Abstract: There is provided a dimensionally accurate insulating substrate in which plane direction-wise shrinkage is practically zero and shrinkage variations are small. The insulating substrate includes a laminated body composed of at least two kinds of insulating layers made of crystallizable glass ceramics. The crystallization temperature of crystallizable glass contained in the first insulating layer is lower than the softening point of crystallizable glass contained in the second insulating layer. The difference in thermal expansion coefficient between the first and second insulating layers is preferably 2×10?6/° C. or below.

Abstract: A multilayer ceramic substrate having high transverse strength, minimized warpage, and no delamination, has a laminated structure including an inner layer portion and surface layer portions, in which the thermal expansion coefficient of the surface layer portions is lower than the thermal expansion coefficient of the inner layer portion, the difference in thermal expansion coefficient between the surface layer portions and the inner layer portion is about 1.0 ppmK?1 or more, and the weight content of a component common to both a material constituting the surface layer portions and a material constituting the inner layer portion is about 75% by weight or more.

Abstract: A method of manufacturing a cutting element having a substrate and an ultra hard material layer sintered together where at least a portion of the substrate is partially densified prior to sintering, is provided.

Abstract: A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.

Abstract: A high reliability ceramic laminate suppresses delamination and cracks. Wide ceramic sheets are temporarily laminated by heat and pressure to form a pre-laminate which is cut to form a unit body. Unit bodies are laminated to obtain a ceramic laminate. Dewaxing removes not less than 90% of a binder resin before the ceramic laminate is sintered.

Abstract: A production method of a multilayer electronic device, comprising the steps of forming a lower side green sheet 10a including at least a ceramic powder on a supporting body 20; forming an electrode pattern layer 12a on a surface of the lower side green sheet; forming a green chip by stacking multilayer units U1 including at least the lower side green sheet and an electrode pattern layer; and firing the green chip; wherein the lower side green sheet 10a formed on the supporting body 20 includes a binder of a curable resin, and the curable resin in the lower side green sheet 10a is cured before forming said electrode pattern layer 12a on the lower side green sheet.

Abstract: The invention relates to a method for the production of a monolithic multilayer actuator, a corresponding monolithic multilayer actuator, as well as an external contact for a monolithic multilayer actuator. According to the invention specific microdisturbances are incorporated in the actuator structure along the longitudinal axis of the stack essentially parallel and spaced to the inner electrodes in the area of the at least two opposite outer surfaces to which the inner electrodes known per se are brought out, which at the earliest during polarisation of the actuator are subject to a pregiven, limited, stress-reducing growth into the interior and/or towards the outer electrode, wherein additionally the basic metallic coating and/or the external contact is formed elongation-resistant or elastic at least in the area of the microdisturbances.

Abstract: When transferring an adhesion layer 28 to an electrode layer 12a, carrier sheets 20 and 26 are fed between first and second transfer rolls 40 and 42 so that a rear surface of a first carrier sheet 20, in which the electrode layer is formed, makes contact with a first transfer roll 40 and a rear surface of a second carrier sheet 26, in which adhesion layer 28 is formed, makes contact with a second transfer roll 42; and a first transfer roll 40 is heated at a first predetermined temperature T1 (° C.), a second transfer roll 42 is heated at a second predetermined temperature T2 (° C.), in which a first predetermined temperature T1 and a second predetermined temperature T2 satisfy 60<T1<110, preferably 80?T1?100; 90?T2?135, preferably 100?T2<120; and 190<T1+T2, preferably 195?T1+T2?220.

Abstract: In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin, the multilayer ceramic body being formed by stacking a ceramic base material layer and a shrinkage-inhibiting layer having a predetermined conductor pattern. Also, a via hole conductor is disposed in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion, and a surface mounting-type electronic component such as a semiconductor element is connected, through a conductive binder, to the one of the end surfaces of the via hole conductor exposed in the surface of the pedestal portion. A resin is provided between the surface mounting-type electronic component and the pedestal portion, the resin having the same composition as in the resin of the pedestal portion.

