Abstract: A method of fabricating a semiconductor device comprising the steps of providing an encapsulated semiconductor device bonded to a lead frame, providing a support ring formed of a material which softens when subjected to one of ultrasonic energy or formed of a material which softens when subjected to heat insufficient to cause sufficient expansion of said lead frame relative to said support ring to cause buckling of the leads of said lead frame, preferably thermoplastic and preferably polyphenylene sulfide, disposing leads of said lead frame over said support ring and causing said leads to embed in said support ring by applying ultrasonic energy to said support ring or by applying heat to said support ring insufficient to cause sufficient expansion of said lead frame relative to said support ring to cause buckling of the leads of said lead frame. The lead frame is preferably formed of gold plated copper, solder plate or tin plate.

Abstract: A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a center opening and a metal attachment ring for attaching a heat sink to either the top or bottom thereof with solder. A casing is further formed on the substrate outwardly of the aperture and the heat sink mounted thereacross, the casing being comprised of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted to the heat sink secured therein.

Abstract: A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially horizontal portion (18), and a second substantially horizontal portion (22) connected to the substantially vertical portion (20) with at least one hole (16) disposed in the strip portion (14). A method of providing an electrical contact for connecting a semiconductor device (12) to a surface (24) comprising the steps of extending at least one lead (10) from the semiconductor device (12) and slotting the lead (10).

Abstract: A quad flat pack arrangement which provides for an electrically enhanced integrated-circuit package structure is disclosed. An integrated-circuit die is centrally attached to the top surface of a thermally-conductive, and electrically conductive or insulated substrate. A lead frame having a plurality of inwardly-extending bonding fingers has the bottom sides thereof attached to the top surface of the substrate by a non-conductive adhesive so that an open portion thereof overlies the integrated-circuit die. The plurality of bonding fingers are disposed so as to peripherally surround the integrated-circuit die. A double-sided printed circuit board having first and second conductive layers disposed on its opposite sides is disposed over and bonded to the lead frame. Bonding wires are used to interconnect bonding pads on the integrated-circuit die to the first and second conductive layers. A plastic material is molded around the substrate, die, lead frame, printed circuit board and conductive layers.

Abstract: An epoxy resin composition for sealing a photosemiconductor element includes(A) an epoxy resin component which comprises an epoxy resin having at least three epoxy groups per molecule,(B) a phenolic resin component which is represented by the following general formula (I) and has a phenolic hydroxyl group equivalent weight (g/eq) of 200 to 800, and(C) a cure accelerator component, ##STR1## wherein n is an integer of from 0 to 14, the phenolic resin component being a mixture of at least two phenolic resins represented by the general formula (I) with at least two different values of n, the resin with n=0 being not more than 20% by weight of the phenolic resin component;and a photosemiconductor device is sealed with the epoxy resin composition.

Abstract: The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil layers stacked thereon is employed placing a thermoplastic polyimide sheet between each copper foil. The metal base substrate with a circuit pattern prepared on each copper foil layer is processed by bending or deep drawing into a box-shaped work which has an opening surface. The opening surface is processed so as to have a substantially equal area with that of the bottom of the substrate and have a collar portion on the periphery thereof. On the collar portion, leads to be used for connection with other wiring substrate are formed by patterning on copper foil layers.

Abstract: The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

Abstract: According to the invention, an electronic device mounted on a substrate is encapsulated using a standard two-piece mold. A novel degating region is formed on a surface of the substrate to allow removal of excess encapsulant formed on the surface during molding without damaging the remainder of the device. The material of the degating region that contacts the encapsulant forms a weak bond with the encapsulant, relative to the bond formed between the encapsulant and the substrate, so that the encapsulant can be peeled away from the degating region without damaging the substrate or other portion of the device. The degating region is provided without introducing additional steps into the process for forming the device. The presence of the degating region eliminates the necessity of using a three-piece or modified two-piece mold to achieve top gating in order to degate without damaging the device. In one embodiment, the degating region is made of gold.

Abstract: A control interface device for an electric motor, particularly an electric motor for operating servomechanisms on a vehicle, which includes a conductor frame, an active integrated component mounted on the conductor frame, and a plurality of electric connectors. A single insulating, one-piece enclosing body contains the conductor frame with the active integrated component and the electric connectors included to the conductor frame. Thus, all of the elements required for powering and controlling the motor are gathered inside a single enclosing body which is convenient to handle and connect.

