Abstract: A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.

Abstract: The present invention provides a production facility of hot dip galvannealed steel plate able to produce hot dip galvannealed steel plate on production conditions optimal at all times despite rapid changes in the steel type, plating deposition, and other external factors, wherein the production facility 1 of hot dip galvannealed steel plate is provided with a soaking/cooling furnace 7 for treating steel plate I running after leaving a rapid heating furnace 6 by at least one of soaking and cooling. Further, the soaking/cooling furnace 7 is configured to enable a change of the ratio in the furnace of the soaking region 15 for soaking steel plate I by soaking means 21 at a soaking temperature of 500° C. to 650° C. and the cooling region 16 for cooling the steel plate I by spray nozzles 22 by a 5° C./sec or more average cooling rate.

Abstract: The present invention provides a resist coating and developing apparatus, a resist coating and developing method, a resist-film processing apparatus, and a resist-film processing method, capable of reducing a line width roughness by planarizing a resist pattern. The resist coating and developing apparatus comprises: a resist-film forming part configured to coat a resist onto a substrate to form a resist film thereon; a resist developing part configured to develop the exposed resist film to obtain a patterned resist film; and a solvent-gas supply part configured to expose the resist film, which has been developed and patterned by the resist developing part, to a first solvent of a gaseous atmosphere having a solubility to the resist film. A solvent supply part supplies, to the resist film which has been exposed to the first solvent, a second solvent in a liquid state having a solubility to the resist film.

Abstract: Devices and methods are provided where photoresist is applied on a substrate and at least some regions of the photoresist are dried prior to removing a substrate from a substrate support.

Abstract: Coating rollers accepting liquid media provide liquid chemicals to substrates for depositing a thin coating layer on the flat substrates, such as semiconductors or panels. The liquid media is cooled to a life-preserving temperature while shielded from the thermal energy heating the substrates to prevent degrading the liquid media. Physical barrier or temperature barrier can be established in vicinities of the rollers to further limit exposing the liquid media to high temperature.

Abstract: A system for passivating a plurality of hollow copper strands in a stator water cooling system including; a first storage tank containing a cleaning solution, a second storage tank containing rinsing water; a third storage tank containing a passivation solution; a plurality of conduits connecting the first, second, and third storage tanks in a closed loop with the plurality of hollow copper strands; and an alkaline pump for pumping the cleaning solution, the rinsing water, and the passivation solution through the closed loop.

Abstract: In one embodiment, a polishing pad includes a hydrophilic polymer base having a polishing surface, and a metal oxide coating. The metal oxide coating has nanoparticles of metal oxide disposed on the polishing surface. In another embodiment, a processing station includes a rotatable platen, a polishing head, and a precursor delivery system. The polishing head is configured to retain a substrate against the polishing pad. The precursor delivery system is configured to form an oxide coating on a surface of a polishing pad disposed on the platen. In yet another embodiment, a method for modifying a surface of a polishing pad includes wetting the surface of the polishing pad and delivering a precursor to the wetted surface of the polishing pad surface. The method also includes forming a metal oxide coating having nanoparticles of metal oxide on the surface from the precursor.

Abstract: A semiconductor device manufacturing method includes forming a first high-k insulating film on a processing target object; performing a crystallization heat-treatment process on the first high-k insulating film at a temperature equal to or higher than about 650° C. for a time less than about 60 seconds; and forming, on the first high-k insulating film, a second high-k insulating film containing a metal element having an ionic radius smaller than that of a metal element of the first high-k insulating film and having a relative permittivity higher than that of the first high-k insulating film.

Abstract: Provided is a method of manufacturing a semiconductor device. The method includes (a) loading a substrate having a silicon-containing film formed thereon into a process chamber; (b) supplying a gas into the process chamber from a gas supply unit until an inner pressure of the process chamber is equal to or greater than atmospheric pressure; and (c) supplying a process liquid from a process liquid supply unit to the substrate to oxidize the silicon-containing film.

Abstract: A transporting apparatus for simultaneously transporting at least two substrates into a substrate-treatment apparatus to be treated in a vacuum-treatment apparatus has at least two carrier apparatuses mounted for rotation in relation to a common axis and offset axially in relation to one another. At least one retaining frame configured for supporting at least one substrate is arranged on each of the two carrier apparatuses. Each retaining frame is configured to be shifted, by rotary movement of the two carrier apparatuses about the common axis, into mutually opposite regions of a treatment unit with the two carrier apparatuses spaced apart axially from one another sufficiently such that the treatment unit is arranged between the two carrier apparatuses.

