Abstract: A semiconductor device includes a substrate, a fin structure protruding from the substrate, a gate insulating layer covering a channel region formed of the fin structure, a gate electrode layer covering the gate insulating layer, and isolation layers disposed on opposite sides of the fin structure. The fin structure includes a bottom portion, a neck portion, and a top portion sequentially disposed on the substrate. A width of the neck portion is less than a width of the bottom portion and a width of a portion of the top portion.

Abstract: A light blocking sheet includes a first outer layer, a second outer layer, an inner substrate layer and a central axis. The first outer layer includes a first opening. The second outer layer includes a second opening. The inner substrate layer is disposed between the first outer layer and the second outer layer. The inner substrate layer connects the first outer layer to the second outer layer, and the inner substrate layer includes a substrate opening. The central axis is coaxial with the first opening, the second opening and the substrate opening.

Abstract: An electrode structure of an LED includes an adhesion layer and a bond pad layer. The adhesion layer is stacked on the LED. The bond pad layer is stacked on the adhesion layer. The bond pad layer includes at least two first metal layers, at least two second metal layers and an outermost gold layer sequentially and alternately stacked. The first metal layers are selected from the group consisting Al and an Al alloy, and the second metal layers are selected from the group consisting of Ti, Ni, Cr, Pt, Pd, TiN, TiW, W, Rh and Cu. Thus, the main structure of the bond pad layer is a stacked structure of the first metal layers and the second metal layers. The first metal layers may be selected from a low-cost material, and the second metal layers improve issues of inadequate hardness and electromigration of the first metal layers.

Abstract: An image sensor structure is provided. The image sensor device structure includes a substrate, and the substrate includes an array region and a peripheral region. The image sensor device structure includes an anti-reflection layer formed on the substrate and a buffer layer formed on the anti-reflection layer. The image sensor device structure includes a first etch stop layer formed on the buffer layer and a metal grid structure formed on the first etch stop layer. The image sensor device structure also includes a dielectric layer formed on the metal grid structure.

Abstract: A light blocking sheet includes a first outer layer, a second outer layer, an inner substrate layer and a central axis. The first outer layer includes a first opening. The second outer layer includes a second opening. The inner substrate layer is disposed between the first outer layer and the second outer layer. The inner substrate layer connects the first outer layer to the second outer layer, and the inner substrate layer includes a substrate opening. The central axis is coaxial with the first opening, the second opening and the substrate opening.

Abstract: An image processing method includes detecting one or more edge regions in a plurality of input image frames; detecting movement of the edge region in the input image frames to generate a movement detecting result; and generating a plurality of output image frames by selectively smoothing at least a portion of the edge region at least according to the movement detecting result.

Abstract: A manufacturing method of a package-on package structure including at least the following steps is provided. A die is bonded on a first circuit carrier. A spacer is disposed on the die. The spacer and the first circuit carrier are connected through a plurality of conductive wires. An encapsulant is formed to encapsulate the die, the spacer and the conductive wires. A thickness of the encapsulant is reduced until at least a portion of each of the conductive wires is removed to form a first package structure. A second package structure is stacked on the first package structure. The second package structure is electrically connected to the conductive wires.

Abstract: A chip package structure and the manufacturing method thereof are provided. Firstly, a conductive frame including a bottom plate and a plurality of partition plates is provided. The bottom plate has a supporting surface and a bottom surface opposite thereto, and the partition plates protrude from the supporting surface to define a plurality of the accommodating regions. Subsequently, a plurality of chips is provided, and each of the chips is correspondingly accommodated in each of the accommodating regions with a back surface facing to the supporting surface. Thereafter, the conductive frame is cut to form a plurality of separated chip package structures.

Abstract: An optical system includes a base, a first lens driving module, and a second lens driving module. The first lens driving module includes a first lens holder, a first magnet, and a first coil. The first lens holder is configured to hold a first optical element. The first coil corresponding to the first magnet is configured to drive the first lens holder to move relative to the base. The second lens driving module includes a second lens holder, a second magnet, and a second coil. The second lens holder is configured to hold a second optical element. The second coil corresponding to the second magnet is configured to drive the second lens holder to move relative to the base. The first magnet is disposed between the first and second lens holders, and no other magnet is disposed between the first and second lens holders except the first magnet.

Abstract: The disclosure provides an optical driving mechanism, including a frame body, a holding member, a plate coil and a magnet. The holding member is movably disposed in the frame body and configured to hold an optical element. The plate coil is disposed on the holding member. The magnet is disposed on the frame body and corresponds to the plate coil. The plate coil acts with the magnet to generate an electromagnetic force to drive the holding member and the optical element to move along an optical axis of the optical element relative to the frame body.

