Abstract: Sidelink communications may be used for positioning between devices. The sidelink based communications may be between equipment (“UE”) and/or with other network nodes, such as a basestation. The sidelink positioning information may be used for location determination. This may include vehicle to everything (V2X) communications via a PC5 interface. The sidelink positioning information is communicated via the PC5 interface and includes location, capability, assistance data, and measurement reports.

Abstract: A memory cell includes a write port and a read port. The write port includes two cross-coupled inverters that form a storage unit. The cross-coupled inverters are connected between a first power source signal line and a second power source signal line. The write port also includes a first local interconnect line in an interconnect layer that is connected to the second power source signal line. The read port includes a transistor that is connected to the storage unit in the write port and to the second power source signal line, and a second local interconnect line in the interconnect layer that is connected to the second power source signal line. The second local interconnect line in the read port is separate from the first local interconnect line in the write port.

Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, a heat dissipation element and conductive balls. The insulating encapsulant is encapsulating the semiconductor die, and has a first surface and a second surface opposite to the first surface. The first redistribution layer is located on the first surface of the insulating encapsulant and includes at least one feed line and one ground plate. The second redistribution layer is located on the second surface of the insulating encapsulant and electrically connected to the semiconductor die and the first redistribution layer. The heat dissipation element is disposed on the first redistribution layer and includes a conductive base and antenna patterns, wherein the antenna patterns is electrically connected to the feed line and is electrically coupled to the ground plate of the first redistribution layer.

Abstract: A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.

Abstract: A computer-implemented method for providing a user with a digital companion in a three-dimensional (3D) environment is provided. The computer-implemented method includes recognizing content of the 3D environment, obtaining a point-of-view (POV) of the user in the 3D environment, displaying the digital companion to the user in the 3D environment based on the content and the POV, moving the digital companion through the 3D environment with the user while continuing the displaying and executing communicative interaction between the digital companion and the user based on the content and one or more communications of the user.

Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a first protective layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The first protective layer includes a first polymer, wherein the cross-linking degree of the first polymer is 0 to 42.3%.

Abstract: A kinetic energy harvesting device implementing a half-wave mechanical motion rectification (HMMR) mechanism is described. The energy harvesting device may include an energy harvesting railroad tie, where the tie includes a tie housing configured to be coupled to at least one rail. The tie housing includes at least one spring and at least one energy harvester. The at least one energy harvester includes a generator having an output shaft, a gearhead, a ball screw or other motion transmission, and a one-way clutch. Under a force of a passing wheel on the at least one rail, the at least one energy harvester is compressed, which causes a rotation of the ball screw or other motion transmission, a rotation of the output shaft, and a transmission of torque to a shaft of the gearhead, driving the generator in a unidirectional rotation to generate electrical power via the one-way clutch.

Abstract: The embodiment of the invention provides a data processing method and apparatus, a cache, a processor and an electronic device. The data processing method includes: receiving a data processing request, wherein data requested by the data processing request includes data that is suitable for being stored in at least two cache units, and main memory addresses of the data in each of the cache units are consecutive; and when main memory address information of each cache unit that satisfies a mapping relationship includes all the main memory addresses, simultaneously performing data processing on the data which corresponds to the main memory addresses. Through the method, a bandwidth is improved such that the efficiency of data transmission is improved.

Abstract: A memory array includes a first memory cell configured to store data, a second memory cell configured to store data and a bit line extending along the first direction, and being over the first memory cell and the second memory cell. The first memory cell and the second memory cell are arranged along a first direction in a first column of memory cells. The bit line includes a first conductor extending in the first direction and being in a first conductive layer, and a second conductor extending in the first direction and being in a second conductive layer different from the first conductive layer.

Abstract: Presented are systems, methods, apparatuses, or computer-readable media for positioning. A wireless communication node may identify a condition associated with a positioning method related to a wireless communication device. The wireless communication node may determine a value of a qualification flag based on whether at least one of a measurement result or assistance data associated with the positioning method satisfies the condition.

