Abstract: A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

Abstract: An electrical bed is provided. The electrical bed includes a frame, a plurality of bed plates, a first connector and a first driving unit. The frame includes a plurality of bed stands, and the bed plates are arranged on the bed stands. The first connector includes a first rotating member, a first connecting arm, a first transmission bar and a second connecting arm. The first rotating member is pivotally connected with the first connecting arm, and the first connecting arm is sleeved with the first transmission bar and fixed relative to each other, and the second connecting arm is sleeved with the first transmission bar and fixed relative to each other. The first driving unit is arranged to drive the first transmission bar to rotate and adjust one of the bed plates.

Abstract: The disclosure provides an image uniformity compensation device. The image uniformity compensation device includes a local pre-compensation circuit, a chromaticity uniformity compensation circuit, a local post-compensation circuit, and a luminance uniformity correction circuit. A local pre-conversion performed by the local pre-compensation circuit includes the following. An image frame is divided into multiple regions, and each of the regions is converted from an optical non-linear domain to an optical linear domain to generate a corresponding region in multiple regions of a converted frame. A local post-conversion performed by the local post-compensation circuit includes the following. An image frame is divided into multiple regions, and each of the regions is converted from the optical linear domain to the optical non-linear domain to generate a corresponding region in multiple regions of a converted frame.

Abstract: The present invention provides a method of generating dummy patterns and calibration kits, including steps of generating devices-under-test (DUTs) using a point of said chip window layer as reference point in a unit cell, generating calibration kits corresponding to the DUTs using the point as reference point in corresponding unit cells, generating DUT dummy patterns for each DUTs individually in the unit cell, copying the DUT dummy patterns in the unit cell to the corresponding calibration kits in the corresponding unit cells using the point as reference point, and merging all of the unit cell and corresponding unit cells into a final chip layout.

Abstract: A package structure and a method for manufacturing a package structure are provided. The package structure includes a substrate, at least one redistribution structure, at least one electronic component and at least one semiconductor die. The substrate has a first surface and a second surface opposite to the first surface. The at least one redistribution structure is disposed on the first surface of the substrate. The at least one electronic component is disposed on the first surface of the substrate. The at least one semiconductor die is disposed on the at least one redistribution structure and electrically connected to the at least one electronic component through the substrate.

Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.

Abstract: A semiconductor device includes a stack of semiconductor layers vertically arranged above a semiconductor base structure, a gate dielectric layer having portions each surrounding one of the semiconductor layers, and a gate electrode surrounding the gate dielectric layer. Each portion of the gate dielectric layer has a top section above the respective semiconductor layer and a bottom section below the semiconductor layer. The top section has a top thickness along a vertical direction perpendicular to a top surface of the semiconductor base structure; and the bottom section has a bottom thickness along the vertical direction. The top thickness is greater than the bottom thickness.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; and removing the sacrificial layer.

Abstract: A camera module includes a plastic carrier, an imaging lens assembly, a reflective element and a plurality of auto-focusing elements. The plastic carrier includes an inner portion and an outer portion, wherein an inner space is defined by the inner portion, and the outer portion includes at least one mounting structure. The imaging lens assembly is disposed in the inner space of the plastic carrier. The reflective element is for folding an image light by a reflective surface of the reflective element into the imaging lens assembly. The auto-focusing elements include at least two magnets and at least one wiring element, wherein the auto-focusing elements are for moving the plastic carrier along a second optical axis of the imaging lens assembly, and the magnets or the wiring element can be disposed on the mounting structure of the outer portion.

Abstract: A lens assembly module includes a base, a cover, a lens unit, an elastic element, at least two conductive elements, at least one AF coil element and at least two first magnetic elements. The cover is coupled to the base. The lens unit is movably disposed in the cover. The elastic element is coupled to the lens unit. The conductive elements are coupled to the lens unit. The AF coil element is disposed on the lens unit, and two ends of the AF coil element are electrically connected to the conductive elements, respectively. The first magnetic elements are disposed in the cover. A part of each of the extending structures is overlapped along a direction parallel to an optical axis and electrically connected to each conductive element. The AF coil element and the conductive elements are electrically connected by a welding method.

Abstract: The disclosure provides a light cabinet, including multiple light boards and multiple light-board controllers. The light boards form a first light-board array of the light cabinet. The light-board controllers are arranged one-to-one on the light boards. The light-board controllers of the light boards in a first column of the first light-board array are connected in series to form a first controller string. The output terminal of the first controller string is connected electrically to an input terminal of a second controller string in a corresponding column of a second light-board array of another light cabinet. The input terminal of the first controller string is connected electrically to a first output terminal of a video data splitter (or an output terminal of a third controller string in a corresponding column of a third light-board array of yet another light cabinet).

