Abstract: A mounting for a semiconductor integrated circuit device, such as a charge coupled device ("CCD") or an erasable programmable read only memory device ("EPROM"), includes an insulating substrate having an aperture between its first and second surfaces. A first surface of the integrated circuit device is placed adjacent to and facing the first surface of the substrate. Light sensitive circuitry on the first surface of the integrated circuit device is aligned with the aperture. Solder bumps on the periphery of the first surface of the integrated circuit are electrically connected to corresponding conductive metallizations on the first surface of the substrate. A aperture cover transparent to light is affixed to the second surface of the substrate and extends over the aperture, so that light may be transmitted through the aperture cover and aperture to the light sensitive circuitry on the first surface of the integrated circuit device. The substrate may be a printed circuit board.

Abstract: The present invention relates to an electronic module, especially a storage module, having a strip on each of two opposite sides and a plastic substrate to accept and hold the electronic module in grooves in two U-shaped rails corresponding to the strips. The electronic module also has a plastic frame which accepts a fitted printed-circuit board and has at least one electrically conductive covering on either its upper and/or lower side and which extends as far as the strips and is connected to a reference potential. The electrical connection of the coverings to reference potential is ensured by contact components.

Abstract: According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having projections formed on the back thereof, with an organic dies bonding agent. Pads on the semiconductor chip, and inner leads are respectively electrically connected to one another by metal thin lines. These portions are sealed with a molding resin. Further, each inner lead extends to the outside of the molding resin and is processed into gull-wing form for substrate mounting. Moreover, the inner lead is processed by soldering so that an external terminal is formed. Thus, since the projections are provided on the back of the die pad, the back of a packing material is brought into point contact with that of the die pad as compared with the conventional face-to-face contact. It is therefore possible to minimize the transfer of organic substances from the packing material.

Abstract: A semiconductor device includes a lead frame assembly having a die attach pad with a die secured by a die bonding material. A portion of the die bonding material may flow out from between the die and the die attach pad to form a squash out layer. A raised bond pad is at least partially in the squash out layer area and extends upward from said die attach pad sufficient to be above the squash out layer. A bond wire has one end secured to a ground terminal on the die and the other end to the raised bond pad. The whole structure is encapsulated in a plastic package.

Abstract: Device for recording flight data in a data recorder located in a spherical metal housing with thermal insulation on the interior surface and with connecting lines between the data recorder and data sources.

Abstract: In a first step, electrical conductor tracks (15 to 20) are applied against the bottom and the walls of a cavity (5) for the integrated circuit (IC4) and connected to external contact pads (2) at the same side of the card. Said tracks lie alternately side-by-side at the bottom 7 of the cavity. In a second step, the IC (4) is glued with its surface which does not carry the contacts on said tracks on the bottom (7) of the cavity by means of a non-conducting glue. Then connections are realized by soldering of conductor wires (12) between contacts of the IC and ends of the tracks, and the cavity is filled with a protective resin. Application: Placement of an IC with inverted contacts in an electronic card support.

Abstract: Improved edge terminals for electronic circuit modules such as single- or multi-chip modules and hybrid circuits, and methods of making the edge terminals are disclosed. The improved edge terminals are formed on the edges of the modules, where they do not take up appreciable surface area from the module, and are formed of heat resisting metal and are of larger size as compared to conventional surface terminal pads which simplifies making connections to the module. In one embodiment, ends of pins are inserted in holes in a substrate along lines which will be the edges of the finished modules. After encapsulating in epoxy, the substrate is cut along the lines to bisect the pins, leaving the halves of the pins as embedded terminals flush with the edge of the module. In another embodiment, terminals are formed by attaching the terminal pieces to pads on the substrate, either in the form of widened zones in a grid structure, or an array of terminal plates.

Abstract: An electrical element comprising a housing or casing, a heat generating part such as a high-tension resistor, a non-heat generating part such as a capacitor, and a resin filling the housing. Further, the electrical element also includes connectors for establishing external connections between the above-mentioned capacitor or high-voltage resistor, the connectors being arranged at positions suitable for them to dissipate heat from the high-voltage resistor and radiate heat outside the element.

