SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR PACKAGE
A semiconductor structure, a method for manufacturing a semiconductor structure and a semiconductor package are provided. The method for manufacturing a semiconductor structure includes the following steps. Firstly, a silicon substrate is provided. Next, a part of the silicon substrate is removed to form a ring hole and a silicon pillar surrounded by the silicon pillar. Then, a photosensitive material is disposed in the ring hole, wherein the photosensitive material is insulating. After that, the silicon pillar is removed, such that the ring hole forms a through hole and the photosensitive material covers a lateral wall of the through hole. Lastly, the conductive material is disposed in the through hole, wherein the outer surface of the conductive material is surrounded by the photosensitive material.
This application claims the benefit of Taiwan application Serial No. 97124100, filed Jun. 27, 2008, the subject matter of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION1. Field of the Invention
The invention relates in general to a semiconductor structure, a method for manufacturing a semiconductor structure and a semiconductor package and more particularly to a semiconductor structure using through silicon via technology, a method for manufacturing a semiconductor structure and a semiconductor package.
2. Description of the Related Art
As electronic products are directed towards slimness, light weight and compactness, the semiconductor structure using through silicon via (TSV) technology has become a mainstream trend. Referring to
The first surface 910a and the second surface 910b of the silicon wafer 910 can be contacted with each other through the conductive pad 950, the copper material 940 and the conductive pad 960. The copper material 940 and the first surface 910a are both protected by the insulating layer 920.
However, according to the conventional method for manufacturing the semiconductor structure 900, the insulating layer 920 is formed by CVD technology. As the CVD technology equipment is expensive, more manufacturing costs are incurred.
Furthermore, according to the conventional method for manufacturing the semiconductor structure 900, the copper material 940 is exposed by way of polishing the second surface 910b, not only incurring more manufacturing process and more time, but also easily damaging the silicon wafer 910. Thus, there are many bottleneck technologies in the through silicon via technology of the silicon wafer 910 that need to be resolved.
SUMMARY OF THE INVENTIONThe invention is directed to a semiconductor structure and a method for manufacturing a semiconductor structure and a semiconductor package. As the photosensitive material is used as an insulating layer, the method for manufacturing the semiconductor structure does not require the CVD process nor require the step of grinding the silicon substrate, hence largely reducing manufacturing cost and increasing product yield rate.
According to a first aspect of the present invention, a method for manufacturing a semiconductor structure is provided. The manufacturing method includes the following steps. Firstly, a silicon substrate is provided. Next, a part of the silicon substrate is removed to form a ring hole and a silicon pillar surrounded by the ring hole. Then, a photosensitive material is disposed in the ring hole, wherein the photosensitive material is insulating. After that, the silicon pillar is removed, such that the ring hole forms a through hole and the photosensitive material covers a lateral wall of the through hole. Lastly, a conductive material is disposed in the through hole, wherein an outer surface of the conductive material is surrounded by the photosensitive material.
According to a second aspect of the present invention, a semiconductor structure including a silicon substrate, a photosensitive material and a conductive material is provided. The silicon substrate has a through hole. The photosensitive material covers a lateral wall of the through hole, wherein the photosensitive material is insulating. The conductive material is disposed in the through hole, wherein an outer surface of the conductive material is surrounded by the photosensitive material.
According to a third aspect of the present invention, a semiconductor package is provided. The semiconductor package comprises a package substrate, a silicon interposer and a chip. The silicon interposer is disposed above the package substrate and comprises a silicon substrate, a photosensitive material and a conductive material. The silicon substrate has a through hole. The photosensitive material covers a lateral wall of the through hole. The photosensitive material is insulating. The conductive material is disposed in the through hole and an outer surface of the conductive material is surrounded by the photosensitive material. The chip is disposed above the silicon interposer.
The invention will become apparent from the following detailed description of the preferred but non-limiting embodiments. The following description is made with reference to the accompanying drawings.
The invention is elaborated in preferred embodiments disclosed below. These embodiments are for exemplification purpose not for limiting the scope of protection of the invention. Also, secondary elements are omitted in the preferred embodiments below for highlighting the technical features of the invention.
