Abstract: A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.

Abstract: An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

Abstract: In accordance with one embodiment there is provided a method of improving the performance of a substrate cleaner of the type having a megasonic probe with a probe shaft extending generally parallel to a surface of a rotating substrate, and at least one dispenser for applying a cleaning liquid onto the surface of the substrate, wherein the megasonic probe agitates the liquid on the surface. The method comprising dissolving gas in the liquid before the liquid reaches the dispenser. In accordance with another embodiment, an apparatus for cleaning substrates comprises a rotary fixture which is adapted to support a substrate and rotate the substrate about a first axis, a probe having a probe shaft extending generally parallel to a surface of the substrate, and a megasonic transducer in acoustically coupled relation to the probe.

Abstract: A system for cleaning a substrate includes a tank defining an inner cavity between a base and sidewalls extending therefrom. A source of acoustic energy affixed to an outer surface of one of the sidewalls. The tank is configured to decouple a direction associated with the acoustic energy from the source of acoustic energy and direct the acoustic energy toward the substrate.

Abstract: A system for cleaning a semiconductor substrate is provided. The system includes transducers for generating acoustic energy oriented in a substantially perpendicular direction to a surface of a semiconductor substrate and an acoustic energy oriented in a substantially parallel direction to the surface of the semiconductor substrate. Each orientation of the acoustic energy may be simultaneously or alternately generated.

Abstract: Apparatus for pressure processing components is disclosed which includes an improved closure system that minimizes dust-generating parts and allows easy access to the chamber. Ports are provided for introducing and releasing pressurized gases and fluids to and from the processing space. The heating system of the apparatus heats both the cover and the stage inside the pressurized chamber such that cycle time to equilibrate heated, pressurized fluids such as supercritical carbon dioxide inside the chamber are decreased. The apparatus includes a mechanism that raises the stage inside the chamber, pressing it against the fixed cover and sealing the inside of the pressure vessel. In one embodiment a screw-type jack is used to move the component-loaded stage fitted with a deformable o-ring seal a short travel distance to seat against the lid and seal the pressure chamber. In a related embodiment a computer and an electronic stepper motor are used to drive the pressing means in an automated fashion.

Abstract: An automated kitchenware washing tank has a pump system with a pump and fluid conduits to couple the pump between an intake opening through one of the walls and discharge openings in the wall of the tank. At least some of the discharge openings are preferably formed in at least one angled portion of the tank wall that faces downwardly into the tank, and, more preferably, on two opposed angled portions that face downwardly into the tank. A control system may be coupled to the pump for controlling the speed with which the pump supplies cleaning fluid to the discharge openings. The control system comprises a speed selector that is adapted to allow a user to activate the speed selector to select between at least two different speeds for pumping the cleaning fluid to the discharge openings. In operation, the automated washing tank pumps cleaning fluid from within the tank through the intake outlet through the fluid conduits and out of the discharge openings into the tank to create turbulence within the tank.

Abstract: A megasonic cleaning apparatus is provided for removing contamination particles on a wafer. The megasonic cleaning apparatus includes a piezoelectric transducer and an energy transfer rod. The piezoelectric transducer is for generating megasonic energy. The energy transfer rod installed over the wafer along a radial direction of the wafer is for distributing the megasonic energy to cleaning solution over the wafer and for vibrating the cleaning solution. The energy transfer rod is shaped and sized to uniformly distribute energy in the radial direction of the wafer through the cleaning solution to remove the contamination particles from the wafer.

Abstract: The invention provides systems, methods and apparatus for processing delicate parts within a process tank such as an ultrasonic tank. Typically, one or more transducers connect to the tank and respond to drive signals from a generator to produce ultrasound within process liquid within the tank.

Abstract: Ultrasonic cleaning devices comprise a sonotrode and a power supply adapted to supply current to the sonotrode, and further include one or more features which facilitate use of the ultrasonic cleaning devices by consumers, improve the safety of the ultrasonic cleaning devices when used by consumers, and/or improve the cleaning efficiency of the ultrasonic cleaning devices when used by consumers.

Abstract: Apparatuses and methods of processing a substrate. The apparatus includes a wet-cleaning chamber, a drying chamber, and a substrate transferring chamber which transfers a substrate to and from the wet-cleaning chamber and the drying chamber. The drying chamber is one of a supercritical drying chamber or a low pressure drying chamber. The wet-cleaning chamber is one of a single-wafer cleaning chamber, a horizontal spinning chamber, a megasonic wet-cleaning chamber, or a horizontal spinning chamber having acoustic waves transmitted to the substrate.