Abstract: An electrical device such as a network protector relay is protected from ambient conditions by a housing having a printed circuit board (PCB) providing a seal for the housing and air and water tight connections between relay leads and external leads. The relay leads are soldered in first plated through apertures in the PCB substrate while the external leads are soldered in second plated through apertures connected to corresponding first apertures by conductive traces on the substrate. Potting material confined by a potting dam electrically insulates the solder connections on the external side of the PCB. Components can be mounted on either side of the substrate by soldering the component pins or leads in additinal plated through apertures electrically connected to relay and/or external leads by the conductive traces.

Abstract: A lead frame for use in the fabrication of a resin-encapsulated semiconductor device of an LOC structure includes a die pad for receiving a semiconductor chip thereon; a plurality of leads having end portions located along the periphery of the die pad; at least two support bars supporting the die pad; tie bars supporting the plurality of leads; and two frame selvages supporting the tie bars. The die pad, leads, support bars, tie, bars, and frame selvages are formed from a flexible metal sheet as one piece. At least one of the support bars is connected to one of the tie bars or connected to one of the frame selvages in a region adjacent a connection point between the one of the tie bars and the at least one of the frame selvages, the region excluding an orthogonal projection of the die pad.

Abstract: An electrical distribution center comprises a main bus plate assembly that is sandwiched between upper and lower auxiliary bus plate assemblies of a known type. The main bus plate assembly comprises stamped metal circuit components having bus strips sandwiched between upper and lower insulation plates that are permanently secured together. The stamped metal circuit components have male blade terminals that protrude through slots of the upper and lower insulation plates. The slots have laterally flexible side wall portions that are spread apart by embossments of the stamped metal circuit components to retain these components during the assembly process.

Abstract: A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted therein from moisture.

Abstract: A microelectronic assembly (10) includes an integrated circuit component (14) spaced apart from a substrate (12) by a gap filled with a polymeric encapsulant (18). The polymeric encapsulant (18) contains a thermally decomposable azide group. In the event that it is necessary to remove the component (14), such as if the component (14) is found to be defective, the microelectronic assembly (10) is heated to a temperature above the decomposition temperature of the azide group. Decomposition of the azide group disintegrates the encapsulant (18) and preferably detaches the component from the substrate (12), thereby permitting replacement of the component (14).

Abstract: The present invention is to provide an electronic part mounting device including: a lamination body composed of a circuit board and a structural member; an electronic part attached in an opening formed in the lamination body; and an encapsulant layer to encapsulate the electronic part, wherein an outer circumferential line of the opening is arranged inside an outer circumferential line of the encapsulant layer. Due to the foregoing arrangement, in the electronic part mounting device of the present invention, even if the device is bent, the encapsulant layer to encapsulate the electronic part is engaged with the circuit board or the structural member arranged inside the outer circumferential line of the encapsulant layer, so that electronic parts are prevented from coming off. Further, the manufacturing process is simple. Therefore, the cost of the electronic part mounting device can be greatly reduced.

Abstract: An encapsulated transducer (10) includes an injection molded encapsulation ensconcing a sensing element (90) proximate the front end (22) and a portion of an information transmitting medium (120) emanating from the back end (24). A component alignment preform (40) operatively couples the sensing element (90) with the information transmitting medium (120). The preform (40) includes a front ferrule (70) and a rear ferrule (80) bonded thereto and linearly spaced apart along a long axis "A". The preform (40) further includes an annular recess (44) in which the sensing element or coil (90) is placed. A first lead (98) and a second lead (100) of the coil are electrically connected to the front ferrule (70) and the rear ferrule (80), respectively. A back end (48) of the preform (40) receives a stripped end (122) of the cable (120) such that a plurality of conductors are operatively coupled to the front ferrule (70) and the rear ferrule (80) and to the leads of the coil.

Abstract: The present invention provides compositions and method for heat absorption which include between about 35 percent and about 45 percent by weight of an between about 35 percent and about 45 percent by weight of an N,N'-ethylenebis-stearamide wax having a melting point of between 232.degree. C. and 240.degree. C. and between about 65 percent and about 55 percent by weight of an N,N'-ethylenebisstearamide wax having a melting point of about 140.degree. C., and thermally protected enclosures including the same.

