Abstract: An SOD system (100A) comprises a process block (8) for performing a prescribed processing so as to form an insulating film on a wafer W, a carrier block (7) for transferring the wafer W from the outside into the process block (8), a sub-transfer mechanism (12) for transferring the substrate W between the process block (8) and the carrier block (7), and a main transfer mechanism (15). A process tower (T1) prepared by stacking one upon the other a plurality of process units for performing a series of processing for forming an insulating film on the wafer W is arranged detachable from the process block (8).

Abstract: The amount of a paint for forming a porous heat-resistant layer supplied to the outer surface of a gravure roll is adjusted by removing the paint with a blade that is disposed so as to contact the outer surface. A resin blade is used, and the position at which the resin blade contacts the outer surface of the gravure roll is changed as the resin blade wears away. This prevents the amount of the paint for forming the porous heat-resistant layer removed from the outer surface of the gravure roll from changing as the resin blade wears away, so that the excess amount of the paint carried on the outer surface of the gravure roll is removed with good accuracy. An almost constant amount of the paint is thus transferred to an electrode surface from the outer surface of the gravure roll, and a porous heat-resistant layer with an almost uniform thickness is stably formed on an industrial scale.

Abstract: Methods for producing substantially round, spherical and sintered particles from a slurry of a calcined, uncalcined or partially calcined raw material having an alumina content of more than 55% by weight, and a mullite growth promoter in an amount of from about 2 to about 10% dry weight of the total solids in the slurry. Methods for using such substantially round, spherical and sintered particles in hydraulic fracturing operations.

Abstract: Embodiments of the invention contemplate the formation of a high efficiency solar cell using novel methods to form the active doped region(s) and the metal contact structure of the solar cell device. In one embodiment, the methods include the steps of depositing a dielectric material that is used to define the boundaries of the active regions and/or contact structure of a solar cell device. Various techniques may be used to form the active regions of the solar cell and the metal contact structure.

Abstract: Methods and devices are provided for improved deposition systems. In one embodiment of the present invention, a deposition system is provided for use with a solution and a substrate. The system comprises of a solution deposition apparatus; at least one heating chamber; at least one assembly for holding a solution over the substrate; and a substrate curling apparatus for curling at least one edge of the substrate to define a zone capable of containing a volume of the solution over the substrate. In another embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.

Abstract: The invention relates to an apparatus to produce coated paper, cardboard or other fibrous webs with at least one thermo-sensitive layer as a plurality of functional layer through the application of at least one thermo-sensitive coating medium onto a carrier web by way of a functional layer forming unit, including at least one applicator device and one drying section. The first functional forming unit includes an applicator device in the embodiment of a multi-layer curtain coater with at least one delivery nozzle and a drying section located after it. The second functional layer forming unit also includes an applicator device in the embodiment of a multi-layer curtain coater with at least one delivery nozzle and one drying section located after it, there is a first web path that including the applicator device of the second functional layer forming unit, as well as a second web path and means to bypass the applicator device are provided.

Abstract: A deposition apparatus and methods for controlling an actuator and a heating system in a deposition apparatus are proposed. The deposition apparatus comprises a deposition chamber and at least one substrate holder movably arranged within the deposition chamber for holding substrates to be coated. The deposition apparatus shall further comprise radio equipment having at least a first radio device which is connected to the substrate holder and a second radio device which is arranged at least partially outside the deposition chamber. Between the first radio device and the second radio device a radio link is to be established at least temporarily for transferring information.

Abstract: An apparatus for coating an article where the apparatus includes an applicator, a conveyor for sequentially transporting a plurality of articles to the roller and a metering bar positioned against the applicator to meter a predetermined amount of coating composition to the applicator for transfer to an article transported to said applicator by the conveyor.

Abstract: A method for manufacturing a thin film, includes the steps of: mixing a thin-film forming material and a surfactant to prepare a dispersion in which the thin-film forming material is dispersed; forming a dispersion film from the dispersion at an inner circumference side of ring-shaped holding means; relatively moving a cylindrical supporter and the dispersion film while being in contact with each other so that the dispersion is transferred on a surface of the supporter to have a film shape, the supporter being disposed between a central portion of an inside space of the holding means and an outer circumference thereof and along an inner circumference of the holding means; drying the dispersion having a film shape formed on the surface of the supporter to form the thin film.

Abstract: Apparatus for holding semiconductor wafers during semiconductor manufacturing processes are disclosed. In one embodiment, the apparatus comprises a heat-conductive layer disposed on a supporting base. The apparatus also comprises a plurality of holes formed through the heat-conductive layer and the supporting base. The apparatus further comprises a plurality of heat-conductive lift pins that extend through the holes over the heat-conductive layer at the top end, and make a direct contact with a wafer substrate. The heat-conductive layer and the lift pins are connected to a heating circuit.

