Abstract: A linear evaporation source is disclosed. In one aspect, the source includes a crucible storing an evaporated material, a heater unit surrounding the crucible and heating the crucible, and a plurality of lateral reflectors surrounding a lateral surface of the heater unit. Each of the lateral reflectors includes a first reflector combined with the heater unit while being spaced apart from the heater unit and having a plurality of first openings and a second reflector movably combined with the first reflector and having a second opening. Open ratios of the lateral reflectors are independently adjusted to control a temperature of the crucible according to areas of the crucible. Thus, deposition uniformity of the linear evaporation source is enhanced.

Abstract: A solution for manufacturing semiconductors is provided. An embodiment provides a chemical vapor deposition reactor, which includes a chemical vapor deposition chamber. A substrate holder located in the chemical vapor deposition chamber can be rotated about its own axis at a first angular speed, and a gas injection component located in the chemical vapor deposition chamber can be rotated about an axis of the gas injection component at a second angular speed. The angular speeds are independently selectable and can be configured to cause each point on a surface of a substrate wafer to travel in an epicyclical trajectory within a gas flow injected by the gas injection component. An angle between the substrate holder axis and the gas injection component axis and/or a distance between the substrate holder axis and the gas injection component axis can be controlled variables.

Abstract: There is provided a slit valve unit including: a body disposed on an outer side of a process chamber and having an entrance connected to an opening of the process chamber; a slit valve provided in an internal space of the body and selectively opening and closing the entrance; a plurality of packing members provided along the circumference of the entrance on an inner side of the body and tightly attached to the slit valve when the slit valve shields the entrance; and a connection pipe having one end exposed between the plurality of packing members on the inner side of the body so as to be connected to an airtight space formed among the plurality of packing members, the body, and the slit valve, and the other end exposed to the outer side of the body, the connection pipe penetrating the body.

Abstract: A coating apparatus for applying a film to a substrate is provided. The coating apparatus includes a coating chamber, a filament fixture having a filament array, a tensioning device to maintain tension on the filament array to maintain filaments in a planar array during the application or removal of current or heat to the filaments, and a movable stage arranged to hold the substrate to be treated in the coating apparatus in proximity to the filament array so as to maintain a constant thermal gradient across the substrates being treated in the apparatus. An apparatus for applying nanocrystalline diamond to a substrate is also provided.

Abstract: A method for applying a coating to a cable, the cable having a longitudinal direction, includes A) cleaning the surface of the cable, and B) applying coating to the cable by rotating a coating application means around the cable allowing the application of the coating. The steps are performed from a platform being moved along the cable in a movement direction by at least three wheels that are fastened in a force-locking manner to the cable. Step A) is performed in the movement direction before the wheels, and step B) is performed in the movement direction behind the wheels. The wheels are driven by a motor that can be controlled in such a manner that the platform can be positioned at predefined positions reproducibly.

Abstract: A method of fabricating a photovoltaic device 100, includes the steps of providing a glass substrate 102, depositing a molybdenum layer 104 on a surface of the glass substrate, directing light through the glass substrate to the near-substrate region of the molybdenum layer 206, detecting an optical property of the near-substrate region of the molybdenum layer after interaction with the incident light 208 and determining a density of the near-substrate region of the molybdenum layer from the detected optical property 210. A molybdenum deposition parameter may be controlled based upon the determined density of the near-substrate region of the molybdenum layer 218. A non-contact method measures a density of the near-substrate region of a molybdenum layer and a deposition chamber 300.

Abstract: An apparatus for plasma processing a substrate is provided. The apparatus comprises a processing chamber, a substrate support disposed in the processing chamber, and a lid assembly coupled to the processing chamber. The lid assembly comprises a conductive gas distributor coupled to a power source. A tuning electrode may be disposed between the conductive gas distributor and the chamber body for adjusting a ground pathway of the plasma. A second tuning electrode may be coupled to the substrate support, and a bias electrode may also be coupled to the substrate support.

