Abstract: According to one embodiment, a transfer apparatus includes a coating part for coating an uncured resin on a substrate, a substrate installation part for positioning and installing the substrate integrally, a mold installation part for installing a sheet-like mold, a transfer roller for transferring a fine transfer pattern formed on the mold to the resin coated on the substrate, and a plasma unit for cleaning the mold by irradiating plasma to the mold peeled off from the resin after transferring. After cleaning by the plasma using the plasma unit, the cleaned mold is used again for transferring of the transfer pattern.

Abstract: The present disclosure provides embodiments of a system and method for detecting processing chamber condition. The embodiments include performing a wafer-less processing step in a processing chamber to determine the condition of the chamber walls. Based on an analysis of the residual gas resulting from the wafer-less processing step, an operator or a process controller can determine whether the chamber walls have deteriorated to such an extent as to be cleaned.

Abstract: A cleaning tray is provided for docking an extraction cleaner, including upright or robot extraction cleaners, for self-cleaning. The cleaning tray may include one or more sprayers for spraying a cleaning fluid toward a suction nozzle, brush chamber, and/or agitator of the extraction cleaner. Systems for self-cleaning extraction cleaners are also provided.

Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

Abstract: A wellbore stimulation operation method includes conveying a downhole assembly into a wellbore. The downhole assembly includes one or more perforating guns and a pressure wave resonator. The perforating guns are axially aligned with a production zone and fired to create a plurality of perforations in the production zone. The pressure wave resonator is axially aligned with the perforations and actuated to emit pressure waves that propagate radially outward and into the production zone. The pressure waves help remove debris from the perforations.

Abstract: Techniques for depowdering in additive fabrication are provided. According to some aspects, techniques are provided that separate powder from additively fabricated parts through liquid immersion of the parts. Motion of the liquid, such as liquid currents, may dislodge or otherwise move powder away from additively fabricated parts to which it is adhered or otherwise proximate to. The liquid may also provide a vehicle to carry away powder from the additively fabricated parts. Removed powder may be filtered or otherwise separated from the liquid to allow recirculation of the liquid to the parts and/or to enable re-use of the powder in subsequent additive fabrication processes. Techniques for depowdering through liquid immersion may be automated, thereby mitigating challenges associated with manual depowdering operations.

Abstract: A method for cleaning a semiconductor fabrication equipment part having gas holes used in single-wafer type semiconductor fabrication equipment for processing semiconductor wafers, wherein the semiconductor fabrication equipment part having gas holes is formed of aluminum or an aluminum alloy, and has a distribution plate having a plurality of gas holes, the method including: a step (1) of scanning a gas injection surface of the distribution plate, which is a surface facing the wafer, with a laser beam; and a step (2) of bringing the gas injection surface and insides of the gas holes into contact with a cleaning liquid containing an inorganic acid.

Abstract: A cleaning method includes: supplying a cleaning gas in a processing container while continuously increasing a pressure in the processing container in a stepwise manner at a plurality of time points, thereby executing a cleaning of the processing container by removing a film deposited in the processing container; and detecting an end point of the cleaning based on time-dependent data of a concentration of a predetermined gas generated during the executing the cleaning, for each pressure of the plurality of time points. The executing the cleaning is implemented when the time-dependent data of the concentration of the predetermined gas generated in the continuously increasing the pressure changes from an increasing state to a decreasing state after exceeding a threshold value.

Abstract: A charged particle beam system is disclosed, comprising: a charged particle beam generator for generating a beam of charged particles; a charged particle optical column arranged in a vacuum chamber, wherein the charged particle optical column is arranged for projecting the beam of charged particles onto a target, and wherein the charged particle optical column comprises a charged particle optical element for influencing the beam of charged particles; a source for providing a cleaning agent; a conduit connected to the source and arranged for introducing the cleaning agent towards the charged particle optical element; wherein the charged particle optical element comprises: a charged particle transmitting aperture for transmitting and/or influencing the beam of charged particles, and at least one vent hole for providing a flow path between a first side and a second side of the charged particle optical element, wherein the vent hole has a cross section which is larger than a cross section of the cha

Abstract: A substrate processing method according to an embodiment of the present disclosure includes a step of holding a substrate by a substrate holding unit (31) which is rotatable, a step of arranging a top plate portion (41) above the substrate, a step of supplying a processing liquid to the substrate, and a step of supplying a rinsing liquid (Lr) between the substrate and the top plate portion (41) to wash the substrate and the top plate portion (41) with the rinsing liquid (Lr).

