Abstract: Provided is a method for cleaning a semiconductor wafer which can effectively reduce deposits on a main surface of a wafer. A method for cleaning a semiconductor wafer of the present disclosure includes supplying ozone water into a cleaning tank from a lower part of the cleaning tank with the ozone water overflowing from the upper part of the cleaning tank to outside the cleaning tank (first step), subsequently, stopping a supply of the ozone water (second step), subsequently, immersing a semiconductor wafer into the ozone water in the cleaning tank (third step), and subsequently, resupplying the ozone water into the cleaning tank from the lower part of the cleaning tank with the ozone water overflowing again from the upper part of the cleaning tank to outside the cleaning tank (fourth step).

Abstract: The method and apparatus for protecting the printhead heating elements in a thermal printer includes preparing the printer for label dispensing and then covering the printhead heating elements such that the label run or thermal material passing over the same does not contact the printhead heating elements. The cover for the printhead heating elements can take various forms. In one implementation, the cover is a sleeve configured to fit over the entire printhead assembly of the thermal printer. In another implementation, the cover is a shim placed between the printhead and a label run path. The printhead cover has a low coefficient of friction.

Abstract: Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

Abstract: A method for reducing defects of an electronic component using a supercritical fluid includes recrystallizing and rearranging grains in the electronic component by introducing the supercritical fluid doped with H2S together with an electromagnetic wave into a cavity. The cavity has a temperature above a critical temperature of the supercritical fluid and a pressure above a critical pressure of the supercritical fluid.

Abstract: According to one embodiment, a chuck cleaner includes a support, an adhesive layer, and a support substrate. The support includes a first portion, a second portion, and a third portion provided between the first portion and the second portion. The support substrate is provided between the support and the adhesive layer. The support substrate includes a first region fixed to the first portion, a second region fixed to the second portion, a third region provided between the first region and the second region and having variable distance from the third portion, a fourth region provided between the first region and the third region and separated from the support, and a fifth region provided between the second region and the third region and separated from the support.

Abstract: Methods and systems for cleaning an optic include cleaning an optic with ultrasonic vibrations. The locations of nodes in a standing wave of the ultrasonic vibrations are changed by changing a frequency of vibration during cleaning.

Abstract: A pressure shock wave apparatus applies shock waves to separate substances, such as oil, from a water mixture in an enclosure. The substance, such as oil, is moved toward a substance removal conduit and the water moved toward a water conduit from action of the shock wave apparatus.

Abstract: Various embodiments comprise apparatuses and related methods for cleaning a substrate. In one embodiment, an apparatus includes a substrate holder to hold and rotate the substrate at various speeds. An optional inner shield and an optional outer shield, when in a closed position, surround the substrate holder during operation of the apparatus. Each of the inner shield and the outer shield can operate independently in at least one of rotational speed and direction from the other shield. At least one of a front-side laser and a back-side laser are arranged to clean one or both sides of the substrate and edges of the substrate substantially concurrently or independently by impinging a light onto at least one surface of the substrate. A gas flow, combined with a high rotational-speed of the shields and substrate, assists in removing effluents from the substrate. Additional apparatuses and methods of forming the apparatuses are disclosed.

Abstract: A particle removal apparatus is provided. The particle removal apparatus includes a reticle holder configured to hold a reticle. The particle removal apparatus further includes a robotic arm. The particle removal apparatus also includes a particle removal device disposed on the robotic arm, and the particle removal device includes a solution spraying module. In addition, the robotic arm and the particle removal device are configured to align with a particle on a backside of the reticle, and the solution spraying module is configured to spray a solution onto the particle to remove the particle.

Abstract: A method and composition for removing contaminant material from industrial equipment are disclosed herein. The method includes providing a solvent composition having methyl soyate, N-methylpyrrolidinone, an additional solvent, and a cationic surfactant. The method also includes contacting the contaminant material with the solvent composition and allowing the solvent composition to react with the contaminant material such that at least a portion of the contaminant material is no longer attached to the industrial equipment.

Abstract: A method includes transmitting a radiation toward an electrostatic chuck, receiving a reflection of the radiation, analyzing the reflection of the radiation, determining whether a particle is present on the electrostatic chuck based on the analyzing the reflection of the radiation, and moving a cleaning tool to a location of the particle on the electrostatic chuck when the determination determines that the particle is present.

Abstract: The present invention relates to an improved method for impregnating a porous material, such as wood, more specifically a method in which an active ingredient to be deposited within the porous material is dissolved in condensed carbon dioxide and impregnated in the material.

