Abstract: The present invention relates to methods and devices for extending a time period until changing a measuring tip of a scanning probe microscope. In particular, the invention relates to a method for hardening a measuring tip for a scanning probe microscope, comprising the step of: Processing the measuring tip with a beam of an energy beam source, the energy beam source being part of a scanning electron microscope.

Abstract: The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.

Abstract: An electric wire connection structure is composed of insulated electric wires each including a core and an insulation coating covering the core. The cores of the insulated electric wires are connected to pads provided on a substrate. The insulated electric wires are arranged along a predetermined alignment direction and arranged parallel to each other. The insulation coating is removed at a part in a longitudinal direction of each of the insulated electric wires to expose the core. Exposed portions of the cores are connected to the pads, respectively. Some of the insulated electric wires are configured in such a manner that the core is exposed in an area where the insulation coatings of adjacent ones of the other insulated electric wires in the alignment direction are not removed.

Abstract: The present invention relates to apparatus and methods for cleaning, decontaminating, and/or sterilizing an instrument during the intraoperative phase of a surgical procedure. In exemplary embodiments, the apparatus comprises: a container having an aperture, a bottom portion, and at least one sidewall defining an instrument bath configured to hold a cleaning agent; a vibration means and radiation means coupled to the container; and a power supply. It is contemplated that at least one of the sidewalls of the container comprises a longitudinal channel disposed within the sidewall for housing the radiation means. It is further contemplated that the cleaning agent can comprise an aqueous solution of chlorohexidine, that the radiation means is configured to emit ultraviolet radiation in a range of at least 100 nanometers to 400 nanometers, and that the vibration means is configured to emit ultrasonic radiation in a range of at least 20 kilohertz to 120 kilohertz.

Abstract: A method for cleaning firearm suppressors comprising: providing a used suppressor having an internal cavity with a fouling material deposited on a surface of the internal cavity; providing a cleaning solution; providing an ultra-sonic probe; introducing the cleaning solution into the internal cavity of the used suppressor; contacting at least part of the ultra-sonic probe with the cleaning solution that is introduced inside the internal cavity of the used suppressor; operating the ultra-sonic probe; removing at least part of the fouling material from the surface of the internal cavity of the used suppressor; and, draining the cleaning solution from the used suppressor.

Abstract: A covering includes an outer material, a plurality of conductive-fibers, and a fastening material. The outer material includes a front surface and a back surface and the conductive-fibers are disposed between the front surface and the back surface. The conductive-fibers are configured to receive a voltage that causes the conductive-fibers to repel and remove dust from the front surface of the outer material. The fastening material is coupled to the back surface of the outer material and facilitates releasably attaching the outer material to an article.

Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.

Abstract: A pump system contains a pair of pumps each of which contains a vibration actuator vibrated by electromagnetic drive and can discharge fluid due to drive of the vibration actuator. The pump system has a vibration suppression mode in which the pair of the pumps are driven so that vibration of the vibration actuators of the pair of pumps is cancelled each other and a vibration generation mode in which the pair of the pumps are driven so that the vibration of the vibration actuators of the pair of pumps is superimposed with each other.

Abstract: Provided is a cooling device capable of controlling the temperature of an upper portion of a reactor, particularly, a gas supply device, for example, a shower head, by using a vortex tube. The cooling device may supply a cooling gas of a temperature lower than the temperature of the gas supply device heated to a high temperature, thereby easily controlling the temperature of the gas supply device.

Abstract: A cleaning system includes an explosive subsystem including: a plurality of detonation cords extending along a direction different from a vertical direction; and a locating assembly locating the plurality of detonation cords relative to each other. The locating assembly spaces each of the detonation cords apart from a system to be cleaned. The cleaning system includes a pressurized air blower assembly adjacent a portion of the system to be cleaned, the pressurized air blower assembly being configured to direct pressurized air towards the portion of the system to be cleaned after the detonation cords have been exploded.