Abstract: An organic layer deposition apparatus includes a transfer unit; a first conveyer unit including a guide member having accommodation grooves, a first accommodation part, a second accommodation part, and a connection part that connects the first accommodation part to the second accommodation part; a second conveyer unit for moving the transfer unit without the substrate; a loading unit for fixing the substrate on the transfer unit; a deposition unit including a chamber and an organic layer deposition assembly; and an unloading unit for separating the substrate, wherein the first accommodation part of the guide member is located close to ground compared to the second accommodation part, and includes a lower member, an upper member, elastic members located between the lower and upper members. The substrate fixed on the transfer unit is spaced from the organic layer deposition assembly while being transferred by the first conveyer unit.

Abstract: An organic layer deposition apparatus, a method of manufacturing the same, and an organic light-emitting display apparatus using the same, and an organic light-emitting display apparatus manufactured using the method, are disclosed. An organic layer deposition apparatus is suitable for mass production of organic light-emitting display apparatuses on large-size substrates, and enables high-precision patterning. A method of manufacturing an organic light-emitting display apparatus by using the organic layer deposition apparatus, and an organic light-emitting display apparatus manufactured using the method, are disclosed.

Abstract: An unlimited movable printing system that allows an operator to accurately and repeatedly print original drawings on a work side and a printing method thereof.

Abstract: According to one embodiment, a film forming apparatus includes: a stage on which a coating object is placed; a rotation mechanism rotating the stage; an application nozzle supplying a coating material to the coating object; an application moving mechanism moving the application nozzle; a controller which controls the rotation mechanism and application moving mechanism to rotate the stage and move the application nozzle between the rotation center and the outer edge and controls the application nozzle to apply the coating material to the coating object; and a sound wave generator which generates a sound wave. The film forming apparatus projects the sound wave onto the surface of the coating film.

Abstract: A fluid dispensing machine includes a frame and a fixture held by the frame. The fixture is configured to support a substrate. A positioning system is supported by the frame. A guidance system is supported by the positioning system. The guidance system has a camera viewing the fixture that is movable relative to the fixture. A fluid dispenser is supported by the positioning system and is moved by the positioning system relative to the fixture. The fluid dispenser is configured to dispense fluid onto the substrate. A controller communicates with the positioning system and the guidance system.

Abstract: A deposition apparatus includes a plurality of deposition sources that provides different deposition materials to a substrate, a sensor assembly that senses a deposition thickness of the deposition materials evaporated from the deposition sources, and a main controller that controls the sensor assembly. The sensor assembly includes a plurality of sensor groups each including a plurality of sensors and respectively corresponding to the deposition sources, and each of the sensor groups senses the deposition thickness of the deposition material evaporated from a corresponding deposition source of the deposition sources to the substrate in response to a control of the main controller.

Abstract: Provided is an integrated coating system. An integrated coating system according to an exemplary embodiment of the present invention includes: a unwinding means provided with a roll to supply a web; a worktable roll configured to support the web supplied from the unwinding means; a plurality of printing means configured to perform printing or coating on the web supplied from the unwinding means; a plurality of curing means each of which is modulated to cure a printing material on the web passing through at least one printing means; and a winding means around which the web, of which printing or coating work is completed by passing through the curing means, is wound in a roll shape.

Abstract: Apparatus, systems and methods for processing covers for electronic devices are disclosed. In one embodiment, oleophobic coatings can be deposited on the covers. Oleophobicity of the coatings can be monitored. In one embodiment, glass members can pertain to cover glass for housings of the electronic devices.

Abstract: A method for using a system, which includes a film formation apparatus for forming a high-dielectric constant thin film on target substrates together and a gas supply apparatus for supplying a process gas. The method includes a preparatory stage of determining a set pressure range of pressure inside a vaporizing chamber for a liquid material cooled at a set temperature. The preparatory stage includes obtaining a first limit value of pressure at which vaporization of the liquid material starts being inhibited due to an increase in the pressure, obtaining a second limit value of pressure at which vaporization of the liquid material starts being unstable and the pressure starts pulsating movement due to a decrease in the pressure, and determining the set pressure range to be defined by an upper limit lower than the first limit value and a lower limit higher than the second limit value.