Abstract: A device for coupling a fly back transformer (FBT) focus unit is disclosed. A protecting wall is installed on the coupling portion of the FBT case in such a manner that the protecting wall should be positioned adjacently to and should keep a gap toward the ceramic circuit board which is attached to the back face of the focus unit in an exposed state. That is, a protecting wall (6) is formed integrally with the FBT case (5) and on the coupling portion 4 for the focus unit (2) and adjacently to the ceramic circuit board (1), so that a tiny space (S) would be formed. A small amount of a hard insulating resin (3) is filled into the tiny space S between the protecting wall and the ceramic circuit board (1), and the resin (3) is made to be cured, so that internal coils of the FBT case (5) would be insulated. Therefore, an injection of a soft insulating resin for preventing a damage to the ceramic circuit board becomes needless.

Abstract: A method of preventing non-uniform bonding wire sweep during an encapsulating process of an integrated circuit package includes the step of forming an encapsulating material flow restricting element between two widely spaced functional bonding wires. The integrated circuit package includes an array of electrically conductive leads for electrically connecting the package to other electrical elements and an integrated circuit die having a plurality of input/output terminal pads. A plurality of functional bonding wires electrically connects certain ones of the input/output terminal pads to associated electrically conductive leads such that the functional bonding wires have a predetermined pitch which defines an approximate minimum desired spacing between adjacent functional bonding wires. The plurality of functional bonding wires includes two widely spaced functional bonding wires which are spaced apart from one another by a distance substantially greater than the predetermined minimum desired spacing.

Abstract: A motor vehicle interior lamp is disclosed which has a lamp body of plastics material on which an electric lighting bulb is mounted by being supported between a pair of bulb terminals. One of the bulb terminals is connected to a power supply. For selectively grounding the other bulb terminal via a hand operated switch, a grounding conductor is embedded in the lamp body by insert molding. The grounding conductor is fabricated from sheet metal in one piece with a set of grounding terminals to be grounded by fastener elements. The grounding conductor is connected to each grounding terminal via an offset link which is capable of deformation in response to possible deformation or displacement of the grounding conductor during the insert molding of the lamp body and which is thus effective to hold the grounding terminals with their mounting holes in register with the mounting holes in the lamp body.

Abstract: A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates that are separated from a lead frame by a plurality of dielectric tapes. The integrated circuit is mounted to the baseplate which has a plurality of tabs that are connected to the lead frame of the package. The power or ground leads of the package are bonded to the corresponding baseplate through the tabs of the metal plate. The lead frame, metal baseplate and dielectric tapes all have center openings to provide clearance for the integrated circuit. The center opening of the tapes are such that the dielectric material extends beyond the ends of the baseplates and lead frame.

Abstract: The encapsulated transducer (10) includes an injection molded encapsulation (20) having a front end (22) and a back end (24). The encapsulation (20) ensconces a sensing element (40) proximate the front end (22) and a portion of a cable (60) which extends from the back end (24). The sensing element or coil (40) is electrically and mechanically connected to the cable (60) by a pair of suitably sized front and rear ferrules (80), (90) secured to a center and coaxial conductor (66), (70) of the associated cable (60) thereby forming a coil and cable assembly (110). At least the rear ferrule (90) includes a shoulder (100) for firmly anchoring the coil and cable assembly (110) within the encapsulation (20). In addition an injection molding process provides the durable encapsulation (20) which bonds with a dielectric (68) of the cable (60) and symmetrically locks the coil and cable assembly (110) therein.

Abstract: A printed circuit board carries a microcircuit package electrically connected to bare copper connector pads on the printed circuit board microcircuit package by aluminum wires. The copper connection pads are encapsulated by a material such as low stress liquid encapsulant having a thermal expansion coefficient approximately equal to that of the printed circuit board substrate material. Preferably the printed circuit board laminate comprises cellulose epoxy mat such as CEM-1.

Abstract: A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as common solder having no moisture absorption, for die-bonding a semiconductor chip to a die pad. Thus, in the semiconductor device in accordance with the present inventions there are no corrosion problems nor package-cracking due to absorbed moisture.

Abstract: A semiconductor device is attached to a supporting substrate by a plurality of solder connections that extend from the supporting substrate to the semiconductor device and the gap between the supporting substrate and the semiconductor device is filled with a reworkable composition comprising:(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and(b) at least one filler present in an amount from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable semiconductor assembly.