Abstract: Examples disclosed herein relate to a method and apparatus for cleaning and repairing a substrate support having a heater disposed therein. A method includes (a) cleaning a surface of a substrate support having a bulk layer, the substrate support is disposed in a processing environment configured to process substrates. The cleaning process includes forming a plasma at a high temperature from a cleaning gas mixture having a fluorine containing gas and oxygen. The method includes (b) removing oxygen radicals from the processing environment with a treatment plasma formed from a treatment gas mixture. The treatment gas mixture includes the fluorine containing gas. The method further includes (c) repairing an interface of the substrate support and the bulk layer with a post-treatment plasma. The post-treatment plasma is formed from a post-treatment gas mixture including a nitrogen containing gas. The high temperature is greater than or equal to about 500 degrees Celsius.

Abstract: A demulsified composition comprising a clear oil phase comprising hydrocarbons, a clear brine phase comprising up to 5 wt. % of a diethanolamine-based C8-C18 alkanolamide demulsifying agent, and a water-wetted solid phase.

Abstract: An automated or manual laser ablation system and method of use to enable safe, non-user-contact, rapid, and remote cleaning of industrial tubular equipment, e.g. heat-exchangers and reactors. The laser ablation system comprises: a fiber optic cable (12) with a laser probe output end (20), connected to an optics unit (5 or 6) enclosed within a laser probe housing (14). The optics unit comprises: a double convex and/or one or two plano-convex lens; and an Axicon prism, mirror cone, and/or galvo-scanning mirror to emit a rotating or a fixed circular beam. The laser beam cleans a plurality of reactor tubes' internal wall to cause the evaporation of deposit buildups and rust. The laser ablation system further comprises: an air vacuum system (30) positioned to cool the ablation system while removing the debris to a vacuum generator (35); and/or a push motor (60) that pushes and pulls the system through the tubes.

Abstract: According to one embodiment, a transfer apparatus includes a coating part for coating an uncured resin on a substrate, a substrate installation part for positioning and installing the substrate integrally, a mold installation part for installing a sheet-like mold, a transfer roller for transferring a fine transfer pattern formed on the mold to the resin coated on the substrate, and a plasma unit for cleaning the mold by irradiating plasma to the mold peeled off from the resin after transferring. After cleaning by the plasma using the plasma unit, the cleaned mold is used again for transferring of the transfer pattern.

Abstract: The present disclosure provides embodiments of a system and method for detecting processing chamber condition. The embodiments include performing a wafer-less processing step in a processing chamber to determine the condition of the chamber walls. Based on an analysis of the residual gas resulting from the wafer-less processing step, an operator or a process controller can determine whether the chamber walls have deteriorated to such an extent as to be cleaned.

Abstract: A cleaning tray is provided for docking an extraction cleaner, including upright or robot extraction cleaners, for self-cleaning. The cleaning tray may include one or more sprayers for spraying a cleaning fluid toward a suction nozzle, brush chamber, and/or agitator of the extraction cleaner. Systems for self-cleaning extraction cleaners are also provided.

Abstract: A wellbore stimulation operation method includes conveying a downhole assembly into a wellbore. The downhole assembly includes one or more perforating guns and a pressure wave resonator. The perforating guns are axially aligned with a production zone and fired to create a plurality of perforations in the production zone. The pressure wave resonator is axially aligned with the perforations and actuated to emit pressure waves that propagate radially outward and into the production zone. The pressure waves help remove debris from the perforations.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

Abstract: Techniques for depowdering in additive fabrication are provided. According to some aspects, techniques are provided that separate powder from additively fabricated parts through liquid immersion of the parts. Motion of the liquid, such as liquid currents, may dislodge or otherwise move powder away from additively fabricated parts to which it is adhered or otherwise proximate to. The liquid may also provide a vehicle to carry away powder from the additively fabricated parts. Removed powder may be filtered or otherwise separated from the liquid to allow recirculation of the liquid to the parts and/or to enable re-use of the powder in subsequent additive fabrication processes. Techniques for depowdering through liquid immersion may be automated, thereby mitigating challenges associated with manual depowdering operations.