Abstract: The present invention relates to systems, materials and methods for the formation of conducting, semiconducting, and dielectric layers, structures and devices from suspensions of nanoparticles. Drop-on-demand systems are used in some embodiments to fabricate various electronic structures including conductors, capacitors, FETs. Selective laser ablation is used in some embodiments to pattern more precisely the circuit elements and to form small channel devices.

Abstract: Apparatus and method for forming multilayer polymer thin film. The method uses a solution container with a gap to prevent the huge amount of solution from directly falling on the first layer. Then the wet film is formed by moving the container with the thin film thickness is decided by the distance between the gap and the substrate. The wet film is dried in a very short time by the heater therefore there is no time for the second solvent to dissolve the first layer. The method can effectively achieve the large-area and multilayer structure in organic devices through solution processing.

Abstract: The problem regarding volatileness of a solvent in an EL forming material, which occurs in adopting printing, are solved. An EL layer is formed in a pixel, portion of a light emitting device by printing. Upon formation of the EL layer, a printing chamber is pressurized to reach a pressure equal to or higher than the atmospheric pressure, and the printing chamber is filled with inert gas or set to a solvent atmosphere. Thus the difficulty in forming an EL layer by printing is eliminated.

Abstract: A system and method for coating a suture are disclosed. The system includes a spool including a core having a suture wrapped thereabout and a dip tank including a first coating composition. The dip tank is configured to submerge the spool therein, thereby coating the suture with the first composition to form a pre-coated suture. The system also includes a coating device including a second coating composition. The coating device is configured to overcoat the pre-coated suture with the second coating composition.

Abstract: A method and a device for treating a material having nanoscale pores), especially implant material for the treatment of living cells, as provided. The method distinguished in that the surface tension of a substance (10) provided for filling the volumes of the nanoscale pores (9) is reduced. The present invention also includes a device for carrying out this method.

Abstract: A system (30) and method for fluidizing a polymer powder (11) to be sprayed, metering the material (12) and mixing it with a heated carrier-gas stream (13) to produce a spray (32), and using the spray (32) to transport the material (12) to a substrate (34) and radiant an convective heating of the material (12) during transport to achieve melting of the polymer powders (11).

Abstract: Apparatus for decorating objects including a heating device for heating an object wrapped in a transferring support bearing a sublimable image and a conveying device for conveying the object into, and removing the object from, the heating device the conveying device being mainly movable in a substantially vertical direction. The conveying device is provided with a supporting element such as to convey one object at a time to the heating device via inlet and outlet openings on the same side of the heating device.

Abstract: An integrated system for depositing films on a substrate for copper interconnect is provided. The system includes a processing chamber with a plurality of proximity heads, and a vacuum transfer module coupled to the processing chamber. Selected ones of the proximity heads are used for surface treatments and atomic layer depositions (ALDs). The system further includes a processing module for copper seed layer deposition, which is integrated with a rinse/dryer to enable dry-in/dry-out process capability and is filled with an inert gas to limit the exposure of the substrate to oxygen. Additionally, the system includes a controlled-ambient transfer module coupled to the processing module for copper seed layer deposition. Further, the system includes a loadlock coupled to the vacuum transfer module and to the controlled-ambient transfer module. The integrated system enables controlled-ambient transitions within the system to limit exposure of the substrate to uncontrolled ambient conditions outside of the system.

Abstract: A susceptor and a semiconductor manufacturing apparatus including the same are provided. A wafer is loaded on a susceptor and the susceptor includes at least one pocket whose bottom surface is inclined. The semiconductor manufacturing apparatus includes a reaction chamber, a heating unit that generates heat in the reaction chamber, a susceptor on which a wafer is loaded and that includes at least one pocket whose bottom surface is inclined, and a rotation shaft coupled with the susceptor.

Abstract: According to a coating method of the present invention, a second member 107 associated with the type of a silicon wafer 101 to be coated is selected, transferred into a coating chamber 102, and placed on a first member 103 thereby forming a susceptor 110. The associated second member 107 is most suitable for providing a uniform temperature distribution across the surface of the silicon wafer 110 and has a nonuniform thickness designed to correct the uniformity of the temperature distribution across the wafer. This arrangement allows minimization of the temperature variation across the surface of different types of silicon wafers 101 when a film is formed on them. The storage chamber 130 preferably includes heating means 131 for heating the second member.

