Abstract: A trench power transistor and a manufacturing method thereof are provided. The trench power transistor includes a substrate, an epitaxial layer, a trench gate structure, a body region, and a source region. The epitaxial layer disposed on the substrate has a trench formed therein. The trench gate structure disposed in the trench includes a bottom dielectric structure, a gate dielectric layer, and a gate. The bottom dielectric structure formed in a lower portion of the trench includes an insulating layer formed along a first inner wall of the lower portion of the trench defining a groove, and a non-conductive structure formed in the groove. The gate dielectric layer is formed along a second inner wall of an upper portion of the trench, and the gate is formed in the trench and connects the gate dielectric layer. The body region and the source region are formed in the epitaxial layer.

Abstract: In a seat height adjustment method for a chair, a body height of a user of an electronic device is acquired from the electronic device which is in communication with the chair. The method further computes a target seat height suitable for the user according to the user's body height and a preset formula. The lifting device can automatically adjust the seat height for a user when the user has leave the chair and further returning the seat of the chair to an original height.

Abstract: A manufacturing method of a trench power MOSFET is provided. In the manufacturing method, the trench gate structure of the trench power MOSFET is formed in the epitaxial layer and includes an upper doped region, a lower doped region and a middle region interposed therebetween. The upper doped region has a conductive type reverse to that of the lower doped region, and the middle region is an intrinsic or lightly-doped region to form a PIN, P+/N? or N+/P? junction. As such, when the trench power MOSFET is in operation, a junction capacitance formed at the PIN, P+/N? or N+/P? junction is in series with the parasitic capacitance. Accordingly, the gate-to-drain effective capacitance may be reduced.

Abstract: A fan-out wafer level chip package structure and the manufacturing method thereof are provided. The method includes the steps of providing a supporting plate having a removable tape formed on the supporting plate, placing a plurality of chips on the removable tape, applying an adhesive layer on a back surface of each of the chips, providing a conductive cover for covering all chips and isolating the chips from each other by a plurality of partitions, injecting a molding compound into an inside of the conductive cover and curing the molding compound for forming an encapsulation, separating the encapsulation from the supporting plate, forming a connection layer on an active surface of each of the chips to establish electrical connections, and performing a cutting process to divide the encapsulation into a plurality of the package structures.

Abstract: A super junction semiconductor device is provided. The super-junction semiconductor device includes a substrate, a drift layer disposed on the substrate, an insulating layer, a lightly-doped region, and a main loop-shaped field plate. The drift layer includes a plurality of n- and p-type doped regions alternately arranged in parallel to form a super-junction structure, and defines a cell region and a termination region surrounding the cell region. The lightly-doped region is formed in the drift layer and connected to a surface of the drift layer. The lightly-doped region has a first end portion closer to the cell region and a second end portion farther away from the cell region. The insulating layer disposed on the drift layer covers the termination region. The main loop-shaped field plate is disposed on the insulating layer and covers the second end portion.

Abstract: A fan-out wafer level chip package structure and the manufacturing method thereof are provided. The method includes the steps of providing a supporting plate having a removable tape formed on the supporting plate, placing a plurality of chips on the removable tape, applying an adhesive layer on a back surface of each of the chips, providing a conductive cover for covering all chips and isolating the chips from each other by a plurality of partitions, injecting a molding compound into an inside of the conductive cover and curing the molding compound for forming an encapsulation, separating the encapsulation from the supporting plate, forming a connection layer on an active surface of each of the chips to establish electrical connections, and performing a cutting process to divide the encapsulation into a plurality of the package structures.

Abstract: The disclosure relates to enhancing performance at a device that implements a stand-alone global navigation satellite system (GNSS) receiver. In particular, a GNSS-enabled mobile device may obtain positioning data from one or more non-satellite sources and determine satellite signal quality in a surrounding environment. As such, in response to determining that the environment surrounding the GNSS-enabled mobile device is a weak satellite signal environment, the GNSS-enabled mobile device may trigger a process to provide the positioning data obtained from the one or more non-satellite sources to the device that implements the stand-alone GNSS receiver such that performance at the device that implements the stand-alone GNSS receiver may be enhanced in poor satellite signal environments.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: The invention provides a monitor circuit, which is used for a fan and receives a driving current and a driving voltage of the fan. The monitor circuit includes sensing circuits and a microcontroller. The sensing circuits respectively sense statuses of the fan and output sensing values. The microcontroller is used for monitoring whether the sensing values exceed preset value ranges respectively to obtain comparison results. The microcontroller outputs warning signals according to the comparison results. Each of the warning signals has a specific frequency.

Abstract: An active circuit includes an active element, an input unit, and a bypass unit. The active element is coupled to an output terminal of the active circuit for outputting an output signal. The input unit is coupled to an input terminal of the active circuit, and is coupled to an input terminal of the active element through a node. The input unit adjusts a capacitance value of the input unit according to a first control signal. The bypass unit is coupled to an output terminal of the input unit through the node, and is coupled to the output terminal of the active circuit. The bypass unit turns on or off a signal bypassing path according to a second control signal.