Abstract: A method for cleaning a semiconductor fabrication equipment part having gas holes used in single-wafer type semiconductor fabrication equipment for processing semiconductor wafers, wherein the semiconductor fabrication equipment part having gas holes is formed of aluminum or an aluminum alloy, and has a distribution plate having a plurality of gas holes, the method including: a step (1) of scanning a gas injection surface of the distribution plate, which is a surface facing the wafer, with a laser beam; and a step (2) of bringing the gas injection surface and insides of the gas holes into contact with a cleaning liquid containing an inorganic acid.

Abstract: A cleaning method includes: supplying a cleaning gas in a processing container while continuously increasing a pressure in the processing container in a stepwise manner at a plurality of time points, thereby executing a cleaning of the processing container by removing a film deposited in the processing container; and detecting an end point of the cleaning based on time-dependent data of a concentration of a predetermined gas generated during the executing the cleaning, for each pressure of the plurality of time points. The executing the cleaning is implemented when the time-dependent data of the concentration of the predetermined gas generated in the continuously increasing the pressure changes from an increasing state to a decreasing state after exceeding a threshold value.

Abstract: A substrate processing method according to an embodiment of the present disclosure includes a step of holding a substrate by a substrate holding unit (31) which is rotatable, a step of arranging a top plate portion (41) above the substrate, a step of supplying a processing liquid to the substrate, and a step of supplying a rinsing liquid (Lr) between the substrate and the top plate portion (41) to wash the substrate and the top plate portion (41) with the rinsing liquid (Lr).

Abstract: A charged particle beam system is disclosed, comprising: a charged particle beam generator for generating a beam of charged particles; a charged particle optical column arranged in a vacuum chamber, wherein the charged particle optical column is arranged for projecting the beam of charged particles onto a target, and wherein the charged particle optical column comprises a charged particle optical element for influencing the beam of charged particles; a source for providing a cleaning agent; a conduit connected to the source and arranged for introducing the cleaning agent towards the charged particle optical element; wherein the charged particle optical element comprises: a charged particle transmitting aperture for transmitting and/or influencing the beam of charged particles, and at least one vent hole for providing a flow path between a first side and a second side of the charged particle optical element, wherein the vent hole has a cross section which is larger than a cross section of the cha

Abstract: A plasma purge method that is performed after dry cleaning in a process container and before applying a deposition process to a substrate includes: (a) activating and supplying a first process gas containing Cl2 in the process container; and (b) activating and supplying a second process gas containing H2 and O2 in the process container.

Abstract: An apparatus for supporting a substrate includes a rotatable spin head that supports the substrate, a hollow shaft that is connected with the spin head and that transmits torque to the spin head, a nozzle assembly that is disposed in an interior space of the spin head so as not to rotate and that supplies a treatment liquid to a backside of the substrate, and a sealing member that seals a gap between the spin head and the nozzle assembly using a magnetic fluid.

Abstract: The invention relates to a thermal control system for an electric vehicle comprising: a high voltage battery; a first heat exchanger adapted to be in contact with the ambient for circulating a heat exchange medium in thermal contact with the ambient; a second heat exchanger in thermal contact with the battery; a heat transport system for transporting the heat exchange medium from the first heat exchanger to an evaporator/condenser assembly that is in thermal contact with the second heat exchanger for transfer of heat to the battery and for transporting the heat exchange medium back to the first heat exchanger. At least one of the first and second heat exchangers is provided with a vibration device, such as an ultrasonic transducer, for releasing of ice formed on the at least one heat exchanger.

Abstract: An photolithographic apparatus includes a particle removing cassette selectively extendable from the processing apparatus. The particle removing cassette includes a wind blade slit and an exhausting slit. The wind blade slit is configured to direct pressurized cleaning material to a surface of the mask to remove the debris particles from the surface of the mask. The exhausting slit collects the debris particles separated from the surface of the mask and contaminants through the exhaust line. In some embodiments, the wind blade slit includes an array of wind blade nozzles spaced apart within the wind blade slit. In some embodiments, the exhausting slit includes array of exhaust lines spaced apart within the exhausting slit.