Abstract: The present invention provides a liquid application device and an ink jet recording apparatus each capable of reducing deterioration in application quality due to an increase in the number of times of use of a roller, thereby improving durability. The present invention includes an application roller which applies liquid to an application medium, and a liquid retention member which retains the liquid in a liquid retention space formed by making the application roller be in contact with the retention member. With this structure, a pool of the liquid is formed, with rotation of the application roller, in an area upstream of a contact area, in a rotational direction, between the application member and the retention member at a side where a surface of the application member enters the contact area therebetween.

Abstract: Systems and methods for plasma processing of microfeature workpieces are disclosed herein. In one embodiment, a method includes generating a plasma in a chamber while a microfeature workpiece is positioned in the chamber, measuring optical emissions from the plasma, and determining a parameter of the plasma based on the measured optical emissions. The parameter can be an ion density or another parameter of the plasma.

Abstract: A thickness adjustment device for thin-film coating is revealed. The thickness adjustment device for thin-film coating includes a coating device, a support set, and a thickness adjustment unit. The coating device consists of a work piece conveyor that delivers a work piece, and a material supply unit that carries a coating material onto a surface of the work piece to form a film. The support set is connected to the coating device while the thickness adjustment unit is inserted through and mounted on the support set. The thickness adjustment unit includes a scrape part disposed correspondingly to the work piece and used for applying coating material to form the film. The thickness of the film is adjusted according to a controlling force or torque of the thickness adjustment unit that presses downward. Thus the film is coated on the work piece evenly and the film coating quality is increased.

Abstract: A measuring unit 13 is provided inside a rotary drum 11. The measuring unit 13 is provided with a light transmitting member 13a and an optical sensor 13b that are provided at the central region on the inner wall of the other end portion 11b. When particles are subjected to a coating treatment, information as to the properties (such as the coating thickness, the moisture, the coating performance, and the impurity) of the particles of a particle layer A being brought into contact with the surface of the light transmitting member 13a is measured on a real-time basis by the NIR sensor 13b via the light transmitting member 13a. The data is processed by the processing unit of the NRI spectroscopic analyzer to thereby perform monitoring.

Abstract: A cassette 42 comprises a tape type storing/feeding unit 42f, and an ink spraying member 72 provided with an ink spraying port 72p, through which the ink reserved in an ink reservoir 74 is sprayed. The ink spraying member 72 is disposed in at least one of side surfaces of the storing/feeding unit 42f.

Abstract: Methods and apparatus for processing a substrate are described herein. A vacuum multi-chamber deposition tool can include a degas chamber with both a heating mechanism and a variable frequency microwave source. A method for degassing a substrate can include positioning a substrate comprising a polymer or an epoxy within a processing chamber maintained between a degas temperature and a glass transition temperature, exposing the substrate to variable frequency microwave radiation, exposing the substrate to a plasma comprising an inert gas, removing oxygen containing compounds from the chamber, raising the pressure of inert gas in the chamber, and maintaining the pressure of inert gas while cooling the substrate to a temperature lower than the degas temperature.

Abstract: Provided is an apparatus for manufacturing a light guiding plate. The apparatus for manufacturing a light guiding plate includes an unwinding unit unwinding a film formed of a flexible material and wound in a roll shape, a winding unit winding the film provided from the unwinding unit in a roll shape, a surface treatment unit disposed between the unwinding unit and the winding unit to treat a surface of the film transferred into the winding part into a hydrophobic surface, a pattern formation unit disposed between the surface treatment unit and the winding unit to form a micro lens pattern on the surface of the film of which the surface is treated, and a pattern curing unit disposed between the pattern formation unit and the winding unit to cure the pattern.

Abstract: A deposition apparatus includes deposition sources, a deposition chamber, a mask assembly, and a transfer unit. The mask assembly includes a support member, a shutter member, and a drive member. The support member has a first opening configured to allow the deposition materials to pass through while supporting the base substrate on which the passed-through deposition materials are deposited. The shutter member is accommodated in the support member and has a second opening smaller than the first opening. The drive member is configured to change a position of the second opening with respect to the base substrate in accordance with the movement of the mask assembly.

