Semiconductor module

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module thereof;

FIG. 3 is a left view of the semiconductor module thereof;

FIG. 4 is a right view of the semiconductor module thereof;

FIG. 5 is a top side view of the semiconductor module thereof; and,

FIG. 6 is a bottom side view of the semiconductor module thereof.

The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, and the bottom view represents a shape of a three-dimensional shape.

Claims

The ornamental design for a semiconductor module, as shown and described.

Referenced Cited
U.S. Patent Documents
6492737 December 10, 2002 Imasu et al.
D523403 June 20, 2006 Mizukoshi
D648290 November 8, 2011 Mori
D674760 January 22, 2013 Mochizuki
D717254 November 11, 2014 Jo
D729250 May 12, 2015 Han
D777124 January 24, 2017 Hasegawa
D783550 April 11, 2017 Hasegawa
D796978 September 12, 2017 Kawashima
D839220 January 29, 2019 Domon
D845921 April 16, 2019 Saito
D859334 September 10, 2019 Yokoyama
D864884 October 29, 2019 Yoneyama
10510626 December 17, 2019 Braun
D873227 January 21, 2020 Yoneyama
10546825 January 28, 2020 Hsu
10553559 February 4, 2020 Besshi
10557191 February 11, 2020 Nishida
10600744 March 24, 2020 Chikamatsu
10600789 March 24, 2020 Ha
10605828 March 31, 2020 Kung
10636703 April 28, 2020 Jeong
10644115 May 5, 2020 Oshima
10651050 May 12, 2020 Nakano
10672878 June 2, 2020 Ohoka
20030102570 June 5, 2003 Imasu et al.
20080061415 March 13, 2008 Morishita et al.
Foreign Patent Documents
2002-076057 March 2002 JP
2008-066655 March 2008 JP
Patent History
Patent number: D933618
Type: Grant
Filed: Jun 26, 2019
Date of Patent: Oct 19, 2021
Assignee: ASAHI KASEI MICRODEVICES CORPORATION (Tokyo)
Inventors: Osamu Shirata (Tokyo), Yusuke Hidaka (Tokyo)
Primary Examiner: Brett Miller
Assistant Examiner: Suzanne E Tisdell
Application Number: 29/696,264