Abstract: The present application discloses a method, an apparatus, a node, and storage medium for communicating a positioning reference signal of a communication node, the method comprising: determining a positioning reference signal PRS region by a first communication node; communicating a PRS signal in the PRS region by the first communication node; wherein the communicating comprises transmitting and/or receiving.

Abstract: Presented are systems and methods for measurements on positioning reference signals. A wireless communication device can receive a first message that includes a configuration of one or more downlink positioning reference signal (DL PRS) resources from a wireless communication element. According to a second message requested by the wireless communication element, the wireless communication device can provide a third message including a location information report derived according to measurements on the one or more DL PRS resources conducted based on the configuration to the wireless communication element.

Abstract: Presented are systems and methods for reference signals communication for positioning. A wireless communication device can receive a first message indicating a plurality of Sounding Reference Signal (SRS) aggregates, wherein each of the plurality of SRS aggregates is associated with a cell identifier from a wireless communication node. The wireless communication device can transmit an SRS according to at least one of the SRS aggregates to the wireless communication node.

Abstract: Disclosed is a device for lowering and raising blind, which relates to the technical field of blind, wherein the device comprises a fixing frame and a lining plate, the fixing frame is used to connect with a blind body; the lining plate articulately connects with the fixing frame; the lining plate has a first usage state and a second usage state, in the first usage state, the blind body is raised, and the lining plate contacts with the blind body to prevent the blind body from being lowered; in the second usage state, the lining plate is located at each side of the blind body, and the blind body may be performed an lowering operation or a raising operation. The application is able to be manually lowered or raised through a cooperation of the lining plate and the fixing frame without a pulling rope.

Abstract: A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

Abstract: Systems and methods for wireless communication systems are disclosed. In one aspect, the wireless communication method includes receiving, by a wireless communication device from a network, a positioning request. The positioning request includes a request for at least one of performing an UL-TDOA positioning method, performing multi-RTT positioning method, performing DL-TDOA positioning method, performing DL-AoD positioning method, performing UL-AoA positioning method, or reporting measurement information. The method includes reporting, by the wireless communication device to the network, the measurement information, wherein the measurement information comprises at least one of UL-TDOA measurement result, multi-RTT measurement result, DL-TDOA measurement result, DL-AoD measurement result, UL-AoA measurement result, SRS resource ID, SRS resource set ID, UE Tx TEG ID, association relationship between SRS signaling and UE Tx TEGs, or ARP information of SRS signaling.

Abstract: A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to the first side of the interposer wafer adjacent the integrated circuit die. The stiffener structure covers the second electrical connectors in a plan view. The integrated circuit die and the stiffener structure are encapsulated with a first encapsulant. The interposer wafer and the stiffener structure are singulated to form a stacked structure.

Abstract: Methods and apparatuses are described that provide tungsten deposition with low roughness. In some embodiments, the methods involve co-flowing nitrogen with hydrogen during an atomic layer deposition process of depositing tungsten that uses hydrogen as a reducing agent. In some embodiments, the methods involve depositing a cap layer, such as tungsten oxide or amorphous tungsten layer, on a sidewall surface of a 3D NAND structure. The disclosed embodiments have a wide variety of applications including depositing tungsten into 3D NAND structures.

Abstract: Performing a three-dimensional (3D) reconstruction process of a set of selected image frames. In some instances, a plurality of sequential image frames that are extracted from a video file (including video content created through the use of Augmented Reality) are converted into a grayscale format. Once these image files are converted to a grayscale format, a two-dimensional (2D) entropy process is performed that is ultimately used to create a set of user-defined clusters, with each of these user-defined clusters being associated with at least a sub-set set of the grayscale frames. After a cluster is selected, a 3D reconstruction process is performed on the frames associated with the selected cluster.

Abstract: An integrated circuit package with a perforated stiffener ring and the method of forming the same are provided. The integrated circuit package may comprise an integrated circuit package component having an integrated circuit die on a substrate, an underfill between the integrated circuit package component and the substrate, and a stiffener ring attached to the substrate. The stiffener ring may encircle the integrated circuit package component and the underfill in a top-down view. The stiffener ring may comprise a perforated region, wherein the perforated region may comprise an array of openings extending from a top surface of the stiffener ring to a bottom surface of the stiffener ring.