Abstract: There is provided a device (1) for surface mounting that has a substrate (10) and a capacitor element loaded on a loading-side surface of the substrate and is integrally molded including the substrate (10) and the capacitor element using a packaging resin. The substrate (10) includes a first terminal electrode (51) electrically connected to a first electrode of the capacitor element and a second terminal electrode (52) electrically connected to a second electrode of the capacitor element, at least part of a mounting-side surface (12) on an opposite side to the loading-side surface of the substrate (10) is exposed on a mounting surface (2) of the device (1), and the first terminal electrode (51) and the second terminal electrode (52) are adjacently disposed around an entire circumference of the mounting surface (2) of the device (1).

Abstract: A wiring substrate includes: a plate-like base material containing carbon fibers; a wiring layer formed on a surface of the base material; a first via including a first through hole penetrating through the base material, a first resin layer formed on an inner wall of the first through hole and including a second through hole, and a first conductive layer formed on an inner wall of the second through hole; and a second via including a third through hole penetrating through the base material and a second conductive layer formed on an inner wall of the third through hole, wherein an inside diameter of the third through hole is greater than an inside diameter of the second through hole.

Abstract: In a power module substrate, a circuit layer is formed on one surface of an insulating layer, a metal layer is formed on the other surface of the insulating layer, and a body to be bonded can be bonded to the other surface of the metal layer using a flux. A flux component intrusion-preventing layer containing an oxide and a resin is formed at a circumferential edge section of a bonding interface between the insulating layer and the metal layer.

Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.

Abstract: Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.

Abstract: A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a region between the plurality of wirings, a constituent atoms of the wirings are diffused in the inducing layer.

Abstract: An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer including an optically opaque agent and formed on the first surface of the insulation layer or a second surface of the insulation layer on the opposite side with respect to the first surface of the insulation layer. The adhesive layer has an opening portion formed at the position corresponding to the alignment mark such that the opening portion exposes the alignment mark directly or through the insulation layer.

Abstract: A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.

Abstract: A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor.

Abstract: An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

Abstract: A suspension board with circuit includes a conductive region in which a conductive layer is formed and a mounting region for mounting a slider on which a magnetic head that is electrically connected to the conductive layer is mounted. The mounting region mounts the slider so that the slider is capable of relatively moving with respect to the conductive region, and the conductive region includes an opposing region that is opposed to the slider in the thickness direction at the time of the relative movement of the slider with respect to the conductive region and a damage preventing portion for preventing damage to the opposing region by the slider.

Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.

Abstract: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.

Abstract: The present invention provides a conductive film that includes a substrate, a first matrix layer, a first conductive layer, a second matrix layer, a second conductive layer, a light-shielding layer, a first lead electrode and a second lead electrode. A first grid groove and a second grid groove are formed in the first matrix layer and the second matrix layer, respectively, and the first grid groove and the second grid groove are filled with conductive materials, to form the first conductive layer and the second conductive layer, respectively. Accordingly, the first matrix layer and the second matrix layer may provide protection for the first conductive layer and the second conductive layer, and thus can improve the production yield. Furthermore, the present invention also provides a method for manufacturing the conductive film and a touch screen including the conductive film.

Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.

Abstract: To provide a multilayer wiring board that ensures sufficient adhesion between a resin insulating layer and a conductor layer and is excellent in connection reliability. The multilayer wiring board has a multilayered build-up construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately laminated. The resin insulating layers are formed of the lower insulating layer and the upper insulating layer disposed on the lower insulating layer. The conductor layer is formed on the surface of the upper insulating layer. The upper insulating layer is formed thinner than the lower insulating layer. The silica filler occupying the upper insulating layer has a lower volume proportion than the volume proportion of the silica filler and the glass cloth that are occupying the lower insulating layer.

Abstract: Disclosed herein is a method of preparing a surface-modified inorganic filler, comprising the steps of: drying an inorganic filler; treating the inorganic filler with fluorine-containing gas to bond fluorine (F) to a part of the surface of the inorganic filler; and bonding a functional group-bonded silane coupling agent to another part of the surface of the inorganic filler, this other part of the surface thereof being not bonded with fluorine.

Abstract: A transparent conductive film includes a transparent substrate and a polymer layer formed on the transparent substrate, a surface of the polymer layer is patterned to define a meshed trench, the meshed trench is filled with a conductive material to form a sending area, a periphery of the sensing area is printed with a lead, the lead is electrically connected to the conductive material in the meshed trench. Besides, a method of manufacturing the transparent conductive film is provided. In the transparent conductive film and the method, the trench is filled with a conductive material to form a sending area, and the lead is formed by printing and electrically connected to the conductive material, the yield of the lead of the transparent conductive film is relatively high.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers laminated therein; an active part including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, and forming capacitance; an upper cover layer formed on the active part and including an upper marking electrode therein; and first and second external electrodes formed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, wherein when a thickness of the dielectric layer is d and a distance between a first internal electrode formed in the uppermost portion of the active part and the upper marking electrode is A1, 2d?A1 is satisfied.