Abstract: Described herein is a technique capable of selectively forming a film in a film-forming step. According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device including: (a) selectively forming a film on a substrate by supplying a process gas into a process chamber accommodating the substrate, wherein an inhibitor layer is formed on a portion of the substrate such that the substrate acquires a selectivity in an adsorption of the process gas; (b) supplying a cleaning gas containing a component contained in the inhibitor layer into the process chamber accommodating no substrate; and (c) removing a residual component of the cleaning gas in the process chamber.

Abstract: Provided is a cleaning agent composition for use in an adhesion process for applying an adhesive to a surface of a first member subjected to a dry treatment without a primer, and adhering a second member to the surface of the first member. The cleaning agent comprises a compound (A) having a (meth)acryloyl group and a liquid (B) having a boiling point of not higher than 200° C.

Abstract: An apparatus for removing particles from a clamp, the apparatus being arrangeable in proximity of the clamp and comprising an insulating portion, a supporting portion, at least a part or all of the insulating portion being arranged on the supporting portion, wherein the supporting portion is configured such that when a voltage is applied to the supporting portion of the apparatus and/or to an electrode of the clamp, the supporting portion acts as an electrode to allow an electric field to be generated between the apparatus and the clamp for removal of the particles from the clamp.

Abstract: An optical waveguide structure includes an optical waveguide, a reflection film provided on the optical waveguide and reflecting a light propagating in the optical waveguide, a metal film provided on the reflection film, and a surface oxidized film provided on the metal film and generated by surface oxidation of the metal film.

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; and a chemical delivery mechanism configured in the processing chamber to provide a chemical to a reaction zone in the processing chamber. The chemical delivery mechanism includes an edge chemical injector, a first radial chemical injector, and a second radial chemical injector configured on three sides of the reaction zone.

Abstract: Materials and methods for degrading a microcystin compound, and filtering microcystin from water, are described.

Abstract: Photoactive cleaning hearing assistance devices and methods of cleaning hearing assistance devices are described. Photoactive nanoparticles may be disposed on or in the hearing assistance devices. The photoactive nanoparticles provide a localized surface plasmon resonance effect when illuminated with light.

Abstract: A wire and a stripping method thereof, and a light strip are provided. The stripping method includes the following steps: holding a wire by a holder, the wire including an insulation layer and a conductor covered by the insulation layer; mounting the holder on a worktable of a an optical device; and activating a light emitter of the optical device to emit a light beam irradiating onto the insulation layer to ablate a portion of the insulation layer to form at least one through hole that penetrates the insulation layer to expose a portion of the conductor.

Abstract: A charged particle beam system is disclosed, comprising: a charged particle beam generator for generating a beam of charged particles; a charged particle optical column arranged in a vacuum chamber, wherein the charged particle optical column is arranged for projecting the beam of charged particles onto a target, and wherein the charged particle optical column comprises a charged particle optical element for influencing the beam of charged particles; a source for providing a cleaning agent; a conduit connected to the source and arranged for introducing the cleaning agent towards the charged particle optical element; wherein the charged particle optical element comprises: a charged particle transmitting aperture for transmitting and/or influencing the beam of charged particles, and at least one vent hole for providing a flow path between a first side and a second side of the charged particle optical element, wherein the vent hole has a cross section which is larger than a cross section of the charged par

Abstract: A magnet extension, magnetic test assembly, and probe card assembly includes a magnet having a first end and a second end, the first end of the magnet being geometrically configured to provide a selected magnetic field. A resilient member 5 is disposed around the magnet between the first end and the second end. A retaining member is disposed between the first end and the second end. The retaining member surrounds at least a portion of the resilient member.

Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig supported on the rotating support plate. In the vessel cleaning step, the jig is located such that the center of the jig is offset from the center of the support plate.

Abstract: Provided is a production method for a film laminate by which a tough film can be bonded to a brittle film while the breakage of the brittle film is prevented. The production method for a film laminate of the present invention includes bonding a tough film having an elongated shape to a brittle film having an elongated shape while conveying the brittle film, wherein the method includes bonding the tough film and the brittle film to each other by bringing the tough film close to the brittle film, followed by blowing of a gas from a side of the tough film opposite to the brittle film.