Abstract: A glass-ceramic is provided having a thermal expansion coefficient in a range of 3-6 ppm/° C., a dielectric constant that is less than 5 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO2 in a range of 45-58 wt %, Al2O3 in a range of 10-18 wt % and MgO in a range of 10-25 wt %. A method of making the glass-ceramic is also provided. Further, an electronic package is also provided, including a base member and a glass-ceramic substrate bonded to the base member.

Abstract: A method of making a slider includes the steps of laminating the bottom-facing surface of a third layer to the upper-facing surface of a fourth layer, laminating the bottom-facing surface of a second layer to the upper-facing surface of the third layer in a heat-compression mold, heat-pressing the combined second, third and fourth layers in the mold to form a desired shape, and heat pressing a first layer on top of the second layer inside the mold.

Abstract: A method of manufacturing a thermoelectric converter including supplying raw materials by mutually supplying a p-type semiconductor raw material and an n-type semiconductor raw material into a piercing hole of a honeycomb made of a non-metal inorganic material. The method also includes sintering the p-type semiconductor raw material and the n-type semiconductor raw material supplied in the honeycomb to form a p-type semiconductor and an n-type semiconductor in the piercing hole of the honeycomb, and connecting the p-type semiconductor and an n-type semiconductor formed in the piercing hole of the honeycomb to each other by an electrode.

Abstract: A piezoceramic multilayer actuator (10) has a plurality of piezoceramic layers (12) and a security layer (20) disposed between two piezoceramic layers (12). The piezoceramic layers (12) have a piezoceramic first material sintered at a sintering temperature. The security layer (20) has a second material (32) and particles (30) at least partially embedded in the second material (32). The particles (30) have a third material different from the first material and different from the second material (32). An adhesion between the third material and the first material is weaker than an adhesion between the second material (32) and the first material.

Abstract: In a method of manufacturing a piezoceramic multilayer actuator (10), a plurality of green layers is provided, wherein the green layers are to be converted to piezoceramic layers (12) with a piezoceramic material in a subsequent step of heating. A security layer material mixture with a second material (32) and particles (30) embedded in the second material (32) is provided, wherein the particles (30) have a third material different from the first material and different from the second material (32). The security layer material mixture is laminated between two piezoceramic layers (12), thereby forming a green stack. The green stack is heated to a sintering temperature, wherein the green layers are converted to the piezoceramic layers (12), and wherein a chemical reaction of the third material degrades the mechanical connection of the piezoceramic layers (12) by the security layer (20).

Abstract: A method of making an acoustic assembly for use in a transducer includes forming a multi-layer assembly. The multi-layer assembly includes a first layer member and a second layer member. Each member includes a center portion, an edge portion and an aperture separating the center portion and the edge portion. The assembly has an assembly stiffness that is greater than the stiffness of either the first or second layer members. A hinge joins the assembled first and second center portions and the first and second edge portions such that the assembled first and second center portions is free to at least partially rotate relative to the assembled first and second edge portions about an axis. A flexible layer member is coupled to the assembly and provides airtight sealing of the passageway.

Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract: It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner.

Abstract: A method of production of peeling layer paste used for producing a multilayer electronic device, having a step of preparing a primary slurry containing a ceramic powder having an average particle size of 0.1 pm or less, a binder, and a dispersion agent and having a nonvolatile concentration of 30 wt % or more, a step of adding to the primary slurry a binder-lacquer solution to dilute the primary slurry to prepare a secondary slurry having a nonvolatile concentration of 15 wt % or less and a content of the binder of 12 parts by weight or more with respect to 100 parts by weight of the ceramic powder, and a high pressure dispersion treatment step of running the secondary slurry through a wet jet mill to apply to the secondary slurry a shear rate of 1.5×106 to 1.3×107 (1/s).

