Abstract: A MEMS apparatus includes a substrate, a cover disposed on the substrate, a movable mass disposed on the substrate, and an impact absorber disposed on the cover. The impact absorber includes a restraint, a stationary stopper disposed on a lower surface of the cover, a movable stopper, elastic elements connecting the restraint and the movable stopper, a supporting element connecting the restraint and the stationary stopper, and a space disposed between the stationary stopper and the movable stopper. The impact absorber is adapted to prevent the movable mass from impacting the cover. In addition, the supporting element may be made of an electrical insulation material to reduce electrostatic interaction between the movable mass and the movable stopper.

Abstract: A MEMS apparatus having measuring range selector including a sensor and an IC chip is provided. The sensor includes a sensing device. The IC chip includes a voltage range selector, an analog front end, a control device and an A/D converter. The sensing device is configured to detect the physical quantity and generate a sensing voltage. The voltage range selector is configured to select a sub-voltage range having a first upper-bound and a first lower-bound. The analog front end is configured to receive the sensing voltage and output a first voltage. The A/D converter has a full scale voltage range having a second lower-bound and a second upper-bound. A ratio of the full scale voltage range to the sub-voltage range is defined as a gain factor. A difference obtained by subtracting the first lower-bound from the first voltage is defined as a shift factor. The control device is configured to adjust the first voltage to the second voltage according to the gain factor and the shift factor.

Abstract: A manufacturing method of a chip package structure is provided. Firstly, a conductive frame including a bottom plate and a plurality of partition plates is provided. The bottom plate has a supporting surface and a bottom surface opposite thereto, and the partition plates protrude from the supporting surface to define a plurality of the accommodating regions. Subsequently, a plurality of chips is provided, and each of the chips is correspondingly accommodated in each of the accommodating regions with a back surface facing to the supporting surface. Thereafter, the conductive frame is cut to form a plurality of separated chip package structures.

Abstract: An interaction force detection apparatus includes a sensor, a driving element, a moving element, and a connecting element. The connecting element is connected to the driving element and the sensor. The driving element is adapted to interact with the moving element, so as to generate a pair of forces. The pair of forces includes a first force and a second force, and a magnitude of the first force is equal to that of the second force. The sensor detects the first force exerted on the driving element, and the second force is exerted on the moving element to generate a movement.

Abstract: A MEMS apparatus includes a substrate, a cover disposed on the substrate, a movable mass disposed on the substrate, and an impact absorber disposed on the cover. The impact absorber includes a restraint, a stationary stopper disposed on a lower surface of the cover, a movable stopper, elastic elements connecting the restraint and the movable stopper, a supporting element connecting the restraint and the stationary stopper, and a space disposed between the stationary stopper and the movable stopper. The impact absorber is adapted to prevent the movable mass from impacting the cover. In addition, the supporting element may be made of an electrical insulation material to reduce electrostatic interaction between the movable mass and the movable stopper.

Abstract: A super junction semiconductor device is provided. The super-junction semiconductor device includes a substrate, a drift layer disposed on the substrate, an insulating layer, a lightly-doped region, and a main loop-shaped field plate. The drift layer includes a plurality of n- and p-type doped regions alternately arranged in parallel to form a super-junction structure, and defines a cell region and a termination region surrounding the cell region. The lightly-doped region is formed in the drift layer and connected to a surface of the drift layer. The lightly-doped region has a first end portion closer to the cell region and a second end portion farther away from the cell region. The insulating layer disposed on the drift layer covers the termination region. The main loop-shaped field plate is disposed on the insulating layer and covers the second end portion.

Abstract: A retractable safety syringe includes a retractable needle hub holding a needle and having a first guiding means; and a hollow barrel having a second guiding means set correspondingly to the first guiding means; and a collapsible plunger comprising of a first plunger element having a protrusion releasably coupled with a second plunger element having a longitudinal slot with a pinched zone to curb the movement of said protrusion; and a spring disposed between the needle hub and hollow barrel and acts between the needle hub and the hollow barrel. The uncoupling of the collapsible plunger triggers the retraction mechanism to enable the needle hub to retract into the barrel by the decompression force of a spring. The reliability of retraction is further improved by a longitudinal slot and a protrusion to facilitate the retreating of the collapsible plunger in an orderly way.

Abstract: The invention provides a monitor circuit, which is used for a fan and receives a driving current and a driving voltage of the fan. The monitor circuit includes sensing circuits and a microcontroller. The sensing circuits respectively sense statuses of the fan and output sensing values. The microcontroller is used for monitoring whether the sensing values exceed preset value ranges respectively to obtain comparison results. The microcontroller outputs warning signals according to the comparison results. Each of the warning signals has a specific frequency.

Abstract: A semiconductor device includes a substrate, a fin structure protruding from the substrate, a gate insulating layer covering a channel region formed of the fin structure, a gate electrode layer covering the gate insulating layer, and isolation layers disposed on opposite sides of the fin structure. The fin structure includes a bottom portion, a neck portion, and a top portion sequentially disposed on the substrate. A width of the neck portion is less than a width of the bottom portion and a width of a portion of the top portion.

