Grooves formed around a semiconductor device on a circuit board

- Nitto Denko Corporation
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Description

FIG. 1 shows a plan view of the design according to a first embodiment of the invention.

FIG. 2 shows a bottom view of the design according to the invention. A claimed portion is not seen from the bottom.

FIG. 3 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 4 shows an enlarged sectional view along the line 4—4 in FIG. 3.

FIG. 5 shows an enlarged sectional view along the line 5—5 in FIG. 3.

FIG. 6 shows a perspective view of the design in FIG. 1, on which an semiconductor device (not claimed) is disposed.

FIG. 7 shows an enlarged sectional view along the line 5—5 in FIG. 3, on which a semiconductor device (not claimed) is disposed.

FIG. 8 shows a plan view of the design according to a second embodiment of the invention.

FIG. 9 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 8.

FIG. 10 shows an enlarged sectional view along the line 10—10 in FIG. 9; and,

FIG. 11 shows an enlarged sectional view along the line 11—11 in FIG. 9.

The elements shown in broken lines are for illustrative purpose only and form no part of the claimed invention.

Claims

The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

Referenced Cited
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Patent History
Patent number: D580895
Type: Grant
Filed: Apr 8, 2008
Date of Patent: Nov 18, 2008
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Naohiro Terada (Osaka), Kouji Kataoka (Osaka), Tetsuya Ohsawa (Osaka), Toshiki Naito (Osaka)
Primary Examiner: Selina Sikder
Attorney: Osha • Liang LLP
Application Number: 29/306,339