Patents by Inventor Wen Hsu

Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of ultra-thin semiconductor device package assembly
    Patent number: 9881897
    Abstract: A manufacturing method of ultra-thin semiconductor device package structure is provided. Firstly, a wafer including a plurality of semiconductor devices is provided, and one of the semiconductor devices has an active surface having an active region and an outer region and a back surface. A first electrode and a second electrode are arranged in the active region, and the outer region has a cutting portion and a channel portion. Subsequently, a trench is formed in the channel portion, and filled with a conductive structure. The wafer is fixed on a supporting board, and then a thinning process and a deposition process of a back electrode layer are performed on the back surface in sequence. Thereafter, the supporting board is removed and a plurality of contacting pads is formed. A cutting process is performed along the cutting portion.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: January 30, 2018
    Assignees: NIKO SEMICONDUCTOR CO., LTD., SUPER GROUP SEMICONDUCTOR CO., LTD.
    Inventors: Chih-Cheng Hsieh, Hsiu-Wen Hsu
  • ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE USING SAME
    Publication number: 20180026360
    Abstract: An antenna structure includes a metallic member, a first radiator, and an isolating portion. The metallic member includes a front frame, a backboard, and a side frame. The side frame includes at least a top portion, a first side portion, and a second side portion. The isolating portion is electrically connected to the first radiator. The side frame defines a slot and the slot is defined on the top portion. The front frame defines a gap. The gap communicates with the slot and extends across the front frame. The first portion of the front frame from a first side of the gap to a first end of the slot forms a short portion. The first radiator is positioned adjacent to the short portion and the isolation portion improves isolation between the short portion and the first radiator.
    Type: Application
    Filed: June 18, 2017
    Publication date: January 25, 2018
    Inventors: CHENG-HAN LEE, YI-WEN HSU, WEI-XUAN YE
  • ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE USING SAME
    Publication number: 20180026347
    Abstract: An antenna structure includes a metal housing, a switching circuit, and a first feed source. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a groove. A first portion of the front frame positioned at a first side of the groove forms a first branch. A second portion of the front frame extending from a second side of the groove to one end of the slot forms a second branch. The first feed source is electrically connected to the first branch and the second branch, and the first branch is grounded through the switching circuit.
    Type: Application
    Filed: July 17, 2017
    Publication date: January 25, 2018
    Inventors: CHENG-HAN LEE, YI-WEN HSU, WEI-XUAN YE
  • ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE USING SAME
    Publication number: 20180026346
    Abstract: An antenna structure includes a metal housing, a first feed source, and a first radiator. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a gap. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The radiator is positioned in the housing and includes a first radiating portion and a second radiating portion. One end of the first radiating portion is electrically connected to the first feed source and another end of the first radiating portion is spaced apart from the long portion. One end of the second radiating portion is electrically connected to the first feed source and another end of the second radiating portion is spaced apart from the short portion.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 25, 2018
    Inventors: CHENG-HAN LEE, YI-WEN HSU, WEI-XUAN YE
  • ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE USING SAME
    Publication number: 20180026370
    Abstract: An antenna structure includes a metallic member and a first feed source. The metallic member includes a front frame, a backboard, and a side frame. The side frame is positioned between the front frame and the backboard. The first feed source is electrically connected to the front frame. The side frame includes at least a top portion, a first side portion, and a second side portion. The first side portion and the second side portion are respectively connected to two ends of the top portion. The side frame defines a slot and the slot is defined on the top portion. The front frame defines a gap. The gap communicates with the slot and extends across the front frame.
    Type: Application
    Filed: June 18, 2017
    Publication date: January 25, 2018
    Inventors: CHENG-HAN LEE, YI-WEN HSU, WEI-XUAN YE
  • ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE USING SAME
    Publication number: 20180026343
    Abstract: An antenna structure includes a metal housing, a first feed source, and a second feed source. The metal housing includes a front frame, a backboard, and a side frame. The side frame is positioned between the front frame and the backboard. The side frame defines a slot and the front frame defines a gap. The gap communicates with the slot and extends across the front frame. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first feed source is electrically connected to the long portion and the second feed source is electrically connected to the short portion.
    Type: Application
    Filed: July 11, 2017
    Publication date: January 25, 2018
    Inventors: CHENG-HAN LEE, YI-WEN HSU, WEI-XUAN YE
  • ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE USING SAME
    Publication number: 20180026348
    Abstract: An antenna structure includes a metal housing, a first feed source, a first ground portion, and a first switching circuit. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a first gap and a second gap. The metal housing is divided into at least a first portion by the slot, the first gap, and the second gap. The first feed source is electrically connected to the first portion for supplying current to the first portion. The first ground portion is electrically connected to the first portion for grounding the first portion. One end of the first switching circuit is electrically connected to the first portion. Another end of the first switching circuit is grounded.