Abstract: A semiconductor device is formed of an insulative case frame having a frame portion; a lead pin block having a base and a plurality of lead pins with inner leads formed in the base, the lead pin block being installed inside the frame portion; a base plate attached to the frame portion for covering a first opening; a circuit board bonded to an inner face of the base plate and having semiconductor chips thereon connected to ends of the inner leads; a gel resin sealant filling an inner space of the insulative case frame over the circuit board and the semiconductor chips; and an insulative cover plate placed on the insulative case frame for closing a second opening of the insulative case frame. A sealing agent is disposed between the lead pin block and the frame portion to seal a gap therebetween, and an air vent is formed in the base of the lead pin block to communicate between the inner space and atmosphere.

Abstract: Semiconductor device package 53 having a lead frame with a mounting pad 31 smaller than the IC chip 10 mounted thereon, and a method of making a semiconductor device package based on wire bonding using a heater insert 38 with a mounting pad insertion concave part 51. Separation between the mounting pad and an encapsulating resin is eliminated, cracks are not created in the resin, or are considerably reduced, and warpage of the package can be prevented. Also, bonding of wires between leads and respective bonding pads 17 on the chip 10can be executed stably and efficiently.

Abstract: A circuit assembly is made by overmolding, with an electrically insulating material, a unitary framework of electrically conductive material forming coplanar conductors which are connected to each other by an integral structural member. The overmolded material secures the conductors relative to each other and enables portions of the structural member to be severed, electrically isolating the conductors from each other. The overmolded material also positions electrical components having leads that are electrically connected to the conductors. Ends of the conductors are formed into terminals which extend out of a hinge formed in the overmolded material. The hinge enables the terminals to be oriented in a different plane than the conductors.

Abstract: A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package, whereas the molding compound includes organic polymer fibers. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the organic polymer fibers includes at least one selected from the group consisting of cotton, cellulose, polyester and nylon.

Abstract: A multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single layer provides a heat conductive yet highly electrically insulative mounting area for a heat sink. The heat sink may be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting advantageously eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.

Abstract: A housing (1) for an electrical device for bodycare, in particular for a tooth cleaning device, is described in which electrical components (8), in particular a charger, surrounded by a casting compound (14) are arranged. The components (8) are connected by an electrical cable (10) which is placed through a cable orifice in the housing (1). The cable orifice (11) is arranged in an external wall (12) of the housing (1) and represents the only orifice in the housing (1) to the electrical components (8). To produce the housing (1), the casting compound (14) is introduced through the cable orifice (11) into the housing (1) by means of a loading device (13).

Abstract: A heat spreader with one or more integrally formed open regions discourages the formation of air bubbles in the encapsulant of a plastic packaged integrated circuit. Little or no air bubbles can be trapped between the heat spreader and the encapsulant surface. Any air bubbles that do form in the encapsulant can escape through the open regions of the heat spreader. The heat spreader of the invention is placed on the surface of a liquid encapsulant and the encapsulant fills the open regions of the heat spreader and covers the sides of the open regions. When the encapsulant hardens, a form fitting bond between the heat spreader and the upper surface of the encapsulant is created. This form fitting bond provides for secure attachment of the heat spreader to the surface of the encapsulant. One embodiment of the heat spreader of the invention includes integrally formed tabs with which a supplementary heat spreader, such as heat tower, is inserted for even greater heat dissipation capability.

Abstract: A method for encapsulating a surface of an integrated circuit to protect the surface. The surface has an outer peripheral area and an inner area to be encapsulated. A frame is provided for handling an integrated circuit package. A plurality of leads are coupled between the frame and the outer peripheral area. An encapsulation material is dispensed on the outer peripheral area covering and protecting a portion of the leads and integrated circuit. A planar encapsulation material is deposited for covering and protecting the inner area. The planar encapsulation material provides a planar surface.

Abstract: An apparatus directed to portable peripheral cards is disclosed which provide protection against electro-static discharge and electro-magnetic interference. Furthermore, this apparatus provides a solid housing which affords a strong protective structure for the PC board and also protects the ICs housed inside the peripheral card from being easily accessed.

Abstract: An organic silicon compound 10 is applied around vibrating electrodes 3a and 3b of a piezoelectric resonant element 1. A compound such as silane, chlorosilane, silazane, silthiane, siloxane, cyclosilane, cyclosilazane, cyclosilthiane, cyclosiloxane, silanol, or metallosilicone is used as the organic silicon compound 10. Around the piezoelectric resonant element 1 and the organic silicon compound 10, for example, an ultraviolet ray curing resin is applied, and the ultraviolet ray curing resin is cured, thereby a permeable film 11 is formed. A cavity 12 is formed around the vibrating electrodes 3a and 3b by dispersing the organic silicon compound 10 to the outside through the film 11. Around the film 11, for example, an outer coating resin is applied, and the outer coating resin is cured, thereby an outer coating material 13 is formed.