Abstract: An embodiment of the invention is an apparatus having a cleaning tank 2, a megasonic energy source 3, and an intake pipe 6 where a membrane contactor 9 is coupled to the intake pipe 6 to change the concentration of nitrogen gas in the deionized water 8 contained in intake pipe 6 to a range between 5.4% to 54% of saturation. Another embodiment is a method of changing the concentration of nitrogen gas in deionized water 8 to a range between 5.4% to 54% of saturation.

Abstract: A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section.

Abstract: A substrate treatment apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety. The nozzle unit is constructed in a form of a bar such that as viewed in plan, the liquid ejected from the nozzle unit reaches the substrate with an area range having a length not smaller than a diameter of the substrate and a width smaller than the diameter of the substrate.

Abstract: A method and apparatus for cleaning internal channels in an article are presented, with the method comprising providing an article that comprises at least one internal channel. The at least one internal channel comprises at least one inlet port and at least one outlet port. The method further comprises providing a cleaning apparatus, and this cleaning apparatus comprises a cleaning fluid, a reservoir containing the cleaning fluid, a transmitter of vibrational energy projecting into the reservoir the transmitter comprising a transmitter tip and a source of vibrational energy coupled to the transmitter, with the vibrational energy comprising a frequency and a wavelength. The reservoir of the provided apparatus comprises an interface adapted to accommodate attachment of the reservoir to the article, and this interface comprises an orifice to allow fluid communication between the reservoir and the at least one internal channel of the article.

Abstract: A cleaning tool for cleaning substrates, comprising a circulation conduit through which is circulated a cleaning liquid or gas. The circulation conduit is disposed in fluid communication with an upstream flow chamber and a downstream cleaning chamber, the cross-sectional area of which cleaning chamber is less than the cross-sectional area of the flow chamber. In use, the cleaning chamber receives a wafer substrate for cleaning of particles or removal of polymer films from the substrate. The smaller cross-sectional area of the cleaning chamber accelerates the flow of a cleaning fluid flowing through the cleaning chamber from the flow chamber. The rapidly-flowing cleaning fluid removes the particles and/or films from the substrate while preventing dropping of the removed particles or re-deposition of the film back onto the substrate. A particle filter may be provided in the circulation conduit downstream of the cleaning chamber for removing the particles.

Abstract: A gas-heated dishwasher includes a gas burner for heating the rinsing liquid and drying dishes, which is suitable for drying dishes and heating the rinsing liquid in an efficient way, while, at the same time, making it possible for a worktop to be placed on top of the dishwasher, the gas burner is embodied and disposed in the motor chamber so that it heats at least one closed tubular heating body filled with a fluid during a sub-program dry section and heats the rinsing fluid during the sub-program sections when the rinsing fluid is used.

Abstract: A system and method for improving the efficiency and effectiveness of the transmission of acoustical energy to process fluids during substrate processing, such as cleaning or photoresist stripping. The invention utilizes a layered stack of materials to transmit acoustical energy from a source of acoustical energy to the process fluid. The material of which each layer is constructed is chosen so as to reduce the differences in acoustical impedance between consecutive layers of the stack, providing a more gradual transition, in terms of acoustical impedance, when acoustical energy is being transmitted from the source to the process fluid. In one aspect, the invention is a system comprising: a process chamber for receiving a process fluid; an acoustical energy source; and an acoustical stack having a first transmission layer and a second transmission layer that forms an acoustical energy pathway from the acoustical energy source to the process fluid in the process chamber.

Abstract: The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a substrate having a plurality of electronic packages on the surface of the chuck. A pulsator nozzle is supported above the chuck and the separated electronic packages on the chuck such that the pulsator nozzle may emit fluid toward the packages. An ultrasonic generator is associated with the nozzle that is adapted to ultrasonically energize fluid that passes through the nozzle to enhance cleaning of the packages.

Abstract: A method including the step of providing a substrate having a contact pad, and an under bump metallurgy overlying the contact pad, and a photoresist layer overlying the under bump metallurgy, and wherein the photoresist layer has an opening defined therein down to the under bump metallurgy and aligned with the contact pad. Pretreating the substrate with the first wetting solution prior to plating a first seed layer over the under bump metallurgy. Thereafter, plating a first seed layer is plated onto the under bump metallurgy.