    Type: Application
    Filed: July 17, 2017
    Publication date: January 25, 2018
    Inventors: CHENG-HAN LEE, YI-WEN HSU, WEI-XUAN YE
  • ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE USING SAME
    Publication number: 20180026349
    Abstract: An antenna structure includes a metal housing, a first feed source, and a first switching circuit. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a first gap and a second gap. The metal housing is divided into at least a first branch and a second branch by the slot, the first gap, and the second gap. The first feed source is electrically connected to the first branch. One end of the first switching circuit is electrically connected to the first branch. Another end of the first switching circuit is grounded.
    Type: Application
    Filed: July 17, 2017
    Publication date: January 25, 2018
    Inventors: CHENG-HAN LEE, YI-WEN HSU, WEI-XUAN YE
  • ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE USING SAME
    Publication number: 20180026345
    Abstract: An antenna structure includes a metal housing, a first feed source, and a first radiator. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a gap. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first radiator is positioned in the housing and includes a first radiating portion and a second radiating portion. One end of the first radiating portion is electrically connected to the first feed source and another end of the first radiating portion is spaced apart from the long portion. One end of the second radiating portion is electrically connected to the first feed source and another end of the second radiating portion is electrically connected to the short portion.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 25, 2018
    Inventors: CHENG-HAN LEE, YI-WEN HSU, WEI-XUAN YE
  • ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE USING SAME
    Publication number: 20180026344
    Abstract: An antenna structure includes a metal housing, a first radiator, and an isolating portion. The metal housing includes a front frame, a backboard, and a side frame. The side frame is positioned between the front frame and the backboard. The side frame defines a slot and the front frame defines a gap. The gap communicates with the slot and extends across the front frame. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first radiator is positioned adjacent to the short portion. The isolating portion is connected to the first radiator to improve isolation between the short portion and the first radiator.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 25, 2018
    Inventors: CHENG-HAN LEE, YI-WEN HSU, WEI-XUAN YE
  • Active circuit capable of preventing impedance from being mismatched in a bypass mode
    Patent number: 9876485
    Abstract: An active circuit includes an active element, an input unit, and a bypass unit. The active element is coupled to an output terminal of the active circuit for outputting an output signal. The input unit is coupled to an input terminal of the active circuit, and is coupled to an input terminal of the active element through a node. The input unit adjusts a capacitance value of the input unit according to a first control signal. The bypass unit is coupled to an output terminal of the input unit through the node, and is coupled to the output terminal of the active circuit. The bypass unit turns on or off a signal bypassing path according to a second control signal.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: January 23, 2018
    Assignee: RichWave Technology Corp.
    Inventors: Chih-Sheng Chen, Ching-Wen Hsu, Chien-Yu Li
  • Trench power transistor structure and manufacturing method thereof
    Patent number: 9876106
    Abstract: A trench power transistor and a manufacturing method thereof are provided. The trench power transistor includes a substrate, an epitaxial layer, a trench gate structure, a body region, and a source region. The epitaxial layer disposed on the substrate has a trench formed therein. The trench gate structure disposed in the trench includes a bottom dielectric structure, a gate dielectric layer, and a gate. The bottom dielectric structure formed in a lower portion of the trench includes an insulating layer formed along a first inner wall of the lower portion of the trench defining a groove, and a non-conductive structure formed in the groove. The gate dielectric layer is formed along a second inner wall of an upper portion of the trench, and the gate is formed in the trench and connects the gate dielectric layer. The body region and the source region are formed in the epitaxial layer.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: January 23, 2018
    Assignee: SUPER GROUP SEMICONDUCTOR CO., LTD.
    Inventor: Hsiu-Wen Hsu
  • System and method for adjusting seat height of chair
    Patent number: 9867465
    Abstract: In a seat height adjustment method for a chair, a body height of a user of an electronic device is acquired from the electronic device which is in communication with the chair. The method further computes a target seat height suitable for the user according to the user's body height and a preset formula. The lifting device can automatically adjust the seat height for a user when the user has leave the chair and further returning the seat of the chair to an original height.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: January 16, 2018
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hsin-Wen Hsu, Yi-Chien Tsai, Hsiao-Ping Chiu
  • Manufacturing method of trench power MOSFET
    Patent number: 9837508
    Abstract: A manufacturing method of a trench power MOSFET is provided. In the manufacturing method, the trench gate structure of the trench power MOSFET is formed in the epitaxial layer and includes an upper doped region, a lower doped region and a middle region interposed therebetween. The upper doped region has a conductive type reverse to that of the lower doped region, and the middle region is an intrinsic or lightly-doped region to form a PIN, P+/N? or N+/P? junction. As such, when the trench power MOSFET is in operation, a junction capacitance formed at the PIN, P+/N? or N+/P? junction is in series with the parasitic capacitance. Accordingly, the gate-to-drain effective capacitance may be reduced.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: December 5, 2017
    Assignee: SUPER GROUP SEMICONDUCTOR CO., LTD.
