Abstract: A high-energy ion implanter includes: a beam generation unit that includes an ion source and a mass analyzer; a high-energy multi-stage linear acceleration unit that accelerates an ion beam so as to generate a high-energy ion beam; a high-energy beam deflection unit that changes the direction of the high-energy ion beam toward the wafer; and a beam transportation unit that transports the deflected high-energy ion beam to the wafer. The deflection unit is configured by a plurality of deflection electromagnets, and at least a horizontal focusing element is inserted between the plurality of deflection electromagnets.

Abstract: The gas nozzle comprises: an outer tube part that is provided in an upright position with respect to the liquid surface of molten metal; an inner tube part provided inside the outer tube part, comprising a cavity inside, through which a wire rod pulled up from the molten metal passes; a void part formed between the outer tube part and the inner tube part; a gas introduction part for introducing gas into the void part; and a jetting port for jetting at least part of the gas introduced by the gas introduction part, via the void part, from one end of the outer tube part towards the liquid surface of the molten metal.

Abstract: A substrate treating apparatus including: a chamber capable of accommodating a substrate; a treating part which conducts a predetermined treatment associated with forming a coating film containing a metal to the substrate accommodated in the chamber; and a detection part which detects a concentration of a predetermined gas containing a chalcogen element within a gas inside the chamber.

Abstract: A high-energy ion implanter includes a high-energy multi-stage linear acceleration unit that accelerates an ion beam so as to generate a high-energy ion beam, a deflection unit that changes the direction of the high-energy ion beam toward a semiconductor wafer, and a beam transportation unit that transports the deflected high-energy ion beam to the wafer. The beam transportation unit includes a beam shaper, a high-energy beam scanner, a high-energy electric field type beam collimator, and a high-energy electric field type final energy filter.

Abstract: A temperature controlled substrate support assembly used for processing a substrate in a vacuum chamber of a semiconductor processing apparatus. The substrate support assembly comprises a top plate for supporting the substrate. A base plate is disposed below the top plate wherein the base plate comprises a cavity in an upper surface of the base plate. A cover plate is disposed between the top plate and the base plate. At least one thermoelectric module is in the cavity in the upper surface of the base plate wherein the at least one thermoelectric module is in thermal contact with the top plate and the base plate, and the at least one thermoelectric module is maintained at atmospheric pressure.

Abstract: According to one embodiment, a semiconductor manufacturing apparatus includes a substrate stage, a transfer unit, and a control unit. A substrate is settable on the substrate stage. The transfer unit is configured to transfer a pattern having an uneven configuration onto a major surface of the substrate by attachably and removably holding a template. The pattern is provided in the transfer surface. The control unit is configured to acquire information relating to a number of foreign objects on the major surface prior to the transferring of the pattern. The control unit adds the number for a plurality of the substrates including the pattern transferred by the transfer unit. The control unit causes the transfer unit not to implement the transferring of the pattern in the case where the sum has reached the upper limit.

Abstract: A liquid crystal material dispensing apparatus includes a spacer height measuring unit for measuring a height of a spacer on a substrate, and a liquid crystal material dispensing system for determining an amount of the liquid crystal material to be dispensed on the substrate based upon the measured spacer height and for dispensing the liquid crystal material onto the substrate.

Abstract: A deposition substrate transferring unit that can deposit a deposition material at an exact location on a substrate, includes an electrostatic chuck that has a first surface to which a substrate is attached; and a carrier having a surface that combines with a second surface of the electrostatic chuck to move the electrostatic chuck in a first direction. The carrier includes accommodation parts disposed in empty space within the carrier, and supplementary ribs respectively formed on surfaces of the accommodation parts.

Abstract: The invention relates to a sealed thin-film device, to a method of repairing a sealing layer applied to a thin-film device to produce the sealed thin-film device, to a system for repairing the sealing layer applied to the thin-film device to generate the sealed thin-film device and to a computer program product. The sealed thin-film device comprises a thin-film device and a sealing layer applied on the thin-film device for protecting the thin-film device from environmental influence. The sealing layer comprises at least a first and a second barrier layer and a getter layer arranged between the first and the second barrier layer. The sealed thin-film device further comprises locally applied mending material for sealing a local breach in an outer one of said barrier layers.