Abstract: An apparatus for wet cleaning a substrate includes a clean air supplier for supplying the clean air into a cleaning draft, a humidifier for supplying steam or mist like water drops into the cleaning draft, a hygrometer, connected to the humidifier and positioned at the level of the cleaning solution, an exhaust piping and an exhaust rate control means.

Abstract: A supercritical fluid cleaning system and method comprising mainly a pressure chamber, a closable lid, a substrate support for holding at least one substrate, a rotable shaft extending outward from within the chamber, an external rotary power source coupled magnetically or otherwise to the shaft, and a rotable component or impeller attached to the chamber end of the shaft in close proximity to the substrate holding position, and baffles located close to the rotable component. The rotable component is con|figured for rotation within the supercritical phase fluid in the chamber close to the surface of the wafer for causing agitation and turbulent fluid flow against the surface of the substrate, and increased intra-chamber fluid circulation.

Abstract: An apparatus includes a rotatable chuck for supporting a substrate and a splash guard. The splash guard surrounds the chuck and surrounds a substrate mounted on the chuck. The splash guard has a portion that deflects fluid being flung off the substrate by centrifugal action in a manner so as to not splash back onto the substrate. The splash guard is moveable between a process position in which the upper annular edge of the splash guard extends above the chuck and a substrate on the chuck, and a load/unload position in which the splash guard is tilted so that one side of the upper annular edge is below an upper edge of the chuck. The movement of the splash guard facilitates loading and unloading of a substrate.

Abstract: An apparatus containing a composition suitable for eliminating a thermosetting resin is disclosed. In the composition, tetra methyl ammonium hydroxide (TMAH) is included so as to eliminate the thermosetting resin. Accordingly, the composition is suitable for removing a dielectric layer, an organic protective layer, an insulating layer, an alignment layer, black matrices and color filters, etc. made form a thermosetting resin in an LCD or a semiconductor, and permits a reproduction or a rework of the thermosetting resin film.

Abstract: The devices and methods of the art do not readily allow moistening of, removing gas bubbles from and/or increasing the transfer of material in through bores and/or pocket holes in printed circuit boards (PCB). Considerable problems are presented by the treatment of very narrow bores with high aspect ratios in particular. To overcome this problem a method was found that involves the following stages: the printed circuit boards PCB are passed through a processing plant on a horizontal conveying path and in one conveying plane 2 by means of transportation means 13, 14 and are thereby brought to contact a liquid for treatment, wherein mechanical pulses are directly transmitted to the printed circuit boards PCB via the transportation means 13, 14 and/or via the liquid for treatment by means of pulse generating means 50.

Abstract: A cleaning station for a vertical nozzle plate of an ink jet printer includes a cylindrical cleaning roller that has an outer surface, and has a substantially vertical central axis and a substantially vertical rotational axis. The roller is spaced from the nozzle plate to form a cleaning cavity between the roller and the nozzle plate. The roller has a top end above the nozzle plate and a bottom end below the nozzle plate. A drive element is connected to the roller to rotate the roller about its rotation axis. A fluid outlet near the top of the roller directs cleaning fluid onto the outer surface of the roller, and into the cleaning cavity between the roller and the nozzle plate. A fluid reservoir stores cleaning fluid, and a fluid conduit conducts cleaning fluid from the fluid reservoir to the fluid outlet.

Abstract: A megasonic cleaning system comprised of a container, a resonator, one or more piezoelectric crystals and a bonding layer comprised of indium or tin for attaching the piezoelectric crystal to the resonator. The resonator comprises a material selected from the group consisting of quartz, sapphire, silicon carbide, silicon nitride, aluminum, ceramics and stainless steel. The piezoelectric crystal may be attached directly to a side or to the bottom of the container, in which case the container acts as the resonator.

Abstract: The present invention provides a method and an apparatus for cleaning substrates. The cleaning chamber defines a processing cavity adapted to accommodate a substrate therein. In one embodiment, the cleaning chamber includes a chamber body having a processing cavity defined therein. A substrate is disposed in the processing cavity without contacting other chamber components by a Bernoulli effect and/or by a fluid cushion above and/or below the substrate. Fluid is flowed into the processing cavity at an angle relative to a radial line of the substrate to induce and/or control rotation of the substrate during a cleaning and drying process.

