Electrical contact for use in a plating apparatus
Latest Ebara Corporation Patents:
- Substrate processing method and substrate processing apparatus
- SUBSTRATE POLISHING DEVICE AND POLISHING PAD
- Substrate conveyance method, substrate processing device, and recording medium
- Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method
- Display screen with an animated graphical user interface
Claims
The ornamental design for an electrical contact for use in a plating apparatus, as shown and described.
Type: Grant
Filed: Apr 18, 2014
Date of Patent: Mar 31, 2015
Assignee: Ebara Corporation (Tokyo)
Inventors: Jumpei Fujikata (Tokyo), Masaaki Kimura (Tokyo), Mitsutoshi Yahagi (Tokyo)
Primary Examiner: Daniel Bui
Application Number: 29/488,445