Abstract: A drawing apparatus which performs drawing on a substrate with a plurality of charged particle beams includes: a blanking device configured to individually blank the plurality of charged particle beams; a scanning deflector configured to deflect the plurality of charged particle beams to scan the plurality of charged particle beams on the substrate; and a controller configured to generate a periodic signal to control a periodic deflection operation of the plurality of charged particle beams by the scanning deflector. The controller is configured to adjust an amount of deflection of the plurality of charged particle beams by the scanning deflector in a period of the periodic signal so that a scanning speed of the plurality of charged particle beams becomes a target speed.

Abstract: A method and apparatus for self-assembling a part on a substrate are disclosed herein. In some embodiments, a method includes placing a substrate having a first binding site capable of generating a first magnetic field and having a first shaped surface with a first droplet conformably disposed thereon into a first fluid; placing a part having a second binding site capable of generating a second magnetic field and having a second shaped surface with a second droplet conformably disposed on the second shaped surface into the first fluid; and attracting the part towards the first binding site such that an equilibrium is formed between an attractive force and a repulsive force such that the part is free to rotate about the first binding site to minimize the repulsive force when the first and second shaped surfaces rotate into an alignment causing the part to aligned with the first binding site.

Abstract: The invention relates to a method for making metallic and/or non-metallic products 2, in particular dental products, by freeform sintering and/or melting, in which the products 2 are fabricated layer by layer from a material 5 that is applied layer by layer by means of a computer-controlled high-energy beam 7, in particular a laser or electron beam. In order to reduce production times, beam 7 irradiates predetermined positions P1 to P6 of a layer of a material 5 a plurality of time, namely m times, where m is a whole integer greater than 1. Each of said positions P1 to P6 is initially heated during the first irradiation to a temperature below the melting point Tmelt of the material 5, and during the mth irradiation to a temperature above said melting point and is completely melted over the entire thickness of the layer in such a way that the material (5) fuses at said position to the layer thereunder. The invention also relates to an apparatus for performing said method.

Abstract: An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.

Abstract: A composition comprises a fluorine-containing aromatic polymer, an epoxy compound and an initiator. Its use as film, laminate with polyimide or copper foils, copper-clad laminated board and adhesive film. The fluorine-containing aromatic polymer is preferably a fluorine-containing aryl ether polymer. The initiator is preferably a cationic initiator.

Abstract: When a formed position of a via formed on a board is the same as a position of a footprint of a chip component located on the back surface of the board corresponding to an area on which a BGA is mounted, a board designing apparatus determines that the chip component and the BGA can be connected using chip on hole. When it is determined that the chip component and the BGA can be connected, the board designing apparatus carries out chip on hole by forming a via in an area of the board on which the BGA is mounted, the via leading to the footprint of the chip component located on the back surface of the board.

Abstract: A method of making a composite light diffusing panel including at least spaced apart lites with a fabric layer applied to an inner surface of at least one of said lites, involves applying a transparent adhesive to the layer of fabric or the lite(s), firmly applying the layer of fabric onto the lite(s) to avoid wrinkling fabric, curing the adhesive to bond the fabric to the lite(s), and assembling the lites to form the light diffusing panel. In this way, a functionally useful product can be obtained that does not suffer from wrinkling and other distracting effects.

Abstract: Methods and apparatuses for adhering optoelectronic components in optical, electronic or optoelectronic devices are disclosed. A UV-active adhesive is applied to an alignment sensitive component of the device. A first, relatively low dose of UV radiation sufficient to solidify an outer layer of the adhesive is applied to the adhesive. A second, relatively high dose of UV radiation sufficient to solidify the remaining thickness of the adhesive is then applied. The methods and apparatuses of the present invention advantageously reduce or eliminate changes in the position of a component during the adhesive curing process. The present method and apparatus allow for shorter total time for solidifying the adhesive, provide stable positioning during the adhesive solidification process, and enable increased manufacturing output and decreased waste.

Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

Abstract: The invention relates to a method for joining objects made of metal, plastic, hybrid structures or ceramic by means of heat input such as soldering or welding, wherein materials such as particles, in particular nanoparticles, elements, atoms, molecules or ions are introduced into the joint. It is proposed according to the invention that a gas stream brings gaseous compounds to the joint which decompose at elevated temperature and deposit particles as heat is being applied to the joint.