Abstract: An apparatus for forming a pattern of a nanoparticle-based ink on a surface of a substrate has a surface conditioning apparatus for conditioning at least a portion of the surface for adhesion of the nanoparticle-based ink; a printing apparatus that is energizable to deposit the pattern of nanoparticle-based ink on the conditioned portion of the surface of the substrate; an illumination apparatus that is energizable to direct illumination energy to cure the deposited ink pattern on the substrate surface; and a transport apparatus that is energizable to provide relative motion between the substrate and the illumination apparatus.

Abstract: A printing device includes a print head configured to execute printing on one surface of a long-size medium to be printed, on the other surface of which a plurality of oblique lines of the same angle of obliquity are formed at regular intervals, a conveying section configured to convey the medium to be printed, a sensor configured to detect the oblique lines, and a control section configured to control the print head to execute printing while changing a position of printing on the medium to be printed in accordance with an interval between the oblique lines in a conveying direction of the medium to be printed detected by the sensor.

Abstract: An atomic layer deposition system with multiple flows comprises: a square vacuum chamber, which internally has four pairs of intakes and vents to control the flowing in-and-out of precursors and improve the quality of coating and the coating uniformity of an asymmetrical testing member; plural gas detection sensors, which monitor the states of the exhausting of the precursors in the chamber and automatically controls and alarms for the amount of the induction of the precursors to prevent the obstruction of the vents; and a discrete pyramidal cover, which has a precursor intake in the top of the cover, the pipelines of the induction of the precursors and the pipelines of the four pairs of the intakes and the vents are integrated in order to cooperate with the cover while coating a three-dimensional element, a vertical flow field of the precursors is then produced from top to bottom in the cover.

Abstract: Provided is an ion implantation method of transporting ions generated by an ion source to a wafer and implanting the ions into the wafer by irradiating an ion beam on the wafer, including, during the ion implantation into the wafer, using a plurality of detection units which can detect an event having a possibility of discharge and determining a state of the ion beam based on existence of detected event having a possibility of discharge and a degree of influence of the event on the ion beam.

Abstract: A method of manufacturing a semiconductor device includes the steps of: providing a supply of molecules containing a plurality of dopant atoms into an ionization chamber, ionizing said molecules into dopant cluster ions, extracting and accelerating the dopant cluster ions with an electric field, selecting the desired cluster ions by mass analysis, modifying the final implant energy of the cluster ion through post-analysis ion optics, and implanting the dopant cluster ions into a semiconductor substrate. In general, dopant molecules contain n dopant atoms, where n is an integer number greater than 10. This method enables increasing the dopant dose rate to n times the implantation current with an equivalent per dopant atom energy of 1/n times the cluster implantation energy, while reducing the charge per dopant atom by the factor n.

Abstract: An adhesive application apparatus for applying a liquid adhesive to an object includes a regular application stage against which the object is placed for a regular application of the liquid adhesive to the object, a trial application stage to which a trial application of the liquid adhesive is carried out, an application unit relatively movable with respect to the regular application stage and trial application stage to carry out the regular application and trial application of the liquid adhesive, and a suction unit carrying out a suction operation of the liquid adhesive used in the trial application. The adhesive application apparatus smoothly carries out the trial application of the liquid adhesive without bothering the operation of an adhesive application line.

Abstract: Embodiments of the present invention provide a CVD repair apparatus, in which an auxiliary gas is ejected from a gas-storage module, impinging upon a substrate, and bounced back to a pressure-sensitive sensor provided on a lower surface of a gas-ejection device, so that the gas pressure is detected, and based on the detected gas pressure, the distance between the substrate and the gas-ejection device is determined; when the distance between the substrate and the gas-ejection device is less than a preset lower-limit value, by increasing the auxiliary-gas amount ejected from the gas-storage module to lift up the gas-ejection device, or by preventing the gas-ejection device from moving parallel to the substrate, the substrate is avoided an inadvertent scratch during the movement of the gas-ejection device.

Abstract: The present disclosure presents a chemical vapor deposition reactor having improved chemical utilization and cost efficiency. The wafer susceptors of the present disclosure may be used in a stackable configuration for processing many wafers simultaneously. The reactors of the present disclosure may be reverse-flow depletion mode reactors, which tends to provide uniform film thickness and a high degree of chemical utilization.