Abstract: The present invention provides a megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate. The apparatus includes a probe having one of a variety of cross-sections configured to decrease the ratio of normal-incident waves to shallow-angle waves. One such cross-section includes a channel running along a portion of the lower edge of the probe. Another cross-section includes a narrow lower edge of the probe. Another cross-section is elliptical. Another cross-section includes transverse bores originating in the lower edge of the probe. As an alternative to, or in addition to, providing a probe having a cross-section other than circular, the present invention may also provide a probe having a roughened lower surface.

Abstract: A method of cleaning using an insonified, pressurized liquid to cleanse and then wash off particulates. The liquid is used to focus and direct the acoustical energy while enabling the trapping of the partials being cleaned and then used to wash off the partials. The acoustical frequency and power is described as optimized to be below the energy level to cause cavitation at the surface of the part being cleaned. The manufacturing process of loading, cleaning and unloading is also described. In another embodiment, a small amount of cavitation is acceptable if the cavitation is below a threshold in which shock waves occur.

Abstract: A process and apparatus for locally removing any material, such as a refractory metal, in particular tungsten, from any desired area of a wafer, such as an alignment mark area of a silicon wafer in process during the formation of integrated circuits thereon.

Abstract: A method for cleaning a substrate surface using ultrasonic energy includes an array of ‘N’ transducer elements. Electrical signals, Sn, having signal parameters including a voltage, VN, and phase, ?N, are provided to drive each transducer element and generate respective ultrasonic waves. A computer sub-system is used to control the signal parameters to establish a substantially uniform cavitation energy at a plurality of locations on the substrate surface. The signal parameters can be established to focus or steer the ultrasonic energy from the array to each location. To calculate the electrical signal parameters, the computer sub-system can use some or all of the following as inputs; the arrangement and inter-element spacing of the transducer elements, characteristics of the fluid medium, and the coordinates of the locations requiring cleaning.

Abstract: A cleaning apparatus is provided with a processing bath to be filled with a cleaning chemical, an ultrasonic oscillator, and a retainer for holding a substrate to be immersed into a cleaning chemical. The front surface of the substrate is cleaned while ultrasonic waves are radiated from the ultrasonic oscillator onto the back surface of the substrate.

Abstract: A dishwasher pump mounting assembly is provided, and includes a pump mounting plate which is supported by the bottom wall of the dishwasher tub and extends through a hole in the bottom wall. A plurality of locking members secure the pump mounting plate to the bottom wall and prevent upward movement of the housing. Each lock member includes a pivotal lever moveable between locked and unlocked position, and a slideable plunger movable between extended and retracted positions within the lever. In the extended position, the plunger maintains the lever in the locked position. In the retracted position, the lever is free to be pivoted between the unlocked and locked positions.

Abstract: A parts washer including a receptacle positioned on a reservoir for cleaning liquid having a drain opening and a module which engages a portion of the reservoir in the cleaning liquid for adjusting the temperature of the cleaning liquid and circulating the cleaning liquid into the receptacle. The module includes a heating element, a sensor and pump. An enclosure houses a temperature controller which displays the temperature of the cleaning liquid and a low liquid level condition. A bridge thermally links the heating element to the sensor so that the sensor normally generates a signal representative of the temperature of the cleaning fluid unless the level of the cleaning fluid is disposed below the sensor.

Abstract: A sonic fruit and vegetable washer for removing inorganic impurities and pathogens from a variety of raw fruit and vegetables. The sonic fruit and vegetable washer is comprised of a housing, a removable basket, a liquid dispenser, a filter, a sonic generator, a spray head, hydraulic values, electrical controls, a blower, and a heating element. The washer is connected to an existing faucet, and drains into a conventional kitchen sink. During a typical operation, the controls are adjusted for a particular fruit or vegetable, a fruit or vegetable is loaded into the basket, and a small amount of a preservative, cleaning agent, sweetener or vitamin or mineral is added and electrical power is applied. Water enters the washer, is filtered, and one or more wash and rinse cycles are completed. The sonic generator is active during the wash and rinse cycles to remove and flush contaminants from the washer. Thereafter, a drying cycle is completed.