Referring to
Next, the method proceeds to step S102 as indicated in
Then, the method proceeds to step S103 as indicated in
After that, the method proceeds to step S104 as indicated in FIG. 3F, the patterned photosensitive material 130 is used as a mask and the silicon pillar 110d (shown in
Lastly, the method proceeds to step S105 as indicated in
To be more precisely, the conductive material 160 may fill the entire through hole 110e or only form a thin film on the photosensitive material 130. In the present embodiment of the invention, the conductive material 160 fills the entire through hole 110e as an exemplification.
According to the above arrangement, there is no need to employ expensive CVD equipment or polish the silicon substrate, hence greatly simplifying manufacturing process and avoiding the silicon substrate being damaged. Thus, the method for manufacturing a semiconductor structure according to the invention largely reduces manufacturing cost and increases product yield rate.
Also, referring to
Firstly, the method begins at step S201, a silicon substrate is provided. Next, the method proceeds to step S202, a part of the silicon substrate is removed to form a ring hole and a silicon pillar surrounded by the ring hole. Then, the method proceeds to step S203, a photosensitive material is disposed in the ring hole and the photosensitive material covers the silicon substrate at the same time, wherein the photosensitive material is insulating. After that, the method proceeds to step S204, the photosensitive material is patterned for exposing the silicon pillar and ripening the photosensitive material. Afterwards, the method proceeds to step S205, the silicon pillar is removed such that the ring hole forms a through hole and the photosensitive material covers a lateral wall of the through hole and the silicon substrate to form a continuous surface. Lastly, the method proceeds to step S206, a conductive material is disposed in the through hole and the silicon substrate, and the conductive material is patterned, wherein part of the conductive material in the through hole is surrounded by the photosensitive material, and part of the conductive material disposed on the silicon substrate is located on the photosensitive material.
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D2≦D1<D3 (1)
In the present embodiment of the invention, the diameter D1 of the mask opening 800a is exactly equal to the diameter D2 of the inner lateral wall 410f.
Then, as indicated in
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Referring to
In the present embodiment of the invention, the conductive material 460 is disposed in the through hole 410e by way of electroplating a metal. Wherein the metal is selected form copper (Cu). After the through hole 410e is filled by the conductive material 460, the outer surface 460c of the conductive material 460 is surrounded by the photosensitive material 430.
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The semiconductor structure and the method for manufacturing the same disclosed in the above embodiments of the invention have many advantages exemplified as follows:
Firstly, according to the manufacturing method disclosed above, the photosensitive material used as an insulating layer is disposed in the through hole and on the second surface by simple procedures without employing expensive CVD equipment, largely reducing manufacturing cost.
Secondly, according to the manufacturing method disclosed above, there is no need to polish the silicon substrate, hence simplifying manufacturing process, avoiding the silicon substrate being damaged and increasing product yield rate.
While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Claims
1. A method for manufacturing a semiconductor structure, comprising:
- providing a silicon substrate;
- removing a part of the silicon substrate to form a ring hole and a silicon pillar surrounded by the ring hole;
- disposing a photosensitive material in the ring hole, wherein the photosensitive material is insulating;
- removing the silicon pillar, such that the ring hole forms a through hole and the photosensitive material covers a lateral wall of the through hole; and
- disposing a conductive material in the through hole, wherein the conductive material is surrounded by the photosensitive material.
2. The manufacturing method according to claim 1, wherein the part of the silicon substrate is removed by etching.
3. The manufacturing method according to claim 1, wherein before the step of forming the ring hole, the manufacturing method further comprises:
- forming a first conductive wiring on a first surface of the silicon substrate, wherein the first conductive wiring is disposed at a pre-determined position corresponding the ring hole.
4. The manufacturing method according to claim 3, wherein the step of disposing the photosensitive material in the ring hole comprises:
- disposing the photosensitive material on a second surface of the silicon substrate, wherein the photosensitive material covers the ring hole;
- melting the photosensitive material, such that part of the melted photosensitive material fills in the ring hole; and
- ripening the photosensitive material which has been melted and filled in the ring hole.
