Semiconductor module

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Description

FIG. 1 is a front view of a semiconductor module showing our new design.

FIG. 2 is a rear view of the semiconductor module of FIG. 1.

FIG. 3 is a left side view of the semiconductor module of FIG. 1.

FIG. 4 is a right side view of the semiconductor module of FIG. 1.

FIG. 5 is a top view of the semiconductor module of FIG. 1.

FIG. 6 is a bottom view of the semiconductor module of FIG. 1.

FIG. 7 is a front, right, and bottom perspective view of the semiconductor module of FIG. 1; and,

FIG. 8 is a rear, left, and top perspective view of the semiconductor module of FIG. 1.

The broken lines shown in the drawing views of FIGS. 1-8 form no part of the claimed design.

Claims

The ornamental design for a semiconductor module, as shown and described.

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Patent History
Patent number: D827593
Type: Grant
Filed: Jan 5, 2018
Date of Patent: Sep 4, 2018
Assignee: Fuji Electric Co., Ltd (Kawasaki-Shi)
Inventors: Shin Soyano (Tokyo), Yoshikazu Takamiya (Tokyo), Keiichi Higuchi (Tokyo), Takahiro Koyama (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/632,135