Abstract: Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions.

Abstract: A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers, and external electrodes electrically connected to the internal electrode layers. A difference of about 3 ?m or less exists between a maximum thickness of a center portion of the external electrode and a thickness of a peripheral portion of the external electrode, and in a range of a field of view of about 50 ?m square centered at a point located farther inward by about 15% than a peripheral end portion of the external electrode, an angle ? of about 4 degrees or less is defined by a straight line connecting two points of intersection of a surface of the external electrode and a sectional line defining the range of the field of view of about 50 ?m square and a perpendicular line to a vertical line passing through one of the two points of intersection.

Abstract: Embodiments of the disclosure are related to polyimide substrates and display devices, a plurality of intaglio patterns are formed on at least a portion of one surface of a polyimide substrate, a high transmissive filling is disposed inside the intaglio pattern, thus an overall transmittance of the polyimide substrate is enhanced. Furthermore, the filling having a certain range of a coefficient of thermal expansion is disposed in the intaglio pattern to maintain a heat resistance of the polyimide substrate, an element being required a high temperature process could be disposed on the polyimide substrate having an enhanced transmittance.

Abstract: The present invention is directed towards a method of coating a substrate comprising electrocoating an electrodepositable coating composition onto the substrate, the electrodepositable coating composition comprising a binder comprising a pH-dependent rheology modifier; an electrochemically active material and/or an electrically conductive agent; and an aqueous medium. Also disclosed are electrodepositable coating compositions, coated substrates and electrical storage devices.

Abstract: A method for manufacturing a slipring module comprising a plurality of sliding tracks and an insulating body. The method includes: making a monolithic sliding track component preferably by a 3D printing process. The monolithic sliding track component comprises a plurality of sliding tracks, multiple connector for electrically connecting the sliding tracks, and at least one strut for mechanically interconnecting the sliding tracks and the connector to form a monolithic sliding track component; inserting the monolithic sliding track component into a mold; filling the mold with an insulating material such as a plastic material, and curing the plastic material; removing the molded product forming a slipring module from the mold, and removing the at least one strut from the slipring module.

Abstract: The present invention enables the achievement of: high density mounting by means of an electronic component for welding; and improvement of thermal responsivity and tensile strength at high temperatures by means of reduction in size and thickness of a temperature sensor. An electronic component for welding, which has a function of a resistor, a capacitor, an inductor or the like, comprises: an insulating substrate; a function part and a bonding electrode part, which are provided on the insulating substrate; and a lead which is electrically connected to the bonding electrode part. The bonding electrode part is configured of: an adhesive active metal layer which is formed from a high-melting-point metal on the insulating substrate; a barrier layer which is formed from a high-melting-point metal on the active metal layer; and a bonding metal layer which is mainly composed of a low-melting-point metal and is formed on the barrier layer.

Abstract: A composition system which is a mixture of colloids forming a physical code is implanted into a product and later extracted and read to authenticate the product thus providing secure means to check the authenticity of the product against counterfeiting.

Abstract: A method of manufacturing a gas turbine engine element, for example a shroud segment. An insert has at least one elongated feature received in a mold cavity. A powder injection molding feedstock is injected. When the green part is disengaged from the mold, each elongated feature is slid out of the green part to define a respective elongated passage. The cross-sectional dimension of the elongated feature may be 0.020 inches or less, and/or a ratio between the length and cross-sectional dimension of the elongated feature may be at least 25. The method may include, after debinding and sintering, projecting a coating material while defining an obstruction between source of coating material and the open end of each elongated feature with a shoulder of the element to prevent the coating material from reaching the open end, followed by machining to remove at least a part of the shoulder.

Abstract: A method of forming a solderable solder deposit on a contact pad, comprising the steps of providing an organic, non-conductive substrate which exposes said contact pad under an opening of a first non-conductive resist layer, depositing a conductive layer inside and outside the opening such that an activated surface results, thereby forming an activated opening, electrolytically depositing nickel or nickel alloy into the activated opening such that nickel/nickel alloy is deposited onto the activated surface, electrolytically depositing tin or tin alloy onto the nickel/nickel alloy, with the proviso that the electrolytic deposition of later steps results in an entirely filled activated opening, wherein the entirely filled activated opening is completely filled with said nickel/nickel alloy, or in the entirely filled activated opening the total volume of nickel/nickel alloy is higher than the total volume of tin and tin alloy, based on the total volume of the entirely filled activated opening.

Abstract: A gas turbine engine component made of a nickel-based superalloy, the gas turbine engine component comprising a protective coating. The protective coating includes an inner diffusion barrier layer including any one or any combination of elements selected from the group consisting of platinum, palladium, tantalum, tungsten, hafnium and iridium, and an outer layer of hard material formed of hard particles embedded in a matrix.

Abstract: Radiation curable compositions for coating optical fibers are disclosed herein. In an embodiment, a radiation curable composition includes a reactive oligomer component, wherein a portion of the polymerizable groups of the reactive oligomer component include methacrylate groups; a reactive diluent monomer component, wherein a portion of the polymerizable groups of the reactive diluent monomer component include acrylate groups, acrylamide groups, or N-vinyl amide groups, or combinations thereof; a photoinitiator component, and an optional additive component. Also described are methods of coating the radiation curable compositions elsewhere described, and the fiber optic coatings and cables resulting therefrom.