Abstract: A ceramic multilayer substrate exhibiting reduced pealing and breakage of an internal conductor disposed between a ceramic layer serving as a base member and a ceramic layer for restricting shrinkage includes a first ceramic layer 11, a second ceramic layer 12 laminated so as to come into contact with a principal surface of the first ceramic layer 11, and an internal conductor 13 disposed between the first ceramic layer 11 and the second ceramic layer 12, a phosphorus component layer 16a is disposed in the first ceramic layer 11 with a concentration gradient in which the concentration decreases in a direction away from the internal conductor 13.

Abstract: A method for embedding optical band gap (OBG) devices in a ceramic substrate (100). The method includes the step (320) of pre-forming an OBG structure (105). The OBG structure can be a micro optical electromechanical systems (MOEMS) device. Further, the OBG structure can be preformed from indium phosphide and/or indium gallium arsenide. The method also includes the step (325) of coating the OBG structure with a surface binding material (230). The surface binding material can be comprised of calcium and hexane. The ratio of the calcium to hexane can be from about 1% to 2%. At a next step (330), the OBG structure can be inserted into the ceramic substrate. A pre-fire step (335) and a sintering step (340) then can be performed on the substrate.

Abstract: A method of manufacturing metal to glass, metal to metal and metal to ceramic connections to be used in SOFC applications, said connections being produced as a mixture of a base glass powder and a metal oxide powder. As a result, the inherent properties of the glass used in the composite seals may be altered locally in the metal-coating interface by adding e.g. MgO in order to control the viscosity and wetting, and at the same time maintain the bulk properties such as high coefficient of thermal expansion of the basic glass towards the seal components.

Abstract: A method for accurately and easily manufacturing a ceramic multi-layered substrate includes a first step of forming a green ceramic laminate including a plurality of stacked green ceramic base layers, a second step of firing the green ceramic laminate to sinter the green ceramic layers, and a third step of separating the sintered ceramic laminate formed by firing the green ceramic laminate into a ceramic multi-layered substrate. The green ceramic base layers stacked in the first step include a separation pattern formed along separation lines, the separation pattern disappearing during firing. In the third step, the sintered ceramic laminate is separated into a plurality of ceramic multi-layered substrates separated through a cavity formed by the disappearance of the separation pattern during the firing in the second step.

Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.

Abstract: A manufacturing apparatus for manufacturing electronic monolithic ceramic components, including a sheet supplier for supplying a plurality of ceramic green sheets of a plurality of types in a predetermined order, and a laminator for laminating the ceramic green sheets supplied by the sheet supplier. A plurality of trays is set in two vertical columns in a rack which is vertically movable. Each tray holds a stack of a plurality of ceramic green sheets of the same type. A particular tray positioned to a predetermined level by the vertical movement of the rack is drawn by a tray drawer device, and one ceramic green sheet is picked up from the tray, and is then conveyed to the laminator. The utilization efficiency of area in the sheet supplier is thus increased.

Abstract: The present invention mainly relates to a method for reducing shrinkage during sintering low-temperature-cofired ceramics, the ceramics comprising a dielectric portion and a heterogeneous material portion, the method comprising the steps of: (a) providing a monolithic structure, the monolithic structure comprising a dielectric body and a constraining layer; the dielectric body comprising at least one dielectric layer that comprises at least one active area; wherein said active area is disposed with at least one heterogeneous material pattern; the constraining layer positioned on the top of the dielectric body comprising at least one window wherein the edge of the active area of the dielectric layer each falls within the edge of the window in the vertical direction; (b) firing the monolithic structure; and (c) singulating the monolithic structure along a cutting line to provide the low-temperature-cofired ceramics, wherein the cutting line is disposed in the area formed between the edge of the window and the e

Abstract: A method for producing a ceramic substrate of the present invention includes a first process of providing holes in a shrinkage suppressing layer, a second process of filling the holes with a thick film material, a third process of laminating the shrinkage suppressing layer filled with the thick film material on an outermost layer of a ceramic substrate sintered in a preparatory process, followed by pressing, thereby obtaining a laminate, a fourth process of sintering the laminate, and a fifth process of removing the shrinkage suppressing layer. Thus, the kind of convex portions formed on the outermost layer of the ceramic substrate can be increased.