Abstract: A multiple lenses driving mechanism is provided, including a frame, a first lens holder, a second lens holder, a first lens driving assembly, a second lens driving assembly and a stopper. The first and second lens holders are disposed in the frame, arranged along a longitudinal axis for respectively holding a first lens and a second lens. The first lens and the second lens define a first optical axis and a second optical axis, respectively. The first and second lens driving assemblies are disposed in the frame to drive the first lens holder and the second lens holder, respectively. The stopper is disposed between the first and second lens holders and has a first restricting surface and a second restricting surface, facing the first and second lens holders, so as to restrict the first and second lens holders in a first restricted position and a second restricted position.

Abstract: An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two substrates, such as wafers, dies, or a wafer and a die, are bonded together. A first mask is used to form a first opening extending partially to an interconnect formed on the first wafer. A dielectric liner is formed, and then another etch process is performed using the same mask. The etch process continues to expose interconnects formed on the first substrate and the second substrate. The opening is filled with a conductive material to form a conductive plug.

Abstract: An electrode structure of an LED includes an adhesion layer and a bond pad layer. The adhesion layer is stacked on the LED. The bond pad layer is stacked on the adhesion layer. The bond pad layer includes at least two first metal layers, at least two second metal layers and an outermost gold layer sequentially and alternately stacked. The first metal layers are selected from the group consisting Al and an Al alloy, and the second metal layers are selected from the group consisting of Ti, Ni, Cr, Pt, Pd, TiN, TiW, W, Rh and Cu. Thus, the main structure of the bond pad layer is a stacked structure of the first metal layers and the second metal layers. The first metal layers may be selected from a low-cost material, and the second metal layers improve issues of inadequate hardness and electromigration of the first metal layers.

Abstract: A trench power semiconductor device and a manufacturing method thereof are provided. The trench power semiconductor device includes a substrate, an epitaxial layer disposed on the substrate, and a gate structure. The epitaxial layer has at least one trench formed therein, and the gate structure is disposed in the trench. A gate structure includes a lower doped region and an upper doped region disposed above the lower doped region to form a PN junction. The concentration of the impurity decreases along a direction from a peripheral portion of the upper doped region toward a central portion of the upper doped region.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A timed glue gun includes a glue pushing unit including a trigger, a glue pushing member and a heating member for melting the hot melt glue stick, and a control unit including a timing member and an alarm member. The trigger is at a released position, and is operable to be pressed to a triggered position. The timing member starts to count upwards from zero when the heating member starts to heat up, and controls the alarm member to emit a first alarm signal when counting to a first elapsed time. The alarm member emits a second alarm signal when the timing member counts to a second elapsed time longer than the first elapsed time in response to continuous location of the trigger at the released position for the second elapsed time during heating of the heating member.

Abstract: A camera module includes a lens barrel holder and a substrate. The substrate may include a circuit board embedded in the substrate. The circuit board may include multiple electrical components mounted to a first side of the circuit board, where the electrical components are not exposed outside. The circuit board may also include multiple electrical connections on another side of the circuit board, an image sensor mounted to the electrical connections, and an upper opening in the circuit board for light to pass through. The substrate may include an upper opening configured to receive, at least partially inside the substrate, a lower portion of the lens barrel holder. The substrate may include a lower opening connected to the upper opening and configured to receive the image sensor. The lens barrel holder may include extensions, such as a flange or tabs, and an adhesive bond between the extensions and the substrate.

Abstract: A resistance device applied to relative rotations between a flywheel and an axis includes an inner stator, an outer rotor, a conductive wire and a magneto-rheological fluid. The inner stator is fixedly joined with the axis and includes an accommodating space surrounding the axis at a position away from the axis. The outer rotor, fixedly joined with the flywheel, encloses and rotates relative to the inner stator. An accommodating gap is formed between the outer rotor and the inner stator at a position away from the axis. The conducting line is winded in the accommodating space, and generates a magnetic line passing the accommodating gap when applied by an electric current. The magneto-rheological fluid is filled in the accommodating gap. Thus, the outer rotor is disposed at the outer most to increase the braking torque, and the magneto-rheological fluid is away from the axis to increasing the braking moment.

Abstract: Network apparatuses and a message providing method are provided. A network apparatus includes a processor, network interface, and display screen. The processor executes a message transmission application. The network interface transceives at least one message of the message transmission application. The display screen displays a window of the message transmission application. The window includes at least one icon and the at least one message. The processor determines that a selected icon of the at least one icon corresponds to a selected message of the at least one message. The processor derives at least one keyword by analyzing the selected message according to a semantic analysis rule corresponding to the selected icon. The processor derives at least one recommended message by searching a database according to the at least one keyword. The display screen displays the at least one recommended message.

Abstract: A moving mechanism for holding a lens is provided, including a carrier having an accommodating space, a coil, a sensing object, a base, at least one magnetic member, and a position detector, wherein the lens is disposed in the accommodating space. The coil and the sensing object are disposed on the carrier, and the coil surrounds the accommodating space. At least a portion of the coil is disposed between the sensing object and the accommodating space. The magnetic member and the position detector are disposed on the base, and the position detector is adjacent to the sensing object. When a current flows through the coil, the carrier moves relative to the base.