Abstract: A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.

Abstract: A method is described for manufacturing a plurality of proximity sensors which are attached to a printed circuit board during the manufacturing steps and subsequently severed from the printed circuit board by shearing. Each of the proximity sensors comprises a core and coil assembly, a plurality of electronic components and an electrical connector. These components of each of the proximity sensors is encapsulated during an overmolding process and the encapsulations are removed from the printed circuit board by a shearing step. Each of the encapsulations can be inserted into a cylindrical housing.

Abstract: In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

Abstract: A lead frame package for housing an integrated circuit. A lead frame (11) having a plurality of leads (13) extending from at least three sides of the package. Lead frame (11) is formed having a first region (18), a transition region (19), and a second region (21). A distance between a heat sink (12) and the lead frame (11) may vary. The offset is chosen to compensate for a predetermined distance between the heat sink (12) and the lead frame (11) such that the lead frame (11) aligns to lead frame handling equipment. A single lead frame manufacturing setup can then be used. A slot (22) is formed in the lead frame (11) extending through the second region (21) and the transition region (19) into first area (18) providing a path for injecting an encapsulation material into a mold.

Abstract: A chip card including a card base with a recess. A circuit support and a microcircuit is arranged on a circuit support surface which faces an interior of the recess and is spaced from the recess bottom. A raised portion is formed on the recess bottom and spaced from a cover section so as to divide the recess into two regions bounded by the recess bottom, the cover section and the raised portion. The first region is completely filled with an encapsulant and the second region is partly filled with the encapsulant.

Abstract: A process and apparatus for producing supported conductive networks which can be flexible or rigid, having densely packed circuits. The process and apparatus for making the conductive network involves forming a conductive material supported on a "dynamic pressure cushion" into a non-planar pattern defining the desired conductive circuits in relation to a fixed reference plane. The "dynamic pressure cushion" is a material having suitable viscosity and flow characteristics to flow out from under the conductive material as it is being formed and fill up any voids. To ensure that the "dynamic pressure cushion" properly flows without deforming the desired circuits, the die used to form the conductive material is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane leaving the desired conductive circuits.

Abstract: A method and mount for a high frequency IC that provides a low inductance path for a high frequency current from the IC to the exterior of a package for the IC and the mount. An electrically and thermally conductive metal base for mounting the IC on an upper surface thereof has a lower surface exposed at the exterior of the package that otherwise encloses the base and the IC. The base also has a plurality of solid or hollow columns for increasing a surface area of the mount, thereby decreasing the inductance to a high frequency current in the path between the IC and the lower surface of the base. Each column is electrically connected to a separate ground terminal on the IC. The columns may have narrow necks connecting them to the base to limit common mode inductance between columns, or may be separated from the base to eliminate common mode inductance.

Abstract: A chip-on chip type semiconductor device is provided in which semiconductor chips provided in a package cannot be displaced during a transfer molding process so as to eliminate a short circuit. At least two lead frames are provided in and extend from the package so that the first semiconductor chip and the second semiconductor chip can be electrically connected to external devices. A die stage is provided between the first semiconductor chip and the second semiconductor chip. A bonding wire is provided for wiring between the first semiconductor chip and the lead frames, and TAB leads connect the second semiconductor chip to the lead frames. The lead frames may extend between the first and second semiconductor devices instead of the die stage. The lead frames may include one having a portion extending in a direction perpendicular to the longitudinal direction of the lead frames between the first and second semiconductor chips.

Abstract: A solid electrolytic chip capacitor in which L-shaped portions of the anode terminal and cathode terminal form slanting surfaces which project beyond the projecting side surfaces of the resin sheathing.

Abstract: A position detector having a movable permanent magnet (5), a circuit board (6) having a magnetic sensor element (1) for detecting the movement of the permanent magnet and a molded resin case (2) supporting the circuit board. The circuit board (6) is surrounded by a box-shaped radiation shield (12) for shielding the circuit board against external electromagnetic radiation. The radiation shield is insert-molded in the mold resin case as its integral part. The radiation shield (12) includes a shield main body (12a) having an open end and a shield cover (12b) closing the open end of the shield main body. The molded resin case (2) has a cavity (2a) open on the same side as the open end of the shield main body (12a) and a case cover (2b) attached to the case opening for closing the cavity.