Abstract: A plasma purge method that is performed after dry cleaning in a process container and before applying a deposition process to a substrate includes: (a) activating and supplying a first process gas containing Cl2 in the process container; and (b) activating and supplying a second process gas containing H2 and O2 in the process container.

Abstract: An apparatus for supporting a substrate includes a rotatable spin head that supports the substrate, a hollow shaft that is connected with the spin head and that transmits torque to the spin head, a nozzle assembly that is disposed in an interior space of the spin head so as not to rotate and that supplies a treatment liquid to a backside of the substrate, and a sealing member that seals a gap between the spin head and the nozzle assembly using a magnetic fluid.

Abstract: The invention relates to a thermal control system for an electric vehicle comprising: a high voltage battery; a first heat exchanger adapted to be in contact with the ambient for circulating a heat exchange medium in thermal contact with the ambient; a second heat exchanger in thermal contact with the battery; a heat transport system for transporting the heat exchange medium from the first heat exchanger to an evaporator/condenser assembly that is in thermal contact with the second heat exchanger for transfer of heat to the battery and for transporting the heat exchange medium back to the first heat exchanger. At least one of the first and second heat exchangers is provided with a vibration device, such as an ultrasonic transducer, for releasing of ice formed on the at least one heat exchanger.

Abstract: An photolithographic apparatus includes a particle removing cassette selectively extendable from the processing apparatus. The particle removing cassette includes a wind blade slit and an exhausting slit. The wind blade slit is configured to direct pressurized cleaning material to a surface of the mask to remove the debris particles from the surface of the mask. The exhausting slit collects the debris particles separated from the surface of the mask and contaminants through the exhaust line. In some embodiments, the wind blade slit includes an array of wind blade nozzles spaced apart within the wind blade slit. In some embodiments, the exhausting slit includes array of exhaust lines spaced apart within the exhausting slit.

Abstract: An apparatus for treating waste of a nuclear reactor pressure vessel includes: a suction unit inserted into the nuclear reactor pressure vessel through a plurality of through-pipes passing through a lower portion of the nuclear reactor pressure vessel to suck waste inside the nuclear reactor pressure vessel; a waste treatment part connected to the suction unit to treat the waste; and a lower collection part connected to the waste treatment part to be positioned under the nuclear reactor pressure vessel with the suction unit therebetween.

Abstract: Exemplary methods of semiconductor processing may include providing a silicon-containing precursor and a carbon-containing precursor to a processing region of a semiconductor processing chamber. The carbon-containing precursor may be characterized by a carbon-carbon double bond or a carbon-carbon triple bond. A substrate may be disposed within the processing region of the semiconductor processing chamber. The methods may include providing a boron-containing precursor to the processing region of the semiconductor processing chamber. The methods may include thermally reacting the silicon-containing precursor, the carbon-containing precursor, and the boron-containing precursor at a temperature above about 250° C. The methods may include forming a silicon-and-carbon-containing layer on the substrate.

Abstract: Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.

Abstract: A method, system and cleaning solutions for the ultrasonic cleaning of drill cuttings and the resulting cleaned drill solids is described. The drill cuttings are characterized by their liquid/solid composition, texture of solids and size of particulates. A cleaning solution formula having surfactant(s) and viscosity agent(s) is selected based on the characterization of drill cuttings. Drill cuttings are contacted with the selected cleaning solution and subjected to ultrasonic vibrations simultaneously for a period of treatment and vibration time. Contaminants from drill cuttings are removed to beneficial use standards and the resulting cleaned drill solids may be reused at the well site. The cleaning may occur at a well site in conjunction with drilling activity and the cleaning solution may be changed to adapt to changes in the drill mud and/or cuttings characteristics.

