METHOD FOR IMPROVING SEMICONDUCTOR SURFACES
A semiconductor fabrication method. The method includes providing a semiconductor substrate, wherein the semiconductor substrate includes a semiconductor material. Next, a top portion of the semiconductor substrate is removed. Next, a first semiconductor layer is epitaxially grown on the semiconductor substrate, wherein a first atom percent of the semiconductor material in the first semiconductor layer is equal to a certain atom percent of the semiconductor material in the semiconductor substrate.
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The present invention relates generally to semiconductor device fabrication and more particularly to method for improving semiconductor surfaces for semiconductor structure fabrication.
BACKGROUND OF THE INVENTIONSemiconductor devices are conventionally formed on semiconductor surfaces. The more planar the semiconductor surfaces are, the higher quality the semiconductor devices have. Therefore, there is a need for a method for improving semiconductor surfaces.
SUMMARY OF THE INVENTIONThe present invention provides a semiconductor fabrication method, comprising providing a semiconductor substrate, wherein the semiconductor substrate comprises a semiconductor material; removing a top substrate portion of the semiconductor substrate; and after said removing is performed, epitaxially growing a first semiconductor layer on the semiconductor substrate, wherein a first atom percent of the semiconductor material in the first semiconductor layer is equal to a certain atom percent of the semiconductor material in the semiconductor substrate.
The present invention provides a method for improving semiconductor surfaces.
FIG. 1D′ shows a plot that illustrates the relationship between the thicknesses of a first silicon layer and the thicknesses of a second silicon layer as a result of a simulation process of the formation of the semiconductor structure of
With reference to
Next, in one embodiment, the top surface 130′ of the silicon layer 130 is thermally oxidized resulting in an oxide layer 132 and what remains of the silicon layer 130 of
Next, in one embodiment, the oxide layer 132 is removed resulting in the structure 100 of
Next, in one embodiment, silicon is epitaxially grown on the top surface 130a′ of the silicon layer 130a of
The silicon layer 130a and the silicon layer 140 can be collectively referred to as a silicon layer 130a+140. The thickness of the silicon layer 130a+140 in the direction 111 at point A is the sum of the thicknesses Ta′ and Tea which can be referred to as Ta′+Tea. The thickness of the silicon layer 130a+140 in the direction 111 at point B is the sum of the thicknesses Tb′ and Teb which can be referred to as Tb′+Teb.
FIG. 1D′ shows a plot that illustrates the relationship between the thicknesses Ta′ and Tb′ of the silicon layer 130a (
Before the first epitaxial growth step is performed, the difference of thicknesses of the silicon layer 130a in the direction 111 at points A and B is Ta′−Tb′=770 Å−450 Å=320 Å. After the first epitaxial growth step is performed, the difference of thicknesses of the silicon layer 130a+140 in the direction 111 at points A and B is (Ta′+Tea)−(Tb′+Teb)=(770 Å+150 Å)−(450 Å+250 Å)=220 Å (which is less than 320 Å). In general, the inventors of the present invention have found that for any third point and fourth point on the top surface 120′ of the dielectric layer 120 such that the difference of the thicknesses of the silicon layer 130a in the direction 111 at the third and fourth point is positive, the difference of the thicknesses of the silicon layer 130a+140 in the direction 111 at the third and fourth points is smaller than the difference of the thicknesses of the silicon layer 130a in the direction 111 at the third and fourth points. In other words, as a result of the formation of the silicon layer 140 by epitaxial process, the thickness variability of the top silicon layer is reduced. It should be also noted that the top surface 140′ of the silicon layer 130a+140 is more planar than the top surface 130a′ of the silicon layer 130a. It is said that the top surface 140′ of the silicon layer 140 is more planar than the top surface 130a′ of the silicon layer 130a if for any third point and fourth point on the top surface 120′ of the dielectric layer 120 such that the difference of the thicknesses of the silicon layer 130a in the direction 111 at the third and fourth point is positive, the difference of the thicknesses of the silicon layer 130a+140 in the direction 111 at the third and fourth points is smaller than the difference of the thicknesses of the silicon layer 130a in the direction 111 at the third and fourth points.
Next, with reference to
Next, with reference to
Next, in one embodiment, a third thinning step and then a third epitaxial growth step, a fourth thinning step and then a fourth epitaxial growth step, and so on (similar to the third thinning step and then the third epitaxial growth step) are performed in turn on the top surface 160′ of the silicon layer 130a+140+160 so as to make the top surface 160′ of the silicon layer 130a+140+160 more planar.
Next, in one embodiment, a final thinning step is performed to achieve a desired thickness for the silicon layer on top of the dielectric layer 120.
Next, in one embodiment, devices (transistors, capacitors, registers, etc.) are formed on the silicon layer 130a+140+160.
In summary, a plurality of epitaxial growth steps and thinning steps (like the first and second epitaxial growth steps and the first and second thinning steps) can be performed on the top surface of a silicon layer so as to make this top surface more planar and achieve a desired thickness of the silicon layer for fabricating devices.
In the embodiments described above, with reference to
In the embodiments described above, the first thinning step is performed before the first epitaxial growth step is performed. In an alternative embodiment, the first thinning step can be omitted.
In the embodiments described above, the second epitaxial growth step is performed after the second thinning step is performed on the silicon layer 130a+140 of
While particular embodiments of the present invention have been described herein for purposes of illustration, many modifications and changes will become apparent to those skilled in the art. Accordingly, the appended claims are intended to encompass all such modifications and changes as fall within the true spirit and scope of this invention.