Abstract: The present invention relates to a device 10 and a method for curtain-coating of panel-shaped components 60 as well as components which have been manufactured by such a method. The device comprises a device 40 for generating a liquid curtain 42 of coating material, an input transport device 20 and an output transport device 30, wherein the output transport device 30 and/or the input transport device 20 can be height-adjusted.

Abstract: A substrate ejection detection device is used for substrate processing apparatus configured to process a substrate by continuously rotating a turntable holding the substrate on a concave portion formed in a surface thereof to receive the substrate thereon. In the substrate processing device, the turntable is substantially horizontally provided in a chamber. The substrate ejection detection device includes a substrate ejection determination unit configured to determine whether the substrate is out of the concave portion by determining whether the substrate exists on the concave portion while rotating the turntable.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, a substrate holder on which the one ore more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, and a gas supply unit disposed inside the external reaction tube to supply a reaction gas into the process space, the gas supply unit forming a flow of the reaction gas having different phase differences in a vertical direction.

Abstract: The imprint apparatus of the present invention includes a holding unit configured to hold a mold; a particle inspection unit configured to inspect whether or not particle is present on an imprint area, in which the resin pattern is formed, of the substrate; a dispenser configured to apply an uncured resin to the imprint area; a movable unit configured to move the imprint area with respect to the holding unit; and a controller. The movable unit is capable of moving the imprint area to each of an inspection position by means of the inspection unit, an application position by means of the dispenser, and a contacting position by means of the holding unit. Also, the controller causes the inspection unit to perform inspection of the imprint area in association with the movement of the imprint area by means of the movable unit.

Abstract: A substrate treatment apparatus configured such that substrates in a same lot are distributed by a delivery mechanism into a plurality of unit blocks, each unit block including a solution treatment module, an ultraviolet irradiation module, and a substrate carrying mechanism, the apparatus includes: an illuminance detection part that detects an illuminance of a light source of the ultraviolet irradiation module; and a control part that controls, when an illuminance detection value of the ultraviolet irradiation module in one unit block among the plurality of unit blocks becomes a set value or less, the delivery mechanism to stop delivery of a substrate to the one unit block and deliver subsequent substrates to another unit block, and the ultraviolet irradiation module to perform irradiation on substrates which have already been delivered to the one unit block with an irradiation time adjusted to a length according to the illuminance detection value.

Abstract: A method of depositing a film of forming a doped oxide film including a first oxide film containing a first element and doped with a second element on substrates mounted on a turntable including depositing the first oxide film onto the substrates by rotating the turntable predetermined turns while a first reaction gas containing the first element is supplied from a first gas supplying portion, an oxidation gas is supplied from a second gas supplying portion, and a separation gas is supplied from a separation gas supplying portion, and doping the first oxide film with the second element by rotating the turntable predetermined turns while a second reaction gas containing the second element is supplied from one of the first and second gas supplying portions, an inert gas is supplied from another one, and the separation gas is supplied from the separation gas supplying portion.

Abstract: The resistivity of a silicon boule may vary along its length, thereby making a uniform ion implantation process sub-optimal. A system and method for measuring a resistivity of a substrate, and processing the substrate based on that measured resistivity is disclosed. The system includes a resistivity measurement system, a controller and an ion implanting system, where the controller configures the ion implantation process based on the measured resistivity of the substrate.

Abstract: A system and method for determining the edge or region where a saw first enters a silicon brick, and using this information to process this region differently is disclosed. This region, referred to as the saw entry region, may be thinner, or have a rougher texture than the rest of the substrate. This difference may impact the substrate's ultimate performance. For example, if the substrate is processed as a solar cell, the performance of the saw entry region may be suboptimal.

Abstract: A deposition amount measuring apparatus includes a plate-shaped body having a rotating shaft, a plurality of deposition amount sensors along side surfaces of the body, the deposition amount sensors being configured to measure an amount of deposition material, and a housing surrounding the body, the housing including an inflow port that exposes one of the deposition amount sensors.