Abstract: A cleaning system and method includes suspending and exploding, adjacent a bank of HRSG finned-tubing, a plurality of generally uniformly spaced detonation cords. Each detonation cord has an explosive grain loading of 18-50 grains per foot. A detonation delay assembly attached to each of the plurality of detonation cords creates a predetermined delay between each detonation cord explosion. After the detonation cords are exploded, a suspended elongated beam, having a transport assembly and a pressurized air blower assembly directs pressurized air towards an adjacent the bank of HRSG finned-tubing as the pressurized air blower assembly is moved along a portion of the beam. A suspension assembly moves the beam, the transport assembly, and the pressurized air blower assembly up or down so that a next portion of the bank of HRSG finned-tubing may be cleaned by the pressurized air.

Abstract: Systems and methods for electrolytic spa sanitation are provided which control electrodes in a manner that extends the use of electrodes, reducing the frequency of replacement of electrodes. The system also incorporates electrodes that can be easily replaced by a user, further reducing the need to maintenance by trained service personnel. Systems and methods use measurements from ORP, pH, and temperature sensors to determine the amount of sanitizer necessary to be produced from the electrodes. The electrodes are capable or acting as either an anode or a cathode.

Abstract: Methods and apparatus for electrostatic control of expelled material for lens cleaners are disclosed. In certain described examples, an apparatus can expel fluid by atomization from a central area of the surface using an ultrasonic transducer mechanically coupled to the surface. A first electrode can be arranged relative to the central area of the surface. A second electrode can be located in a peripheral area relative to the central area of the surface, in which a voltage can be applied between the first and second electrodes to attract atomized fluid at the peripheral area.

Abstract: A standalone UV-C sanitizing apparatus and method is provided that is operable to sanitize and disinfect a user's hands or protective gloves. The apparatus includes a housing with light emitting diodes (LEDs) positioned to emit ultraviolet (UV-C) light connected to a circuit board which are individually connected to a power source. The apparatus is configured so that when the user positions the hands or gloves under the housing, the UV-C light is emitted for a predetermined period of time based on the distance to the hands and the power output of the LEDs. The UV-C light is emitted at a wavelength suitable to kill, destroy, or reduce growth of microorganisms/germs. The housing can be configured with a sensor to detect motion under the housing and include a limiter hand guard.

Abstract: The present invention relates to a system, and the method of application thereof, for washing and decontamination comprising nebulizing means (8) of a mixture of at least one first gas and at least one first liquid, and pressurizing means (1) of said first gas, wherein said pressurizing means (1) are in fluid communication with a first pressure-regulating valve (3) and with a second pressure-regulating valve (4), the first pressure-regulating valve (3) being in fluid communication with a first pressurized tank (5) through first inlet means (31) of said first gas, the first pressurized tank (5) being configured to contain the first liquid, and comprising first outlet means (30) of said first liquid to the nebulizing means (8) through a first valve (6), at a first pressure that is greater than atmospheric pressure, and wherein the second pressure-regulating valve (4) is in fluid communication with said nebulizing means (8), and is configured to pressurize the gas at a second pressure that is greater than atmosp

Abstract: In some embodiments, a sonic cleaning system includes a tank configured to receive a liquid that enables propagation of sonic waves and a cylindrical insert located within the tank. The cylindrical insert includes a first end having a first opening and a second end opposite the first end. The second end has a second opening. The cylindrical insert is configured to suspend a workpiece between the first opening and the second opening. The sonic cleaning system includes a sonic transducer located within the cylindrical insert.

Abstract: Embodiments of a three-dimensional (3D) memory device with a corrosion-resistant composite spacer and method for forming the same are disclosed. In an example, a method for forming a 3D memory device is disclosed. A dielectric stack including a plurality of dielectric/sacrificial layer pairs is formed on a substrate. A memory string extending vertically through the dielectric stack is formed. A slit extending vertically through the dielectric stack is formed. A memory stack is formed on the substrate including a plurality of conductor/dielectric layer pairs by replacing, with a plurality of conductor layers, the sacrificial layers in the dielectric/sacrificial layer pairs through the slit. A composite spacer is formed along a sidewall of the slit. The composite spacer includes a first silicon oxide film, a second silicon oxide film, and a dielectric film formed laterally between the first silicon oxide film and the second silicon oxide film. A slit contact extending vertically in the slit is formed.