Abstract: A micromodule includes a slotted metal strip and a perforated dielectric strip having a thickness of less than 70 micrometers, preferably between 30 and 50 micrometers. The metal strip is bonded to the dielectric strip so as to overlie the slots in the metal strip. A chip is bonded to the dielectric strip and connected to the metal strip through the perforations in the dielectric strip. An insulating resin layer encapsulates the chip and is bonded to the dielectric strip. The micromodule may be used, for example, in a smart card, as a radiating antenna, or as an identification label.

Abstract: The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are non-functional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

Abstract: An induction heating module encapsulation apparatus and method for its use is disclosed. The apparatus comprises a substantially airtight chamber which is composed of ceramic or some other high temperature insulating material in which a cap and a ceramic substrate having semiconductor chips joined thereon are placed. A sealband of solder or other brazing material is placed at the periphery of the cap where the cap and substrate are to be joined. An RF coil, which serves as inductor in the apparatus, the energized by a high frequency generator, generating an electromagnetic field in the radio frequency spectrum. The RF coil is oriented to localize the inducted current at the periphery of the cap and the sealband. The inducted current is dissipated in the form of heat until the sealband is molten. The RF power is then turned off.

Abstract: A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor device (16). The device may be transfer molded or encapsulated by glob top technology. The metal coating (19) serves as a barrier to the transmission of electromagnetic or radio frequency energy, thereby shielding the semiconductor device (16). The shielded semiconductor package is manufactured by providing a metallization pattern (12 and 14) on a substrate (10) and mechanically attaching and electrically interconnecting a semiconductor device (16) to the metallization pattern. A resin (18) is transfer molded about the semiconductor device, the electrical interconnections (17), and the metallization pattern so as to form an assembly, and a metal coating (19) is applied via vacuum deposition or plating to interconnect with a portion of the metallization pattern.

Abstract: An electronic device (10) includes a package (16) having two posts (30) suitable for insertion in PCB holes. Package (16) presents a lengthwise molding plane (32) along which the upper portion (42) and bottom portion (44) of package (16) are mated during the molding process. Posts (30) are disposed substantially exclusively in bottom portion (44) so that posts (30) are asymmetric about lengthwise molding plane (32). Thus, even if a top mold (42a) and a bottom mold (44a) are misaligned there will be no effect on the dimensional tolerance of posts (30) and thus the tolerance of post (30) can be closely matched with a PCB hole (20) tolerance to insure a snug fit. Thus, device (10) is mounted edgewise on a PCB (18) by insertion of posts (30) into PCB holes (20) so that tips (24) of lead fingers (4 14) can be connected to PCB (18) by surfacing-mounting techniques or the like.

Abstract: A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the portable peripheral card is a PCMCIA card.

Abstract: A method of manufacturing an electronic part includes a step of preparing a molten resin bathtub used for coating the outer surface of the electronic part. On a surface of the resin in the molten resin bathtub, a layer of a surface-active agent is formed. The electronic part body is dipped via the solvent layer into the molten resin bathtub. After coating the electronic part body with the molten resin, the electronic part body is removed from the molten resin bathtub. The molten resin is cured by heating and the resin layer is formed on the electronic part body.

Abstract: In a device and a method for passivating components, a thixotropic gel is arranged in the shape of a ring around a component. The inside space surrounded by the thixotropic gel is filled with a passivating gel until the component is completely covered with passivating gel. The gels are subsequently hardened.

Abstract: A first aspect of the present invention comprises a card substrate having a front surface and a reverse surface, a magnetic stripe provided on the reverse surface for storing information therein, a module provided on a given region of the front surface with a built-in semiconductor integrated circuit device provided with ready access terminals for connecting to an external device, wherein an end portion of the module is positioned perpendicular to the magnetic stripe. With such an arrangement of the IC card, deformation in thickness of the card substrate is reduced at the portion adjacent to the upper portion of the module, and hence stress to be applied to this portion is relaxed. Furthermore, according to a second aspect of the present invention, the thickness of an end portion is gradually thinned so that deformation in thickness of the card substrate is further reduced at the portion adjacent to the upper portion of the module, and hence the stress to be applied to this portion is further relaxed.