Abstract: The present disclosure provides a method for cleaning a lanthanum gallium silicate wafer which comprises the following steps: at a step of 1, a cleaning solution constituted of phosphorous acid, hydrogen peroxide and deionized water is utilized to clean the lanthanum gallium silicate wafer with a megahertz sound wave; at a step of 2, the cleaned lanthanum gallium silicate wafer is rinsed and dried by spinning; at a step of 3, a cleaning solution constituted of ammonia, hydrogen peroxide and deionized water is utilized to clean the lanthanum gallium silicate wafer with the megahertz sound wave; at a step of 4, the cleaned lanthanum gallium silicate wafer is rinsed and dried by spinning; and at a step of 5, the rinsed and dried wafer is placed in an oven to be baked.

Abstract: Disclosed is a method of cleaning a substrate processing apparatus in which a substrate having a surface wet by a liquid is brought into contact with a supercritical fluid so as to perform a drying process of drying the substrate. The method includes a cleaning gas filling process and an exhausting process. The cleaning gas filling process fills a cleaning gas containing isopropyl alcohol in the substrate processing apparatus. The exhausting process exhausts the cleaning gas from an inside of the substrate processing apparatus after the cleaning gas filling process.

Abstract: A water treatment equipment includes a reaction chamber, a waveform generator, and a controller. The reaction chamber includes a pipe having a first electrode and a second electrode. The first and second electrodes are coupled to a waveform generator. The reaction chamber includes a water inlet, and a water outlet. The waveform generator is coupled to the first and second electrodes. The waveform generator is configured to generate an electrical current with a frequency that is substantially equal to the electrical resonance of the pipe of the reaction chamber. The controller is configured to control the waveform generator, wherein the reaction chamber is configured to enable a flow of ozone and water to be treated through the pipe.

Abstract: Disclosed is a laser beam processing device, the main part of which is a coupling device (1) for coupling a focused laser beam (2) into a fluid jet (3) of a defined cross-section. The coupling device (1) comprises a housing (4), in which a fluid nozzle is configured for forming the fluid jet (3). In addition, an outlet opening (6) is provided in the housing, through which the fluid jet (3) exits from the housing (4) and the cross-section of which is larger than the cross-section of the fluid jet (3). A passage chamber is provided between the fluid nozzle (5) and the outlet opening (6) for the fluid jet (3).

Abstract: The present disclosure generally relates to methods and apparatuses for additive manufacturing (AM) that utilize compression chambers to reduce pressure on grown objects. In one aspect, the disclosure provides a method for fabricating an object. The method includes (a) irradiating a layer of powder in a build area above a build platform to form a fused region; (b) providing a subsequent layer of powder over the build area; and (c) repeating steps (a) and (b) until at least a portion of the object, at least one chamber, and a tube are formed in the build area. The chamber encloses a region of unfused powder and the tube extends from a passage within the build platform to the chamber. The method also includes (d) removing unfused powder from within the chamber via the tube and the passage. The disclosure also provides an apparatus for forming compression chambers within an object.

Abstract: Embodiments described herein generally relate to methods of depositing thin films and, more particularly, to depositing metal thin films. The methods herein provide a nucleation free conversion (NFC) approach which involves forming an amorphous silicon layer over the dielectric layer, and performing an NFC process which acts to convert the amorphous silicon layer into a thin metal film. In some embodiments, the NFC process is performed multiple times until the resulting thin metal film is continuous. A bulk metal is formed over the thin metal film.

Abstract: A processing apparatus includes: a holding unit that holds a workpiece; a processing mechanism that processes the workpiece held by the holding unit; a processing liquid supplying mechanism that supplies a processing liquid containing an oxidizing agent to at least the workpiece held by the holding unit at the time of processing the workpiece by the processing means; a processing waste liquid recovery section that recovers a processing waste liquid containing the processing liquid supplied from the processing liquid supplying mechanism to the workpiece; a discharge passage through which the processing waste liquid is discharged from the processing waste liquid recovery section to the outside of the processing apparatus; and a waste liquid treatment mechanism that is disposed in the discharge passage and that decomposes the processing liquid contained in the processing waste liquid while the processing waste liquid flows through the discharge passage.

Abstract: Provided is an endless metal ring manufacturing method for manufacturing an endless metal ring by carrying out a barrel polishing step for polishing the endless metal ring by using a barrel of a resin material, a rolling step for rolling the endless metal ring which was cleaned, and a nitriding step for nitriding the endless metal ring which was rolled, wherein after the barrel polishing step and before the rolling step, provided is a resin removing step for removing resin that has adhered to the endless metal ring.

