Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
Latest Tokyo Electron Limited Patents:
- Plasma processing method and plasma processing apparatus
- Substrate processing method and substrate processing apparatus
- Deposition apparatus with pressure sensor and shower head on same plane and deposition method
- Deposition method and deposition apparatus
- COMPLEMENTARY FIELD-EFFECT TRANSISTORS AND METHODS FOR FORMING THE SAME
Description
Claims
The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
Referenced Cited
Patent History
Patent number: D615937
Type: Grant
Filed: Sep 2, 2009
Date of Patent: May 18, 2010
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Izumi Sato (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/342,851
Type: Grant
Filed: Sep 2, 2009
Date of Patent: May 18, 2010
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Izumi Sato (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/342,851
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)