Gas-separating plate for reactor for manufacturing semiconductor
Latest Tokyo Electron Limited Patents:
- ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Method of transporting workpiece and processing apparatus
- Plasma processing apparatus, analysis apparatus, and storage medium
- Apparatus and methods for beam processing of substrates
- Purification processing apparatus, substrate processing system, and processing method
Description
The broken lines are shown for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for gas-separating plate for reactor for manufacturing semiconductor, as shown and described.
Referenced Cited
U.S. Patent Documents
| 3618921 | November 1971 | Corbett, Jr. |
| 5709543 | January 20, 1998 | Shimazu |
| 6379466 | April 30, 2002 | Sahin et al. |
| D600220 | September 15, 2009 | Sato |
| 7625205 | December 1, 2009 | Sasajima et al. |
| D615937 | May 18, 2010 | Sato |
| D616392 | May 25, 2010 | Sato |
| 7798811 | September 21, 2010 | Nitadori et al. |
| 20050056218 | March 17, 2005 | Sun et al. |
| 20050252447 | November 17, 2005 | Zhao et al. |
| 20070131168 | June 14, 2007 | Gomi et al. |
| 20090159002 | June 25, 2009 | Bera et al. |
Patent History
Patent number: D655260
Type: Grant
Filed: Apr 13, 2011
Date of Patent: Mar 6, 2012
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventors: Manabu Honma (Oshu), Katsuyuki Hishiya (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/389,564
Type: Grant
Filed: Apr 13, 2011
Date of Patent: Mar 6, 2012
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventors: Manabu Honma (Oshu), Katsuyuki Hishiya (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/389,564
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)