Abstract: Initially, process parameters for dense phase fluid cleaning are determined. Thereafter, a cleaning chamber containing a substrate is pressurized with a dense phase fluid, based on these process parameters. The substrate is then cleaned with the dense phase fluid, again based on these process parameters. Exhaust fluid is subsequently expelled from the cleaning chamber, and thereafter analyzed. The process parameters are then adjusted to adjusted process parameters based on the analysis of the exhaust fluid. Thereafter, the cleaning chamber is again pressurized and cleaning repeated. This pressurization and cleaning is based on the adjusted process parameters. Also, this pressurization and cleaning is repeated until the substrate is sufficiently clean.

Abstract: A method for cleaning a semiconductor substrate with a sonic cleaner is provided. The method initiates by introducing a cooling fluid into an inner jacket region of a sonic cleaner to cool a sonic resonator positioned within the inner jacket region. Then, a cleaning agent is introduced into an outer jacket region of the sonic cleaner to clean a semiconductor substrate. Next, a cooling fluid/cleaning agent interface is defined at an orifice location between the inner jacket region and the outer jacket region. Then, sonic energy from the resonator is transmitted to the cleaning agent through the interface at the orifice. Next, the cleaning agent is applied to the semiconductor substrate.

Abstract: According to the present invention, a pre-cleaning process is performed for removing a physical substance such as blood, mucus or tiny pieces of tissue that are attached to the exterior of the medical device and are inside a duct or a hollow portion. Then, the pre-cleaned medical device is immersed in a chlorine dioxide solution and/or a chlorine dioxide solution is passed through the duct or the hollow portion. Thereafter, the medical device is placed in a chlorine dioxide gas atmosphere and/or a chlorine dioxide gas is passed through the duct or the hollow portion. In this manner, the exterior of the medical device and the interiors of the duct and the hollow portion are deodorized, disinfected and sterilized.

Abstract: A system and method for re-circulating processing fluids in a substrate processing system is provided. A fluid re-circulation system for a brush box processing tool includes a supply tank into which processing chemicals, DI water, or other processing fluids are introduced into the system from an external source. Processing chemicals are provided to the brush box and dispensed to process a substrate. Dispensed fluids drain from the brush box into a diverter through which fluids either flow to waste, or into a collection tank. Fluids from the collection tank flow into the supply tank to re-circulate for wafer processing. The re-circulation system includes filters for maintaining chemical purity, and chemical concentration is monitored and adjusted as necessary.

Abstract: An apparatus comprising an acoustically resonant ultrasound launcher is provided for cleaning of optical fiber connectors and other optical fiber parts. The resonant ultrasound launcher is designed to transfer and to focus ultrasonic energy from an ultrasound transducer to a relatively small target area with high intensity. Specially designed fluid flow channels allow this apparatus to efficiently clean optical fiber connectors with an exposed end surface or with an end surface concealed in a connector adapter. Circuitry is provided to automatically track the frequency to enhance the ultrasound generation. Another circuitry is provided to program the sequence of the cleaning process, including washing, rinsing and drying.

Abstract: Contaminants are removed from a semiconductor wafer by the in-situ generation of oxidizing species. These active species are generated by the simultaneous application of ultra-violet radiation and chemicals containing oxidants such as hydrogen peroxide and dissolved ozone. Ultrasonic or megasonic agitation is employed to facilitate removal. Radicals are generated in-situ, thus generating them close to the semiconductor substrate. The process chamber has a means of introducing both gaseous and liquid reagents, through a gas inlet, and a liquid inlet. O2, O3, and H2O vapor gases are introduced through the gas inlet. H2O and H2O2 liquids are introduced through the liquid inlet. Other liquids such as ammonium hydroxide (NH4OH), hydrochloric acid (HCI), hydrofluoric acid (HF), and the like, may be introduced to further constitute those elements of the traditional RCA clean. The chemicals are premixed in a desired ration and to a predetermined level of dilution prior to being introduced into the chamber.

Abstract: The present invention pertains to a system for cleaning wafers that includes specialized pressurization, process vessel, recirculation, chemical addition, depressurization, and recapture-recycle subsystems, as well as methods for implementing wafer cleaning using such a system. A solvent delivery mechanism converts a liquid-state sub-critical solution to a supercritical cleaning solution and introduces it into a process vessel that contains a wafer or wafers. The supercritical cleaning solution is recirculated through the process vessel by a recirculation system. An additive delivery system introduces chemical additives to the supercritical cleaning solution via the solvent delivery mechanism, the process vessel, or the recirculation system. Addition of chemical additives to the sub-critical solution may also be performed. The recirculation system provides efficient mixing of chemical additives, efficient cleaning, and process uniformity.

