Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers

- Tokyo Electron Limited
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Description

FIG. 1 is front, top perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a rear, bottom perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof; and,

FIG. 9 is a cross-sectional view taken through line 99 of FIG. 7.

Claims

The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

Referenced Cited
U.S. Patent Documents
D404373 January 19, 1999 Kimura
D404374 January 19, 1999 Kimura
D405427 February 9, 1999 Ishii
D410438 June 1, 1999 Ishii
D427570 July 4, 2000 Ishii
6093644 July 25, 2000 Inaba et al.
D600220 September 15, 2009 Sato
Patent History
Patent number: D615937
Type: Grant
Filed: Sep 2, 2009
Date of Patent: May 18, 2010
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Izumi Sato (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/342,851