Abstract: A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate comprises power supply lines and power return lines and respective heater zone connected between every pair of power supply line and power return line. The method reduces maximum currents carried by the power supply lines and power return lines by temporally spreading current pulses for powering the heater zones.

Abstract: Methods of pressure coating a target surface of an article comprising one or more grooves formed in an outer surface of an article include fluidly connecting a pressure masker comprising a pressurized masking fluid to one or more coolant supply holes on a first side of the article. The one or more coolant supply holes in fluidic communication with the one or more grooves. Passing the pressurized masking fluid through the one or more grooves from the first side to a second side comprising the target surface at a pressure less than the coating pressure of the coating material, and, coating the target surface with the coating material to allow the coating material to bridge over the one or more grooves and form one or more micro-channels. The pressurized masking fluid passing through the one or more grooves prevents the coating material from permanently altering a cross sectional area of the one or more grooves along its length.

Abstract: A method for depositing a polysilazane on a semiconductor wafer is provided. The method includes steps of disposing a silazane onto the semiconductor wafer, and heating the silazane to form the polysilazane on the semiconductor wafer. An apparatus for preparing a polysilazane on a semiconductor wafer is also provided.

Abstract: The invention relates to a coating installation, in particular for painting motor vehicle bodies, comprising a transport path (2, 12), along which a plurality of coating objects (1) are transported one after the other through the coating installation, and a plurality of treatment stations (13-17, 18-22, 23-27), in which the coating objects (1) are treated. It is proposed that the transport path (2, 12) branches into a plurality of parallel branches (5-9), in each of which at least one of the treatment stations (13-17, 18-22, 23-27) is arranged.

Abstract: In accordance with the embodiment of the present invention, there is provided a susceptor which includes an annular first susceptor portion for supporting the peripheral portion of a silicon wafer and further includes a second susceptor portion provided in contact with the peripheral portion of the first susceptor portion and covering the opening of the first susceptor portion. The second susceptor portion is disposed so that, when the silicon wafer is supported on the first susceptor portion, a gap of a predetermined size is formed between the silicon wafer and the second susceptor portion, and so that another gap of a size substantially equal to the predetermined size and directly connected to the above gap is formed between the first susceptor portion and the second susceptor portion.

Abstract: A coating device for coating a medical device with a drug-eluting material uses an in-process drying station between coats to improve a drug release profile. The drying station includes a heat nozzle configured for applying a uniform drying gas.

Abstract: Apparatus for directing air to media. The apparatus including an impinging plate having an array of orifices. The orifices are arranged in a plurality of rows oblique to the direction of motion of the media, and are also arranged to provide air to the media.

Abstract: A stator having a common varnish and weld insulation includes a stator lamination core and a motor winding wound around the stator lamination core. The motor winding includes a plurality of magnet wires configured such that they are substantially parallel to each other. Each magnet wire has two distal ends configured such that each distal end is welded to one distal end of an adjacent magnet wire, thereby forming a plurality of welded tips. The stator further includes a resin coating the welded tips and the stator. The resin serves as both a primary insulation for the welded tips, and as a varnish for the stator. This dual function of the resin may eliminate the need for separate insulation for the welded tips and varnish for the stator, and allow the resin to be applied to the welded tips and to the stator at substantially the same time.

Abstract: Embodiments disclosed herein propose the controlled application of a heated spray cloud to a target surface. The spray cloud may be delivered in connection with applications of atomized (misted) sunless tanning sprays using a variety of spray systems. A formulation of the cosmetic or conditioning liquid may conduct and retain heat to allow a pleasantly warm spray to be received on the skin surface. The formula may come to temperature quickly and the heat may be retained even though a nozzle cooling effect inherently cools the spray as it leaves the nozzle.

Abstract: A method for producing a catalyst supporting a metal or an alloy on a support, including: independently controlling a temperature of a first supercritical fluid to be first temperature, the first supercritical fluid containing a precursor of the metal or precursor of the alloy that is dissolved in a supercritical fluid; independently controlling a temperature of the support to be a second temperature higher than the temperature of the first supercritical fluid; and supplying the first supercritical fluid controlled to the first temperature to the support, to cause the metal or the alloy to be supported on the support.

