Abstract: A coating film forming method includes coating a coating liquid by supplying the same to a front surface of a substrate and rotating the substrate to form a coating film, supplying a high-temperature gas having a temperature higher than the substrate to an exposed region of a rear surface of the substrate, adjusting film thickness distribution of the coating film in a plane of the substrate by rotating the substrate at a first rotation speed, and drying, after the adjusting the film thickness distribution, the coating film by adjusting the film thickness of the coating film in an entire plane of the substrate by rotating the substrate at a second rotation speed different from the first rotation speed. A period in which the drying of the coating film is performed includes a period in which the supplying of the high-temperature gas to the substrate is stopped.

Abstract: Apparatus (1) for cooling an automobile component (20) by means of a gas, the apparatus comprising a cooling box (11) with a re-closeable opening (12) for receiving an automobile component (20) to be cooled, wherein at least one heat sink (13) is provided inside the cooling box (11) for cooling of the gas, and wherein the apparatus (10) includes at least one infra sound pulsator (2,3) arranged to provide an infra sound into said cooling box (11) to improve heat exchange of the gas both with a cooling surface of the at least one heat sink (13), and with the automobile component (20).

Abstract: A structural coupling for use within a laser system. In a preferred embodiment, a laser system for cleaning purposes would be displaced within a facility having dangerous conditions which could potentially damage the components of the laser, such as within a nuclear power facility. Protecting the laser components typically requires shielding which can fail, resulting in potential contamination of laser generator and components. The structural coupling would allow the laser to pass through a structural element to be used on the interior of the facility such that the end effector may be freely used within the facility while the mobile laser unit itself is safely stored outside of the dangerous area. The coupling allows the laser to pass through the structural element or opening to the end effector without exposing the laser itself to potential contamination.

Abstract: A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a processing light; and a partition member that surrounds a space including an optical path between the surface of the object and an optical member that is disposed at the most object side in an optical system of the light irradiation apparatus that allows the processing light to pass therethrough.

Abstract: An orifice cavitation device is disclosed herein which promotes cavitation at low operating pressures. An output opening has a sharp edge which facilitates cavitation. Moreover, an inner perimeter length may be increased by forming notches in the opening. Also, grooves may be formed on the inner surface of a funnel of the orifice cavitation device. The grooves may be straight and also spiral or slanted to encourage the water to rotate and increase shearing forces which also facilitates cavitation.

Abstract: A vapor delivery head for wet treatment of a substrate includes a body including an upper surface, a lower surface, an upper plenum and a lower plenum. A first bore is arranged on the upper surface of the body and fluidly connected to the upper plenum to supply heated fluid. A second bore is arranged on the upper surface of the body and connected to the upper plenum to remove heated fluid. A third bore is arranged on the upper surface of the body and connected to the lower plenum to receive a gas mixture. A plurality of through holes through the lower surface of the body are in fluid communication with the lower plenum.

Abstract: A method for media blasting a workpiece includes, during a scan cycle: accessing a first set of images captured by an optical sensor traversing a scan path over the workpiece; compiling the first set of images into a virtual model of the workpiece; accessing a first set of blast parameters; generating a first tool path for a first workpiece region of the workpiece based on a geometry of the workpiece represented in the virtual model and the first set of blast parameters. The method further includes, during a processing cycle: via the set of actuators, navigating the blast nozzle over the first workpiece region according to the first tool path; and projecting blasting media toward the workpiece according to the first set of blast parameters.

Abstract: The present disclosure provides embodiments of a system and method for detecting processing chamber condition. The embodiments include performing a wafer-less processing step in a processing chamber to determine the condition of the chamber walls. Based on an analysis of the residual gas resulting from the wafer-less processing step, an operator or a process controller can determine whether the chamber walls have deteriorated to such an extent as to be cleaned.