Abstract: Method and apparatus for treatment of a surface of a rotor blade of a windmill, the apparatus being placed in such a manner to be moveable in relation to the surface of a rotor blade, and the apparatus being caused to move depending on a form of treatment determined by means for treatment mounted on, in or next to the apparatus. In this manner, various forms of treatment of a rotor blade may be carried out such as for instance washing, finishing, sealing, etc.

Abstract: According to one embodiment, a film forming system includes: a stage including a placement surface on which an object to be coated is placed; a rotating mechanism rotating the stage in a rotational direction along the placement surface; an application nozzle discharging a material onto the object placed on the stage for application; a moving mechanism relatively moving the stage and the application nozzle along the placement surface in a cross direction crossing the rotational direction; a controller performing a control to rotate the stage on which the object is placed through the rotating mechanism while relatively moving the stage and application nozzle along the placement surface in the cross direction through the moving mechanism and applying the material to the object on the stage through the application nozzle; and a cleaning apparatus cleaning the application nozzle.

Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract: Methods, apparatuses and devices related to the manufacturing of compensation devices are provided. In some cases, an n/p-codoped layer is deposited for calibration purposes to minimize a net doping concentration. In other cases, alternatingly n- and p-doped layers are then deposited. In other embodiments, an n/p-codoped layer is deposited in a trench where n- and p-dopants have different diffusion behavior. To obtain different doping profiles, a heat treatment may be performed.

Abstract: Substrate processing systems and methods are described for processing substrates having two or more regions. The processing includes one or more of molecular self-assembly and combinatorial processing. At least one of materials, processes, processing conditions, material application sequences, and process sequences is different for the processing in at least one region of the substrate relative to at least one other region of the substrate. Processing systems are described that include numerous processing modules. The modules include a site-isolated reactor (SIR) configured for one or more of molecular self-assembly and combinatorial processing of a substrate.

Abstract: A deposition apparatus is capable of checking, in real time, the thickness or uniformity of a thin layer which is formed. The deposition apparatus includes a moving unit to which a substrate is detachably fixed. A conveyer unit conveys the moving unit in a first direction or in an opposite direction to the first direction. A deposition unit includes at least one deposition assembly for depositing a deposition material on the substrate. A discharge data acquisition unit acquires data associated with the amount of the deposition material discharged per unit time from the at least one deposition assembly. A transmission unit transmits the data acquired by the discharge data acquisition unit.

Abstract: The present invention relates to a method of preparing calcium carbonate coated calcium hydroxide particles by combining calcium hydroxide and dry ice in an acquiescent manner. The invention further relates to an apparatus for carrying out the method and to the use of the calcium carbonate coated calcium hydroxide particles of the method as filler for use with thermoplastics polymers.

Abstract: A system for controlling a boundary of spreading liquid adhesive on a surface is disclosed. The system includes one or more ultra-violet (UV) sources configurable to emit UV light onto the liquid adhesive; and a control circuit coupled to the one or more UV sources and configured to control the one or more UV sources to selectively apply the UV light at selected locations on the liquid adhesive to cure the adhesive and prevent its further spread at those locations.

Abstract: The invention provides an apparatus for manufacturing a cylindrical member comprising a cylindrical core body having an outer peripheral surface with a releasing property, the apparatus comprising: a film-forming device that forms a resin film in a region at a central portion from both ends in the axial direction of the outer peripheral surface of the core body; a judging device that judges the deterioration of the releasing property of regions continuous from the region where the resin film is to be formed in the region at the inner side from both ends in the axial direction of the outer peripheral surface of the core body, before the resin film is formed by the film-forming device; and a control device that controls the film-forming device such that the resin film is formed by exposing regions with an undeteriorated releasing property on both ends in the axial direction of the outer peripheral surface of the core body, in accordance with the results of judgment by the judging device.

Abstract: A graphical application system, with a surface spattering device, with at least one nozzle for expelling a spattering material onto a target surface, a nozzle control mechanism controls expelling of the nozzle. A spatial referencing unit references the spattering device in space and a computation means automatically controls the nozzle according to information from the spatial referencing unit and according to predefined desired spattering data as a digital image or a CAD-model of a desired pattern to be spattered onto the target surface. A communication means for establishing a communication link from the spatial referencing unit to the computation means to supply the position and orientation to the computation means. The spatial referencing unit is located remote from the spattering device and comprises at least two optical 2D cameras arranged with a stereobasis, for determining the position and orientation of images taken by the cameras.

