Mainframe of dual-robot substrate processing system

- APPLIED MATERIALS, INC.
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Description

FIG. 1 is a front, top perspective view of a mainframe for a dual-robot substrate processing system in accordance with the present design.

FIG. 2 is a left side elevational view of the present design.

FIG. 3 is a right side elevational view of the present design.

FIG. 4 is a front elevational view of the present design.

FIG. 5 is a rear elevational view of the present design.

FIG. 6 is a top plan view of the present design.

FIG. 7 is a bottom plan view of the second embodiment of the present design; and,

FIG. 8 is a front, top perspective view of the present design, showing unclaimed components attached thereto.

The broken lines shown in the figures are directed to unclaimed portions of the mainframe and/or unclaimed components attached to the mainframe that are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a mainframe for a dual-robot substrate processing system, as shown and described.

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Patent History
Patent number: D1029066
Type: Grant
Filed: Mar 11, 2022
Date of Patent: May 28, 2024
Assignee: APPLIED MATERIALS, INC. (Santa Clara, CA)
Inventors: Michael R. Rice (Pleasanton, CA), Michael C. Kuchar (Georgetown, TX), Travis Morey (Austin, TX), Adam J. Wyatt (Round Rock, TX), Ofer Amir (Half Moon Bay, CA)
Primary Examiner: Patricia A Palasik
Application Number: 29/830,396