Abstract: An apparatus for cleaning a semiconductor substrate is provided. In embodiment of the present invention, a megasonic cleaner capable of providing localized heating is provided. The megasonic cleaner includes a transducer and a resonator. The resonator is configured to propagate energy from the transducer. The resonator has a first and a second end, the first end is operatively coupled to the transducer and the second end is configured to provide localized heating while propagating the energy from the transducer. A system for cleaning a semiconductor substrate through megasonic cleaning and a method for cleaning a semiconductor substrate is also provided.

Abstract: This invention relates to a vibrating abrasive cleaning apparatus and method which is powered by at least one electric motor specially fabricated to the cleaning container assembly mounted on a rigid square tubing frame on one side by compression springs, on the opposite side by tension springs. The compression springs and tension springs have a different spring rate which produces better rolling of the media and therefore, faster circulation and cleaning. The specially fabricated electric motor attached to the cleaning container provides for enhanced oscillation and much greater cleaning capabilities thereby reducing the cleaning time. The entire vibrating assembly sits on a base and has a lid operated by a cable and counterweight for ease in loading the container for oscillation of the parts.

Abstract: Apparatuses and methods of processing a substrate. The apparatus includes a wet-cleaning chamber, a drying chamber, and a substrate transferring chamber which transfers a substrate to and from the wet-cleaning chamber and the drying chamber. The drying chamber is one of a supercritical drying chamber or a low pressure drying chamber. The wet-cleaning chamber is one of a single-wafer cleaning chamber, a horizontal spinning chamber, a megasonic wet-cleaning chamber, or a horizontal spinning chamber having acoustic waves transmitted to the substrate.

Abstract: Embodiments of the invention include a megasonic energy cleaning apparatus that has the ability to rotate the wafer to be cleaned, as well as rotate the cleaning probe during the cleaning process. Rotating the cleaning probe while the wafer is being cleaned is effective to increase the cleaning action of the apparatus while also minimizing damage to the wafer. Curved grooves, such as a spiral groove, can be etched into the cleaning probe to minimize forming harmful waves that could potentially cause damage to the wafer surface or to structures already made on the surface. Using a cleaning probe having a curved groove while also rotating the cleaning probe effectively cleans particles from a wafer while also limiting damage to the surface of the wafer.

Abstract: A device for scouring a coating from a fibrous material includes a tank for immersing a plurality of fibers in scouring solvent therein. The device also includes a bubbling device positioned therein and having a chamber formed between a base plate and a cover plate with a plurality of holes. The plurality of fibers is mounted within the tank above the cover plate and holes of the bubbling device, so that gas bubbles produced thereby move through the scouring solvent and through the plurality of fibers. The holes are arranged in a pattern on the cover plate that corresponds to a shape assumed by the plurality of fibers when mounted within the tank. A process for scouring a coating from a fibrous material is also disclosed and involves immersing a plurality of fibers in a scouring solvent and producing a plurality of gas bubbles that move through the solvent and the plurality of fibers.

Abstract: This invention relates to a fluid driven agitator used in densified gas cleaning system, which comprises a hydraulic motor mounted to a cleaning vessel of the densified gas cleaning system, wherein the hydraulic motor comprises a fluid in-port for charging the fluid into the hydraulic motor from outside of the cleaning vessel, and a fluid out-port for discharging the fluid from the hydraulic motor out of the cleaning vessel. An output shaft of the hydraulic motor can be joined to a rotatable component, such as a rotary basket or an impeller, subjecting circulation of the fluid and resulting in stirring.

Abstract: A method and device for cleaning the inside of a liquid dispensing tube that is contaminated with a previously dispensed liquid. The contaminated liquid dispensing tube is filled with a cleaning fluid. The liquid dispensing tube is then impacted with an impacting device. The impacting of the liquid dispensing tube creates pressure waves in the cleaning fluid. The pressure waves dislodge the liquid contaminate from the inside of the liquid dispensing tube while a flowing cleaning fluid flushes the liquid contaminate out of the liquid dispensing tube.