Abstract: According to the present invention, a method is provided for attaching a package substrate to a circuit board. In one version of the invention, the package substrate has a semiconductor die disposed thereon, and the semiconductor die has a plurality of bond pads formed thereon which are electrically connected to conductive traces on the package substrate. In one embodiment of the invention, the method comprises the steps of attaching a first surface of an electrical connector to one of the conductive traces by thermoplastic adhesion; and attaching a second surface of the electrical connector to a conducting pad on the circuit board, also by thermoplastic adhesion.

Abstract: An enclosure for protecting a heat sensitive item from high temperatures and shock which includes: (a) an outer housing including an inner cavity for containing at least one heat sensitive item; (b) an aquarium located within the inner cavity including at least one protective compartment within which the at least one heat sensitive item is located; (c) a thermal mass, located within the inner cavity and covering at least a portion of the exterior surface of the aquarium; and (d) a venting mechanism for venting any moisture, that penetrates the aquarium and enters the at least one protective compartment included therein, to the ambient air outside the outer housing. The invention finds particular utility in the Flight Recorder field where heat sensitive components, such as solid state memories, may be subject to fire and shock often resulting from an aircraft crash.

Abstract: A hybrid multi-chip module includes semiconductor chips (27, 31) bonded to a base plate (24). The base plate includes a substrate (11) having two surfaces (12, 13) and a conductive material (16) molded on the two surfaces (12, 13). A coefficient of thermal expansion (CTE) mismatch between the substrate (11) and the conductive material (16) at the first surface (12) is balanced by a similar, but opposite, CTE mismatch between the substrate (11) and the conductive material (16) at the second surface (13). The CTE mismatch balance across the base plate (24) produces a base plate (24) having a substantially planar form at high temperatures.

Abstract: An electric cell comprises first and second parallel flexible substrates, set apart from each other at a determined spacing, carrying electrodes on their opposing faces, the substrates enclosing between them a layer of sensitive material which can change its physical properties, in particular its optical properties, as a result of a voltage applied to the electrodes, or change its electrical properties as a result of stress or radiation passing through one of the substrates, the sensitive material being protected from contact with the atmosphere by a sealing frame which connects, in a sealed manner, peripheral parts of the substrates, said frame having a width parallel to the substrates.

Abstract: A method of producing a high-density wiring board for mounting comprises the steps of providing an electroconductive metallic film on the main surface thereof with a photosensitive resist layer, subjecting the photosensitive resist layer to selective exposure to light and development thereby forming holes for selectively exposing the surface of the electroconductive metallic foil in the photosensitive resist layer, depositing an electroconductive metal by plating on the exposed surface of the electroconductive metallic foil thereby forming electroconductive bumps thereon, peeling off the remainder of the photosensitive resist layer, superposing an insulating polymer sheet on the electroconductive bump forming surface, pressing the resultant superposed layers so that the electroconductive bumps to pierce the polymer sheet in the direction of thickness thereof and allowing the leading end parts of the electroconductive bumps to emerge from the polymer sheet and give rise to connecting terminal parts, and select

Abstract: A semiconductor chip mount structure includes a substrate having a base surface on which base side connectors are formed; a semiconductor chip mounted on the base surface, the semiconductor chip having chip side connectors on a first surface thereof facing the base surface, the chip side connectors being electrically connected to the base side connectors; an insulating resin layer covering the chip side connectors and the base side connectors; a metal layer, made of a metal having a melting point lower than a temperature at which the electrical components of the semiconductor chip may be thermally destroyed, for covering the semiconductor chip and the insulating resin layer; and a wetting characteristic improving layer such as a metal powder or foil layer, formed along a contact surface between the metal layer and the insulation resin layer.

Abstract: The invention is designed to improve a radiation effect of a junction box so as to eliminate a limit in a current to be applied to busbars. A filler 15 of epoxy resin is injected into the interior of coupled lower and upper casings 1 and 3 through injection holes formed in suitable positions of the casings 1 and 3 so as to fill the interior with the filler 15. Since air layers within the coupled casings 1 and 3 can be eliminated by the filler 15, heat generated due to application of a current to busbars 11 can be efficiently radiated via the filler 15 and the casings 1 and 3, thereby improving a radiation effect within the junction box. Therefore, it is not necessary to limit a current applied to the busbars, and a relatively large current can be applied to the busbars.