Abstract: A method and a device for monitoring a property of a coating of a solid dosage form during a coating process forming the coating of the solid dosage form are provided. The device comprises a coating apparatus configured for forming the coating on the solid dosage form, and a monitoring apparatus configured for monitoring the property of the coating of the solid dosage form in process, wherein at least a part of the monitoring apparatus is located so as to have insight in an interior of the coating apparatus, the interior accommodating the solid dosage form to be coated and a precursor for forming the coating, and wherein the monitoring apparatus is configured for monitoring the property of the coating of the solid dosage form simultaneously with and during a coating process using low coherence interferometry.

Abstract: A low-pressure chemical vapor deposition (LPCVD) apparatus and a thin-film deposition method thereof The apparatus comprises a reaction furnace, having reaction gas input pipelines respectively arranged at a furnace opening part and a furnace tail part. During thin film deposition, each reaction gas is synchronously introduced into the reaction furnace through the input pipeline at the furnace opening part and the input pipeline at the furnace tail part.

Abstract: An assembly method of a voice coil motor for assembling component parts of a voice coil motor includes the following steps: (1) providing identifiable glue, and the identifiable glue is made by mixing colorable substance or phosphor into transparent glue; (2) coating the identifiable glue on connecting positions of the component parts; (3) curing the identifiable glue, and identifying the identifiable glue simultaneously to check dispensing and curing effect of the component parts. The assembly method can cure and check the voice coil motor simultaneously, thereby it can improve the production efficiency, reduce the manpower, and promote the development of the automated production line. An assembly device is also disclosed.

Abstract: Ionisation device, comprising a linear hollow cathode device which has hollow cathode electrodes, defining a main hollow cathode electrode gap in which a magnetic field created by means of magnetic elements is confined; and a gas distribution element in which a gas distribution cavity is arranged providing uniform gas distribution on the main hollow cathode electrode gap with suitable powering which in a substantially vacuum environment would be able to produce a substantially linear plasma discharge which is spatially extended by the relative position of the hollow cathode electrodes and an anode element wherein this extended plasma allowing a wide interaction with particles travelling from a coating material source ionised in order to produce a coating or a plasma treatment on a substrate surface.

Abstract: An apparatus for use in connection with application of decoration to a container by printing thereon includes a container transport system comprising a processing position configured to receive a container, a coating installation disposed at the processing position, and a transfer element. The transfer element applies a base coat to the container by rolling on or off the container.

Abstract: Systems and methods for soft pulsing are described. One of the systems includes a master radiofrequency (RF) generator for generating a first portion of a master RF signal during a first state and a second portion of the master RF signal during a second state. The master RF signal is a sinusoidal signal. The system further includes an impedance matching circuit coupled to the master RF generator via an RF cable to modify the master RF signal to generate a modified RF signal and a plasma chamber coupled to the impedance matching circuit via an RF transmission line. The plasma chamber is used for generating plasma based on the modified RF signal.

Abstract: A thin film deposition apparatus includes: a chamber; a mask stage in the chamber and configured to support a mask; a jig in the chamber and above the mask stage, the jig being configured to move in a direction of the mask stage; and a rail in the chamber and configured to support the movement of the jig. Another thin film deposition apparatus includes a chamber, a mask stage positioned within the chamber and configured to support a mask, a camera part proximate to a side of the mask stage, and a jig above the mask stage and configured to move in a direction of the mask stage and over the camera part. The jig is further configured to radiate laser beams in a downward direction from the jig to obtain first scanning data regarding the mask stage and second scanning data regarding the camera part.

Abstract: An object is to suppress differences in concentration between processing gases supplied to a plurality of works in a chemical solution vaporizing tank. The chemical solution vaporizing tank includes a tank body having a plurality of vaporizing chambers formed by laterally and airtightly partitioning an internal space of the tank body, a chemical solution passage located under a liquid level in each vaporizing chamber and formed at each partition member for passing the chemical solution between the vaporizing chambers, and a gas passage located above the liquid level in each vaporizing chamber and formed at the partition member to communicate the vaporizing chambers with each other for uniformizing pressures in the respective vaporizing chambers. A quantity of the channel layer in each vaporizing chamber is controlled by managing, e.g., the liquid level.