Abstract: A robotic arm can clean an end-of-arm tool using a cleaning station. The end-of-arm tool can be positioned at an introduction position with a portion of the end-of-arm tool in contact with a cleaning agent contained within the cleaning station. The end-of-arm tool can be positioned at a scrubbing position with the end-of-arm tool in contact with a cleaning surface. And the end-of-arm tool can be positioned at a drying position for drying of the end-of-arm tool.

Abstract: A laser descaling device and process includes a first laser sending a ray to the product to be descaled, reflected rays being intercepted by sensors that send collected information into a processing unit that calculates the absorption of the ray by the surface of the product, deduces the emissivity of the oxidized surface in the direction of the reflected rays, and correlates this emissivity with reference information prerecorded inside the processing unit; a second laser sends a ray onto the surface of the product, the spots of the rays covering the entire surface to be descaled, the second laser being controlled by a control unit receiving information provided by the processing unit making it possible to determine the operating parameters to be imposed on the second laser to obtain the descaling of the surface of the product, compared with experimental results prerecorded in the control unit.

Abstract: A cleaning method for removing a film deposited in a processing container includes: executing a cleaning of a processing container by supplying a cleaning gas to the processing container while increasing a pressure in the processing container in a stepwise manner at a plurality of time points, thereby removing a film deposited in the processing container; and detecting an end point of the cleaning based on time-dependent data of a concentration of a predetermined gas generated during the execution of the cleaning, for each pressure of the plurality of time points.

Abstract: A substrate processing device includes a processing container; a substrate holder configured to hold a substrate arranged within the processing container; a gas nozzle configured to spray gas within the processing container; a controller configured to control collision of the gas with the substrate held by the substrate holder. The controller is configured to remove particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.

Abstract: A cleaning process (blasted-particles cleaning process) includes performing, a plural number of consecutive cycles, an ultrasonic cleaning treatment including immersing a turbine rotor blade in a water basin and conducting an ultrasonic wave into the water basin to clean the turbine rotor blade, and a pressurized-water cleaning treatment including spraying pressurized water into an internal cooling flow channel after the ultrasonic cleaning treatment is performed. The cleaning process is performed after a bonding coat layer removing process of removing a bonding coat layer (first coating layer) by chemical treatment, and a cleaning process of cleaning the turbine blade by blast treatment. Heat tinging process is then performed.

Abstract: The present invention provides a regeneration method and a regeneration device of a poisoning honeycomb catalyst, and belongs to the field of catalyst regeneration. The regeneration method of the poisoning honeycomb catalyst provided by the present invention includes the following steps: carrying out microwave heating treatment on the poisoning honeycomb catalyst, and then spraying liquid nitrogen into cells of the poisoning honeycomb catalyst so that the poisoning honeycomb catalyst is regenerated. The regeneration method provided by the present invention is simple, and the efficiency of the regenerated catalyst can be increased by 90% more than the original efficiency. According to the regeneration device of a poisoning honeycomb catalyst provided by the present invention, the catalyst regeneration is carried out by using the regeneration device provided by the present invention, the regeneration operation is simple, and the catalytic efficiency of the regenerated catalyst is improved.

Abstract: The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 ?g/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 M?·cm.

Abstract: A method for treating a substrate includes arranging a substrate in a processing chamber. At least one of a vaporized solvent and a gas mixture including the solvent is supplied to the processing chamber to form a conformal liquid layer of the solvent on exposed surfaces of the substrate. The at least one of the vaporized solvent and the gas mixture is removed from the processing chamber. A reactive gas including a halogen species is supplied to the processing chamber. The conformal liquid layer adsorbs the reactive gas to form a reactive liquid layer that etches the exposed surfaces of the substrate.