Abstract: Exemplary methods of semiconductor processing may include providing a silicon-containing precursor and a carbon-containing precursor to a processing region of a semiconductor processing chamber. The carbon-containing precursor may be characterized by a carbon-carbon double bond or a carbon-carbon triple bond. A substrate may be disposed within the processing region of the semiconductor processing chamber. The methods may include providing a boron-containing precursor to the processing region of the semiconductor processing chamber. The methods may include thermally reacting the silicon-containing precursor, the carbon-containing precursor, and the boron-containing precursor at a temperature above about 250° C. The methods may include forming a silicon-and-carbon-containing layer on the substrate.

Abstract: An apparatus for treating waste of a nuclear reactor pressure vessel includes: a suction unit inserted into the nuclear reactor pressure vessel through a plurality of through-pipes passing through a lower portion of the nuclear reactor pressure vessel to suck waste inside the nuclear reactor pressure vessel; a waste treatment part connected to the suction unit to treat the waste; and a lower collection part connected to the waste treatment part to be positioned under the nuclear reactor pressure vessel with the suction unit therebetween.

Abstract: Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.

Abstract: A method, system and cleaning solutions for the ultrasonic cleaning of drill cuttings and the resulting cleaned drill solids is described. The drill cuttings are characterized by their liquid/solid composition, texture of solids and size of particulates. A cleaning solution formula having surfactant(s) and viscosity agent(s) is selected based on the characterization of drill cuttings. Drill cuttings are contacted with the selected cleaning solution and subjected to ultrasonic vibrations simultaneously for a period of treatment and vibration time. Contaminants from drill cuttings are removed to beneficial use standards and the resulting cleaned drill solids may be reused at the well site. The cleaning may occur at a well site in conjunction with drilling activity and the cleaning solution may be changed to adapt to changes in the drill mud and/or cuttings characteristics.

Abstract: A cleaning system and method includes suspending and exploding, adjacent a bank of HRSG finned-tubing, a plurality of generally uniformly spaced detonation cords. Each detonation cord has an explosive grain loading of 18-50 grains per foot. A detonation delay assembly attached to each of the plurality of detonation cords creates a predetermined delay between each detonation cord explosion. After the detonation cords are exploded, a suspended elongated beam, having a transport assembly and a pressurized air blower assembly directs pressurized air towards an adjacent the bank of HRSG finned-tubing as the pressurized air blower assembly is moved along a portion of the beam. A suspension assembly moves the beam, the transport assembly, and the pressurized air blower assembly up or down so that a next portion of the bank of HRSG finned-tubing may be cleaned by the pressurized air.

Abstract: Systems and methods for electrolytic spa sanitation are provided which control electrodes in a manner that extends the use of electrodes, reducing the frequency of replacement of electrodes. The system also incorporates electrodes that can be easily replaced by a user, further reducing the need to maintenance by trained service personnel. Systems and methods use measurements from ORP, pH, and temperature sensors to determine the amount of sanitizer necessary to be produced from the electrodes. The electrodes are capable or acting as either an anode or a cathode.

Abstract: Methods and apparatus for electrostatic control of expelled material for lens cleaners are disclosed. In certain described examples, an apparatus can expel fluid by atomization from a central area of the surface using an ultrasonic transducer mechanically coupled to the surface. A first electrode can be arranged relative to the central area of the surface. A second electrode can be located in a peripheral area relative to the central area of the surface, in which a voltage can be applied between the first and second electrodes to attract atomized fluid at the peripheral area.