Abstract: There is disclosed an ultrasonic cleaning bar for cleaning a roller of a printing machine. The ultrasonic cleaning bar comprises: an elongate body defining a longitudinal axis; a doctor blade supported by the body; an ultrasonic transducer for generating ultrasonic waves within the cleaning fluid; and first and second formations positioned at longitudinally opposite ends of the body, the first formation being releasably engageable with a first mounting bracket of the printing machine and the second formation being releasably engageable with a second mounting bracket of the printing machine; and wherein, when the first and second formations are engaged with the first and second brackets, the doctor blade engages a surface of the roller, such that the body, the doctor blade and the roller define a trough therebetween configured to contain a cleaning fluid which contacts the roller.

Abstract: A hydrotherapy system can include a tub of tempered water, a cold water tank, and a refrigeration system. The system cools the water in the tub following initial immersion of the patient by using valving in conjunction with a transfer pump allowing blending of the cold water from the cold water tank with the tempered water of the tub to gradually begin the therapy process.

Abstract: A method for manufacturing a semiconductor device includes: forming an isolating layer on a surface of a substrate; forming a groove on the isolating layer, where the groove penetrates the isolating layer; forming a protection layer in the groove and on the isolating layer; forming a dielectric layer on the protection layer; and forming a contact hole, where the contact hole penetrates the protection layer and the dielectric layer to the surface of the substrate, respectively. The method for manufacturing the semiconductor device according to the present invention can be used not only in chemical vapor deposition but also in a process of a metal wire of a short-circuit in physical vapor deposition.

Abstract: As treatment of a semiconductor wafer to be a product proceeds in a heat treatment apparatus, contaminants adhere to an inner wall surface of a chamber. After the treatment of the semiconductor wafer is completed, a gas containing ozone is supplied into the chamber to form an atmosphere containing ozone. While the atmosphere containing ozone is heated by irradiation with light from a halogen lamp, a flash lamp emits a flash of light containing ultraviolet light. The ultraviolet light decomposes ozone to generate active oxygen, and the active oxygen reacts with the contaminants to decompose and remove the contaminants from the inner wall surface of the chamber. The contaminants decomposed and vaporized are discharged out of the chamber by exhausting the atmosphere in the chamber.

Abstract: A semiconductor wafer has a base material. The semiconductor wafer may have an edge support ring. A grinding phase of a surface of the semiconductor wafer removes a portion of the base material. The grinder is removed from or lifted off the surface of the semiconductor wafer during a separation phase. The surface of the semiconductor wafer and under the grinder is rinsed during the grinding phase and separation phase to remove particles. A rinsing solution is dispensed from a rinsing solution source to rinse the surface of the semiconductor wafer. The rinsing solution source can move in position while dispensing the rinsing solution to rinse the surface of the semiconductor wafer. The grinding phase and separation phase are repeated during the entire grinding operation, when grinding conductive TSVs, or during the final grinding stages, until the final thickness of the semiconductor wafer is achieved.

Abstract: A method for treating a substrate, including a solvent processing step of supplying an organic solvent onto the substrate to treat the substrate, a drying step of drying the substrate to remove the organic solvent on the substrate, and a bake step of heating the substrate to thermally decompose an impurity adhering to the substrate, where the drying step and the bake step are performed in different chambers.

Abstract: Systems and methods are described for integrated decomposition and scanning of a material, such as a semiconducting wafer, a scanning nozzle includes, but is not limited to, a nozzle body defining one or more nozzle ports to receive fluid for introduction to the surface of the material and to recover fluid from the surface of the material, and a nozzle hood extending from the nozzle body, the nozzle hood defining an inner channel longitudinally disposed along the nozzle body, the nozzle hood further defining one or more outer channels longitudinally disposed along the nozzle body, the inner channel fluidically coupled with the one or more outer channels via one or more gaps defined by the nozzle hood.

Abstract: A method of activating and dewatering sludge through application of acoustic pressure shock waves to wastewater.

Abstract: The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.

