Gas nozzle for semiconductor manufacturing equipment

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front, top and left side perspective view of a gas nozzle for semiconductor manufacturing equipment, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a rear elevational view thereof; and,

FIG. 8 is an enlarged cross-sectional view taken along line 8-8 in FIG. 2.

The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.

Claims

The ornamental design for a gas nozzle for semiconductor manufacturing equipment, as shown and described.

Referenced Cited
U.S. Patent Documents
4880163 November 14, 1989 Kobayashi
5135170 August 4, 1992 Takeda
D336096 June 1, 1993 Farndahl
D641830 July 19, 2011 Alexander
D771543 November 15, 2016 Morita
D771772 November 15, 2016 Morita et al.
D783351 April 11, 2017 Fujino
D828091 September 11, 2018 Fujino
D847301 April 30, 2019 Yoshida
10364498 July 30, 2019 Terada
D888196 June 23, 2020 Okajima
D889596 July 7, 2020 Okajima et al.
D890572 July 21, 2020 Saiki
10960415 March 30, 2021 Amato
D937385 November 30, 2021 Takeshita et al.
D965740 October 4, 2022 Sambu
D1020668 April 2, 2024 Kagaya
20120167824 July 5, 2012 Maeng
Foreign Patent Documents
D1534651 October 2015 JP
D1563524 November 2016 JP
D1605945 June 2018 JP
Other references
  • WaveTopSign Laser Machine Gas Nozzle Air Regulating Diameter 6mm 8mm 2Pcs / Lots for Co2 Laser Head and Air Nozzle,https://www.aliexpress.us/item/2251832773301553.html?src=google&gatewayAdapt=glo2usa, 2024. (Year: 2024).
Patent History
Patent number: D1042731
Type: Grant
Filed: Nov 28, 2022
Date of Patent: Sep 17, 2024
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Atsushi Hirano (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/861,210