Abstract: A set of resin sheets includes a plurality of resin sheets. Each resin sheet is disposed in a site to be a surface recess or inner void in a ceramic green sheet to be laminated, and a plurality of such ceramic green sheets each with the resin sheet disposed therein are laminated and fired, whereupon the resin sheets are removed by thermal decomposition during the firing. In the set of resin sheets, the relation of Ta<Tb?Tc is satisfied wherein Ta (° C.) indicates an 80% weight reduction temperature of an uppermost resin sheet, Tb (° C.) indicates an 80% weight reduction temperature of a lowermost resin sheet, and Tc (° C.) indicates a 20% weight reduction temperature of a resin binder which is contained in the ceramic green sheets in which the green sheets are disposed.

Abstract: A ceramic slurry composition has a powdered ceramic uniformly dispersed therein without excessive damage thereto. A method for producing a ceramic green sheet using the ceramic slurry composition and a method for producing multilayer ceramic electronic devices are also disclosed. The ceramic slurry composition contains the powdered ceramic, a dispersing agent, a binder and a solvent, in which an anionic dispersing agent is used as the dispersing agent, and the content of the anionic dispersing agent is set to be such that the total acid content thereof corresponds to about 10 to 150% of the total base content of the powdered ceramic. In addition, the powdered ceramic having an average particle diameter of about 0.01 to 1 ?m is used.

Abstract: An inductor element comprises: a ceramic base member; and a coil composed of a conductor having a shape complementary to the ceramic base member. In the inductor element, a prescribed plural number of steps are formed on at least an inner wall surface of the ceramic base member facing to the coil in one direction.

Abstract: A method of producing an actuator includes shaping a block of ferroelectric material to provide an active element of the actuator. The element includes a stack of ferroelectric layers with adjacent layers separated by electrodes arranged parallel to end faces of the element. The method includes applying a primary electrode to the end faces, immersing the element and the primary electrode within a dielectric fluid, applying a primary poling voltage to the primary electrode so as to polarize the element in a first polarization direction, applying a secondary external electrode to side faces of the element, and applying a secondary poling voltage to the secondary electrode to polarize alternate layers along the first polarization direction and the other layers along a second, oppositely-directed polarization axis. The method may also include applying a conductive film to the end faces and/or applying heat to help evaporate the dielectric fluid.

Abstract: A production method of a multilayer electronic device, comprising the steps of forming a lower side green sheet 10a including at least a ceramic powder on a supporting body 20; forming an electrode pattern layer 12a on a surface of the lower side green sheet; forming a green chip by stacking multilayer units U1 including at least the lower side green sheet and an electrode pattern layer; and firing the green chip; wherein the lower side green sheet 10a formed on the supporting body 20 includes a binder of a curable resin, and the curable resin in the lower side green sheet 10a is cured before forming said electrode pattern layer 12a on the lower side green sheet.

Abstract: A method produces a component having a ceramic base body and contact surfaces on opposite sides of the ceramic base body. The method includes forming first protective layers on the opposite sides of the ceramic base body in regions not to be covered by the contact surfaces, forming second protective layers on opposite surfaces of the ceramic base body, sintering the ceramic base body with the first and second protective layers at a first temperature, forming the contact surfaces on the ceramic base body, and sintering the contact surfaces at a temperature that is lower than the first temperature.

Abstract: A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.