Abstract: A camera module includes a metal yoke, a holder, a plastic barrel, a plurality of plastic lens elements and a plurality of metal conducting elements. The holder is connected to the metal yoke for forming an inner space. The plastic barrel is movably disposed in the inner space and includes at least one buffering part. The plastic lens elements are disposed in the plastic barrel. The metal conducting elements are at least one leaf spring and a wire element, wherein the metal conducting elements are connected to the plastic barrel. Before the at least one buffering part contacts a contacting part of the at least one leaf spring, there is a gap distance between the at least one buffering part and the contacting part of the at least one leaf spring.

Abstract: An imaging lens driving module includes a lens carrier, a frame element, a driving mechanism and a metal conductive element. The lens carrier is disposed in the frame element. The driving mechanism includes a metal elastic element, a coil and a magnet assembly. The metal elastic element includes an outer fixing part coupled to the frame element, an inner fixing part coupled to the lens carrier, and an elastic part. The coil is fixed to the lens carrier and disposed corresponding to the magnet assembly. The metal conductive element is coupled to the lens carrier. The metal elastic element further includes an electrically connecting part and a compensating elastic part. The metal conductive element has a corresponsive surface corresponding to and electrically connected to the electrically connecting part. The compensating elastic part is connected to the electrically connecting part and the inner fixing part.

Abstract: A semiconductor substrate structure and a method of manufacturing a semiconductor substrate structure are provided. The semiconductor substrate structure includes a substrate, an electronic device, and a filling material. The substrate defines a cavity. The electronic device is disposed in the cavity and spaced apart from the substrate by a gap. The filling material is disposed in the gap and covers a first region of an upper surface of the electronic device.

Abstract: A lens driving module includes a holder, a cover, a carrier, at least one first magnet, a first coil, at least two second magnets, at least one first sensor and at least one second sensor. The holder includes an opening hole. The cover is made of metal material and coupled to the holder. The carrier is movably disposed in the cover and for coupling to a lens. The first magnet is movably disposed in the cover. The first coil is wound around an outer side of the carrier. The second magnets are disposed on one end of the carrier. The first sensor is for detecting a magnetic field of the second magnets. The second sensor is for detecting a magnetic field of the first magnet.

Abstract: A torsion sensor, including a casing assembly, a sleeve set, a driven slider, a driving slider, an elastic member, a magnetic sensor, and a magnetic member is provided. The sleeve set includes a first sleeve, a second sleeve, and a third sleeve. The first sleeve is disposed in the casing assembly. The second sleeve has a neck portion sleeved on the second side of the first sleeve. The third sleeve is disposed between the first and the second sleeves. The driven slider is connected to a head portion of the second sleeve. The driving slider surrounds an outer side of the driven slider. The elastic member surrounds an outer side of the second sleeve. One of the magnetic sensor and the magnetic member is disposed in the casing assembly, and the other one is disposed in the sleeve set. The magnetic sensor and the magnetic member are disposed opposite to each other.

Abstract: A camera driving module includes: a base including a central opening; a casing disposed on the base and including an opening hole corresponding to the central opening; a lens unit movably disposed on the casing; and a focus driving part. The focus driving part includes a carrier, an AF coil element, at least two permanent magnets and a Hall element. The carrier is disposed on the lens unit and movable in a direction parallel to an optical axis. The AF coil element is fixed to the base and faces toward the carrier. The permanent magnets are fixed on one side of the carrier facing toward the base and disposed opposite to each other about the optical axis. The Hall element faces toward a corresponding surface of one of the permanent magnets. The AF coil element and the corresponding surfaces are arranged in the direction parallel to the optical axis.

Abstract: A system and a method for compensating uniformity of brightness are provided. The system includes an edge-type backlight assembly, a display panel, a brightness sensor, a compensating calculator, and a local dimming controller. The display panel is disposed above the edge-type backlight assembly. The display panel includes plural regions for local dimming. The brightness sensor is configured to measure whether the brightness distribution of the display panel is uniform. When the brightness distribution of the display panel is not uniform, the compensating calculator calculates a brightness compensation value corresponding to each of the regions of the display panel. The local dimming controller is configured to drive the edge-type backlight assembly according to the brightness compensation value corresponding to each of the regions of the display panel.