Claims
1. A semiconductor fabrication method, comprising:
- providing a semiconductor substrate, wherein the semiconductor substrate comprises a semiconductor material;
- removing a top substrate portion of the semiconductor substrate; and
- after said removing is performed, epitaxially growing a first semiconductor layer on the semiconductor substrate, wherein a first atom percent of the semiconductor material in the first semiconductor layer is equal to a certain atom percent of the semiconductor material in the semiconductor substrate.
2. The method of claim 1, wherein said removing the top substrate portion of the semiconductor substrate comprises:
- thermally oxidizing the top substrate portion of the semiconductor substrate resulting in a substrate dielectric layer; and
- removing the resulting substrate dielectric layer.
3. The method of claim 1, wherein the semiconductor material comprises silicon.
4. The method of claim 1, further comprising, after said epitaxially growing the first semiconductor layer is performed, removing a first top portion of the first semiconductor layer.
5. The method of claim 4, wherein said removing the first top portion of the first semiconductor layer comprises:
- thermally oxidizing the first top portion of the first semiconductor layer resulting in a first dielectric layer; and
- removing the resulting first dielectric layer.
6. The method of claim 4, further comprising, after said removing the first top portion of the first semiconductor layer is performed, epitaxially growing a second semiconductor layer on the first semiconductor layer.
7. The method of claim 6, wherein a second atom percent of the semiconductor material in the second semiconductor layer is equal to the first atom percent of the semiconductor material in the first semiconductor layer.
8. The method of claim 6, further comprising, after said epitaxially growing the second semiconductor layer is performed, removing a second top portion of the second semiconductor layer.
9. The method of claim 8, wherein said removing the second top portion of the second semiconductor layer comprises:
- thermally oxidizing the second top portion of the second semiconductor layer resulting in a second dielectric layer; and
- removing the resulting second dielectric layer.
10. The method of claim 1, further comprising, after said epitaxially growing the first semiconductor layer is performed, epitaxially growing a third semiconductor layer on top of and in direct physical contact with the first semiconductor layer,
- wherein after said epitaxially growing the first semiconductor layer is performed and before said epitaxially growing the third semiconductor layer is performed, a top surface of the first semiconductor layer is not exposed to any silicon atom in a surrounding ambient, and
- wherein no portion of the first semiconductor layer is removed after said epitaxially growing the first semiconductor layer is performed and before said epitaxially growing the third semiconductor layer is performed.
11. The method of claim 10, wherein a third atom percent of the semiconductor material in the third semiconductor layer is equal to the first atom percent of the semiconductor material in the first semiconductor layer.
12. A semiconductor fabrication method, comprising:
- providing a semiconductor substrate, wherein the semiconductor substrate comprises a semiconductor material;
- epitaxially growing a first semiconductor layer on the semiconductor substrate,
- after said epitaxially growing the first semiconductor layer is performed, removing a first top portion of the first semiconductor layer; and
- after said removing the first top portion of the first semiconductor layer is performed, epitaxially growing a second semiconductor layer on the first semiconductor layer, wherein a first atom percent of the semiconductor material in the first semiconductor layer is equal to a second atom percent of the semiconductor material in the second semiconductor layer.
13. The method of claim 12, wherein the semiconductor material comprises silicon.
14. The method of claim 12, wherein said removing the first top portion of the first semiconductor layer comprises:
- thermally oxidizing the first top portion of the first semiconductor layer resulting in a first dielectric layer; and
- removing the resulting first dielectric layer.
15. The method of claim 12, further comprising, after said epitaxially growing the second semiconductor layer is performed, removing a second top portion of the second semiconductor layer.
16. The method of claim 15, wherein said removing the second portion of the second semiconductor layer comprises:
- thermally oxidizing the second top portion of the second semiconductor layer resulting in a second dielectric layer; and
- removing the resulting second dielectric layer.
17. The method of claim 15, further comprising, after said removing the second top portion of the second semiconductor layer is performed, epitaxially growing a third semiconductor layer on the second semiconductor layer.
18. The method of claim 17, wherein a third atom percent of the semiconductor material in the third semiconductor layer is equal to the second atom percent of the semiconductor material in the second semiconductor layer.
19. The method of claim 17, further comprising, after said epitaxially growing the third semiconductor layer is performed, removing a third top portion of the third semiconductor layer.
20. The method of claim 19, wherein said removing the third top portion of the third semiconductor layer comprises:
- thermally oxidizing the third top portion of the third semiconductor layer resulting in a third dielectric layer; and
- removing the resulting third dielectric layer.
Type: Application
Filed: Jul 8, 2008
Publication Date: Jan 14, 2010
Patent Grant number: 7776624
Applicant: INTERNATIONAL BUSINESS MACHINES (Armonk, NY)
Inventors: Ashima B. Chakravarti (Hopewell Junction, NY), Judson Robert Holt (Wappingers Falls, NY), Jeremy John Kempisty (Poughkeepsie, NY), Suk Hoon Ku (Beacon, NY), Woo-Hyeong Lee (Poughquag, NY), Amlan Majumdar (White Plains, NY), Ryan Matthew Mitchell (Wake Forest, NC), Renee Tong Mo (Briarcliff Manor, NY), Zhibin Ren (Hopewell Junction, NY), Dinkar Singh (Chicago, IL)
Application Number: 12/168,945
International Classification: H01L 21/20 (20060101);