Abstract: Apparatus for making coated paper serving as lower ignition propensity paper for cigarettes has a transport path (L) for a web (W), a coating unit (10) arranged on the path (L) to apply a combustion inhibition material to the web (W), a pre-dryer (16) for drying the web (W) with the material applied, a gravure roller (22) arranged downstream of the pre-dryer (16) to apply water to the web (W), a drying roller (34) arranged downstream of the roller (22) to post-dry the web (W), a smoothing roller (32) arranged between the roller (22) and the roller (34) to flatten wrinkles in the web (W) passing around the roller (32), a displacement sensor (42) for measuring wrinkles in the web (W) having passed around the roller (34), and a controller (44) for controlling tension in the web (W) on the basis of measurements received from the sensor (42).

Abstract: The embodiments disclosed herein relate generally to magnetic resonance imaging systems and, more specifically, to the manufacturing of a gradient coil assembly for magnetic resonance imaging (MRI) systems. For example, in one embodiment, a method of manufacturing a gradient coil assembly for a magnetic resonance imaging system includes depositing a first layer comprising a base material onto a surface to form a substrate and depositing a second layer onto the first layer. The second layer may enable bonding between a conductor material and the substrate. The method also includes depositing a third layer onto the second layer using a consolidation process. The consolidation process uses the conductor material to form at least a portion of a gradient coil.

Abstract: The invention relates to an apparatus for surface processing on a substrate, for example for applying a coating to the substrate or for removing a coating from the substrate, wherein the apparatus comprises: a chamber enclosing an interior and serving for arranging the substrate for the surface processing, a process gas analyser for detecting at least one gaseous constituent of a residual gas atmosphere formed in the interior, wherein the process gas analyser comprises an ion trap for storing the gaseous constituent to be detected, and an ionization device for ionizing the gaseous constituent. The invention also relates to an associated method for monitoring surface processing on a substrate.

Abstract: Epitaxial films are grown by alternately exposed to precursor dosing regions, inert gas plasma regions, hydrogen-containing plasma regions, chlorine-containing plasma and metrology regions, or regions where an atomic hydrogen source is located. Alternately, laser irradiation techniques may be substituted for the plasma energy in some of the processing regions. The film growth process can be implemented at substrate temperatures between about 25 C and about 600 C, together with optional exposures to laser irradiation to cause the surface of the film to melt or to experience a near-melt condition.

Abstract: A hydride assembling system includes a first spool configured to support a sensor tube assembly comprising a wire disposed within a sensor tube. Also included is a hydrogen inlet fluidly coupled to the first spool for providing hydrogen from a hydrogen plenum. Further included is a second spool configured to receive the sensor tube assembly as the sensor tube assembly is fed from the first spool. Yet further included is a heated section at a temperature above an ambient temperature and configured to heat the sensor tube assembly as the sensor tube assembly is fed through the heated section.

Abstract: A label forming apparatus includes a film forming device and a printer. The film forming device includes a transportation mechanism that transports a base sheet having a print surface, a storage unit that stores a position of the film based on prescribed positions of markers, a film forming unit that forms the film on the print surface, and a marker forming unit that forms the markers at the prescribed marker positions on the print surface. The printer includes a marker position detector provided on the downstream side of the film forming device to detect the markers, an image layer forming unit provided on the downstream side of the marker position detector to form an image layer on the film, and a second controller coupled with the marker position detector and the image layer forming unit to form the image layer on the film by controlling the image layer forming unit.

Abstract: A label production apparatus includes: a printing unit; a test unit; and a post-process unit configured to cut a material in accordance with test results by the test unit. In the stated label production apparatus, each of a label images includes a common image portion and a changeable image portion. Further, in the label production apparatus, the post-process unit cuts a first base material using a first cut-line, the common image portion and the changeable image portion of a label image that has been detected to have no print defect, whereas the post-process unit cuts the first base material using a second cut-line for not cutting out the common image portion from the first base material but cutting out from the first base material at least part of the changeable image portion of a label image that has been detected to have a print defect.

