole, wherein each of the inner extended portions is extended and tapered from the first corresponding circle towards the second corresponding circle and includes an inner surface, and the inner surface includes a line pair. The line pair includes two line sections, wherein one end of one line section thereof and one end of the other line section thereof are towards the second corresponding circle and approach to each other.
    Type: Application
    Filed: June 28, 2017
    Publication date: August 30, 2018
    Inventors: Ming-Ta CHOU, Ming-Shun CHANG, Chih-Wen HSU
  • Patent number: 10054721
    Abstract: An optical lens assembly includes at least two lens elements and at least one light blocking sheet. Each of the lens elements includes a connecting structure for aligning the two lens elements. Each of the connecting structures includes a connecting surface and a circular conical surface, and a receiving space is formed between the two lens elements. A vertical distance between the receiving space and an optical axis is shorter than a vertical distance between each circular conical surface and the optical axis. The light blocking sheet is received in the receiving space and has a polygonal opening, and an outside diameter of the light blocking sheet is smaller than or equal to a minimum diameter of each circular conical surface.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: August 21, 2018
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chih-Wen Hsu, Ming-Ta Chou
  • Publication number: 20180226449
    Abstract: An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two substrates, such as wafers, dies, or a wafer and a die, are bonded together. A first mask is used to form a first opening extending partially to an interconnect formed on the first wafer. A dielectric liner is formed, and then another etch process is performed using the same mask. The etch process continues to expose interconnects formed on the first substrate and the second substrate. The opening is filled with a conductive material to form a conductive plug.
    Type: Application
    Filed: April 3, 2018
    Publication date: August 9, 2018
    Inventors: Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin, Shu-Ting Tsai, Jiech-Fun Lu, Shih-Chang Liu, Yeur-Luen Tu, Chia-Shiung Tsai
  • Publication number: 20180209598
    Abstract: A wide-angle linear LED lighting device includes a polygonal lampshade, a base and at least two LED modules. The polygonal lampshade includes at least two lateral parts and an installation part. The base is disposed within the polygonal lampshade and disposed on an inner surface of the installation part. There is an included angle between the base and the inner surface of the installation part. The at least two LED modules are disposed on the base. The light beams emitted by the at least two LED modules are outputted from different lateral parts of the polygonal lampshade. The light-outputting characteristics of the wide-angle linear LED lighting device are correlated with the included angle and the at least two LED modules.
    Type: Application
    Filed: January 25, 2017
    Publication date: July 26, 2018
    Inventors: Wei-Ting Chien, Chia-Wen Hsu
  • Publication number: 20180196171
    Abstract: An optical lens assembly includes at least two lens elements and at least one light blocking sheet. Each of the lens elements includes a connecting structure for aligning the two lens elements. Each of the connecting structures includes a connecting surface and a circular conical surface, and a receiving space is formed between the two lens elements. A vertical distance between the receiving space and an optical axis is shorter than a vertical distance between each circular conical surface and the optical axis. The light blocking sheet is received in the receiving space and has a polygonal opening, and an outside diameter of the light blocking sheet is smaller than or equal to a minimum diameter of each circular conical surface.
    Type: Application
    Filed: May 11, 2017
    Publication date: July 12, 2018
    Inventors: Chih-Wen Hsu, Ming-Ta Chou
  • Publication number: 20180199458
    Abstract: An electronic device including a display module, a circuit module and a housing is provided. The housing accommodates the display module and the circuit module and includes a transparent cover, a multi-layer stacked structure and a tinted layer. At least a part of the transparent cover presents a curve. The multi-layer stacked structure is disposed on an inner surface of the transparent cover and has a plurality of optical layers stacked in sequence. The tinted layer is disposed on the multi-layer stacked structure. Through the disposition of the multi-layer stacked structure, the housing has variable visual effects.
    Type: Application
    Filed: January 5, 2018
    Publication date: July 12, 2018
    Applicant: HTC Corporation
    Inventors: Tzu-Wen Hsu, Yu-Hsuan Chiu
  • Publication number: 20180197903
    Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.
    Type: Application
    Filed: February 26, 2018
    Publication date: July 12, 2018
    Inventors: Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng
  • Publication number: 20180196217
    Abstract: A lens driving module is provided which includes a movable portion, a base, a housing, a plastic substrate, and a 3D circuit. The base is adjacent to the movable portion, and the housing is connected to the base and surrounds the movable portion. The plastic substrate is disposed between the housing and the movable portion. At least a portion of the 3D circuit is disposed on the plastic substrate and is configured to transmit the signals or power for the operation of the lens driving module. The 3D circuit has an inner connecting portion and an outer connecting portion positioned on different planes and arranged to be parallel to each other.
    Type: Application
    Filed: November 7, 2017
    Publication date: July 12, 2018
    Inventors: Shang-Yu HSU, Nai-Wen HSU
  • Publication number: 20180196218
    Abstract: An electromagnetic driving mechanism is provided for driving two different optical lenses, including a base, a first holder, a frame, a resilient element, a first electromagnetic driving assembly, a second holder, and a second electromagnetic driving assembly. The first and second holders are provided for holding the optical lenses. The frame is affixed to the base, has magnetically permeable material, and surrounds the first holder. The resilient element connects the first holder with the frame. The first electromagnetic driving assembly is disposed between the first holder and the frame to drive the first holder moving relative to the base. The second electromagnetic driving assembly is disposed on an outer side of the second holder to drive the second holder moving relative to the base.
    Type: Application
    Filed: November 7, 2017
    Publication date: July 12, 2018
    Inventors: Kuo-Chun KAO, Nai-Wen HSU, Sin-Jhong SONG
  • Patent number: 10020562
    Abstract: An antenna structure includes a metal housing, a first feed source, and a first switching circuit. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a first gap and a second gap. The metal housing is divided into at least a first branch and a second branch by the slot, the first gap, and the second gap. The first feed source is electrically connected to the first branch. One end of the first switching circuit is electrically connected to the first branch. Another end of the first switching circuit is grounded.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: July 10, 2018
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Cheng-Han Lee, Yi-Wen Hsu, Wei-Xuan Ye
  • Publication number: 20180188220
    Abstract: A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 5, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Wen Hsu, Ying-Che Lo, Chao-Ta Huang, Li-Tao Teng
  • Publication number: 20180186624
    Abstract: A MEMS apparatus includes a substrate, a cover disposed on the substrate, a movable mass disposed on the substrate, and an impact absorber disposed on the cover. The impact absorber includes a restraint, a stationary stopper disposed on a lower surface of the cover, a movable stopper, elastic elements connecting the restraint and the movable stopper, a supporting element connecting the restraint and the stationary stopper, and a space disposed between the stationary stopper and the movable stopper. The impact absorber is adapted to prevent the movable mass from impacting the cover. In addition, the supporting element may be made of an electrical insulation material to reduce electrostatic interaction between the movable mass and the movable stopper.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 5, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Wen Hsu, Chin-Fu Kuo, Chao-Ta Huang