Abstract: A circuitized substrate having conductive circuitry thereon and a barrier located adjacent at least portions of the circuitry to serve as an effective constraint for liquid material (e.g., encapsulant) applied to cover and protect the circuitry. The barrier can be formed concurrently with circuitry formation and formed of materials (e.g., copper, nickel, gold) similar to those used for the circuitry. The barrier is of two-part construction and of a particular shape wherein one part affords a greater surface tension than the other such that the material may actually lie on one part while being prevented from engagement with the other. Providing such dual (or "progressive") surface tensions successfully constrains the liquid material at least until solidification thereof occurs.

Abstract: A process for potting electrical circuits with asphalt based potting compounds by providing uniform strips of solid potting compound, of controlled shape and melt characteristics, which are placed in a container in a certain sequence with the circuit board. The strips, or the uppermost strip is then reflow melted by the application of Infrared Radiant heat from directly above. The melted strip flows into the can, filing all void spaces, potting the circuit.

Abstract: An electronic package is provided where in a semiconductor device on a substrate is encapsulated with a thermally reworkable encapsulant composition including:(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and(b) at least one filler present from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable electronic package.

Abstract: Disclosed is a plastic material pouring device for forming electronic components consisting of a cover and a leadframe corresponding to the cover in configuration, such that the cover is firmly joined and assembled with the leadframe with the help of a suitable tool to allow quick pouring of plastic material into the assembled cover and leadframe to form a desired electronic component. Such plastic material pouring device requires less material and reduced manufacturing cost while permits the leadframe to be produced in sheet form in a continuous manner and to have pins with desired shapes.

Abstract: The encapsulated transducer (10) includes an injection molded encapsulation (20) having a front end (22) and a back end (24). The encapsulation (20) ensconces a sensing element (40) proximate the front end (22) and a portion of a cable (60) which extends from the back end (24). The sensing element or coil (40) is electrically and mechanically connected to the cable (60) by a pair of suitably sized front and rear ferrules (80), (90) secured to a center and coaxial conductor (66), (70) of the associated cable (60) thereby forming a coil and cable assembly (110). At least the rear ferrule (90) includes a shoulder (100) for firmly anchoring the coil and cable assembly (110) within the encapsulation (20). In addition an injection molding process provides the durable encapsulation (20) which bonds with a dielectric (68) of the cable (60) and symmetrically locks the coil and cable assembly (110) therein.

Abstract: A control unit for an automatic transmission in a motor vehicle includes a housing having an open bottom part with an interior. A carrier is disposed in the housing. Circuit components are disposed on the carrier. Valve coils for electromagnetic hydraulic valves are disposed in the housing and embedded in a flexible compound. A rotational-speed sensor disposed in the interior of the open bottom part is embedded in the flexible compound and thus fixed in its position in the housing. The rotational-speed sensor extends into the vicinity of a gearwheel or of some other rotating component of the transmission and detects or records its rotary motion by induction or the Hall effect.

Abstract: A thermal and shock resistant data recorder assembly as an outer container (1) containing an inner container (2) which in turn houses one or more data recorder elements (3). The elements (3) which have a thin conformal coating thereon are encapsulated in an innermost cavity (4) of the inner container (2) in an Ester wax material which absorbs heat when changing from a solid to a liquid. An outermost cavity (8) surrounds the innermost cavity (4) in the container (2) and in turn contains a first insulating material which gives off water vapor when heated to absorb heat. Surrounding the inner container (2) in the outer container (1) is a second insulating material. The Ester wax material is enabled to leak when liquid into the outer container and from thence, if necessary, to the exterior of the outer container. This permits pressure equalization. The first insulating material is provided with a fusible material plug which melts under heat and allows the vapor to escape to the exterior of the assembly.

Abstract: A resin-sealed semiconductor device includes a plurality of electronic components mounted on a printed wiring board, a circuit mounting surface of the board being resin-sealed, with connection terminals of the electronic components electrically connected to a printed wiring on the board. A surface portion of the board is coated with insulator material which contains tiny hollow spheres and constitutes a thermal expansion resin.

Abstract: A die cast housing having an open side receives a circuit which seats on a housing ledge near the open side. An accelerometer and other components carried by the board are enclosed by the housing and board. The outer side of the circuit board is covered with an adhesive sealant compound which secures and seals the circuit board to the housing without fasteners for efficient structural transmissibility, and also structurally dampens the circuit board. A sheet metal cover over the open side inhibits electromagnetic interference. Lateral ports on the housing are aligned with connectors on the circuit board and permit coupling to the circuit board by mating connectors which seal the ports. The connectors have an interference fit with webs on the housing to permit thrust testing before the adhesive sealant is cured.