Abstract: Making use of the feature that a high polymer is difficult to fiberize when used at below the glass transition point, a pressure-feed device (22) and part of an upstream pipe (26) are covered by a temperature regulation device (128) and the heat exchange in the temperature regulation device (128) maintains the temperature of a paste (PA) containing a water-repellent substance having a glass transition point and that passes through the pressure-feed device (22) to below the glass transition point of the water-repellent substance while coating the paste (PA) from a coating device (24).

Abstract: A method for drying wood based materials includes applying a treatment including a first chemical, such as a solvent, to a wood based material. The wood based material is preheated using steam. At least part of an atmosphere is evacuated from around the wood based material. The wood based material is dried using heated using steam and is exposed to radiation to evaporate at least a portion of the first chemical.

Abstract: A panels-off painting process and system adapted for use with a plurality of workpieces includes a carrier having a main platform, stationary support structures, and at least one rotatable assembly interconnected to the platform, configured so as to be caused to shift at least a portion of the workpieces between first and second orientations, and including a counterbalance that reduces the force necessary to cause the shift, and preferably further includes a retrofitted robotic arm programmably configured to apply a coat to the workpieces and subsequently engage the assembly so as to cause the shift.

Abstract: A system is described to deposit a buffer layer onto exposed surfaces of two different solar cell absorber layers of two different flexible workpieces from a process solution including all chemical components of the buffer layer material. The buffer layer is deposited from the process or deposition solution while the flexible workpieces are simultaneously heated and processed within a chamber in a face to face manner as the process solution is flown through a process gap formed between the exposed surfaces of the two solar cell absorber layers.

Abstract: A system and method for growing diamond crystals from diamond crystal seeds by epitaxial deposition at low temperatures and atmospheric and comparatively low pressures. A solvent is circulated (by thermal convection and/or pumping), wherein carbon is added in a hot leg, transfers to a cold leg having, in some embodiments, a range of progressively lowered temperatures and concentrations of carbon via the circulating solvent, and deposits layer-by-layer on diamond seeds located at the progressively lower temperatures since as diamond deposits the carbon concentration lowers and the temperature is lowered to keep the solvent supersaturated. The solvent includes metal(s) or compound(s) that have low melting temperatures and transfer carbon at comparatively low temperatures. A controller receives parameter signals from a variety of sensors located in the system, processes these signals, and optimizes diamond deposition by outputting the necessary control signals to a plurality of control devices (e.g.

Abstract: A coating apparatus and a coating method that are suitable for manufacturing a MEMS or a substrate having a through electrode are provided. A nozzle 14 gradually moves in the X-axis direction while being moved back and forth in the vertical direction (Y-axis direction). When coating in the vertical direction is completed, the nozzle 14 gradually moves in the Y-axis direction while being moved back and forth in the lateral direction (X-axis direction). Thus, the nozzle 14 coats the surface of a substrate W while scanning the surface twice during a single coating, and uncoated areas can be eliminated by making the direction in the first scanning and the direction in the second scanning different from each other by 90°.

Abstract: A substrate processing apparatus includes a substrate holding stage to hold a substrate having a surface facing up, the substrate having an exposed and developed resist pattern over the surface, a rotation driving mechanism to rotate the substrate holding stage around a vertical axis, a solvent vapor discharge nozzle having a discharge hole capable of discharging solvent vapor to swell the resist pattern onto the surface of the substrate and a vacuum opening capable of absorbing the solvent vapor discharged from the discharge hole, and a moving mechanism to move the solvent vapor discharge nozzle from an edge to a center of the substrate. The substrate is rotated around the vertical axis while moving the solvent vapor discharge nozzle from the edge to the center of the substrate, discharging the solvent vapor from the discharge hole, to supply the solvent vapor over the substrate in a spiral manner.

Abstract: An apparatus for depositing coating onto a substrate including a housing having a nozzle including a nozzle orifice, a fluid source configured to deliver coating fluid to the nozzle, and a solvent vapor emitter. The solvent vapor emitter can be located proximate to the nozzle, for example, such as behind the nozzle orifice and/or in a direction substantially parallel to a central axis of the housing. During coating, coating fluid may exit the nozzle and is deposited onto the substrate while the solvent vapor emitter emits solvent vapor proximate to the nozzle orifice.

Abstract: A method and apparatus for forming a semiconductor sheet suitable for use as a solar cell by depositing an array of solidified drops of a feed material on a sheet support. The desired properties of the sheet fabricated with the teaching of this invention are: flatness, low residual stress, minority carrier diffusion length greater than 40 microns, and minimum grain dimension at least two times the minority carrier diffusion length. In one embodiment, the deposition chamber is adapted to form and process sheets that have a surface area of about 1,000-2,400 cm2.

