Gas nozzle for substrate processing apparatus
Latest KOKUSAI ELECTRIC CORPORATION Patents:
- Substrate processing apparatus and method of manufacturing semiconductor device
- Method of manufacturing semiconductor device
- Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
- Substrate processing apparatus
- Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
The broken lines in
Claims
We claim the ornamental design for an gas nozzle for substrate processing apparatus, as shown (and described).
D58914 | September 1921 | Kerr |
D258309 | February 17, 1981 | Leighton |
D322470 | December 17, 1991 | Garlich |
6553986 | April 29, 2003 | Liu |
6851420 | February 8, 2005 | Jennings |
D613116 | April 6, 2010 | Roberts |
D695883 | December 17, 2013 | Vest |
D771772 | November 15, 2016 | Morita |
D783351 | April 11, 2017 | Fujino et al. |
D847301 | April 30, 2019 | Yoshida |
D851763 | June 18, 2019 | Mathews |
20080171296 | July 17, 2008 | Yen |
20100154775 | June 24, 2010 | Robinson |
1589673 | October 2017 | JP |
Type: Grant
Filed: May 25, 2018
Date of Patent: Jul 7, 2020
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Tokyo), Toru Kagaya (Tokyo), Hiroaki Hiramatsu (Tokyo), Shinya Ebata (Tokyo)
Primary Examiner: Derrick E Holland
Assistant Examiner: Andrew Kerr
Application Number: 29/649,036