Abstract: A retarder film provides a first light retardation and can be heat processed in one or more selected areas to provide a second light retardation in the selected area(s). The retarder film may have an absorption characteristic such that the heat processing can be carried out by selectively exposing the film to a suitable radiant beam. The retarder film is composed of a stack of contiguous ultrathin layers configured to provide an effective optical medium for visible light. Visible light propagates through the stack as an effective medium having effective refractive indices along principal x-, y-, and z-axes. At least some of the ultrathin layers possess intrinsic birefringence, and the effective indices of the stack are functions of the intrinsic refractive indices of the constituent ultrathin layers. The heat processing is carried out so that the ultrathin layer stack structural integrity is not substantially altered in the processed area(s).

Abstract: Provided herein are technologies generally relating to creating connections and/or associations. In some examples, the embodiments can relate to a circuit that includes a surface, a first electrical contact that is attached to the surface, a glass substrate, a second electrical contact that is attached to the glass substrate, and at least one elastomer layer. In some embodiments, the elastomer layer can provide or assist in creating a contact between the first electrical contact and the second electrical contact.

Abstract: The present invention provides a process for producing a surface-modified layer system comprising a substrate (2) and a self-assembled monolayer (SAM) (1) anchored to its surface. The SAM (1) is comprised by aryl or rigid alicyclic moiety species. The process comprises providing a polymorphic SAM (1) anchored to the substrate (2), and thermally treating (4) the SAM to change from a first to a second structural form thereof. The invention also provides a thermolithographic form of process in which the thermal treatment (4) is used to transfer a pattern (3) to the SAM (1), which is then developed.

Abstract: A sandwich laminate for wind turbine blades includes a sandwich core material and an upper laminate part and a lower laminate part, wherein the upper laminate part and the lower laminate part have a thermoplastic matrix material and heating elements. The heating elements are electrically conductive fibres constituting electric circuits in the interior part of the thermoplastic matrix. Further, a wind turbine blade including such a sandwich laminate as well as a method of manufacturing such a sandwich laminate are provided.

Abstract: Elastic averaging infrared welded assembly. A first component has left and right longitudinal sidewalls. A second component has a plurality of localized locating features at each of the left and right longitudinal sides thereof which abut the left and right sidewalls of the first component so as to cause the left and right sidewalls to flex outwardly so as to precisely self-align by elastic averaging the first and second components. The mutually abutting ribs are conjoined, preferably by infrared welding.

Abstract: This invention pertains to a process for making flexographic printing forms, particularly relief printing forms, from two or more photosensitive elements welded to one another at their edges, wherein the welding is accomplished by microwave energy. This invention also relates to sealing edges of a cylindrically-shaped photosensitive element. Using microwave energy provides a smooth surface upon welding with a near disappearance of the weld-lines.

Abstract: A method for making a patterned conductive element includes following steps. A substrate is provided. A patterned adhesive layer is applied on a surface of the substrate. A carbon nanotube layer is placed on a surface of the patterned adhesive layer. The patterned adhesive layer is solidified to obtain a fixed part of the carbon nanotube layer and a non-fixed part of carbon nanotube layer. The non-fixed part of carbon nanotube layer is removed.

Abstract: The invention relates to a compensation element for joining components made of fusible plastics, designed as a hollow cylinder, at least some sections of which are conical and having at least one heating element which when supplied with energy heats at least some regions of the inner surface or the outer surface of the compensation element or of both surfaces to produce a welded connection between the components. Said compensation element is characterized in that cuts are provided, starting from each outer edge of the hollow body, at least one section of the cuts extending up to or beyond a plane of the compensation element that guarantees flexibility. The invention also relates to methods in which a sleeve consisting of an outer sheath and at least one compensation element is used.

Abstract: According to one embodiment, a pattern formation method is provided, the pattern formation includes: laminating a self-assembled monolayer and a polymer film on a substrate; causing chemical bonding between the polymer film and the self-assembled monolayer by irradiation with an energy beam to form a polymer surface layer on the self-assembled monolayer; and forming on the polymer surface layer a polymer alloy having a pattern of phase-separated structures.

Abstract: A pipe coupling for forming a pipe connection includes: a wall formed as a tube and including an inner surface defining an inner diameter and an outer surface; an electrical conductor supported by the wall and extending about a circumference of the coupling; and a pair of contacts exposed on the outer surface and electrically in contact with the electrical conductor for connecting an electrical power source to the electrical conductor.