Abstract: A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

Abstract: The present disclosure provides a coating method and a coating device. The coating method includes: heating a to-be-coated area of a to-be-coated member; and coating the heated to-be-coated area of the to-be-coated member. Therefore, by pre-heating the to-be-coated area of the to-be-coated member, the temperature of the to-be-coated area of the to-be-coated member is increased to reduce the temperature difference between the to-be-coated area of the to-be-coated member and the coating air flow, which prevents the mixture contained in the coating air flow from generating crystalline material on the to-be-coated area of the to-be-coated member. Thus, the coating layer can be stuck to the to-be-coated area directly and tightly without block from the crystalline material located therebetween, and is prevented from falling off easily to improve the success rate and stability of the coating operation.

Abstract: A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base.

Abstract: A method including preparing a molecular sieve material in a first chamber; transferring the molecular sieve material from the first chamber to a second chamber comprising at least one support; in the second chamber, contacting the at least one support with the molecular sieve material under conditions that promote the crystallization of molecular sieve material on the at least one support; and synthesizing crystals of molecular sieve material on the at least one support. A system including a first chamber defining a volume sufficient to accommodate a volume of molecular sieve material, an inlet and an outlet; a heating element coupled to the first chamber; and a second chamber comprising a pair of inlets and defining a volume sufficient to accommodate a support.

Abstract: Disclosed is a ceramic honeycomb structure comprising a honeycomb body and a multilayered outer layer formed of a thick core layer applied and rapidly dried and a thin clad layer dried more gently to form a crack free dual skin layer. The core layer may have properties that are closer to those of the ceramic honeycomb body in service than the clad layer that may provide a tough outer shell to withstand handling and assembly.

Abstract: A nanosynthesis apparatus includes an outer tube and an inner tube with surfaces that oppose each other across a gap as part of a reaction chamber. A deposition fluid flows along the reaction chamber to grow nanostructures such as graphene or carbon nanotubes on a substrate in the reaction chamber. The reaction chamber may have an annular cross-section, and the growth substrate may wrap around the inner tube in a helical manner. This configuration can allow a flexible film substrate to travel through the reaction chamber along a path that is significantly longer than the length of the reaction chamber while maintaining a uniform gap between the substrate and the reaction chamber wall, which can facilitate a uniform temperature distribution and fluid composition across the width of the substrate.

Abstract: There is provided a manufacturing method of a deposition material, including immersing at least one kind of powder in liquid, and after the immersing, vaporizing the liquid to solidify the powder as a deposition material for electron beam irradiation deposition.

Abstract: The present invention provides a method for forming an oxide film by which normal formation of an oxide film is always achieved without receiving an influence of a change in the atmosphere, a metal oxide film having a low resistance can be formed, and a high efficiency of film formation is obtained. In the present invention, a raw material solution containing an alkyl compound is formed into a mist and ejected to a substrate (100) in the atmosphere. Additionally, an oxidizing agent that exerts an oxidizing effect on the alkyl compound is supplied to the mist of the raw material solution. Through the above-described processes, an oxide film is formed on the substrate in the present invention.

Abstract: A chemical bath deposition apparatus is presented to prepare different thin films on continuous flexible substrates in roll-to-roll processes. In particular, they are useful to deposit CdS or ZnS buffer layers in manufacture of thin film solar cells. This apparatus deposits thin films onto vertically travelling continuous flexible workpieces delivered by a roll-to-roll system. The thin films are deposited with continuously spraying the reaction solutions from their freshly mixed styles to gradually aged forms until the designed thickness is obtained. The substrates and the solutions are heated to a reaction temperature. During the deposition processes, the front surfaces of the flexible substrates are totally covered with the sprayed solutions but the substrate backsides are remained dry. The reaction ambience inside the reactor can be isolated from the outside atmosphere. The apparatus is designed to generate a minimum amount of waste solutions for chemical treatments.

Abstract: A method for removing the edge bead from a substrate by applying an impinging stream of a medium that is not a solvent for the material to be removed. The medium is applied to the periphery of the substrate with sufficient force to remove the material. Also, an apparatus to perform the inventive method.

