Gas nozzle for semiconductor manufacturing equipment
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Description
The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.
Claims
The ornamental design for a gas nozzle for semiconductor manufacturing equipment, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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- WaveTopSign Laser Machine Gas Nozzle Air Regulating Diameter 6mm 8mm 2Pcs / Lots for Co2 Laser Head and Air Nozzle,https://www.aliexpress.us/item/2251832773301553.html?src=google&gatewayAdapt=glo2usa, 2024. (Year: 2024).
Patent History
Patent number: D1042731
Type: Grant
Filed: Nov 28, 2022
Date of Patent: Sep 17, 2024
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Atsushi Hirano (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/861,210
Type: Grant
Filed: Nov 28, 2022
Date of Patent: Sep 17, 2024
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Atsushi Hirano (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/861,210
Classifications
Current U.S. Class:
Dispersal (i.e., Sprayer, Fogger, Nozzle, Aerator, Etc.) (4) (D23/213)