Abstract: The present invention relates to a method for manufacturing multi-layer ceramic substrate, a plurality of aluminum oxide ceramic substrate units are piled together, between each two ceramic substrate units is an oxide medium layer which can grow crystal grain during sintering. Such that the upper and lower ceramic substrate units will compactly bind together with the oxide medium layer because the grown crystal grains enter into the gaps or holes formed between the crystal grains of the surfaces of ceramic substrate units during sintering process.

Abstract: This invention provides a method of producing a ceramic laminate body capable of suppressing the occurrence of de-lamination and cracks, and providing high reliability. This method comprises a heat-bonding step of covering a full periphery of side surfaces of ceramic layers 11 positioned in an orthogonal direction to a laminating direction with a side surface jig while the ceramic layers are laminated, heating the ceramic layers and pressing the ceramic layers from both end faces positioned in the laminating direction by end face jigs to form a heat-bonded ceramic laminate body; and a side surface grinding step of grinding or cutting the full periphery of the side surfaces inclusive of damage portions 9 occurring in the ceramic laminate body in the heat-bonding step.

Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.

Abstract: A process for forming a multilayer ceramic device. The device includes forming a ceramic precursor layer followed by ink jet printing in alternating order an electrode precursor in a predetermined pattern on the ceramic precursor layer to form an electrode and a ceramic ink on the electrode. The ceramic precursor is then sintered.

Abstract: The invention relates to a ceramic green body consisting of at least two ceramic bodies that are bonded together. The invention is characterized in that the green body is produced using an adhesive tape that consists of an adhesive film located on a release liner.

Abstract: In a method of producing a multi-terminal type laminated ceramic electronic component in which internal electrodes are embedded in a sintered ceramic member, and the internal electrodes have plural first lead-out electrodes led out to a first side surface and plural second lead-out electrodes led out to a second side surface, the plural second lead-out electrodes of one of the adjacent internal electrodes in each internal electrode pattern are not continuous with the plural first lead-out electrodes of the other of the adjacent internal electrodes, and the plural second lead-out electrodes and the plural first lead-out electrodes are alternately arranged in a direction that is substantially perpendicular to the direction of a line connecting the first and second side surfaces.

Abstract: A block of stacked green films provided with internal electrodes is laminated, at least one actuator is separated from the block, the actuator obtains its shape by means of a machining operation, is then sintered, and the sinter skin produced by the sintering is used as an insulating layer. The sinter skin is abraded at the points where the internal electrodes are connected to the external electrodes.

Abstract: An organic EL device includes a substrate, at least an organic EL device layer formed above the substrate, a barrier film which covers and seals the organic EL device layer. The organic EL device layer includes a lower electrode, an upper electrode, at least an organic material layer between the lower and upper electrodes. The barrier film comprises a glass film.

Abstract: An electrical component with a printed circuit board. The printed circuit board has an upper face and a lower face. A microprocessor is mounted to the upper face. A capacitor is mounted to the lower face. The capacitor has a first face parallel to the printed circuit board and a second face opposite to the first face. First plates and second plates are in alternating planar relationship with a dielectric therebetween and arranged in a plane perpendicular to the plane created by the circuit board. Each first plate has a first coupling tab and a power tab on opposing edges wherein the first coupling tab terminates at the first face and the power tab terminates at the second face. Each second plate of the second plates comprises a second coupling tab and a ground tab on opposing edges wherein the second coupling tab terminates at the first face and the ground tab terminates at the second face. The first coupling tab and the second coupling tab are in electrical contact with the microprocessor.

Abstract: There is provided a multilayer ceramic device enabling achievement of secure electric connection via electroconductive members in through holes and reduction in the thickness of internal electrodes during manufacturing. In multilayer piezoelectric device 1, a melting point of a material of the electroconductive members in the through holes is higher than a melting point of a material of the internal electrodes 2 and others. For this reason, the electroconductive members in the through holes have a contraction percentage in baking smaller than that of the internal electrodes 2 and others. Therefore, contraction of the electroconductive members is relatively constricted in baking, so as to decrease the difference of contraction percentages in baking between green sheets intended for piezoelectric layers 3 and others, and the electroconductive members in the through holes. This results in preventing breakage of the electrical connection via the electroconductive members in the through holes.