Abstract: Coating rollers accepting liquid media provide liquid chemicals to substrates for depositing a thin coating layer on the flat substrates, such as semiconductors or panels. The liquid media is cooled to a life-preserving temperature while shielded from the thermal energy heating the substrates to prevent degrading the liquid media. Physical barrier or temperature barrier can be established in vicinities of the rollers to further limit exposing the liquid media to high temperature.

Abstract: The present invention has to do with a method and system for coating and curing engineered wood products (EWP) in general, and the edges of EWPs in particular. One method for coating and curing medium density fiberboard (MDF) and other engineered wood laminates using coatings is provided.

Abstract: The inventive substrate treatment method includes: an organic solvent supplying step of supplying an organic solvent having a smaller surface tension than a rinse liquid to the upper surface of a substrate so that rinse liquid adhering to the upper surface of the substrate is replaced with the organic solvent; a higher temperature maintaining step of maintaining the upper surface of the substrate at a predetermined temperature higher than the boiling point of the organic solvent to thereby form a gas film of the organic solvent on the entire upper surface of the substrate including the gap of the minute pattern and to form a liquid film of the organic solvent on the gas film, the higher temperature maintaining step being performed after the organic solvent supplying step is started; and an organic solvent removing step of removing the organic solvent liquid film from the upper surface of the substrate.

Abstract: A manufacturing method for a secondary battery electrode, includes conveying an electrode current collector; applying an active material layer-forming composition that is prepared in a slurry state onto the electrode current collector; and drying a coating film that is made of the active material layer-forming composition formed on the electrode current collector. The coating film is dried by blowing a first hot air in a direction parallel to a coating film surface of the electrode current collector.

Abstract: Methods for coating medical devices for implantation within a body vessel are provided comprising providing a cylindrical container, placing a medical device inside the cylindrical container, and applying a polymer in liquid form inside the container.

Abstract: According to one embodiment, a film forming apparatus includes: a stage on which a coating object is placed; a rotation mechanism rotating the stage; an application nozzle supplying a coating material to the coating object; an application moving mechanism moving the application nozzle; a controller which controls the rotation mechanism and application moving mechanism to rotate the stage and move the application nozzle between the rotation center and the outer edge and controls the application nozzle to apply the coating material to the coating object; and a sound wave generator which generates a sound wave. The film forming apparatus projects the sound wave onto the surface of the coating film.

Abstract: A method for printing fluid layers for producing functional layers for electronic components in a rotary printing machine. The drying time tdry, or the time timm between the printing of the fluid layer in the printing nip of cylinders of the printing machine and the immobilization of the fluid layer, and the time (x·tlev) after which differences in thickness in the fluid layer have subsided after printing to a residual level that is no longer problematic for the functionality of the layer, are adapted to one another. This is effected either by way of technical method-related measures after leaving the printing nip or by suitable setting of the rheology of the fluid to be printed.

Abstract: A system and method for coating an expandable member of a medical device comprises providing a dispenser in fluid communication with a fluid source with the dispenser having at least one outlet to dispense fluid of the fluid source therefrom. The outlet(s) of the dispenser is positioned proximate a surface of an expandable member, with relative movement between the outlet(s) and the surface of the expandable member established along a coating path, and fluid is dispensed from the dispenser to form a substantially continuous bead of fluid between the at least one outlet and the surface of the expandable member along the coating path, and simultaneously drying the fluid while dispensing the fluid from the dispenser to control flow of fluid on the surface of the expandable member. The fluid source can include a variety of therapeutic agents.

Abstract: Thermally cross-linkable photo-hydrolyzable inkjet printable polymers are used to print microfluidic channels layer-by-layer on a substrate. In one embodiment, for each layer, an inkjet head deposits droplets of a mixture of hydrophobic polymer and cross-linking agent in a pattern lying outside a two-dimensional layout of the channels, and another inkjet head deposits droplets of a mixture of poly(tetrahydropyranyl methacrylate) PTHPMA (or another hydrophobic polymer which hydrolyzes to form a hydrophilic material), cross-linking agent, and a photoacid generator (PAG) in a pattern lying inside the two-dimensional layout of the channels. After all layers are printed, flood exposure of the entire substrate to UV radiation releases acid from the PAG which hydrolyzes PTHPMA to form hydrophilic poly(methacrylic acid) PMAA, thereby rendering the PTHPMA regions hydrophilic. The layers of these now-hydrophilic patterned regions together define the microfluidic channels. The cross-linking agent (e.g.