Abstract: A method and apparatus for manufacturing composite components. A tool is present for use in manufacturing composite components. The tool comprises an encapsulation layer having a shape, an insulation layer on the encapsulation layer, and an isolation layer on the insulation layer. The isolation layer has an outer surface capable of contacting a composite material laid up on the outer surface. The insulation layer is capable of insulating the encapsulation layer from heat applied to the composite material. The encapsulation layer is capable of maintaining a shape with the composite material laid up on the isolation layer during a curing process to form a composite component from the composite material.

Abstract: A substrate treating apparatus is capable of promptly heating substrates after exposure, and avoiding an adverse thermal influence on an exposing apparatus. A developing block includes heating modules for heating exposed substrates. An interface block is interposed between the heating modules and the exposing apparatus to isolate the exposing apparatus from the thermal influence of the heating modules. The interface block has a transport mechanism for transporting the substrates to the heating modules, whereby the exposed substrates are promptly transferred to the heating modules.

Abstract: A deposition method which deposits a CdS buffer layer on a surface of a solar cell from a process solution including all chemical components of the CdS buffer layer material. CdS is deposited in a deposition chamber by heating the surface of the solar cell absorber to cause the transfer of heat from the solar cell absorber layer to at least a portion of the process solution that is in contact with the surface. Used solution is cooled, and replenished in a solution container and redirected into the deposition chamber.

Abstract: A method and system of coating an implantable device, such as a stent, are provided.

Abstract: The disclosure relates to a hot air drier assembly for a solvent and waterborne paint spray booth for drying a substrate coated with liquid waterborne basecoat located inside the spray booth, comprising: a free-standing portable heat exchange device with a hot air outlet directed towards the substrate and a heat exchange fluid heating device located remotely from the paint spray booth and in fluid communication with the heat exchange device via heat exchange fluid conduits which are in fluid communication with heat exchange fluid conducting tubes for heating spray booth air directed from the spray booth air intake to the heat is exchange chamber and out the hot air outlet. The disclosure additionally relates to a paint spray booth incorporating the hot air drier assembly and methods for drying a substrate using the hot air drier assembly.

Abstract: The invention includes a hermetic container provided with a substrate mount; a vacuum exhauster connected to the hermetic container; a current member; and a current member raising and lowering mechanism. When the current member is raised and lowered as a function of the pressure inside the hermetic container, a liquid flow of the coating solution on the substrate is controlled, thereby controlling the uniformity of the film thickness of the coating solution.

Abstract: A method for performing a predetermined process on a substrate having coating film formed thereon includes preparing a data base denoting a relationship between each of parameters and a processing time of a predetermined process and storing the data base in a control section. The parameters include the temperature of a disposing plate, a supply rate of an ammonia gas, and an amount of a water vapor contained in the ammonia gas. The method further includes inputting a preset specific time value of the process into the control section; calculating candidate values of the parameters to finish the predetermined process by the specific time value; and determining specific values of the parameters to be used, based on the candidate values.

Abstract: The invention relates to a device (10) for hardening an UV varnish and thermohardening varnish or the similar for coating an object, in particular a motor car body (12) comprising at least one emitter (48, 48?) generating electromagnetic radiation. The inventive device is provided with a conveying system (14, 16) which conveys the object (12) closely to the emitter (48, 48?) and, afterwards removes it. Said conveying system comprises an overhead travelling carriage (16) which is translatory displaceable along at least one guideway (14) suspended above at least one emitter (48, 48?). Two suspension supports (66) extending downwards and making it possible to suspend the object (12) are arranged successively in a longitudinal direction (85) on a chassis (50) of the travelling carriage (16). The length of said suspension supports is individually modifiable with the aid of a motor.

Abstract: A device and a method for delivering a fluid, in particular hot-melt adhesive. The device includes a base member having an inlet opening for receiving the fluid from a fluid source and an outlet opening for delivering the fluid to a nozzle arrangement. The nozzle arrangement has a discharge passage with a discharge opening for delivery of the fluid. A heat transfer member heats or cools the fluid and includes a heat transfer passage through which the fluid can flow. The heat transfer passage is of a flow cross-section which changes in the flow direction.

Abstract: Systems and methods for in-situ annealing of metal layers as they are being plated on a substrate by action of a chemical solution are provided. The in-situ annealing, in conjunction with controlled slow growth rates, allows control of the structure of the plated metal layers. The systems and methods are used for maskless plating of the substrates.

