Gas nozzle for substrate processing apparatus
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Claims
We claim the ornamental design for an gas nozzle for substrate processing apparatus, as shown (and described).
| D58914 | September 1921 | Kerr |
| D258309 | February 17, 1981 | Leighton |
| D322470 | December 17, 1991 | Garlich |
| 6553986 | April 29, 2003 | Liu |
| 6851420 | February 8, 2005 | Jennings |
| D613116 | April 6, 2010 | Roberts |
| D695883 | December 17, 2013 | Vest |
| D771772 | November 15, 2016 | Morita |
| D783351 | April 11, 2017 | Fujino et al. |
| D847301 | April 30, 2019 | Yoshida |
| D851763 | June 18, 2019 | Mathews |
| 20080171296 | July 17, 2008 | Yen |
| 20100154775 | June 24, 2010 | Robinson |
| 1589673 | October 2017 | JP |
Type: Grant
Filed: May 25, 2018
Date of Patent: Jul 7, 2020
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Tokyo), Toru Kagaya (Tokyo), Hiroaki Hiramatsu (Tokyo), Shinya Ebata (Tokyo)
Primary Examiner: Derrick E Holland
Assistant Examiner: Andrew Kerr
Application Number: 29/649,036