Abstract: An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.

Abstract: Method and apparatus are disclosed for forming a sealed communication between conduits or conduit subassemblies, each of which has a wall with an exterior surface, and at least one of the walls includes an electrically conductive portion. The exterior surfaces may be brought into a facing relationship, and each conductive portion is heated sufficiently to sterilize the exterior surfaces of the walls by generating electrical current in the conductive portion, such as by application of a voltage or by induction. An aperture is then provided, as by an aperture-forming member, through the facing walls to provide communication between the conduits or conduit subassemblies.

Abstract: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.

Abstract: The present disclosure relates to optical stacks having nanostructure-based transparent conductive films and low diffuse reflection. Also described are display devices that incorporate the optical stacks.

Abstract: A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials.

Abstract: A magnetic component includes: a magnetic core including an upper flange portion on one end side of a winding shaft portion and a lower flange portion on another end side of the winding shaft portion; a pair of conductive terminals attached to the lower flange portion; and a coil including a conductive wire. The terminals each include an electrode portion extending along a lower surface of the lower flange portion and including an end portion projecting outward relative to an outer periphery of the lower flange portion, and a columnar wire splicing portion erected from the end portion of the electrode portion, and an upper end surface of the wire splicing portion includes a wire splicing surface for conductive wire connection.

Abstract: A sheet for use in a heat exchange apparatus. The sheet includes a first vertical rib that extends in a first direction and protrudes in a second direction out of the plane. The sheet also includes a second vertical rib that extends in the first direction along the sheet, between the first and second edges of the sheet. The second vertical rib also protrudes in the second direction out of the plane. The sheet further includes a first horizontal rib that extends in a third direction along the sheet between the third and fourth edges of the sheet, and protrudes in a fourth direction opposite said second direction. The sheet additionally includes a second horizontal rib that extends in the third direction along the sheet between the third and fourth edges of the sheet. The second horizontal rib protrudes in a fourth direction and intersects said second vertical rib.

Abstract: The invention relates to a method for depositing functional groups on a surface of an object, and to the object treated as such, by generating and maintaining a plasma, bringing the object surface close to or in a space between the plasma electrodes, an atmosphere being present between the two electrodes, and depositing a plurality of functional groups on at least part of the surface of the object, whereby the atmosphere between the two electrodes comprises a multi-functional hyperbranched compound which is a polymer based on ABm type monomers, or a derivative of such polymer, whereby m is at least 2, and A and B are two reactive functional groups selected such that group A is able to react at least m times with group B, and whereby the hyperbranched compound is having a degree of branching (DB) in the range of 10.0-99.9%.

Abstract: It arranges a bonding material between a pair of base materials having different heat capacities and in which a difference between thermal expansion coefficients thereof is within 10×10?7/° C.; and bonds the pair of the base materials by the bonding material, by irradiating electromagnetic wave to the bonding material to melt and then harden it, wherein a thermal expansion coefficient at part of the bonding material facing one of the pair of the base materials of which the heat capacity is smaller is smaller than a thermal expansion coefficient at part of the bonding material facing the other of the pair of the base materials of which the heat capacity is larger by a difference within 10×10?7/° C., thereby bonding the base materials of which a difference of thermal expansion coefficients is relatively small, as preventing breakage and crack from occurring and further suppressing a degree of warp.

Abstract: A battery packaging method comprises providing a battery comprising at least one battery cell on a substrate, the battery cell comprising a plurality of electrodes about an electrolyte, and the battery having at least one open peripheral side surface. A thermoplastic bead is provided at an open peripheral side surface of the battery. A cap is placed over the battery and in contact with the thermoplastic bead. The thermoplastic bead is locally heated by directing an energy beam onto the thermoplastic bead, the energy beam having a beam width sized sufficiently small to heat a beam incident region on the thermoplastic bead substantially without heating adjacent regions.

Abstract: A method for manufacturing a multilayer wiring substrate processes a via hole without unnecessarily increasing the diameter thereof and which can easily achieve the formation of fine wiring. A first resin layer in a cured state is prepared in which at least one first via hole including a bottom made of a conductive pattern is formed by laser processing, a second resin layer in an uncured state is prepared in which at least one second via hole is formed to penetrate therethrough at a position corresponding to the first via hole, and the first resin layer and the second resin layer are laminated to each other so that the first via hole and the second via hole communicate with each other. After a conductive paste is simultaneously filled in the first via hole and the second via hole, a metal foil is pressure-bonded to the second resin layer, and the second resin layer and the conductive paste are simultaneously cured. Subsequently, the metal foil is patterned.

Abstract: A method to bond carbon nanotubes to a surface. The mechanism of this bonding is studied, and shows that intercalation of alkali ions is possibly the central mechanism. Bonding pull-off forces of 4-5 N/cm2 were measured. This bonding also provides improved interfacial properties for other phenomenon, including improved thermal conductivity.

Abstract: A light source device is provided, which includes: a hold member; a light source held by the hold member; an optical element held by the hold member; and a hardened first adhesive agent bonding at least one of the light source and the optical element to the holding member. The hardened first adhesive agent has elasticity.

Abstract: The present disclosure includes systems and methods for manufacturing a composite wood product. In some embodiments, the method includes the steps of forming a mat from a plurality of wood elements and an adhesive, the mat having a width W measured substantially perpendicular to a longitudinal axis of the mat and an initial thickness T1. The mat is then moved in a machine direction, the machine direction being substantially parallel to the longitudinal axis and the temperature across the width W of the mat is adjusted. The mat is then compressed into a billet having a final thickness T2. In some embodiments, the system includes a continuous movement mechanism, a side preheat assembly, and a press assembly.

Abstract: Disclosed are building board manufacturing techniques that minimize the build-up of slurry on associated forming equipment and also produce panels with enhanced physical properties. The methods involve applying a dissolvable film laminate to one or more fiber mats at the outset of the forming process. In the un-dissolved state, the film acts as a containment envelope for the gypsum slurry and any free floating glass fibers. During subsequent curing, the film is dissolved by vaporized water. In its dissolved state, the film is liquefied and coats the fibers of the underlying mat. This results in a building board with improved physical properties.

Abstract: A method for making an actuator device includes forming a substantially planar structure, including an outer frame with a latch foot, a fixed frame coupled to the outer frame, a latch mass coupled to the fixed frame, a latch block coupled to the latch mass by a latch block flexure, a moveable frame coupled to the outer frame, and an actuator incorporating a plurality of interdigitated teeth alternately attached to the fixed and moving frames. For operation, the latch mass is rotated downward until an upper surface of the latch block is disposed below and held in latching contact with a lower surface of the latch foot by the latch block flexure.

Abstract: Various processes for the creation of a film to film bond using printed patterns of adhesive traces. In some implementations of the process, control of the process including control of the temperature of the adhesive and film to a temperature approaching the heat distortion temperature for the film will vary the strength of the bond from a frangible bond to a bond the tears the film, (a film-tearing bond). Some implementations of the process may be used to produce bonded films at web speed rates that are significantly higher than commercial rates for heat seal processes.

Abstract: In a method for manufacturing floor panels that have at least a substrate and a top layer provided on the substrate, the top layer including a thermoplastic layer that is translucent or transparent, the method may involve providing the top layer, including the thermoplastic layer, on the substrate. The method may also involve heating at least the thermoplastic layer, and structuring the thermoplastic layer using a mechanical press element.

Abstract: A method of curing radiation-curable fluid is described. In one example, the method includes emitting radiation from an array of light-emitting diodes towards ink to be cured. LEDs are cheap, light weight, highly efficient in their conversion of electrical power, and give effectively instant switching to full power. Another advantage is that the emission spectrum of an LED is sharply peaked around the nominal frequency. Thus LEDs give several advantages over conventional radiation sources such as mercury lamps. A low oxygen environment is preferably provided at the radiation source to accelerate the curing reaction. Also described are inks which are specially formulated to respond to the radiation emission spectrum of an LED.

Abstract: According to a manufacturing method for a fuel cell, an insulating member having a plurality of communication holes therein is disposed on a side of a gas diffusion layer, which is formed by stacking a layer made of a carbon fiber and a water-repellent layer, where the water-repellent layer is provided, the gas diffusion layer and the insulating member are sandwiched by a pair of electrodes, and a pair of contact pressure plates are disposed on respective rear surfaces of the pair of electrodes so as to sandwich the pair of electrodes so that the gas diffusion layer is pressurized by the pair of contact pressure plates. When a voltage is applied to the pair of electrodes while maintaining the pressurized state, an electric current flows through a protrusion portion of a carbon fiber which comes in contact with the electrode on the water-repellent layer side via the communication holes of the insulating member, so that the protrusion portion of the carbon fiber is burned and removed by Joule heat.

Abstract: A method to bond carbon nanotubes to a surface. The mechanism of this bonding is studied, and shows that intercalation of alkali ions is possibly the central mechanism. Bonding pull-off forces of 4-5 N/cm2 were measured. This bonding also provides improved interfacial properties for other phenomenon, including improved thermal conductivity.

Abstract: A pressure-sensitive adhesive containing a pressure-sensitive adhesive resin and fine particles having an average particle diameter of 0.1 to 20 ?m. The pressure-sensitive adhesive has a storage elastic modulus (G?) at 23° C. of 0.3 to 15 MPa, and a haze value that is 5% or more.

Abstract: The invention relates to a method of making a composite sheet. A plurality of layers is first assembled, each layer being comprised of an untreated, unidirectional array of strands. The assembled layers are then placed adjacent one another to form an assembled sheet, with adjacent layers being in a non-parallel orientation, and without any of the layers having been treated with a matrix or binding component. The assembled sheet is then impregnated with a matrix component, which comprises a binding component and may also comprise a radiation-absorbing component.

Abstract: A method of fabricating a composite item may include dispensing a composite material comprising a reinforcement and a resin. The method may further include energizing an infrared heat source. The infrared heat source may tend to generate a wavelength of electromagnetic radiation that is preferentially absorbed by the reinforcement. The method may additionally include controlling power to the infrared heat source to cause the infrared heat source to emit a wavelength of electromagnetic radiation that is absorbed by the resin to a relatively greater extent than the wavelength of electromagnetic radiation that is absorbed by the reinforcement.

Abstract: The invention provides a method for fabricating a camera module. An exemplary embodiment of the method for fabricating a camera module comprises providing plurality of lens sets. A dry film layer is formed on the plurality of lens sets. The dry film layer is patterned to form a plurality of dry film patterns respectively attaching to a plurality of lens sets. The plurality of lens sets are separated. A lens set separated from the plurality of lens sets is bonded to an image sensor device chip. The dry film pattern on the lens set is removed.

Abstract: The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.

Abstract: A radiological image detection apparatus includes a radiological image conversion panel and a sensor panel. A sealant that is disposed between a substrate of the radiological image conversion panel and a substrate of the sensor panel and surrounds a scintillator in the radiological image conversion panel and a pixel array in the sensor panel to form an isolated space on the inside of the sealant. The scintillator includes a columnar portion including a group of columnar crystals formed by growing crystals of the phosphor in columnar shapes and a surface configured by a set of tips of the columnar crystals is disposed in close contact with the pixel array without being bonded to the pixel array. Both of the substrate of the radiological image conversion panel and the substrate of the sensor panel are flexible, and the isolated space is depressurized.

Abstract: A method for making a tripping ball comprising configuring two or more parts to collectively make up a portion of a tripping ball; and assembling the two or more parts by adhering the two or more parts together with an adherent dissolvable material to form the tripping ball, the adherent dissolvable material operatively arranged to dissolve for enabling the two or more parts to separate from each other. A method of performing a pressure operation with a tripping ball is also included.

Abstract: A method for manufacturing a catheter includes preparing raw materials and maturing the raw materials in a drier at 50-55° C. for 20 days, preparing the expandable member, and the first and second tubes, in forms, by cutting the raw materials, fitting an index ring on the second tube, welding the expandable member to the first tube, and welding the expandable member with the second tube, connecting the first tube to a first side of the manifold, and connecting the second tube to a second side of the manifold, forming a shape and a size of the expandable member, and drying an interior of the expandable member and the second tube and maturing the expandable member for 24 hours in the drier at 50-55° C., then for 48 hours in the drier at 50-55° C.

Abstract: The present invention relates to a phenoxy resin for an optical material obtained by subjecting at least one selected from specific difunctional epoxy resins and at least one selected from specific difunctional phenols to polyaddition reaction, wherein a film comprising the above phenoxy resin has a refractive index of 1.580 or less at 25° C. and a wavelength of 830 nm, a resin composition for an optical material containing the above phenoxy resin, a resin film for an optical material comprising the above resin composition and an optical waveguide produced by using the above resin composition and/or the above resin film.