Abstract: A pellicle suitable for use with a patterning device for a lithographic apparatus. The pellicle comprising at least one breakage region which is configured to preferentially break, during normal use in a lithographic apparatus, prior to breakage of remaining regions of the pellicle. At least one breakage region comprises a region of the pellicle which has a reduced thickness when compared to surrounding regions of the pellicle.

Abstract: A cleaning device includes a tank configured to contain a cleaning liquid and one or more substrates in the cleaning liquid. A megasonic transducer array is coupled to the tank and configured to direct megasonic frequency waves to surfaces of the substrates. Multiple pairs of ultrasonic transducers are also coupled to the tank and configured to direct ultrasonic frequency waves to surfaces of the substrates. The megasonic transducer array includes a support plate with a plurality of megasonic transducers and a central plane that extends perpendicular to the support plate. The multiple pairs of ultrasonic transducers are arranged in a mirror symmetric manner on opposite sides of the central plane.

Abstract: A holding apparatus for holding a sterilizable medical product and for storing the medical product before and/or after the cleaning process, and a product monitoring system featuring such a holding apparatus. The holding apparatus includes a data processing device connectable to at least one sensor in a signal-conducting manner. The sensor is a temperature sensor for determining a temperature during the cleaning process and/or a pressure sensor for determining a static and/or dynamic pressure of a cleaning fluid during the cleaning process. The data processing device processes the sensor signals to form cleaning information and is connectable to a memory apparatus in a data-conducting manner, on which memory apparatus the cleaning information is storable. The cleaning information is retrievable or readable from the memory apparatus by an evaluation device such that a cleaning profile of the medical product can be determined based on the cleaning information.

Abstract: This disclosure discloses a mass transfer method and mass transfer device thereof for micro-LED devices, wherein the mass transfer method includes: coating a surface, provided with micro-LED devices, of an epitaxial substrate with a flexible covering solution; curing the flexible covering solution to form a flexible covering layer wrapping the micro-LED devices; turning over the epitaxial substrate with the flexible covering layer wrapping the micro-LED devices, for locating the epitaxial substrate on an upper side of the flexible covering layer; separating the epitaxial substrate from the micro-LED devices; butting a surface, provided with the micro-LED devices, of the flexible covering layer against a receiving substrate; turning over the receiving substrate in butt joint with the micro-LED devices, for locating the flexible covering layer on an upper side of the receiving substrate; and separating the flexible covering layer from the micro-LED devices.

Abstract: An apparatus and method for prevention and treatment of marine biofouling on a surface to be treated by the apparatus includes a body defining a cavity, the body terminating in a distal open end that is adapted, in use, to be in the vicinity of a surface to be treated such that the surface forms a first end wall of a chamber within the cavity; an acoustic transducer mounted within the cavity to form an opposite second end wall of the chamber, the acoustic transducer being adapted to cause acoustic pressure fluctuations; and a reservoir for a liquid, the reservoir including an inlet passage and a plurality of mutually spaced outlet passages for liquid flow from the reservoir into the chamber, the outlet passages at least partially surrounding the chamber in the vicinity of the distal open end.

Abstract: Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method includes receiving, at the temperature monitoring system (TMS) controller, information from a first plurality of temperature sensors and a second plurality of temperature sensors, comparing, using the TMS controller, the temperature information to one or more pre-determined control limits, and communicating, using the TMS controller, an out-of-control event to a user. Generally, the temperature monitoring system features the first and second pluralities of temperature sensors, the TMS controller, a first connection module, and a second connection module.

Abstract: A substrate cleaning system include a chamber and a substrate stage positioned within the chamber. The substrate stage is configured to secure a substrate for cleaning with a cleaning head. The substrate cleaning system includes a robot configured to transfer the substrate between a storage receptable and the substrate stage. The cleaning head includes a disposable electrode ribbon loaded on a roller assembly. The disposable electrode ribbon includes a positive electrode and a negative electrode and is configured to electrostatically clean the substrate by electrostatically removing particles from the substrate. The roller assembly is configured to advance the disposable electrode ribbon following cleaning of the substrate.