Abstract: A conductive film may be provided that includes a base film, a primer layer formed on the base film, the primer layer having voids, and a conductive layer formed on the primer layer. The conductive layer may include a conductor that contains a nano-material forming a network structure.

Abstract: The present invention provides a conductive film that includes a substrate, a first matrix layer, a first conductive layer, a second matrix layer, a second conductive layer, a light-shielding layer, a first lead electrode and a second lead electrode. A first grid groove and a second grid groove are formed in the first matrix layer and the second matrix layer, respectively, and the first grid groove and the second grid groove are filled with conductive materials, to form the first conductive layer and the second conductive layer, respectively. Accordingly, the first matrix layer and the second matrix layer may provide protection for the first conductive layer and the second conductive layer, and thus can improve the production yield. Furthermore, the present invention also provides a method for making the conductive film and a touch screen including the conductive film.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps: (a) dissolving an N,O-heterocyclic compound of Formula I or Formula II into a first solvent to form a first reaction solution: (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization to provide a solution of ring-opening polymerized product; and (c) cooling the solution of ring-opening polymerized product to a second temperature to substantially terminate the ring-opening polymerization to obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature.

Abstract: A circuit board for connecting a secondary battery including a first insulation layer, a conductive layer positioned on one surface of the first insulation layer, and a pad layer positioned on the conductive layer and divided into at least two areas is disclosed. In the circuit board, the conductive layer has an area wider than that of the pad layer. Accordingly, the conductive layer has an area wider than that of the pad layer, so that it is possible to miniaturize the circuit board and to improve the safety of the circuit board.

Abstract: An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces or prevents vibration being transmitted to a circuit substrate on which it is mounted.

Abstract: The invention provides a method for manufacturing a thin film substrate. The method comprises steps of: providing a substrate having at least one through hole; forming a first metallic layer on a surface of the substrate and the through holes; forming a resist layer and a first opening on the first metallic layer; forming a second metallic layer in the first opening and the through hole; removing the resist layer and a part of the first metallic layer to form a circuit layer and a plurality of grooves; forming a solder mask layer on the circuit layer and in the groove, and forming a second opening on the solder mask layer to expose a part of the circuit layer; and polishing the surface of the exposed circuit layer and the solder mask layer.

Abstract: A touch screen according to an embodiment of the present invention includes: a transparent conductive material deposited on the upper surface of a flexible plastic film; and a metal layer vacuum-deposited on the transparent conductive film. The embodiment of the invention can provide a highly flexible touch screen of which manufacturing process can be simplified, and a manufacturing method thereof.

Abstract: A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

Abstract: There is provided a wiring board for mounting a light emitting element thereon. The wiring board includes: an insulating layer; a wiring pattern on the insulating layer; a reflecting layer on the insulating layer to cover the wiring pattern, wherein the light emitting element is to be mounted on a surface of the reflecting layer; and a silica film on the surface of the reflecting layer.

Abstract: A method of manufacturing a flexible printed circuit board including determining an elastic modulus of a conductive portion and an elastic modulus of first and second dielectric portions, determining a thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the flexible printed circuit board, and insulating the conductive portion according to the determined thickness and the determined elastic modulus.

Abstract: An anisotropic conductive film includes an insulating adhesive resin layer, and a plurality of conductive particles located at the insulating adhesive resin layer and comprising acutely angled edges.

Abstract: A device for storing electromagnetic energy and signals, for example from biological systems and, possibly modifying, and emitting them again is provided with a planar substrate, having a first side and a second side, at least one first arrangement being provided on the first side, which has at least one first single-wire and possibly at least one first cavity, and at least one first device for storing electromagnetic energy being provided, one end of a single-wire being connected to the device for storing the electromagnetic energy, and the other end of the single-wire being disposed possibly, as free end, in, below or abutting on the first cavity.

Abstract: Provided is a conductive structure body comprising: a substrate; a conductive pattern; and a darkened pattern comprising CuOx (0<x?1), and a method for manufacturing the same. The conductive structure body may prevent reflection due to a conductive pattern without affecting the conductivity of the conductive pattern, and may improve the concealment of the conductive pattern by improving the absorbance of the conductive structure body. Therefore, a display panel with improved visibility may be developed using the conductive structure body.

Abstract: A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.

Abstract: A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction.

Abstract: A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1).

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.

Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

Abstract: An interdigitated electrode film co-extruded with bus bars for thin film electronics or other devices. First electrode layers are located between first and second major surfaces of the film with a first bus bar electrically connecting and integrated with the first electrode layers. Second electrode layers are located between the first and second major surfaces with a second bus bar electrically connecting and integrated with the second electrode layers. The first electrode layers are interdigitated with the second electrode layers, and insulating layers electrically isolate the first bus bar and electrode layers from the second bus bar and electrode layers. The electrode films include multilayer films with vertical bus bars and multilane films with horizontal bus bars.