Abstract: Transport mechanisms are respectively provided in first and second processing blocks. Each transport mechanism has a hand. The hand holds the other surface of a substrate without coming into contact with an edge of the substrate. The hand is moved such that the substrate is transported between an adhesion reinforcement processing unit or a cooling unit and a coating processing unit or a development processing unit. In the adhesion reinforcement processing unit and the cooling unit, temperature processing is performed on the substrate while the back surface of the substrate is held by suction. In the coating processing unit and the development processing unit, a processing liquid is supplied to the main surface of the substrate while the back surface of the substrate is held by suction by a spin chuck.

Abstract: With abluminal side of a stent masked, the luminal side of the stent is selectively coated with a substance, such as an anti-coagulant, a platelet inhibitor and/or a pro-healing substance. The stent can be masked by inserting it into a rigid mandrel chamber or by compressing a masking sleeve onto the outer side of the stent. A spray nozzle inserted into the masked stent spray coats the substance onto the luminal side. The sprayed coating can be cured onto the stent such as by inserting an electrical-resistance heater bar into the stent.

Abstract: A system and a method for providing a film having a matte finish. The system includes means for providing a coated substrate, the coated substrate comprising a first coatable material applied to a substrate, the coatable material forming a first major surface of the coated substrate; means for changing the viscosity of the first coatable material from a first viscosity to a second viscosity; a face-side roller having an outer surface positioned to contact the first major surface of the coated substrate to impart a matte finish thereon; and optionally, means for hardening the first coatable material.

Abstract: An apparatus for atomic layer deposition of a material on a moving substrate comprises a conveying arrangement for moving a substrate along a predetermined planar or curved path of travel and a coating bar having at least one precursor delivery channel. The precursor delivery channel conducts a fluid containing a material to be deposited on a substrate toward the path of travel. When in use, a substrate movable along the path of travel defines a gap between the outlet end of the precursor delivery channel and the substrate. The gap defines an impedance Zg to a flow of fluid from the precursor delivery channel. A flow restrictor is disposed within the precursor delivery channel that presents a predetermined impedance Zfc to the flow therethrough. The restrictor is sized such that the impedance Zfc is at least five (5) times, and more preferably at least fifteen (15) times, the impedance Zg. The impedance Zfc has a friction factor f.

Abstract: A disk processing system having a heater chamber and dual single-sided sputter chambers each with a sustaining heater.

Abstract: The device for knife coating a layer of ink based on copper and indium on a substrate includes a supply tank of an ink, said tank collaborating with a coating knife. In addition, the device includes means that allow the ink, the substrate and the coating knife to be kept at different and increasing respective temperatures.

Abstract: An image forming apparatus includes a generating mechanism to generate foam from a liquid or gel which may take a foam state, a coating roller having a peripheral surface supplied with the foam to coat the foam on the peripheral surface onto a surface of a recording medium, and a transport passage to transport the foam from the generating mechanism to the coating roller by an accumulation force of the foam.

Abstract: A method for depositing a polysilazane on a semiconductor wafer is provided. The method includes steps of disposing a silazane onto the semiconductor wafer, and heating the silazane to form the polysilazane on the semiconductor wafer. An apparatus for preparing a polysilazane on a semiconductor wafer is also provided.

Abstract: An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.

Abstract: A manufacturing apparatus which manufactures a superconducting wire rod, includes first, second, and third chambers which are connected in series, an exhaust device which exhaust air from the first to third chambers, a carrier device which carries a substrate such that the substrate passes through the first to third chambers in this order, a first film formation device which forms a metal layer on the substrate in the first chamber, a first gas supply device which supplies oxidation gas to the second chamber to oxidize a surface of the metal layer, and a second film formation device which forms an oxide layer on the metal layer, the surface of which has been oxidized, in the third chamber.

Abstract: Methods and devices are provided for improved deposition systems. In one embodiment of the present invention, a deposition system is provided for use with a solution and a substrate. The system comprises of a solution deposition apparatus; at least one heating chamber; at least one assembly for holding a solution over the substrate; and a substrate curling apparatus for curling at least one edge of the substrate to define a zone capable of containing a volume of the solution over the substrate. In another embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.