    Inventor: Hsiu-Wen Hsu
  • FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE
    Publication number: 20170338154
    Abstract: A fan-out wafer level chip package structure and the manufacturing method thereof are provided. The method includes the steps of providing a supporting plate having a removable tape formed on the supporting plate, placing a plurality of chips on the removable tape, applying an adhesive layer on a back surface of each of the chips, providing a conductive cover for covering all chips and isolating the chips from each other by a plurality of partitions, injecting a molding compound into an inside of the conductive cover and curing the molding compound for forming an encapsulation, separating the encapsulation from the supporting plate, forming a connection layer on an active surface of each of the chips to establish electrical connections, and performing a cutting process to divide the encapsulation into a plurality of the package structures.
    Type: Application
    Filed: August 10, 2017
    Publication date: November 23, 2017
    Inventors: CHIH-CHENG HSIEH, HSIU-WEN HSU
  • SUPER-JUNCTION SEMICONDUCTOR DEVICE
    Publication number: 20170309705
    Abstract: A super junction semiconductor device is provided. The super-junction semiconductor device includes a substrate, a drift layer disposed on the substrate, an insulating layer, a lightly-doped region, and a main loop-shaped field plate. The drift layer includes a plurality of n- and p-type doped regions alternately arranged in parallel to form a super-junction structure, and defines a cell region and a termination region surrounding the cell region. The lightly-doped region is formed in the drift layer and connected to a surface of the drift layer. The lightly-doped region has a first end portion closer to the cell region and a second end portion farther away from the cell region. The insulating layer disposed on the drift layer covers the termination region. The main loop-shaped field plate is disposed on the insulating layer and covers the second end portion.
    Type: Application
    Filed: February 1, 2017
    Publication date: October 26, 2017
    Inventors: SUNG-NIEN TANG, HO-TAI CHEN, HSIU-WEN HSU
  • Fan-out wafer level chip package structure and manufacturing method thereof
    Patent number: 9799563
    Abstract: A fan-out wafer level chip package structure and the manufacturing method thereof are provided. The method includes the steps of providing a supporting plate having a removable tape formed on the supporting plate, placing a plurality of chips on the removable tape, applying an adhesive layer on a back surface of each of the chips, providing a conductive cover for covering all chips and isolating the chips from each other by a plurality of partitions, injecting a molding compound into an inside of the conductive cover and curing the molding compound for forming an encapsulation, separating the encapsulation from the supporting plate, forming a connection layer on an active surface of each of the chips to establish electrical connections, and performing a cutting process to divide the encapsulation into a plurality of the package structures.
    Type: Grant
    Filed: July 3, 2015
    Date of Patent: October 24, 2017
    Assignees: NIKO SEMICONDUCTOR CO., LTD., SUPER GROUP SEMICONDUCTOR CO., LTD.
    Inventors: Chih-Cheng Hsieh, Hsiu-Wen Hsu
  • METHOD FOR ENHANCED STAND-ALONE GLOBAL NAVIGATION SATELLITE SYSTEM (GNSS) PERFORMANCE
    Publication number: 20170299724
    Abstract: The disclosure relates to enhancing performance at a device that implements a stand-alone global navigation satellite system (GNSS) receiver. In particular, a GNSS-enabled mobile device may obtain positioning data from one or more non-satellite sources and determine satellite signal quality in a surrounding environment. As such, in response to determining that the environment surrounding the GNSS-enabled mobile device is a weak satellite signal environment, the GNSS-enabled mobile device may trigger a process to provide the positioning data obtained from the one or more non-satellite sources to the device that implements the stand-alone GNSS receiver such that performance at the device that implements the stand-alone GNSS receiver may be enhanced in poor satellite signal environments.
    Type: Application
    Filed: April 14, 2016
    Publication date: October 19, 2017
    Inventors: Sheng-Wen HSU, Jeremy Robin Christopher O'DONOGHUE
  • MONITOR CIRCUIT AND MONITORING METHOD
    Publication number: 20170276512
    Abstract: The invention provides a monitor circuit, which is used for a fan and receives a driving current and a driving voltage of the fan. The monitor circuit includes sensing circuits and a microcontroller. The sensing circuits respectively sense statuses of the fan and output sensing values. The microcontroller is used for monitoring whether the sensing values exceed preset value ranges respectively to obtain comparison results. The microcontroller outputs warning signals according to the comparison results. Each of the warning signals has a specific frequency.
    Type: Application
    Filed: June 30, 2016
    Publication date: September 28, 2017
    Inventors: Yueh-Lung HUANG, Jung-Yuan CHEN, Ching-Sen HSIEH, Yu-Cheng LIN, Nai-Wen HSU
  • BSI Image Sensor and Method of Forming Same
    Publication number: 20170278881
    Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.
    Type: Application
    Filed: March 24, 2016
    Publication date: September 28, 2017
    Inventors: Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng