Abstract: A fabricating method of a ceramic thin plate includes the steps of providing at least one first pre-mold plate and at least two second pre-mold plates; stacking up the first pre-mold plate and the second pre-mold plates so that the first pre-mold plate is disposed and sandwiched between the two second pre-mold plates; and sintering the first pre-mold plate and the second pre-mold plates at the sintering temperature of the first pre-mold plate so as to make the first pre-mold plate to form the ceramic thin plate. The sintering temperature of the second pre-mold plate is higher than that of the first pre-mold plate.

Abstract: A fabricating method for a ceramic substrate includes the steps of: providing a ceramic thin plate and a pre-mold plate; stacking the ceramic thin plate and the pre-mold plate together; and sintering the ceramic thin plate and the pre-mold plate, both of which jointly form the ceramic substrate. Also, a ceramic substrate composed of a ceramic thin plate and a pre-mold plate is disclosed. The ceramic substrate is an LTCC substrate, and the pre-mold plate is formed by mixing a ceramic material and an inorganic adhesive including crystallized or non-crystallized glass or a glass ceramic, or the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process.

Abstract: A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.

Abstract: An assembly for forming a hollow, ceramic arc discharge vessel for high-intensity discharge (HID) lamps is described wherein a means for self-alignment of two molded sections is provided. In particular, the sealing surface of one section of the arc discharge vessel is provided with a convex surface and the sealing surface of the other section is provided with a concave surface. The radius of the convex sealing surface is smaller than the radius of the concave sealing surface so that the sections may self-align during joining, preferably without gas entrapment in the seal.

Abstract: A method of forming a hollow ceramic body (10) comprising the steps of: forming a first section half (12) with a given wall thickness T and a second section half (14) with the given wall thickness T, the first section half and the second section half containing a binder material; forming a first joining surface (16) on the first section and forming a second joining surface (18) on the second section, the first joining surface 16 and the second joining surface 18 having a wall thickness T1 thinner than the given thickness; simultaneously heating the first and second joining surfaces (16, 18) to cause localized melting of the binder material; initially contacting the first joining surface with the second joining surface to form an interface region; and applying compression to the interface region to join the first section (12) to the second section (14) without the protrusion of any material into a discharge space (20) formed when the first section (12) and the second section (14) are joined.

Abstract: The present invention relates to a method for manufacturing multi-layer ceramic substrate, a plurality of aluminum oxide ceramic substrate units are piled together, between each two ceramic substrate units is an oxide medium layer which can grow crystal grain during sintering. Such that the upper and lower ceramic substrate units will compactly bind together with the oxide medium layer because the grown crystal grains enter into the gaps or holes formed between the crystal grains of the surfaces of ceramic substrate units during sintering process.

Abstract: This invention provides a method of producing a ceramic laminate body capable of suppressing the occurrence of de-lamination and cracks, and providing high reliability. This method comprises a heat-bonding step of covering a full periphery of side surfaces of ceramic layers 11 positioned in an orthogonal direction to a laminating direction with a side surface jig while the ceramic layers are laminated, heating the ceramic layers and pressing the ceramic layers from both end faces positioned in the laminating direction by end face jigs to form a heat-bonded ceramic laminate body; and a side surface grinding step of grinding or cutting the full periphery of the side surfaces inclusive of damage portions 9 occurring in the ceramic laminate body in the heat-bonding step.

Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.

Abstract: The invention relates to a ceramic green body consisting of at least two ceramic bodies that are bonded together. The invention is characterized in that the green body is produced using an adhesive tape that consists of an adhesive film located on a release liner.

Abstract: A method for increasing the strength of the bond between a cementitious layer and a tile or substrate layer, including applying a coating of high-silica glaze to the tile, bonding the high-silica glaze to the tile, bonding the high-silica glaze to the cementious layer, and curing the cementitious layer to yield a high-strength bonded tile system. The high-silica glaze further includes silica and flux. The molar ratio of silica to flux is at least about 5 to 1 and the flux further comprises RO and R2O. The molar ratio of RO to R2O is at least about 7 to 3. RO is selected from the group including CaO, SrO, BaO, ZnO, FeO, PbO and their combinations and R2O is selected from the group including Li2O, Na2O, K2O, and their combinations.

Abstract: A hybrid structure (50) and method of manufacturing the same including a structural ceramic matrix composite (CMC) material (42) coated with a layer of ceramic insulating tiles (24). Individual ceramic tiles are attached to a surface (22) of a mold (20). The exterior surface (32) of the tiles may be subjected to a mechanical process such as machining with the mold in place to provide mechanical support for the tiles. A layer of CMC material is then applied to bond the tiles and the CMC material together into a hybrid structure. The mold may include a fugitive material portion (26) to facilitate removal of the mold when the hybrid structure has a complex shape. Tiles located in different regions of the structure may have different compositions and/or dimensions. The gaps between adjacent tiles may be filled from the outside before the CMC material is applied or from the inside after the mold is removed.

Abstract: A method for manufacturing a ceramic stack is provided, which can suppress distortion, separation, cracking and the like that may be caused in plural types of ceramic sheets after being stacked and baked for integration. The method includes a step of obtaining a relation between volume rates of organic materials contained in the ceramic sheets and baking shrinkages of the sheets, resulting from baking the sheets at a predetermined temperature, a step of selecting a volume rate of organic materials for each of the ceramic sheets based on the relation obtained at the previous step, so that all the sheets may have substantially the same baking shrinkage as desired, a step of forming the plural types of ceramic sheets based on the volume rate selected at the previous step, and a step of stacking and baking for integration the plural types of ceramic sheets to fabricate a ceramic stack.

Abstract: A mold system for producing components of a turbine engine. The mold system may enable a configuration of a turbine engine component to be changed in less time than conventional systems. The mold system may include a mold formed from mold plates wherein at least one of the mold plates has at least one mold cavity configured to receive a ceramic insert and a ceramic insert positioned in the at least one mold cavity and including a core making cavity. The ceramic insert may be formed from a material having high compressive strength, good wear resistance, good corrosion resistance, good thermal conductivity, and high toughness, such as but not limited to, graphite partially or fully converted to silicon carbide, silicon carbide, graphite coated with silicon carbide, and other appropriate materials. The ceramic insert may also be formed with other near net shape processes, such as, reaction bonded metal oxides.

Abstract: Provided are processes for producing articles containing low sinterability titanium dioxide pigment. A low sinterability titanium oxide (powder) is desirable as an ingredient in moisture resistant printed circuit boards, ceramic substrates with high dimensional stability and ceramic layers which resist sintering with adjacent layers. According to the processes disclosed herein, low sinterability titanium dioxide can be produced by introducing silicon during the oxidation of titanium chloride in the chloride process of titanium dioxide production.

Abstract: This method is a manufacturing method of a plugged honeycomb structure including porous partition walls which form a plurality of cells divided as channels of a fluid in the form of a honeycomb and a plugging portion formed at one opening end portion of a predetermined cell of a cylindrical honeycomb structure. Openings of all cells of a honeycomb structure are filled with a slurry-like plugging material. Separately, an image of end-surface cells of the honeycomb structure is picked up with a camera. A photo-setting or thermosetting resin film is attached to an end surface of the honeycomb structure in which all of the cells are plugged. After a plugging pattern is printed on the film, the honeycomb structure to which a printed film is attached is irradiated with light or heat by use of a light or heat source. In consequence, only target film portions are allowed to set.

Abstract: A ceramic laminate body, a gas sensor element employing such a ceramic laminate body and related manufacturing method are disclosed as including first and second ceramic sheets, made of material compositions different from each other, and an intermediate bonding layer, bonding the first and second ceramic sheets to each other so as to form a closed hollow space between the first and second ceramic sheets. The intermediate bonding layer has a multilayer structure including first and second unit intermediate layers laminated on each other such that innermost end portions of the first and second unit intermediate layers are displaced from each other to adapt a difference in degreasing contraction rates of associated component parts.

Abstract: A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer; distributing an adhesive layer on active areas, splitting the semiconductor wafer into a plurality of first dies, each one comprising at least one of the active areas; mounting the plurality of first dies, which are already equipped with the adhesive layer, on a support; and mounting a plurality of second dies on the adhesive layer.

Abstract: A composite body made of at least two ceramic layers, in which the ceramic layers are permanently bonded to one another at defined bonding points by a contact layer made of a bonding material. To achieve a permanent, thermally stable bond of ceramic layers having different coefficients of thermal expansion, the bonding material has a low modulus of elasticity. During the manufacture of the composite body, the bonding points of the ceramic layers are pretreated to form a porous surface structure, the bonding material is applied to these bonding points, and after the ceramic layers are laid one on top of another with bonding points facing toward one another and bonding material lying between them, the assembled composite body is subjected to a heat treatment.

Abstract: A method of facilitating the crystallisation of a macromolecule comprising the step of adding a mesoporous glass to a crystallisation sample wherein the mesoporous glass comprises pores having diameters between 4 nm and 100 nm and has a surface area of at least 50 m2/g. A method of facilitating the crystallisation of a macromolecule comprising the step of adding to a crystallisation sample a mesoporous glass of the composition Si02; CaO—P205-SiO2 or Na20-CaO—P205-SiO2, wherein each of the Ca, P, Si or Na atoms within the compositions may be substituted with a suitable atom chosen from B, Al, Ti, Mg, or K, and, optionally, the composition may also include heavy elements to enhance X-ray diffraction contrast such as Ag, Au, Cr, Co, Sr, Ba, Pt, Ta or other atom with an atomic number over 20.

Abstract: An orthogonal stitch-weave method and fiber architecture. The architecture allows near-net-shape composite preforms to be fabricated, thereby reducing costs associated with complex preform shapes and increasing desired strengths of the composite.

Abstract: A method of producing an LTCC substrate having improved cavity bondability is disclosed that involves providing a stack of green ceramic tape sheets having a cavity, placing a template having an opening corresponding to the cavity over the stack, placing a stretchable sheet of material coated with graphite or zinc stearate over the template, isostatically laminating the stack to produce an LTCC substrate having a cavity, and removing the template and sheet of stretchable material from the stack.

Abstract: The present invention provides a process and an apparatus for the preparation of a motor coil by which a longitudinally wound motor coil, so called, can be easily prepared. First, a molded product 10 comprising a column part 11, and a fin part 12 projected in the form of flat plate from an outer peripheral surface 11A, 11B, 11C, 11D of the column part to an outer side in a radial direction of the column part and helically continuing in an axis direction of the column part at predetermined intervals along the outer peripheral surface of column part is prepared. The column part 11 of the first molded product is punched out in an axis direction of the column part with retaining the fin part 12 to remove the column part, and the fin part 12 having helical shape left after the removal is coated with an insulating film.

Abstract: An apparatus for burning green sheets of a plasma display panel comprises a feeding part that feeds a green sheet to a plasma display panel substrate, a heat and pressure roller that heats and compresses the green sheet and the plasma display panel substrate from above the plasma display panel substrate, and a heating module that applies heat to a contact portion between the green sheet and the plasma display panel substrate. The heat and pressure roller applies heat and pressure to the green sheet to bring the green sheet into intimate contact with the plasma display panel substrate and to remove residual solvent from the green sheet.

Abstract: A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A metal paste is filled into the conductive openings and the thermal conductive openings. The green tapes are stacked together so that the metal paste inside the conductive openings and the thermal conductive openings of every green tape is in contact respectively with its neighboring metal paste within the conductive openings and thermal conductive openings of the green tapes. Cofire those green tapes and the metal paste to form a pre-substrate. The pre-substrate comprises an insulating structure, a plurality of thermal conductive plugs and conductive plugs.

Abstract: Disclosed is a method of forming an LTCC structure that involves providing at least a first ceramic tape sheet, laminating at least a second ceramic tape sheet to the at least a first ceramic tape sheet to form a substructure, laminating at least a third ceramic tape sheet to the substructure to form an intermediate structure, and laminating at least a fourth ceramic tape sheet to the intermediate structure to form an LTCC structure.

Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

Abstract: This invention is directed to a process for the fabrication of features on a display panel utilizing fibers or ribbons comprising organic polymer and inorganic material, the inorganic material containing phosphoe, conductrice metals or dielectric particles.

Abstract: The present invention has an object to provide a producing method and producing apparatus of multilayered printed-circuit board that has eliminated the resin flow and resolved the problems of board thickness discrepancy and misregistration. A producing method of multilayered printed-circuit board, comprising steps of stacking up a laminated sheet covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer and, thereafter, setting the prepreg by pressurizing/heating, wherein, before conducting the pressurizing/heating, gas is sprayed to the surface of the laminated shoot covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer to eliminate impurities from the surface.

Abstract: Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate pattern (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract: Unfired first ceramic layers 11 and at least one unfired second ceramic layer 12 having a different color from the unfired first ceramic layers 11 are laminated to prepare an unfired ceramic laminate 13. Notches 14 are then formed on a surface of the unfired ceramic laminate 13 using the second ceramic layer 12 as a reference. The unfired ceramic laminate 13 is fired to provide a fired ceramic laminate 13a, which is then divided along the notches 14 into ceramic composites 13b. In this process, notches having the proper depth can be formed on the unfired ceramic laminate 13.

Abstract: Methods are provided for producing a ceramic matrix composite by slurry infiltration. The methods involve placing a desized ceramic cloth lay-up into a non-ceramic cloth bag, sealing the bag to form a bagged ceramic preform, infiltrating the bagged ceramic preform with a ceramic-containing slurry, and sintering the preform to convert the slurry to a ceramic while decomposing the non-ceramic bag. The methods of the present invention maximize slurry infiltration of the ceramic cloth tow bundle while minimizing damage to the ceramic cloth.

Abstract: An optical device mounted substrate assembly includes a ceramic substrate having a first recess, an optical device mounted on the ceramic substrate and having one of a light emitting portion and a light receiving portion, the optical device being to be optically connected to one of an optical waveguide and an optical fiber connector in way as to align optical axes of the optical wave guide or the optical fiber connector with each other, a resin layer disposed in the first recess and having a second recess smaller in diameter than the first recess, and an alignment guide member fitted in the second recess and having a protruded portion protruding from a front surface of the ceramic substrate and fittingly engageable in an alignment hole of one of the optical waveguide and the optical fiber connector. A fabrication method of such a substrate assembly is also provided.

Abstract: The present invention relates to a method to achieve the suppression of planar shrinkage in LTCC ceramic tape laminate structures without externally applied forces or sacrificial constraining tape. The method utilizes a non-sacrificial constraining tape that constrains a tape assembly.

Abstract: A composite laminate, including shrink-prevention ceramic green sheets arranged on the main surfaces of an unfired ceramic laminate and having a sintering temperature greater than the firing temperature of the unfired ceramic laminate, is fired at a temperature which is greater than the sintering temperature of the unfired ceramic laminate, and which is less than the sintering temperature of the shrink-prevention ceramic green sheet. Thereafter, the shrink-prevention ceramic green sheets are removed in a first removing step of spraying water and compressed gas against the shrink-prevention ceramic green sheets so as to remove a portion thereof that has not reacted with a glass component of the unfired ceramic laminate, and in a second removing step of ceramic powder, spraying water, and compressed air, such that a residual material not removed in the first removing step is removed, and in a third removing step of supersonic-cleaning the ceramic multi-layer substrate after the first and second steps.

Abstract: A capacitive vacuum measuring cell includes first and second ceramic housing bodies (1, 4) joined by an edge seal (3). A thin ceramic membrane (2) is supported between first and second housing bodies (1, 4) by the edge seal (3) at a small distance from the first housing body (1) creating a reference vacuum chamber (25) therebetween. An electrically conductive material (7) coats opposing surfaces of the first housing body (1) and the membrane (2) to form a capacitor. A measurement vacuum chamber (26) is provided between the membrane (2) and the second housing body (4). A port (5) communicates with the second housing body (4) to connect the measurement vacuum chamber (26) of the measuring cell to the medium to be measured. The membrane (2) is made from an Al2O3 slurry that is sintered in a first heating step, cooled, and then reheated to smooth the membrane.

Abstract: The present invention is directed to a conductive paste for via conductor, comprising a Cu powder having a glass layer formed on the surface, a Ni powder having a metal oxide layer formed on the surface, and a ceramic component homogeneous as that of a ceramic component contained in a green sheet, a ceramic wiring board such as laminated ceramic capacitor, comprising via conductors formed of the same, and a method of manufacturing the same. According to the present invention, via conductors having excellent electrical conductivity can be formed by preventing the formation of a Cu—Ni alloy due to the reaction of the Cu powder and the Ni powder.

Abstract: On a surface of a glass cloth adhered a mica layer sheet, a mixture of inorganic particles having a thermal conductivity of at least 5 W/mK, a resin, and a solvent is applied to form a layer of the mixture of the inorganic particles, the resin, and the solvent; the layer of the mixture is reduced in thickness using a doctor blade, followed by pressurizing to form a high thermally conducting layer; the mica layer sheet on which the high thermally conducting layer is disposed is cut to obtain a mica insulating tape; and the mica insulation tape is wound around a coil conductor. As a result, an insulated coil that is excellent in the voltage endurance characteristics and has a high thermal conductivity is manufactured.

Abstract: A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed over the first conductive layer. A second conductive layer is formed over the lower surface of the second ceramic component. The second ceramic component is stacked over the first ceramic component wherein the second conductive layer on the second ceramic component opposes the intermediate film on the first component. The first and second ceramic components are anodically bonded together.

Abstract: A method of joining at least two sintered bodies to form a composite structure, including providing a first multicomponent metallic oxide having a perovskitic or fluorite crystal structure; providing a second sintered body including a second multicomponent metallic oxide having a crystal structure of the same type as the first; and providing at an interface a joint material containing at least one metal oxide containing at least one metal identically contained in at least one of the first and second multicomponent metallic oxides. The joint material is free of cations of Si, Ge, Sn, Pb, P and Te and has a melting point below the sintering temperatures of both sintered bodies. The joint material is heated to a temperature above the melting point of the metal oxide(s) and below the sintering temperatures of the sintered bodies to form the joint. Structures containing such joints are also disclosed.

Abstract: A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 ?m and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size may be formed by CVD. Larger particles may be milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.

Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

Abstract: An improved process for producing ceramic thick film array elements is provided. In this regard, ceramic elements are formed on a temporary, or printing, substrate by screen printing or other forming methods. The temporary, or printing, substrate is advantageously provided with a release layer. This makes it possible to release the printed and soft-baked ceramic elements from the temporary substrate and transfer the ceramic elements to the sintering substrate. The contemplated release technique takes advantage of the phase transition of a liquid, e.g. water, to transfer the elements to a sintering substrate. After sintering and electrode deposition, the ceramic element array is bonded to a target substrate. Then, the sintering substrate is removed to make the array available for implementation in a variety of suitable environments.

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract: A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.

Abstract: Refractory coatings comprising unstabilized zirconia, silica, and, optionally, zircon and/or mullite are disclosed herein. The unstabilized zirconia, silica, and optional zircon and/or mullite are applied as a slurry onto ceramic substrates such as silicon carbide and fired. The refractory coatings of the present invention maintained good edge definition and color when applied to ceramic substrates and subjected to temperatures over 1100° C.

Abstract: A method for joining similar materials to create multi-component assemblies so the joint materials share similar physical, chemical, and electrical characteristics with the base materials. The method includes aligning the materials, applying joining material, focusing a microwave beam on the joint area to initially heat the joint area to allow the joining material to soften and fill physical discontinuities while the surrounding surfaces remains cool, rapidly heating the joint area to the reactive area of the joining material, rapidly cooling the joint area and maintaining the joint area at a recrystallization temperature. The materials can be ceramics such as aluminum oxide.

Abstract: The present invention provides a highly reliable technology for manufacturing a substrate with protrusions. After filling an UV-curable transfer material into the grooves of an intaglio plate for transfer, the UV-curable transfer material is cured by irradiating UV rays under the conditions where it is exposed to an atmosphere that contains at least one of oxygen and ozone while a curing-inhibited portion is formed in an area of the UV-curable transfer material exposed to this atmosphere, and the UV-curable transfer material is transferred to the substrate to form the protrusions, while the curing-inhibited portion is made to adhere to the substrate.

Abstract: A method of producing a composite sheet in which a through hole formed in a predetermined portion of the first ceramic sheet is buried with a different kind of sheet having substantially the same thickness as the first ceramic sheet, such as a resin sheet a metal sheet or a ceramic sheet of a material different from that of the first ceramic sheet. A first method comprises a step of preparing a first ceramic sheet from a ceramic powder, and a different kind of sheet; a step of forming a through hole in a predetermined portion of the first ceramic sheet; a step of laminating the different kind of sheet on the ceramic sheet in which the through hole is formed; and a step of preparing a composite sheet by pressing the portion of the first ceramic sheet where the through hole is formed from the side of the different kind of sheet, such that the first ceramic sheet and the different kind of sheet are integrated together.

Abstract: A first step of alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body, and a second step of sintering the laminated body are provided. The adhesive layer includes a thermoplastic resin and at least one of Cr, Mg, Al, Si, a Cr compound, an Mg compound, an Al compound, an Si compound and an inorganic powder included in the ceramic sheet. This manufacturing method improves adhesion between a ceramic layer and the internal electrode after sintering and suppresses a structural defect such as delamination or a crack.