Abstract: A case houses a portable telephone apparatus having a display portion, an operating portion, a speaker portion and a microphone portion provided with respect to two main portions and a hinge portion which connects the main portions so as to be opened and closed. The case is formed of plastic molding. The hinge portion is formed of a soft resin having a resiliency, and the main portion is formed of a hard resin and integral with the hinge portion. A wiring member for provide an electric connection between the main portions extend through the hinge portion.

Abstract: An athletic shoe (or other article of clothing) has a pocket formed therein, and an interchangeable unitary assembly is slidably received within the pocket and is retained therein by means of a flap carried by the shoe. The interchangeable unitary assembly preferably comprises a molded plastic card having a battery, microchip, speaker and on/off switch encapsulated therein and electrically connected together. A push (or "press") button is carried by the shoe and overlays the switch when the card is received in the pocket. The push button may be pushed to close the switch, so as to energize the microchip from the battery and generate an audible signal, such as a tune or message.

Abstract: A method and a structure for reducing the stresses arising in a hybrid circuit from the interface between the encapsulant and the substrate. An additional layer, preferably of the same material as the substrate, is added to the outside surface of the encapsulant. The purpose of the layer is to provide a second opposing surface to balance and thereby reduce the stress originating from the encapsulant/substrate interface. The second layer is applied prior to the curing of the encapsulant material.

Abstract: A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal-space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space. The terminal pins are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space.

Abstract: This invention relates to an article comprising a potted electrical component in a structure, wherein the electrical component is potted in a polyimide composition. The invention also relates to a method of potting electrical components comprising the steps of (1) adding a polyimide precursor to a structure including an electrical component, (2) curing the polyimide precursor to form a polyimide composition encapsulating the electrical component.

Abstract: A radio (100) which includes a plurality of printed circuit boards (101) which are positioned in a planar arrangement so to provide a substantially fiat structure. The printed circuit boards (101) are connected using flexible conductors (105) which mechanically and electrically couple the printed boards (101) and provide a flexible link to allow the printed circuit boards (101) to be manipulated into various configurations. A flexible radio housing (151) is used to encapsulate the printed circuit boards (101) and flexible conductors (105) allowing radio (100) to be impacted and/or easily manipulated without crushing the contents. The radio (100) may be worn and easily concealed on the body without risk of breakage.

Abstract: A ballast case for electronic fluorescent lamp. The ballast case makes good a deficiency of potting compound even when deficient amount of potting compound is charged in the ballast enclosure, thus to facilitate the potting compound charging work and to effectively prevent generation of noise caused by overvoltage of ballast, and to effectively protect the ballast and varieties of parts. The ballast case comprises a rectangular box type ballast enclosure charged with potting compound and having the ballast and the varieties of parts therein, and a rectangular plate type cover covering the ballast enclosure. The cover has an embossed section for making good the deficiency of potting compound. The embossed section is formed by embossing an area of flat surface of the cover so that the embossed section corresponds to sizes and arrangement of the ballast and the varieties of parts.

Abstract: A penetrator and flexible circuit apparatus comprises a penetrator housing having a passageway through which at least one elongated flat flexible circuit having a plurality of parallel electrical traces is placed. A retention material substantially occupies the passageway to retain the flexible circuit in the passageway, to establish a hermetic seal of the flexible circuit within the penetrator and to thereby seal the interior of a computer which is cooled by cooling fluid from its exterior environment.

Abstract: A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.

Abstract: A supported conductive network (SCN), which can be flexible or rigid, can have self-aligning conductors which connect with corresponding conductors of other networks. The conductive network can be fabricated into densely packed contact clusters for use as electrical interconnectors or circuits. The methods and apparatus for making the conductive network involve forming a sheet of conductive material into ridges and troughs one of which defines the conductive network and the other of which is waste material and then mechanically removing the waste material. The conductive network thus formed is supported by a dielectric layer.

Abstract: An electronic device (100) comprises a circuit carrying substrate (300) having an electronic circuit pattern (301) formed thereon, at least one component (302) having leads (304) for electrically coupling the at least one component (302) to the electronic circuit pattern (301) formed on the circuit carrying substrate (300), and a thermoplastic coating (200, 200') for covering the leads (304) of the at least one component (302) to insulate the leads (304) thereof.

Abstract: A semiconductor device of the present invention accommodates a large semiconductor chip in a downsized package without impairing its reliability. The semiconductor chip is bonded on a relatively small die pad. Common inner leads and a plurality of inner leads are disposed opposite and spaced from the semiconductor chip by a gap ranging from 0.1 mm to 0.4 mm and the gap between the semiconductor chip and the common inner leads and the plurality of inner leads is filled with a resin which forms pan of a resin package.