Abstract: A method for dry cleaning a susceptor is performed after a substrate is removed from a processing chamber of a substrate processing apparatus. In the method, a cleaning gas for dry cleaning is supplied to a first region including a substrate receiving region in the susceptor. The cleaning gas is regionally supplied to a second region where the cleaning gas is difficult to reach when the cleaning gas is supplied to the first region.

Abstract: According to one embodiment, a laser lift-off apparatus (1) which irradiates with laser light (16) from a side of a substrate (11) an interface between the substrate (11) and a separating layer (12) of a workpiece (10) including the substrate (11) and the separating layer (12) formed over the substrate (11), and separates the separating layer (12) from the substrate (11) includes: an injection unit (22) which blows a gas (35) onto the workpiece (10) and blows away dusts existing on a surface of the workpiece (10), and a dust collecting unit (23) which includes an opening (52) at a position meeting an irradiation position of the laser light (16), and sucks and collects the blown dusts through the opening (52).

Abstract: A method of cleaning a deposition apparatus is provided. The method includes cleaning, with a cleaning gas formed into a plasma, an interior of a processing vessel on which a silicon nitride film is deposited. The cleaning gas includes a fluorine-containing gas and oxygen gas.

Abstract: The present invention has as an object the provision of a light irradiation device capable of performing optical cleaning with high stability regardless of the transport speed of a workpiece. The light irradiation device of the present invention emits ultraviolet light to one surface of a band-shaped workpiece transported along a transport path, and includes a lamp house having an opening along a passing plane on a side of the one surface of the workpiece in the transport path, an ultraviolet lamp provided in the lamp house so as to extend in a width direction of the workpiece, gas supplier configured to supply a treatment-space gas into the lamp house, and an exhaust space forming member having an opening along a passing plane on a side of the other surface of the workpiece in the transport path.

Abstract: Disclosed herein is an environmentally safe etching composition and method for a concrete or mortar surface. The composition includes, in some embodiments, an aqueous solution of urea, acetic acid, a buffering agent, an anticorrosive agent, and a surfactant with no more than about 30% (w/v) urea and at least about 10% (v/v) acetic acid. The method includes, in some embodiments, obtaining the etching composition; applying the etching composition to the concrete or mortar surface at a prescribed ratio of the etching composition to the concrete or mortar surface; allowing the etching composition to stand on the concrete or mortar surface for a prescribed amount of time; and washing the concrete or mortar surface with water to produce an etched surface of the concrete or mortar.

Abstract: Examples of a substrate processing apparatus include a stage, an outer peripheral ring that surrounds the stage while provided with a gap between a side surface of the stage and the outer peripheral ring, a gas supply unit configured to supply gas from a lower side of the gap to an upper side of the gap, and an upper electrode provided above the stage.

Abstract: The present invention relates to a cleaning apparatus. The cleaning apparatus according to the present invention includes a first cleaner for spraying a first detergent through a first nozzle, a second cleaner for discharging a second detergent to an outside of a second nozzle, and a vibration unit for vibrating the second cleaner when the second cleaner discharges the second detergent.

Abstract: A system for performing a Chemical Mechanical Polishing (CMP) process is provided. The system includes a CMP module configured to polish a semiconductor wafer. The system further includes a cleaning brush assembly configured to clean the semiconductor wafer. The cleaning brush includes a rotation shaft and a brush member surrounding a segment of the rotation shaft. The system also includes an agitation transducer arranged to be distant from the brush member and configured to produce an agitated cleaning liquid to clean the cleaning brush assembly.

Abstract: Disclosed herein is a sonic cleaning insert. In one example, the sonic cleaning insert includes a carousel configured to rotate about a central axis. The carousel further includes a platform having an outer perimeter. The platform is radially disposed about the central axis. The carousel has an inner ring and an outer ring circumscribing the inner ring. A plurality of partitions couple the inner ring and the outer ring to the platform. The plurality of partitions are arranged at a predetermined angle about the central axis. The carousel further includes a plurality of holders. Each holder is formed from a portion of the platform, a portion of each of the inner ring and outer ring, and a first sidewall and a second sidewall formed from the plurality of partitions. The carousel is configured for immersion in an ultrasonic vibrating fluid.