Abstract: A cleaning booth has a handheld blaster, which emits a pulsed electromagnetic wave that is produced by a wave source. A fiber-optic cable feeds the wave from the source to the blaster. An operator can aim the blaster toward a part that rests on a movable table in the booth. When the operator actuates the wave source, a radiation beam from the blaster ablates anti-reflective coating residue from the part. The cleaning operation can be performed in a same room as the anti-reflective coating process equipment.

Abstract: Examples of a system dedicated for parts cleaning includes a gas supply apparatus configured to supply a cleaning gas, a first adapter connected to a gas supply port of the gas supply apparatus, an exhaust system configured to exhaust the gas supplied from the gas supply apparatus, and a second adapter connected to a gas inlet of the exhaust system.

Abstract: A particle removal method for removing particles on the backside of a reticle is provided. The method includes disposing the reticle on a reticle holder. In addition, the method includes moving a baffle defining an enclosed area that encompasses a particle to be removed on a backside of the reticle. The method further includes spraying, by a solution spraying module of a particle removal device, a solution onto the particle. The method further includes sucking, by a sucking module of the particle removal device, the solution on the reticle with the particle. The method further includes emitting, by the particle removal device, a gas onto the backside of the reticle for drying the backside.

Abstract: The present invention relates to methods and devices for extending a time period until changing a measuring tip of a scanning probe microscope. In particular, the invention relates to a method for hardening a measuring tip for a scanning probe microscope, comprising the step of: Processing the measuring tip with a beam of an energy beam source, the energy beam source being part of a scanning electron microscope.

Abstract: The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.

Abstract: An electric wire connection structure is composed of insulated electric wires each including a core and an insulation coating covering the core. The cores of the insulated electric wires are connected to pads provided on a substrate. The insulated electric wires are arranged along a predetermined alignment direction and arranged parallel to each other. The insulation coating is removed at a part in a longitudinal direction of each of the insulated electric wires to expose the core. Exposed portions of the cores are connected to the pads, respectively. Some of the insulated electric wires are configured in such a manner that the core is exposed in an area where the insulation coatings of adjacent ones of the other insulated electric wires in the alignment direction are not removed.

Abstract: The present invention relates to apparatus and methods for cleaning, decontaminating, and/or sterilizing an instrument during the intraoperative phase of a surgical procedure. In exemplary embodiments, the apparatus comprises: a container having an aperture, a bottom portion, and at least one sidewall defining an instrument bath configured to hold a cleaning agent; a vibration means and radiation means coupled to the container; and a power supply. It is contemplated that at least one of the sidewalls of the container comprises a longitudinal channel disposed within the sidewall for housing the radiation means. It is further contemplated that the cleaning agent can comprise an aqueous solution of chlorohexidine, that the radiation means is configured to emit ultraviolet radiation in a range of at least 100 nanometers to 400 nanometers, and that the vibration means is configured to emit ultrasonic radiation in a range of at least 20 kilohertz to 120 kilohertz.

Abstract: A method for cleaning firearm suppressors comprising: providing a used suppressor having an internal cavity with a fouling material deposited on a surface of the internal cavity; providing a cleaning solution; providing an ultra-sonic probe; introducing the cleaning solution into the internal cavity of the used suppressor; contacting at least part of the ultra-sonic probe with the cleaning solution that is introduced inside the internal cavity of the used suppressor; operating the ultra-sonic probe; removing at least part of the fouling material from the surface of the internal cavity of the used suppressor; and, draining the cleaning solution from the used suppressor.

Abstract: A covering includes an outer material, a plurality of conductive-fibers, and a fastening material. The outer material includes a front surface and a back surface and the conductive-fibers are disposed between the front surface and the back surface. The conductive-fibers are configured to receive a voltage that causes the conductive-fibers to repel and remove dust from the front surface of the outer material. The fastening material is coupled to the back surface of the outer material and facilitates releasably attaching the outer material to an article.

Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.

Abstract: A pump system contains a pair of pumps each of which contains a vibration actuator vibrated by electromagnetic drive and can discharge fluid due to drive of the vibration actuator. The pump system has a vibration suppression mode in which the pair of the pumps are driven so that vibration of the vibration actuators of the pair of pumps is cancelled each other and a vibration generation mode in which the pair of the pumps are driven so that the vibration of the vibration actuators of the pair of pumps is superimposed with each other.

Abstract: Provided is a cooling device capable of controlling the temperature of an upper portion of a reactor, particularly, a gas supply device, for example, a shower head, by using a vortex tube. The cooling device may supply a cooling gas of a temperature lower than the temperature of the gas supply device heated to a high temperature, thereby easily controlling the temperature of the gas supply device.

Abstract: A cleaning system includes an explosive subsystem including: a plurality of detonation cords extending along a direction different from a vertical direction; and a locating assembly locating the plurality of detonation cords relative to each other. The locating assembly spaces each of the detonation cords apart from a system to be cleaned. The cleaning system includes a pressurized air blower assembly adjacent a portion of the system to be cleaned, the pressurized air blower assembly being configured to direct pressurized air towards the portion of the system to be cleaned after the detonation cords have been exploded.

Abstract: Examples disclosed herein relate to a method and apparatus for cleaning and repairing a substrate support having a heater disposed therein. A method includes (a) cleaning a surface of a substrate support having a bulk layer, the substrate support is disposed in a processing environment configured to process substrates. The cleaning process includes forming a plasma at a high temperature from a cleaning gas mixture having a fluorine containing gas and oxygen. The method includes (b) removing oxygen radicals from the processing environment with a treatment plasma formed from a treatment gas mixture. The treatment gas mixture includes the fluorine containing gas. The method further includes (c) repairing an interface of the substrate support and the bulk layer with a post-treatment plasma. The post-treatment plasma is formed from a post-treatment gas mixture including a nitrogen containing gas. The high temperature is greater than or equal to about 500 degrees Celsius.

Abstract: A demulsified composition comprising a clear oil phase comprising hydrocarbons, a clear brine phase comprising up to 5 wt. % of a diethanolamine-based C8-C18 alkanolamide demulsifying agent, and a water-wetted solid phase.

Abstract: An automated or manual laser ablation system and method of use to enable safe, non-user-contact, rapid, and remote cleaning of industrial tubular equipment, e.g. heat-exchangers and reactors. The laser ablation system comprises: a fiber optic cable (12) with a laser probe output end (20), connected to an optics unit (5 or 6) enclosed within a laser probe housing (14). The optics unit comprises: a double convex and/or one or two plano-convex lens; and an Axicon prism, mirror cone, and/or galvo-scanning mirror to emit a rotating or a fixed circular beam. The laser beam cleans a plurality of reactor tubes' internal wall to cause the evaporation of deposit buildups and rust. The laser ablation system further comprises: an air vacuum system (30) positioned to cool the ablation system while removing the debris to a vacuum generator (35); and/or a push motor (60) that pushes and pulls the system through the tubes.

Abstract: According to one embodiment, a transfer apparatus includes a coating part for coating an uncured resin on a substrate, a substrate installation part for positioning and installing the substrate integrally, a mold installation part for installing a sheet-like mold, a transfer roller for transferring a fine transfer pattern formed on the mold to the resin coated on the substrate, and a plasma unit for cleaning the mold by irradiating plasma to the mold peeled off from the resin after transferring. After cleaning by the plasma using the plasma unit, the cleaned mold is used again for transferring of the transfer pattern.