5. The manufacturing method according to claim 1, wherein the step of removing the silicon pillar comprises:
- patterning the photosensitive material, such that the photosensitive material forms an opening corresponding to the silicon pillar; and
- using the patterned photosensitive material as a mask and etching the silicon pillar to remove the silicon pillar.
6. The manufacturing method according to claim 5, wherein the ring hole has an inner lateral wall and an outer lateral wall and in the step of patterning the photosensitive material, and the diameter of the opening is greater than or equal to the diameter of the inner lateral wall but smaller than the diameter of the outer lateral wall.
7. The manufacturing method according to claim 1, wherein the step of disposing the conductive material in the through hole comprises:
- electroplating a metal in the through hole.
8. The manufacturing method according to claim 1, wherein the step of disposing the conductive material in the through hole comprises:
- filling a solder paste in the through hole; and
- reflowing the solder paste.
9. The manufacturing method according to claim 1, further comprising:
- forming a second conductive wiring on a second surface of the silicon substrate, the second conductive wiring electrically connects the conductive material in the through hole.
10. The manufacturing method according to claim 9, further comprising:
- forming a bump on the second conductive wiring.
11. A semiconductor structure, comprising:
- a silicon substrate having a through hole;
- a photosensitive material disposed on a lateral wall of the through hole, wherein the photosensitive material is insulating; and
- a conductive material disposed in the through hole and an outer surface of the conductive material is surrounded by the photosensitive material.
12. The semiconductor structure according to claim 11, further comprising:
- a first conductive wiring formed on a first surface of the silicon substrate, wherein the first conductive wiring connects one end of the through hole; and
- a conductive bump disposed on a second surface of the silicon substrate, wherein the conductive bump connects the other end of the through hole;
- wherein the first conductive wiring, the conductive material and the conductive bump are electrically connected.
13. The semiconductor structure according to claim 11, further comprising:
- a second conductive wiring formed on the second surface of the silicon substrate;
- wherein the conductive bump is disposed on the second conductive wiring.
14. The semiconductor structure according to claim 11, wherein the outer surface of the conductive material is completely covered by the photosensitive material.
15. The semiconductor structure according to claim 11, wherein the photosensitive material is further disposed on a second surface of the silicon substrate.
16. The semiconductor structure according to claim 11, wherein the thickness of the photosensitive material is 3-10 μm.
17. A semiconductor package, comprising:
- a package substrate;
- a silicon interposer disposed above the package substrate, comprising: a silicon substrate having a through hole; a photosensitive material disposed on a lateral wall of the through hole, wherein the photosensitive material is insulating; and a conductive material disposed in the through hole and an outer surface of the conductive material is surrounded by the photosensitive material; and
- a chip disposed above the silicon interposer.
18. The semiconductor package according to claim 17, wherein the silicon interposer further comprises:
- a first conductive wiring formed on a first surface of the silicon substrate, wherein the first conductive wiring connects one end of the through hole; and
- a conductive bump disposed on a second surface of the silicon substrate, wherein the conductive bump connects the other end of the through hole;
- wherein the first conductive wiring, the conductive material and the conductive bump are electrically connected.
19. The semiconductor package according to claim 17, wherein the silicon interposer further comprises:
- a second conductive wiring formed on the second surface of the silicon substrate;
- wherein the conductive bump is disposed on the second conductive wiring.
20. The semiconductor package according to claim 17, wherein the outer surface of the conductive material is completely covered by the photosensitive material.
21. The semiconductor package according to claim 17, wherein the photosensitive material is further disposed on a second surface of the silicon substrate.
22. The semiconductor package according to claim 17, wherein the thickness of the photosensitive material is 3-10 μm.
Type: Application
Filed: Jun 15, 2009
Publication Date: Dec 31, 2009
Inventors: Meng-Jen Wang (Pingtung City), Chien-Yu Chen (Kaohsiung City)
Application Number: 12/484,860
International Classification: H01L 23/498 (20060101); H01L 21/768 (20060101);