Abstract: Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion.

Abstract: A laser machining apparatus that allows efficient machining of a workpiece includes a nozzle for jetting a jet liquid column, a rectifying chamber attenuating disturbances in flow of liquid, a liquid oscillating chamber guiding the liquid flowing from the rectifying chamber to a nozzle inlet opening, a laser oscillator generating a laser beam, a focusing optical system focusing the laser beam generated by the laser oscillator above the nozzle inlet opening so that the laser beam is guided by the jet liquid column, and a window opposed to the nozzle inlet opening so that the laser beam transmitting from the focusing optical system enters the liquid oscillating chamber. The liquid oscillating chamber increases a surface wave on an outer surface of the jet liquid column so that the jet liquid column jetted from the nozzle onto a workpiece is easily atomized at a machining point.

Abstract: A surface side is irradiated with an SF6 gas plasma to etch a semiconductor wafer which has been peeled off in street portions, and divide the semiconductor wafer into a plurality of individual semiconductor chips. A removing agent is subsequently supplied from the surface side. At that time, it is preferable that the semiconductor wafer divided into the plurality of chips is rotated at high speed. Accordingly, a mask material layer remaining on the surface is removed by the removing agent. Moreover, the removing agent is preferably an organic solvent, and more preferably, methyl ethyl ketone, ethanol, and ethyl acetate, or a combination of these.

Abstract: The invention provides a light guide element (1300) comprising a light guide (300), wherein the light guide (300) in comprises a first light guide face (301) and a second light guide face (302) with UV radiation transmissive light guide material (305) between the first light guide face (301) and the second light guide face (302), wherein the light guide element (1300) further comprises one or more of: (i) a first layer element (30) in contact with the first light guide face (301), wherein the first layer element (30) is transmissive for UV radiation; and (ii) a second layer element (130) in contact with the second light guide face (301), wherein the second layer element (130) has one or more functionalities selected from the group consisting of (a) reflective for UV radiation, (b) adhesive for adhering the light guide (300) to an object, (c) reinforcing the light guide element (1300), and (d) protective for the light guide (300).

Abstract: A method for removing a coating of a surface of a wheel. The wheel is provided with screw channels and with a centrally positioned hub opening. Each of the screw channels and the central opening is delimited by an area from which the coating is to be removed. Each of the areas extends annularly around one of the screw channels or around the hub opening. The method is implemented using a laser beam generated by a laser source. The method comprises the steps of positioning an extraction opening directly beneath a center of one of the screw channels or the central opening surrounded by the area, moving the laser beam over the area without masking the area (7) from which the coating is to be removed, and extracting gases and particles produced during the step of removing the coating directly through one of the screw channels or the central opening.

Abstract: Methods are disclosed that illuminate etch solutions to provide controlled etching of materials. An etch solution (e.g., gaseous, liquid, or combination thereof) with a first level of reactants is applied to the surface of a material to be etched. The etch solution is illuminated to cause the etch solution to have a second level of reactants that is greater than the first level. The surface of the material is modified (e.g., oxidized) with the illuminated etch solution, and the modified layer of material is removed. The exposing and removing can be repeated or cycled to etch the material. Further, for oxidation/dissolution embodiments the oxidation and dissolution can occur simultaneously, and the oxidation rate can be greater than the dissolution rate. The material can be a polycrystalline material, a polycrystalline metal, and/or other material. One etch solution can include hydrogen peroxide that is illuminated to form hydroxyl radicals.

Abstract: A shielded containment cabinet device for use for the cleaning under high visibility and high protection for user, while using reduction flow pressurized water for cleaning of materials.

Abstract: A method for reducing level of contaminants from an object, the method comprises introducing the object into an ultrasonic (US) bath carrying an aqueous medium that holds, suspended therein, insoluble nanoparticles and activating said bath to apply US waves only said object while the object is at least partially submerged within said aqueous medium.

Abstract: Methods and systems are provided which project germicidal light from a lamp toward an individual donned in outerwear to disinfect the outerwear. In specific embodiments, germicidal light is projected toward an individual situated greater than approximately 1 foot from the light source. Some systems include sensor/s for detecting presence of an individual within a target area a set distance from the disinfection apparatus comprising the light source and program instructions for commencing operation of the disinfection apparatus based on information from the sensor/s. In addition or alternatively, some systems include reflective panel/s exhibiting greater than approximately 85% reflectance.