Abstract: A method of making a multilayer electronic component which can further improve a withstand voltage characteristic is provided. In the method of making a multilayer capacitor in accordance with the present invention, a sheet multilayer body is formed in a multilayer body forming step by laminating a plurality of electrode sheets and blank sheets formed in a sheet forming step. The sheet multilayer body is fired in a firing step, whereby a multilayer capacitor is obtained. The sheet multilayer body includes one blank sheet interposed between the electrode sheets. Namely, two green sheets are interposed between electrode patterns of the electrode sheets, whereby the green sheet thickness is substantially increased. The inventors have newly found that increasing the green sheet thickness by making the sheet multilayer body have such a structure is effective in improving the withstand voltage characteristic.

Abstract: An object of the present invention is to provide internal electrode paste capable of preventing dripping and blurring, etc. of paste even when a solvent ratio is increased and an electrode material powder ratio is decreased in the paste and, moreover, capable of forming a uniform internal electrode layer without any printing unevenness so as to obtain a thin internal electrode layer: comprising an electrode material powder, a solvent and a binder resin; wherein a molecular structure of the binder resin comprises both of a first structure unit (an acetal group derived from acetaldehyde) and a second structure unit (a butyral group derived from butylaldehyde).

Abstract: A method of producing a laminated dielectric element of high quality, free of delamination. A method of producing a laminated dielectric element 1 by alternately laminating dielectric ceramic layers 12 and base metal electrode layers 13, comprising the steps of printing electrodes by applying a paste material for the base metal electrodes onto the surfaces of at least one side of the ceramic green sheets, laminating and press-adhering the ceramic green sheets to fabricate a laminate thereof, dewaxing the laminate, reducing the electrodes to form base metal electrode layers by heating the laminate while flowing an atmospheric gas and by reducing the paste material for the base metal electrodes, and sintering the laminate.

Abstract: The invention relates to an air/fuel ratio detection apparatus. This apparatus includes (a) a heater portion having an elongate cylindrical shape and heating by applying electricity thereto from outside; (b) a solid electrolyte layer surrounding the heater portion and being activated by heat to conduct oxygen ions therethrough; (c) first and second electrodes in contact with the solid electrolyte layer and being away from each other such that pumping voltage is applied by the first and second electrodes to the solid electrolyte layer; (d) a reference electrode for outputting an air/fuel ratio detection signal, the reference electrode being formed on the solid electrolyte layer and being away from the first and second electrodes; and (e) a diffusion layer made of a porous material and surrounding periphery of the solid electrolyte layer to cover the first and second electrodes and the reference electrode.

Abstract: A method of producing an LTCC substrate having improved cavity bondability is disclosed that involves providing a stack of green ceramic tape sheets having a cavity, placing a template having an opening corresponding to the cavity over the stack, placing a stretchable sheet of material coated with graphite or zinc stearate over the template, isostatically laminating the stack to produce an LTCC substrate having a cavity, and removing the template and sheet of stretchable material from the stack.

Abstract: The present invention provides a process and an apparatus for the preparation of a motor coil by which a longitudinally wound motor coil, so called, can be easily prepared. First, a molded product 10 comprising a column part 11, and a fin part 12 projected in the form of flat plate from an outer peripheral surface 11A, 11B, 11C, 11D of the column part to an outer side in a radial direction of the column part and helically continuing in an axis direction of the column part at predetermined intervals along the outer peripheral surface of column part is prepared. The column part 11 of the first molded product is punched out in an axis direction of the column part with retaining the fin part 12 to remove the column part, and the fin part 12 having helical shape left after the removal is coated with an insulating film.

Abstract: The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part.