Power semiconductor module

- ROHM CO., LTD.
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Description

FIG. 1 is a front, top, and right side perspective view of a first embodiment of a power semiconductor module showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a front, top, and right side perspective view of a second embodiment of a power semiconductor module showing my new design;

FIG. 8 is a front view thereof;

FIG. 9 is a rear view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a right side view thereof; and,

FIG. 12 is a left side view thereof.

The features shown in broken lines in the drawings depict portions of the article that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Claims

The ornamental design for a power semiconductor module, as shown and described.

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Patent History
Patent number: D864132
Type: Grant
Filed: Jul 3, 2017
Date of Patent: Oct 22, 2019
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Hideki Sawada (Kyoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/609,637