Abstract: Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent copper heat seal strength and superior internal adhesion strength comprise a layer of polyimide having first and second major surfaces and at least a first fluoropolymer layer wherein the first fluoropolymer layer comprises fluoropolymer, metal oxide and ammonium salt. Protected wire or cable using the multilayer insulation structures, are also described.

Abstract: The substrate with a transparent electrode includes a first dielectric material layer mainly composed of SiOx, a second dielectric material layer mainly composed of a metal oxide, a third dielectric material layer mainly composed of SiOy, and a transparent electrode layer, in this order on a transparent film substrate. The transparent electrode layer is patterned to have an electrode layer-formed part and an electrode layer non-formed part. The transparent electrode layer is a layer mainly composed of an indium-tin composite oxide and having a thickness of 20 nm to 35 nm. The refractive index n1 of the first dielectric material layer, the refractive index n2 of the second dielectric material layer, and the refractive index n3 of the third dielectric material layer satisfy n3<n1<n2. The first dielectric material layer, the second dielectric material layer and the third dielectric material layer each have specific thicknesses.

Abstract: [Object]To provide a flexible printed board improved in bendability. [Means for solving]The flexible printed board 2 comprises: an insulating substrate 21; a circuit wiring 22 laid on the insulating substrate 21; a circuit protection layer 23 laid on the circuit wiring 22; a shield conductive layer 24 laid on the circuit protection layer 23; and a shield insulating layer 25 laid on the shield conductive layer 24, and is characterized by meeting the following Expression (1). 0.75?E2/E1?1.29??Expression (1) Note that E1 denotes the tensile elastic modulus of the shield conductive layer 24 and E2 denotes the tensile elastic modulus of the shield insulating layer 25.

Abstract: A substrate for an electronic circuit is provided wherein the substrate comprises a plurality of contact areas (304), a plurality of dielectric areas (307), and a conductor path (301), wherein each of the plurality of contact areas is surrounded by a respective one of the dielectric areas, and wherein at least two of the contact areas are connected with each other by the conductor path. Furthermore, the conductor path is formed at the dielectric area in such a way that it completely covers the dielectric area.

Abstract: A flexible film is provided. The flexible film includes a dielectric film, a metal layer disposed on the dielectric film, and at least one hole formed through the dielectric film and the metal layer. Therefore, it is possible to facilitate the alignment of circuit patterns on a flexible film with an electrode of a panel of a display device or a circuit of a driving unit of a display device.

Abstract: A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

Abstract: A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically connected to the plate wirings. The base has first and second surfaces on which the surface wirings are formed. The surface wirings are thinner than the plate wirings, and the minimum wiring gap between the surface wirings is smaller than the minimum wiring gap between the plate wirings. One of the plate wirings has substantially the same shape as that of a region where the first top-surface wiring on the first surface and the first bottom-surface wiring on the second surface overlap with each other in the normal direction of the first surface. The first top-surface wiring and the first bottom-surface wiring are connected to each other through the above-mentioned one of the plate wirings.

Abstract: A thin-film wiring substrate includes a base B including a ceramic substrate having an upper surface and a wiring conductor provided on the upper surface of the ceramic substrate; a bonding layer and a thin-film wiring layer laminated in order on the upper surface of the ceramic substrate; and a through conductor that passes through the bonding layer in a thickness direction and electrically connects the wiring conductor to the thin-film wiring layer, Wherein the bonding layer includes a core layer composed of a thermosetting resin and adhesive layers respectively laminated on an upper surface and a lower surface of the core layer, the adhesive layers being composed of a thermosetting resin having an elastic modulus smaller than that of the thermosetting resin constituting the core layer.

Abstract: Inkjet printer-compatible solder mask inks include amide gellants to provide improved print resolution. A solder mask ink includes an amide gellant and a plurality of acrylate monomers, oligomers, or combinations thereof.

Abstract: A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 ?m and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 ?m and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode.

Abstract: A conductive film is disclosed in the present disclosure, which includes: a substrate having a first surface and a second surface opposite to each other; and a first conductive layer laid on the first surface, the first conductive layer includes a plurality of first conductive areas and first insulating areas, the first conductive areas include a metal mesh formed by a metal, the first insulating areas include an insulating mesh formed by an insulating metal sulfide, the insulating metal sulfide is obtained from a reaction between the metal and hydrogen sulfide. Accordingly, the problem of producing lots of wastewater of the metal salts and heavy metal pollution can be avoided, the insulating areas include the insulating mesh having a transmittance close to the metal mesh, benefit for reach a uniform transmittance of the touch screen, and avoid forming alternating light and dark color patches.