Abstract: A process for preparing a coated plasterboard, comprising the following steps in the following order in one production cycle: a) forming a plasterboard; b) drying the plasterboard in a drying device; c) coating the plasterboard by spraying with a coating agent after said drying; d) stacking the plasterboards; wherein there is a period of time of less than 60 seconds between the end of the coating and the stacking of the plasterboards.

Abstract: A fabrication apparatus and fabrication method of a semiconductor device are provided, allowing the temperature distribution of a substrate to be rendered uniform. The fabrication apparatus for a semiconductor device includes a susceptor holding the substrate, a heater arranged at a back side of the susceptor, a support member located between the substrate and susceptor, including a support portion, and a spacer located between the susceptor and support member. The spacer has an opening formed corresponding to the site where said support portion is located, at an opposite face side of the support member.

Abstract: An apparatus for applying a wax seal to an article such as a wine bottle including a bottom tank formed of at least one upstanding wall and a bottom wall and having an open top end, the bottom tank being fitted with electrical heating means; an upper tank formed of at least one upstanding wall and having an open top end and a closed bottom wall, the upper tank being fitted with electrical heating means, the upper tank being connected at its closed bottom wall with the open top end of said bottom tank, a screen adjustably located inside the upper tank, a pump located in the bottom tank and extending into the upper tank for conveying molten wax from the bottom tank to the upper tank and an overflow opening in the upper tank.

Abstract: Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a drying/development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The drying/development processing block comprises a drying processing group. The interface block comprises an interface transport mechanism. A substrate is subjected to exposure processing by the exposure device, and subsequently transported to the drying processing group by the interface transport mechanism. The substrate is cleaned and dried by the drying processing group.

Abstract: A crucible heating apparatus and a deposition apparatus including the same. The crucible heating apparatus includes: a crucible including a main body to house a deposition material, and a cover disposed on the main body, having a nozzle; a band coupled to the crucible, through contact parts; a thermocouple coupled to the band; a housing to house the crucible and the band; and a heater disposed inside the housing, to heat the deposition material.

Abstract: A vertical heat treatment apparatus enabling the insertion of a temperature sensor in the reaction tube without disassembling the apparatus is disclosed. The vertical heat treatment apparatus includes a reaction tube; a heating section; a wafer holding section; a supporting section movably provided in the vertical direction so as to seal the reaction tube while the wafer holding section is in the reaction tube; a temperature sensor insertion section provided in the supporting section and having a through hole for guiding a temperature sensor so that the temperature sensor can be inserted into the reaction tube; and a cap section for opening and closing the through hole of the temperature sensor insertion section while the wafer holding section is on the supporting section.

Abstract: While one side of a lens L is held by a suction-holding member 17 and the suction-holding member 17 is moved by the moving mechanism, a coating process, a drying process, and a curing process are sequentially performed in respective receptacles disposed independently of each other. A suction force applied to the lens L by the suction-holding member 17 is controlled by a control section 22 in accordance with each of the receptacles in which the suction-holding member 17 is positioned.

Abstract: An apparatus and process for protecting metal from oxidation during metal forming operations. A salt is deposited onto at least a portion of a surface of the metal. The salt is heated in a protective environment until the salt melts on the metal to form a coated metal. The protective environment may then be removed and the coated metal may be exposed to an active environment. The coated metal may then be formed using standard metal forming processes. In alternative embodiments salts are selected for particular melting and vaporizing temperatures. An automated apparatus for coating a metal object with a salt may be provided. An applicator is configured to deposit the salt onto a surface of the metal object to form a salted metal object. A furnace is configured to receive the salted metal object and to melt at least a portion of the salt on the surface of the salted metal object.

Abstract: A substrate treating apparatus includes a plurality of substrate treatment lines arranged vertically. Each substrate treatment line has a plurality of main transport mechanisms arranged horizontally, and a plurality of treating units provided for each main transport mechanism for treating substrates. A series of treatments is carried out for the substrates, with each main transport mechanism transporting the substrates to the treating units associated therewith, and transferring the substrates to the other main transport mechanism horizontally adjacent thereto. The substrate treating apparatus realizes increased processing capabilities by treating the substrates in parallel through the substrate treatment lines.

Abstract: The present invention has an object of providing a substrate processing apparatus and a semiconductor device manufacturing method that can prevent adverse effects on electrical characteristics and provide a thinner EOT. A semiconductor device manufacturing method comprises the steps of: forming a metal oxide film on a silicon substrate, and forming a silicate film by inducing a solid phase reaction between the metal oxide film and the silicon substrate by heat treatment, and forming a high dielectric constant insulating film on the silicate film.