Abstract: A method for encapsulating an electronic component includes providing a substrate; providing an enclosure dam around at least a portion of electronic component placed relative to the substrate; providing a first substantially uncured flowable encapsulation material outwardly of the electronic component and within the enclosure dam; providing a second encapsulation material atop the first encapsulation material and within the enclosure dam; and curing the first encapsulation material into a substantially non-flowable state, the second encapsulation material and the enclosure dam retaining the first flowable encapsulation material relative to the electronic component and substrate during the curing, the cured first material and the second material collectively forming a resultant encapsulation body on the electronic component. An encapsulated body having the above attributes is also disclosed.

Abstract: A power semiconductor module includes a plastic housing having a bottom plane in which a substrate is disposed. Disposed inside the module are the substrate, structures on the substrate, a rubber-like soft encapsulation and a hard encapsulation above the soft encapsulation. Internal struts of the housing extend into the soft encapsulation and, if appropriate, have ends with transverse extensions disposed within the soft encapsulation. The effect of this module construction is that a back pressure or reaction opposes forces acting externally on the substrate.

Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production.

Abstract: An electronic control module (10) includes a package substrate (12) having an interior cavity (28) through which a package lead (22) traverses. The interior cavity (28) is filled with an expandable polymer material (34). The expandable polymer material (34) is constrained within the cavity by a pressure resistive layer (32, 35) that overlies expandable polymer material (34) In one embodiment, an epoxy layer (32) forms an upper surface of the interior cavity (28). The expandable polymer material (34) is responsive to a fluid, such that upon contact with a fluid diffusing along the package lead (22), the expandable polymer material (34) will swell and form a fluid-tight pressure seal around the package lead (22). The fluid-tight pressure seal prevents the fluid from diffusing to interior portions of the electronic control module (10) and causing the failure of electronic components (18) mounted within the electronic module (10).

Abstract: This invention relates to metal-containing inserts, such as transformers, that are encapsulated, via compression molding processes, with at least one wet lay thermoplastic sheet material and that do not experience significant visible cracking during heat cycling.

Abstract: Electronic devices protected by an organic polymeric encapsulant and placed in a corrosive environment can have added protection by dispersing in the encapsulant particles of a solid buffer which tend to neutralize the effect of the corrosive agent. This approach is quite effective when strong acids are the corrosive agents, and when solid acid-base buffers are dispersed in the polymeric material. The encapsulant may be elastomeric, and silicone elastomers containing solid acid-base buffers are quite effective in protecting the underlying electronic device from corrosion by strong acids.

Abstract: A device and method wherein electrical components are mechanically suspended and electrically interconnected in an insulative elastomeric body, such as silicone, thereby eliminating the need for a circuit board or other circuit substrate. The device can change shape through compression, distension, flexure, and other external forces while maintaining its electrical performance and mechanical integrity. The device can be compressed and deformed to fit snugly within another device, such as the shell of an electrical connector or a plastic clamshell, simultaneously creating spring forces for reliable electrical contacts and an environmental seal. Accordingly, the device and method can be used for a wide variety of purposes such as electrical filtering for avionics, computer or automotive connectors, or a non-intrusive manner to package electronics for medical implants.

Abstract: An apparatus directed to portable peripheral cards is disclosed which provides protection against electro-static discharge and electro-magnetic interference. Furthermore, this apparatus provides a solid housing which affords a strong protective structure for the PC board and also protects the ICs housed inside the peripheral card from being easily accessed.

Abstract: A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space. The terminal pins are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space.

Abstract: The present invention introduces a method of reducing conductive and convective heat loss from the battery unit in battery-powered devices, such as RFID tag devices. Battery heat loss prevention is accomplished by suspending the battery in a vacuum or within a low thermally conductivity gas, such as air, nitrogen, helium or argon. Further improvement is accomplished by using a minimum number of suspension points made of solid material which possesses a low thermally conductivity. The battery can be suspended by various means, the first of which totally encapsulates the battery using the minimum number of solid material suspension points mentioned above, and the second of which only a portion of the battery (such as the lower portion) is suspended in a low thermally conductive material and the upper portion is encapsulated by the low thermally conductive material fabricated in an arching structure that does not contact the upper portion of the battery.