Abstract: The disclosure discloses an electromagnetic driving module which includes a base, two magnetic elements, a wiring assembly, a reference element, and a sensor element. The two magnetic elements are arranged along a reference line and positioned at two sides of the base. The wiring assembly is connected to the base and arranged adjacent to the two magnetic elements. The reference element is positioned on the base. The sensor element is adjacent to the reference elements and configured to detect the movement of the reference element to position the base. A lens device using the electromagnetic driving module is also disclosed.

Abstract: An electrode structure of an LED includes an adhesion layer and a bond pad layer. The adhesion layer is stacked on the LED. The bond pad layer is stacked on the adhesion layer. The bond pad layer includes at least two first metal layers, at least two second metal layers and an outermost gold layer sequentially and alternately stacked. The first metal layers are selected from the group consisting Al and an Al alloy, and the second metal layers are selected from the group consisting of Ti, Ni, Cr, Pt, Pd, TiN, TiW, W, Rh and Cu. Thus, the main structure of the bond pad layer is a stacked structure of the first metal layers and the second metal layers. The first metal layers may be selected from a low-cost material, and the second metal layers improve issues of inadequate hardness and electromigration of the first metal layers.

Abstract: A light blocking sheet includes a first outer layer, a second outer layer, an inner substrate layer and a central axis. The first outer layer includes a first opening. The second outer layer includes a second opening. The inner substrate layer is disposed between the first outer layer and the second outer layer. The inner substrate layer connects the first outer layer to the second outer layer, and the inner substrate layer includes a substrate opening. The central axis is coaxial with the first opening, the second opening and the substrate opening.

Abstract: An image sensor structure is provided. The image sensor device structure includes a substrate, and the substrate includes an array region and a peripheral region. The image sensor device structure includes an anti-reflection layer formed on the substrate and a buffer layer formed on the anti-reflection layer. The image sensor device structure includes a first etch stop layer formed on the buffer layer and a metal grid structure formed on the first etch stop layer. The image sensor device structure also includes a dielectric layer formed on the metal grid structure.

Abstract: A light blocking sheet includes a first outer layer, a second outer layer, an inner substrate layer and a central axis. The first outer layer includes a first opening. The second outer layer includes a second opening. The inner substrate layer is disposed between the first outer layer and the second outer layer. The inner substrate layer connects the first outer layer to the second outer layer, and the inner substrate layer includes a substrate opening. The central axis is coaxial with the first opening, the second opening and the substrate opening.

Abstract: An image processing method includes detecting one or more edge regions in a plurality of input image frames; detecting movement of the edge region in the input image frames to generate a movement detecting result; and generating a plurality of output image frames by selectively smoothing at least a portion of the edge region at least according to the movement detecting result.

Abstract: A manufacturing method of a package-on package structure including at least the following steps is provided. A die is bonded on a first circuit carrier. A spacer is disposed on the die. The spacer and the first circuit carrier are connected through a plurality of conductive wires. An encapsulant is formed to encapsulate the die, the spacer and the conductive wires. A thickness of the encapsulant is reduced until at least a portion of each of the conductive wires is removed to form a first package structure. A second package structure is stacked on the first package structure. The second package structure is electrically connected to the conductive wires.

Abstract: A chip package structure and the manufacturing method thereof are provided. Firstly, a conductive frame including a bottom plate and a plurality of partition plates is provided. The bottom plate has a supporting surface and a bottom surface opposite thereto, and the partition plates protrude from the supporting surface to define a plurality of the accommodating regions. Subsequently, a plurality of chips is provided, and each of the chips is correspondingly accommodated in each of the accommodating regions with a back surface facing to the supporting surface. Thereafter, the conductive frame is cut to form a plurality of separated chip package structures.

Abstract: The disclosure provides an optical driving mechanism, including a frame body, a holding member, a plate coil and a magnet. The holding member is movably disposed in the frame body and configured to hold an optical element. The plate coil is disposed on the holding member. The magnet is disposed on the frame body and corresponds to the plate coil. The plate coil acts with the magnet to generate an electromagnetic force to drive the holding member and the optical element to move along an optical axis of the optical element relative to the frame body.

Abstract: A multiple lenses driving mechanism is provided, including a frame, a first lens holder, a second lens holder, a first lens driving assembly, a second lens driving assembly and a stopper. The first and second lens holders are disposed in the frame, arranged along a longitudinal axis for respectively holding a first lens and a second lens. The first lens and the second lens define a first optical axis and a second optical axis, respectively. The first and second lens driving assemblies are disposed in the frame to drive the first lens holder and the second lens holder, respectively. The stopper is disposed between the first and second lens holders and has a first restricting surface and a second restricting surface, facing the first and second lens holders, so as to restrict the first and second lens holders in a first restricted position and a second restricted position.

Abstract: An optical system includes a base, a first lens driving module, and a second lens driving module. The first lens driving module includes a first lens holder, a first magnet, and a first coil. The first lens holder is configured to hold a first optical element. The first coil corresponding to the first magnet is configured to drive the first lens holder to move relative to the base. The second lens driving module includes a second lens holder, a second magnet, and a second coil. The second lens holder is configured to hold a second optical element. The second coil corresponding to the second magnet is configured to drive the second lens holder to move relative to the base. The first magnet is disposed between the first and second lens holders, and no other magnet is disposed between the first and second lens holders except the first magnet.