Abstract: The present disclosure provides embodiments of a system and method for detecting processing chamber condition. The embodiments include performing a wafer-less processing step in a processing chamber to determine the condition of the chamber walls. Based on an analysis of the residual gas resulting from the wafer-less processing step, an operator or a process controller can determine whether the chamber walls have deteriorated to such an extent as to be cleaned.

Abstract: A cleaning tray is provided for docking an extraction cleaner, including upright or robot extraction cleaners, for self-cleaning. The cleaning tray may include one or more sprayers for spraying a cleaning fluid toward a suction nozzle, brush chamber, and/or agitator of the extraction cleaner. Systems for self-cleaning extraction cleaners are also provided.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

Abstract: A wellbore stimulation operation method includes conveying a downhole assembly into a wellbore. The downhole assembly includes one or more perforating guns and a pressure wave resonator. The perforating guns are axially aligned with a production zone and fired to create a plurality of perforations in the production zone. The pressure wave resonator is axially aligned with the perforations and actuated to emit pressure waves that propagate radially outward and into the production zone. The pressure waves help remove debris from the perforations.

Abstract: Techniques for depowdering in additive fabrication are provided. According to some aspects, techniques are provided that separate powder from additively fabricated parts through liquid immersion of the parts. Motion of the liquid, such as liquid currents, may dislodge or otherwise move powder away from additively fabricated parts to which it is adhered or otherwise proximate to. The liquid may also provide a vehicle to carry away powder from the additively fabricated parts. Removed powder may be filtered or otherwise separated from the liquid to allow recirculation of the liquid to the parts and/or to enable re-use of the powder in subsequent additive fabrication processes. Techniques for depowdering through liquid immersion may be automated, thereby mitigating challenges associated with manual depowdering operations.

Abstract: A method for cleaning a semiconductor fabrication equipment part having gas holes used in single-wafer type semiconductor fabrication equipment for processing semiconductor wafers, wherein the semiconductor fabrication equipment part having gas holes is formed of aluminum or an aluminum alloy, and has a distribution plate having a plurality of gas holes, the method including: a step (1) of scanning a gas injection surface of the distribution plate, which is a surface facing the wafer, with a laser beam; and a step (2) of bringing the gas injection surface and insides of the gas holes into contact with a cleaning liquid containing an inorganic acid.

Abstract: A cleaning method includes: supplying a cleaning gas in a processing container while continuously increasing a pressure in the processing container in a stepwise manner at a plurality of time points, thereby executing a cleaning of the processing container by removing a film deposited in the processing container; and detecting an end point of the cleaning based on time-dependent data of a concentration of a predetermined gas generated during the executing the cleaning, for each pressure of the plurality of time points. The executing the cleaning is implemented when the time-dependent data of the concentration of the predetermined gas generated in the continuously increasing the pressure changes from an increasing state to a decreasing state after exceeding a threshold value.

Abstract: A substrate processing method according to an embodiment of the present disclosure includes a step of holding a substrate by a substrate holding unit (31) which is rotatable, a step of arranging a top plate portion (41) above the substrate, a step of supplying a processing liquid to the substrate, and a step of supplying a rinsing liquid (Lr) between the substrate and the top plate portion (41) to wash the substrate and the top plate portion (41) with the rinsing liquid (Lr).

Abstract: A charged particle beam system is disclosed, comprising: a charged particle beam generator for generating a beam of charged particles; a charged particle optical column arranged in a vacuum chamber, wherein the charged particle optical column is arranged for projecting the beam of charged particles onto a target, and wherein the charged particle optical column comprises a charged particle optical element for influencing the beam of charged particles; a source for providing a cleaning agent; a conduit connected to the source and arranged for introducing the cleaning agent towards the charged particle optical element; wherein the charged particle optical element comprises: a charged particle transmitting aperture for transmitting and/or influencing the beam of charged particles, and at least one vent hole for providing a flow path between a first side and a second side of the charged particle optical element, wherein the vent hole has a cross section which is larger than a cross section of the cha