Abstract: A standalone UV-C sanitizing apparatus and method is provided that is operable to sanitize and disinfect a user's hands or protective gloves. The apparatus includes a housing with light emitting diodes (LEDs) positioned to emit ultraviolet (UV-C) light connected to a circuit board which are individually connected to a power source. The apparatus is configured so that when the user positions the hands or gloves under the housing, the UV-C light is emitted for a predetermined period of time based on the distance to the hands and the power output of the LEDs. The UV-C light is emitted at a wavelength suitable to kill, destroy, or reduce growth of microorganisms/germs. The housing can be configured with a sensor to detect motion under the housing and include a limiter hand guard.

Abstract: The present invention relates to a system, and the method of application thereof, for washing and decontamination comprising nebulizing means (8) of a mixture of at least one first gas and at least one first liquid, and pressurizing means (1) of said first gas, wherein said pressurizing means (1) are in fluid communication with a first pressure-regulating valve (3) and with a second pressure-regulating valve (4), the first pressure-regulating valve (3) being in fluid communication with a first pressurized tank (5) through first inlet means (31) of said first gas, the first pressurized tank (5) being configured to contain the first liquid, and comprising first outlet means (30) of said first liquid to the nebulizing means (8) through a first valve (6), at a first pressure that is greater than atmospheric pressure, and wherein the second pressure-regulating valve (4) is in fluid communication with said nebulizing means (8), and is configured to pressurize the gas at a second pressure that is greater than atmosp

Abstract: In some embodiments, a sonic cleaning system includes a tank configured to receive a liquid that enables propagation of sonic waves and a cylindrical insert located within the tank. The cylindrical insert includes a first end having a first opening and a second end opposite the first end. The second end has a second opening. The cylindrical insert is configured to suspend a workpiece between the first opening and the second opening. The sonic cleaning system includes a sonic transducer located within the cylindrical insert.

Abstract: Embodiments of a three-dimensional (3D) memory device with a corrosion-resistant composite spacer and method for forming the same are disclosed. In an example, a method for forming a 3D memory device is disclosed. A dielectric stack including a plurality of dielectric/sacrificial layer pairs is formed on a substrate. A memory string extending vertically through the dielectric stack is formed. A slit extending vertically through the dielectric stack is formed. A memory stack is formed on the substrate including a plurality of conductor/dielectric layer pairs by replacing, with a plurality of conductor layers, the sacrificial layers in the dielectric/sacrificial layer pairs through the slit. A composite spacer is formed along a sidewall of the slit. The composite spacer includes a first silicon oxide film, a second silicon oxide film, and a dielectric film formed laterally between the first silicon oxide film and the second silicon oxide film. A slit contact extending vertically in the slit is formed.

Abstract: A robotic arm can clean an end-of-arm tool using a cleaning station. The end-of-arm tool can be positioned at an introduction position with a portion of the end-of-arm tool in contact with a cleaning agent contained within the cleaning station. The end-of-arm tool can be positioned at a scrubbing position with the end-of-arm tool in contact with a cleaning surface. And the end-of-arm tool can be positioned at a drying position for drying of the end-of-arm tool.

Abstract: A laser descaling device and process includes a first laser sending a ray to the product to be descaled, reflected rays being intercepted by sensors that send collected information into a processing unit that calculates the absorption of the ray by the surface of the product, deduces the emissivity of the oxidized surface in the direction of the reflected rays, and correlates this emissivity with reference information prerecorded inside the processing unit; a second laser sends a ray onto the surface of the product, the spots of the rays covering the entire surface to be descaled, the second laser being controlled by a control unit receiving information provided by the processing unit making it possible to determine the operating parameters to be imposed on the second laser to obtain the descaling of the surface of the product, compared with experimental results prerecorded in the control unit.

Abstract: A cleaning method for removing a film deposited in a processing container includes: executing a cleaning of a processing container by supplying a cleaning gas to the processing container while increasing a pressure in the processing container in a stepwise manner at a plurality of time points, thereby removing a film deposited in the processing container; and detecting an end point of the cleaning based on time-dependent data of a concentration of a predetermined gas generated during the execution of the cleaning, for each pressure of the plurality of time points.

