Mainframe of dual-robot substrate processing system
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The broken lines shown in the figures are directed to unclaimed portions of the mainframe and/or unclaimed components attached to the mainframe that are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a mainframe for a dual-robot substrate processing system, as shown and described.
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Type: Grant
Filed: Mar 11, 2022
Date of Patent: May 28, 2024
Assignee: APPLIED MATERIALS, INC. (Santa Clara, CA)
Inventors: Michael R. Rice (Pleasanton, CA), Michael C. Kuchar (Georgetown, TX), Travis Morey (Austin, TX), Adam J. Wyatt (Round Rock, TX), Ofer Amir (Half Moon Bay, CA)
Primary Examiner: Patricia A Palasik
Application Number: 29/830,396