Abstract: Disclosed is an apparatus and method for providing asymmetric oscillations to a container. The container may include a fluid, a particle, and/or a gas. A vibration driver attached to the container provides asymmetric oscillations. A controller connected to the vibration driver controls an amplitude, frequency, and shape of the asymmetric oscillations. An amplifier amplifies the asymmetric oscillations in response to the controller. A sensor disposed on the vibration driver provides feedback to the controller.

Abstract: A method of driving a vibration device including a light-transmitting body and a piezoelectric element connected to the light-transmitting body is provided to vibrate the light-transmitting body. The method atomizes and removes liquid drops sticking to the light-transmitting body. A driving voltage to vibrate the piezoelectric element is swept at a sweep speed in a range of about 1 Hz to about 50 Hz so as to sweep a vibration frequency of the piezoelectric element to cover a frequency range including both of a resonant frequency of the light-transmitting body without liquid drops sticking to the light-transmitting body and a resonant frequency of the light-transmitting body with the liquid drops sticking to the light-transmitting body.

Abstract: An apparatus for finishing a component includes at least one articulating arm, at least one plasma gun disposed at an end of a first articulating arm of the at least one articulating arm, at least one shot peen nozzle maintained in a fixed positioned relative to the plasma gun, and a controller controllably coupled to the articulating arm such that output signals from the controller control motions of the articulating arm.

Abstract: An appliance and method utilize a context-sensitive fixed-position user interface including cycle type controls used to select a cycle type and cycle configuration controls used to configure settings associated with particular cycle types. Indicators of the cycle type and cycle configuration controls are selectively set to active or inactive states during cycle type selection and cycle configuration phases to facilitate user configuration of settings for the appliance prior to performing an appliance cycle.

Abstract: An ion beam device according to the present invention suppresses the fluctuation of an ion emission current by cleaning the inside of a chamber without entailing wear damage to an emitter electrode. The ion beam device includes a GFIS including an emitter electrode having a needle-shaped tip; an extraction electrode having an opening at a position spaced apart from the tip of the emitter electrode; and a chamber encapsulating the emitter electrode therein. The GFIS includes an ionizable gas introduction path for introducing an ionizable gas into the chamber in a state where a voltage equal to or more than a beam generating voltage is applied to the emitter electrode; and a cleaning gas introduction path for introducing a cleaning gas into the chamber in either a state where a voltage less than the beam generating voltage is applied to the emitter electrode or a state where no voltage is applied to the emitter electrode.

Abstract: A method of removing material from a surface of a workpiece includes discharging a flow of fluid towards a workpiece at a pressure and a flow rate that facilitates forming a plurality of cavitation bubbles, and introducing abrasive media. The method includes exciting the abrasive media with the cavitation bubbles, removing material from the workpiece by an interaction between the cavitation bubbles and the abrasive media, and the surface of the workpiece.

Abstract: Systems and methods for cleaning a substrate include a combined treatment of hydrogen peroxide and ultraviolet (UV) irradiation. Specific embodiments include the direct irradiation with 185/254 nm UV of a spinning substrate immersed under a liquid film of dilute hydrogen peroxide solution. Such a cleaning treatment can result in about a 100% improvement of TiN strip rate compared to processing with the same hydrogen peroxide solution without UV exposure. Such method can also be executed at room temperature and still provide improved cleaning efficiency.

Abstract: A cleaning apparatus for concentration controller of coating machine may include a pulse bubble generator and a container used for cleaning a concentration controller of a coating machine and a tube thereof. The pulse bubble generator has a bubble-generating end connected to the container through a pipe, and the container is filled with a plentiful detergent. The pulse bubble generator is configured to pump air into the detergent with a pulse per time, and a large amount of detergent bubbles are adapted to be generated in the container. The detergent bubbles are configured to be pumped by the concentration controller into the tube and the concentration controller so as to complete cleaning effect of the tube and the concentration controller.

Abstract: Disclosed are a de-icing device for a solar panel and a method of operating the same. The de-icing device for the solar panel and the method of operating the same include a sensor unit, a power supply unit, a switching unit, and a control unit, so that it is possible to provide a high-efficiency de-icing device for the solar panel in which snow deposited on the solar penal may be dissolved by applying a reverse current to the solar panel. In addition, it is possible to provide a high-efficiency and high-precision de-icing device for the solar panel in which solar power generation and de-icing may be simultaneously performed and the amount of the reverse current may be controlled.