Abstract: In a paint plant which comprises at least one spray-painting device incorporating at least one application unit for painting workpieces and in particular motor vehicle bodies with a fluid paint, in order to enable the fluid paint overspray i.e. the paint particles which are not adhering to the workpieces that are to be painted and which are picked up and carried along in an air flow passing through the application area of the paint shop, to be re-separated from this air flow and also to enable the cleansed air flow to be returned to the application area in an air re-circulating system or else expelled into the environment of the plant, the paint shop comprises a device for separating fluid paint overspray from a stream of crude gas that contains overspray particles wherein this device comprises at least one filter element for separating the overspray from the stream of crude gas.

Abstract: Method and device for providing dough products with a topping material, comprising a dough product conveyor, for transporting the dough products, a topping dispenser for dispensing topping material onto the dough product conveyor, comprising a topping conveyor, for conveying the topping towards a dispensing location above the dough product conveyor, a collector for superfluous topping material from the dough product conveyor, a supply system, for supplying the topping conveyor with topping material from the collector or from a reservoir with fresh topping material, characterised by a topping material sensor for measuring the amount of topping material on the topping conveyor, a controller, for controlling the amount of topping material to be dispensed by adjusting the speed of the topping conveyor; and the ratio of topping material from the reservoir and the collected superfluous topping material.

Abstract: The metallurgical composition of a machine surface may be determined. Based on the composition of the surface layer and its substrate materials, a mixture of pure metal nanoparticles, each coated with a monomolecular organic layer adsorbed on its surface can be mixed with catalysts, reaction initiators, and/or other necessary ingredients for the repair action of the machine surface, depending on the specific machine, operational type, and/or the nature of the damage. The nanoparticles are applied to the machine surface, the organic monolayer wears away from the nanoparticles under shear stresses and the nanoparticles adhere to the machine surface to form a repair layer on the machine surface, thereby providing a repaired surface.

Abstract: A method of preparing a surface for deposition of a thin film thereon, wherein the surface including a plurality of protrusions extending therefrom and having shadowed regions, includes locally treating at least one of the protrusions.

Abstract: Provided are a deposition method of patterning a thin film on a substrate using momentary Joule heating in a vacuum environment, and a method thereof. The deposition device forms a deposition target layer on one surface of a source substrate as a pattern to be deposited. A deposition target layer forming unit forms a deposition target layer on the one surface of the source substrate to cover the conductive layer. A chamber in a vacuum state receives the source substrate on which the conductive layer and the deposition target layer are formed and the target substrate. A target substrate is disposed in the chamber to face the source substrate. A power supply applies power to the conductive layer to heat-generate the conductive layer. A configuration of the deposition device is very simple, and it is easy to uniformly form a deposition thickness.

Abstract: A single axis application unit for processing a glass workpiece includes a workpiece supporting table, an applicator movable on a traveler shiftable along a first linear axis and a central suction unit that is activateable to grip the glass workpiece that travels along a second linear axis oriented generally perpendicular to the first linear axis. A central suction unit brake selectively secures the central suction unit both rotationally and translationally. The central suction unit is freely moveable both translationally and rotationally when the central suction unit brake is released. A mid-peripheral suction unit is located at a fixed location remote from the central suction unit and selectively activateable to grip the glass workpiece to hold the glass workpiece in a fixed orientation. A corner suction gripper is movable with the applicator parallel to the first linear axis, and is selectively activateable to grip the glass workpiece.

Abstract: Provided is an apparatus for coating a photoresist on a substrate. The photoresist coating apparatus includes a nozzle, a discharge unit, and a foreign substance barrier. The nozzle coats a photoresist on the substrate. The discharge unit is formed in a body with a lower portion of the nozzle and discharges a photoresist. The foreign substance barrier is formed at a front lower portion of the nozzle and protects the discharge unit from a foreign substance on the substrate.

Abstract: A flux monitor system includes a light source and a sensor.

Abstract: The present invention relates to an apparatus and a method for measuring the dimensions of 1-dimensional and 0-dimensional nanostructures on semiconductor substrates in real-time during epitaxial growth. The method includes either assigning a pre-calculated 3D-model from a data base to the sample or calculating a 3D-model of the sample using the measured optical reflectances of the plurality of different measuring positions of the sample, where calculation or pre-calculation of the 3D-model includes calculation of the interference effects of light reflected from the front and back interfaces of the nano-structure and calculation of the interference effects due to superposition of neighbouring wave-fronts reflected from the nano-structure area and wave-fronts reflected from the substrate area between the nano-structures.