Abstract: An imaging optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with negative refractive power has an image-side surface being concave. The second lens element has an object-side surface being concave and an image-side surface being convex. The third lens element has an object-side surface being concave and an image-side surface being convex. The fourth lens element with positive refractive power has an image-side surface being convex. The fifth lens element with negative refractive power has an object-side surface being concave.

Abstract: The invention provides a MEMS device. The MEMS device includes: a substrate; a proof mass, including at least two slots, each of the slots including an inner space and an opening, the inner space being relatively closer to a center area of the proof mass than the opening; at least two anchors located in the corresponding slots and connected to the substrate; at least two linkages located in the corresponding slots and connected to the corresponding anchors; and a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors. The multi-dimensional spring structure includes first and second springs for assisting an out-of-plane movement and an in-plane movement of the proof mass.

Abstract: The present disclosure provides a method for generating a parameter pattern including: performing a plurality of measurements upon a plurality of regions on a surface of a workpiece to obtain a plurality of measured results; and deriving a parameter pattern according to the plurality of measured results by a computer; wherein the parameter pattern includes a plurality of regional parameter values corresponding to each of the plurality of regions on the surface of the workpiece. The present disclosure provides a Feed Forward semiconductor manufacturing method including: forming a layer with a desired pattern on a surface of a workpiece; deriving a control signal including a parameter pattern according to spatial dimension measurements against the layer with the desired pattern distributed over a plurality of regions of the surface of the workpiece; and performing an ion implantation on the surface of the workpiece according to the control signal.

Abstract: A micro-electromechanical (MEMS) apparatus includes a substrate, two first anchors, a frame, and two elastic members. The substrate is provided with a reference point thereon. The frame surrounds the two first anchors, and each of the elastic members connects the corresponding first anchor and the frame. Each of the first anchors is disposed near the center of the MEMS apparatus to decrease an effect caused by warpage of the substrate. The MEMS apparatus can be applied to an MEMS sensor having a rotatable mass, such as a three-axis accelerometer or a magnetometer, to improve process yield, reliability, and measurement accuracy.

Abstract: A micro-electromechanical temperature control system including a micro-electromechanical apparatus is provided. The micro-electromechanical apparatus includes a heater and a thermal reservoir. A specific heat capacity of the thermal reservoir is greater than a specific heat capacity of the heater, so that a heating time and a heating frequency of the heater are reduced to save electrical power consumption. The micro-electromechanical temperature control system is adapted for a micro-electromechanical sensor that is required to be controlled at an operating temperature, such as a gas sensor.

Abstract: An imaging optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with negative refractive power has an image-side surface being concave. The second lens element has an object-side surface being concave and an image-side surface being convex. The third lens element has an object-side surface being concave and an image-side surface being convex. The fourth lens element with positive refractive power has an image-side surface being convex. The fifth lens element with negative refractive power has an object-side surface being concave.

Abstract: A carrier substrate includes an insulation encapsulation, first conductive patterns, second conductive patterns, at least one first dummy pattern, and at least one second dummy pattern. The carrier substrate has a first layout region and a second layout region. The first conductive patterns and the first dummy pattern are located in the first layout region. The second conductive patterns and the second dummy pattern are located in the second layout region. The first and second conductive patterns and the first and second dummy patterns are embedded in the insulation encapsulation. The insulation encapsulation exposes top surfaces of the first and second conductive patterns and the first and second dummy patterns. The first dummy pattern and the second dummy pattern are insulated from the first conductive patterns and the second conductive patterns. An edge profile of the first dummy pattern facing the second dummy pattern is non-linear.

Abstract: The present invention provides a composition for regulating blood sugar. The composition comprises at least one yellow pigment extracted from a red mold product, wherein the said yellow pigment is Monascin, Ankaflavin, or combination of Monascin and Ankaflavin. Moreover, results of a variety of animal experiments have proved that this blood sugar regulating composition indeed possess the functionalities of: lowering Hyperglycemia induced by high energy diet, alleviating ROS and inflammatory caused by the Hyperglycemia, reduce AST and ALT value of liver as well as sarcosine value of kidney.

Abstract: A timed glue gun includes a glue pushing unit including a trigger, a glue pushing member and a heating member for melting the hot melt glue stick ,and a control unit including a timing member and an alarm member. The trigger is at a released position, and is operable to be pressed to a triggered position. The timing member starts to count upwards from zero when the heating member starts to heat up, and controls the alarm member to emit a first alarm signal when counting to a first elapsed time. The alarm member emits a second alarm signal when the timing member counts to a second elapsed time longer than the first elapsed time in response to continuous location of the trigger at the released position for the second elapsed time during heating of the heating member.

Abstract: An electromagnetically actuated bicycle trainer includes a base, a support assembly disposed on the base, and a hysteresis resistance generating module. The support assembly includes a support arm, and a fastening member disposed on the support arm and for securing an axle of a pedaling wheel. The hysteresis resistance generating module includes an inner magnetic stationary member and an outer magnetic stationary member, a semi-hard magnetic rotating member between the inner magnetic stationary member and the outer magnetic stationary member, and a conductive coil. The conductive coil receives an electric power and senses opposite magnetisms that the inner magnetic stationary member and the outer magnetic stationary member generate. Thus, the semi-hard magnetic rotating member is caused to generate a hysteresis resistance when rotated in response to hysteresis effects.