Abstract: Provided are methods and systems for forming piezoelectric coatings on power line cables using sol-gel materials. A cable may be fed through a container with a sol-gel material having a piezoelectric material to form an uncured layer on the surface of the cable. The layer is then cured using, for example, infrared, ultraviolet, and/or other types of radiation. The cable may be suspended in a coating system such that the uncured layer does not touch any components of the system until the layer is adequately cured. Piezoelectric characteristics of the cured layer may be tested in the system to provide a control feedback. The cured layer, which may be referred to as a piezoelectric coating, causes resistive heating at the outer surface of the cable during vibration of the cable due transmission of alternating currents and environmental factors.

Abstract: A deposition apparatus for depositing a deposition material on a substrate in order to improve characteristics of a deposition layer includes: a deposition source facing the substrate and ejecting the deposition material; a patterning slit sheet including patterning slits for depositing the deposition material in a desired pattern and disposed to face the substrate; a frame coupled to the patterning slit sheet; and a stage bonded to the frame to support the frame, wherein a separation area is formed between the frame and the stage.

Abstract: At the time of transporting a substrate into or from a space where a film formation process is performed, the space where the film formation process is performed, a space where a lower heater 16 is provided, and a space where an upper heater 19 is provided are made in an inert gas atmosphere.

Abstract: A vapor phase growth apparatus of an embodiment includes a reaction chamber, a first gas supply channel that supplies a Si source gas to the reaction chamber, a second gas supply channel that supplies a C source gas to the reaction chamber, a third gas supply channel that supplies an n-type impurity source gas to the reaction chamber, a fourth gas supply channel that supplies a p-type impurity source gas to the reaction chamber, and a control unit that controls the amounts of the n-type impurity and p-type impurity source gases at a predetermined ratio, and introduces the n-type impurity and p-type impurity source gases into the reaction chamber. Where the p-type impurity is an element A and the n-type impurity is an element D, the element A and the element D form a combination of Al, Ga, or In and N, and/or a combination of B and P.

Abstract: A warp correction apparatus includes an injection mechanism including a nozzle that performs injection treatment, an adsorption table that holds the substrate by adsorption at a principal surface side or a film surface side, a moving mechanism that moves the adsorption table so that the substrate relatively moves with respect to an injection area of an injection particle by the nozzle, an injection treatment chamber that houses the substrate held on the adsorption table and in the interior of which injection treatment is performed, a measurement mechanism that measures a warp of the substrate, and a control device that, based on a difference between a target warp amount and a warp amount measured by the measurement mechanism, performs at least either one of a setting processing of an injection treatment condition of the injection mechanism and an accept/reject determination of the substrate for which injection treatment has been performed.

Abstract: A coating film (90) is formed by causing vapor deposition particles (91) discharged from a vapor deposition source opening (61) of a vapor deposition source (60) to pass through a space (82) between a plurality of limiting plates (81) of a limiting plate unit (80) and a mask opening (71) of a vapor deposition mask in this order and adhere to a substrate while the substrate is moved relative to the vapor deposition mask in a state in which the substrate (10) and the vapor deposition mask (70) are spaced apart at a fixed interval. It is determined whether or not it is necessary to correct the position of at least one of the plurality of limiting plates in the X axis direction, and in the case where it is necessary to correct the position, the position of at least one of the plurality of limiting plates in the X axis direction is corrected. Accordingly, a coating film whose edge blur is suppressed can be stably formed at a desired position on a large-sized substrate.

Abstract: According to certain techniques, a system for coating a substrate includes a preparation component, a coating component, and a curing component. The preparation component includes a plasma applicator that irradiates the substrate with plasma to form a prepared substrate. The coating component coats the prepared substrate with a coating medium to form a coated substrate. The coating component includes a coating head that receives the coating medium from a reservoir and applies the coating medium to the prepared substrate to form the coated substrate. The coating component includes a vacuum that removes an excess amount of the coating medium from the coated substrate. The curing component includes at least one ultraviolet emitter and irradiates the coated substrate with ultraviolet energy to form a cured substrate.