Abstract: In a ticket printer, an end of a paper sensor has an optic emitter and receiver arranged one after the other in the paper advancement direction and operationally connected together via a signal guide. The emitter and the receiver are arranged on one side of the path of the paper whereas the signal guide is arranged on the opposite side.

Abstract: Coating apparatus including a spray to provide a coating, a controller to control the spray to vary a spraying width of the spray, and a first roller to receive the coating and to smear the coating on a substrate.

Abstract: Provided is a film crack detecting apparatus capable of recognizing a possibility of occurrence of particles in real time by detecting film cracks of an unnecessary film adhered to a probe unit provided in a processing container. The film crack detecting apparatus is provided in a film forming apparatus, which includes a processing container configured to accommodate an object to be processed and forms a thin film on a surface of the object, to perform a film crack detection operation. The film crack detecting apparatus includes a probe unit installed within the processing container, an elastic wave detecting unit attached to an end of the probe unit to detect an elastic wave, and a determination unit configured to determine whether the maintenance of the processing container is necessary based on a detection result of the elastic wave detecting unit.

Abstract: An organic layer deposition apparatus, a method of manufacturing an organic light-emitting display device by using the same, and an organic light-emitting display device manufactured using the method, and in particular, an organic layer deposition apparatus that is suitable for use in the mass production of a large substrate and enables high-definition patterning, a method of manufacturing an organic light-emitting display device by using the same, and an organic light-emitting display device manufactured using the method.

Abstract: Systems and methods for producing, applying and evaluating coating compositions are disclosed. The amounts of components contained in the coating compositions may be monitored, along with processing parameters when the coating compositions are applied to various substrates. In certain embodiments, the characteristics of a produced sample coating are compared with the characteristics of a target or reference coating to determine if they are sufficiently matched.

Abstract: A vapor deposition particle emitting device of the present invention includes: a nozzle section (110) having emission holes (111) from which gaseous vapor deposition particles are emitted out; a heating plate unit (100), provided in the nozzle section (110), which is made up of heating plates (101) each having a surface on which a vapor deposition material remains as a result of adherence of vapor deposition particles to the surface; and a heating device (160) for heating the vapor deposition material, which is thus remaining on the surface of each of the heating plates (101), so that a temperature of the vapor deposition material is not less than a temperature at which to become transformed into gaseous form.

Abstract: An organic layer deposition apparatus includes: a conveyer unit including a transfer unit for attaching a substrate, a first conveyer unit, and a second conveyer unit; and a deposition unit including a vacuum chamber and an organic layer deposition assembly for depositing an organic layer on the substrate. The organic layer deposition assembly includes: a deposition source for discharging a deposition material; a deposition source nozzle unit including a plurality of deposition source nozzles; a patterning slit sheet including a plurality of patterning slits that are arranged in a first direction; and a deposition source shutter that moves in the first direction, and selectively blocks the deposition material that is vaporized in the deposition source. The transfer unit moves between the first and second conveyer units. The transfer unit keeps the attached substrate spaced apart from the organic layer deposition assembly while being transferred by the first conveyer unit.

Abstract: An apparatus for depositing and inspecting an organic light emitting display panel includes a depositor part configured to deposit thin film layers on a panel, the thin film layers including an anode layer, an organic film layer, and a cathode layer, and an inspector part configured to measure spectra of light reflected from the thin film layers, compare the measured spectra to reference spectra, and determine thickness correctness of individual thin film layers.

Abstract: A system for depositing a substance onto a substrate comprises continuously transporting the substrate in a transport direction while traversing a deposition arrangement across the substrate to deposit the substance in a number of swathes. During such movement the positions of the deposition arrangement and the substrate are controlled with respect to one another such that the swathes complement one another to provide substantially uniform coverage of the substrate. As a result of the defined arrangement, improved substrate speeds can be achieved since there is no need for the substrate to stop at each traverse.