Abstract: A cleaning process (blasted-particles cleaning process) includes performing, a plural number of consecutive cycles, an ultrasonic cleaning treatment including immersing a turbine rotor blade in a water basin and conducting an ultrasonic wave into the water basin to clean the turbine rotor blade, and a pressurized-water cleaning treatment including spraying pressurized water into an internal cooling flow channel after the ultrasonic cleaning treatment is performed. The cleaning process is performed after a bonding coat layer removing process of removing a bonding coat layer (first coating layer) by chemical treatment, and a cleaning process of cleaning the turbine blade by blast treatment. Heat tinging process is then performed.

Abstract: A substrate processing device includes a processing container; a substrate holder configured to hold a substrate arranged within the processing container; a gas nozzle configured to spray gas within the processing container; a controller configured to control collision of the gas with the substrate held by the substrate holder. The controller is configured to remove particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.

Abstract: The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 ?g/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 M?·cm.

Abstract: The present invention provides a regeneration method and a regeneration device of a poisoning honeycomb catalyst, and belongs to the field of catalyst regeneration. The regeneration method of the poisoning honeycomb catalyst provided by the present invention includes the following steps: carrying out microwave heating treatment on the poisoning honeycomb catalyst, and then spraying liquid nitrogen into cells of the poisoning honeycomb catalyst so that the poisoning honeycomb catalyst is regenerated. The regeneration method provided by the present invention is simple, and the efficiency of the regenerated catalyst can be increased by 90% more than the original efficiency. According to the regeneration device of a poisoning honeycomb catalyst provided by the present invention, the catalyst regeneration is carried out by using the regeneration device provided by the present invention, the regeneration operation is simple, and the catalytic efficiency of the regenerated catalyst is improved.

Abstract: A method for treating a substrate includes arranging a substrate in a processing chamber. At least one of a vaporized solvent and a gas mixture including the solvent is supplied to the processing chamber to form a conformal liquid layer of the solvent on exposed surfaces of the substrate. The at least one of the vaporized solvent and the gas mixture is removed from the processing chamber. A reactive gas including a halogen species is supplied to the processing chamber. The conformal liquid layer adsorbs the reactive gas to form a reactive liquid layer that etches the exposed surfaces of the substrate.

Abstract: A method for dry cleaning a susceptor is performed after a substrate is removed from a processing chamber of a substrate processing apparatus. In the method, a cleaning gas for dry cleaning is supplied to a first region including a substrate receiving region in the susceptor. The cleaning gas is regionally supplied to a second region where the cleaning gas is difficult to reach when the cleaning gas is supplied to the first region.

Abstract: According to one embodiment, a laser lift-off apparatus (1) which irradiates with laser light (16) from a side of a substrate (11) an interface between the substrate (11) and a separating layer (12) of a workpiece (10) including the substrate (11) and the separating layer (12) formed over the substrate (11), and separates the separating layer (12) from the substrate (11) includes: an injection unit (22) which blows a gas (35) onto the workpiece (10) and blows away dusts existing on a surface of the workpiece (10), and a dust collecting unit (23) which includes an opening (52) at a position meeting an irradiation position of the laser light (16), and sucks and collects the blown dusts through the opening (52).

Abstract: A method of cleaning a deposition apparatus is provided. The method includes cleaning, with a cleaning gas formed into a plasma, an interior of a processing vessel on which a silicon nitride film is deposited. The cleaning gas includes a fluorine-containing gas and oxygen gas.

Abstract: The present invention has as an object the provision of a light irradiation device capable of performing optical cleaning with high stability regardless of the transport speed of a workpiece. The light irradiation device of the present invention emits ultraviolet light to one surface of a band-shaped workpiece transported along a transport path, and includes a lamp house having an opening along a passing plane on a side of the one surface of the workpiece in the transport path, an ultraviolet lamp provided in the lamp house so as to extend in a width direction of the workpiece, gas supplier configured to supply a treatment-space gas into the lamp house, and an exhaust space forming member having an opening along a passing plane on a side of the other surface of the workpiece in the transport path.