Abstract: An integrated additive manufacturing system includes: (a) at least one resin supply (41); (b) a plurality of additive manufacturing machines (43) on which parts may be produced, each of the additive manufacturing machines (43) operatively associated with the at least one resin supply (41); and (c) at least one peripheral machine (200, 48, 220) operatively associated with each of the additive manufacturing machines and the at least one resin supply.

Abstract: The present disclosure provides a cleaning machine, including: a cleaning chamber; a turn table having a plurality of areas arranged around a rotary axis, configured to turn one area of the plurality of areas to the cleaning station and another area to the transport station, each of the plurality of areas having: a cleaning tank including a closable opening, a rotating device arranged at the cleaning tank, and a cleaning table on which the object is placed, and which is arranged on the rotating device and rotatably arranged in the cleaning tank; a nozzle moving device arranged in the cleaning station; a cleaning nozzle arranged on the nozzle moving device; a shutter arranged in the cleaning station and closing the closable opening; and a shutter moving device configured to move the shutter toward the closable opening.

Abstract: A cleaning system and method includes suspending and exploding, adjacent a bank of HRSG finned-tubing, a plurality of generally uniformly spaced detonation cords. Each detonation cord has an explosive grain loading of 18-50 grains per foot. A detonation delay assembly attached to each of the plurality of detonation cords creates a predetermined delay between each detonation cord explosion. After the detonation cords are exploded, a suspended elongated beam, having a transport assembly and a pressurized air blower assembly directs pressurized air towards an adjacent the bank of HRSG finned-tubing as the pressurized air blower assembly is moved along a portion of the beam. A suspension assembly moves the beam, the transport assembly, and the pressurized air blower assembly up or down so that a next portion of the bank of HRSG finned-tubing may be cleaned by the pressurized air.

Abstract: A resist composition is disclosed which comprises a perovskite material with a structure having a chemical formula selected from ABX3, A2BX4, or ABX4, wherein A is a compound containing an NH3 group, B is a metal and X is a halide constituent. The perovskite material may comprise one or more of the following components: halogen-mixed perovskite material; metal-mixed perovskite material, and organic ligand mixed perovskite material.

Abstract: Disclosed is an ultraviolet (UV) light cleaning device. By providing an energy conversion component between an UV light source and a supporting platform, the UV light cleaning device can convert the energy of the UV light to specific energy by the energy conversion component. When the energy of the UV light is higher, the energy of the UV light is converted to specific energy lower than the energy of the UV light, thereby avoiding damage to the substrate while cleaning the substrate to solve the technical problem that the conventional UV light cleaning damages the substrate in a cleaning process.

Abstract: Pressure vessels that operate at elevated temperatures and pressures (e.g., 600° F./316° C., 20000 psig), and ultrasonic transducers and signal connectors for use therein, are described. The pressure vessels include a housing defining a cavity. The housing includes a cylindrical body with plugs positioned within openings of the cylindrical body. Each plug has a recess extending from an external surface to a location ultrasonically adjacent the cavity. The pressure vessels additionally include transducer assemblies positioned within respective plug recesses. Each transducer assembly includes a signal connector positioned within the recess adjacent the external surface, a transducer having a piezoceramic element positioned within the recess at the location ultrasonically adjacent the cavity, and a metallic interconnection spring interconnecting the transducer to the signal connector.

Abstract: A household dishwasher includes a washing compartment receiving items to be washed, a control device configured to carry out a washing program selected from a number of washing programs for washing the items to be washed in the washing compartment, an optical sensor configured to acquire an optical sensor signal of the items to be washed in the washing compartment, and an evaluation unit configured to identify a drying state of the items to be washed in the washing compartment as a function of the acquired optical sensor signal.

Abstract: A substrate processing apparatus includes a chamber to accommodate a substrate. The apparatus includes a stage to support the substrate in the chamber. The apparatus includes an electrode disposed above the stage and containing aluminum. The electrode generates plasma from gas supplied into the chamber to form a first film on the substrate by the plasma. The apparatus further includes a second film formed on a surface of the electrode and containing aluminum and fluorine or containing aluminum and oxygen.