Abstract: The present disclosure provides an apparatus for fabricating a semiconductor device, including a reaction chamber having a gas inlet for receiving a gas flow, a pedestal in the reaction chamber configured to support a substrate, and a first gas distribution plate (GDP) in the reaction chamber and between the gas inlet and the pedestal, wherein the first GDP is configured to include a plurality of concentric regions arranged along a radial direction, and a plurality of first holes arranged in the concentric regions of the first GDP, an open ratio of the first GDP in an outer concentric region is greater than that in an inner concentric region proximal to the outer concentric region to redistribute the gas flow.

Abstract: A semiconductor device includes: an island that is formed by a metallic layer including a single metallic layer or a plurality of different metallic layers; a semiconductor chip provided upon an upper surface of the island, and having a pair of side portions mutually opposing each other; a plurality of signal terminals disposed at an external periphery of at least the pair of side portions of the semiconductor chip, and formed by the metallic layer; a grounding terminal disposed at an external periphery of the plurality of signal terminals, and formed by the metallic layer; electrically conductive connection members that are connected between each of a plurality of electrodes of the semiconductor chip and each of the plurality of signal terminals; sealing resin that seals the island, the semiconductor chip, the electrically conductive connection members, the plurality of signal terminals, and the grounding terminal, so that a lower surface of the island, lower surfaces of the plurality of signal terminals, an

Abstract: The present embodiment provides a display method and a display device, wherein the display method includes: receiving an image data of a target picture; acquiring a first voltage signal corresponding to the image data; converting the adjacent first voltage signal into a voltage distributed second voltage signal; driving a pixel unit and responding the pixel unit to display the target picture according to the second voltage signal.

Abstract: DNA synthesis devices, systems, and methods are disclosed. An apparatus can include a synthesizer chip having an array of reaction units in a predetermined pattern, each reaction unit including a reaction surface and a reaction electrode of an IC array of reaction electrodes, and a synthesizer chip controller coupled to the IC array of reaction electrodes configured to address each reaction electrode individually. The apparatus can also include a reagent delivery chip positionable above the synthesizer chip, comprising an array of reagent delivery units arranged in the predetermined pattern, each reagent delivery unit including a reagent electrode of an IC array of reagent electrodes and each reagent delivery unit configured to receive and deliver a droplet of reagent fluid having a volume of 1 picoliter or less, and a reagent delivery chip controller coupled to the IC array of reagent electrodes configured to address each reagent electrode individually.

Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by ultrasonic welding is provided with a monolithic connector body with a bore. An annular flare seat is angled radially outward from the bore toward a connector end of the connector, the annular flare seat open to the connector end of the connector. An inner conductor cap is provided for interconnection with an inner conductor of the coaxial cable by ultrasonic welding. The ultrasonic welding of each of the inner and outer conductor interconnections may be performed via inner conductor and outer conductor sonotrodes which are coaxial with one another, without requiring the cable and or connector to be removed from their fixture.

Abstract: Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.

Abstract: The SnAg alloy plating solution of the invention is a SnAg alloy plating solution including a water-soluble tin compound, a water-soluble silver compound, and a particular sulfide compound in an amount in the range of 0.25 mol or more and 10 mol or less with respect to 1 mol of silver in the water-soluble silver compound.

Abstract: A semiconductor device includes: at least one power semiconductor element; a sealing resin disposed so as to seal the power semiconductor element; and a plurality of electrical terminals each electrically connected to the power semiconductor element and each including a protrusion protruding from a surface of the sealing resin. The protrusion includes a first part that is provided on a side of the sealing resin in a protrusion direction of the protrusion and of which a cross-section intersecting the protrusion direction has one of a circular shape and an oval shape.

Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.

Abstract: The invention relates to a microarray structure including a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material wherein the structure includes accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalised areas are part of the continuous 3D surface layer and are isolated by the inert material and are interconnected within the structure by the continuous 3D surface layer.

Abstract: There is disclosed an electrode array architecture employing continuous and discontinuous circumferential electrodes. There is further disclosed a process for the neutralization of acid generated at anode(s) by base generated at cathode(s) circumferentially located to each other so as to confine a region of pH change. The cathodes can be displayed as concentric rings (continuous) or as counter electrodes in a cross pattern (discontinuous). In this way reagents, such as acid, generated in a center electrode are countered (neutralized) by reagents, such as base, generated at the corners or at the outer ring.

Abstract: A method for aerosolising a liquid comprises the steps of: —providing an aperture plate having at least 100 outlet holes per mm2; delivering liquid to the aperture plate; and vibrating the aperture plate to produce an aerosol. The viscosity of the liquid is in the range of from 1 to 15 cP and the surface tension of the liquid is in the range of from 72 to 0.5 mN/m. The output rate of the generated aerosol is greater than 0.01 mL/min.

Abstract: Ionic liquid bath plating methods for depositing aluminum-containing layers utilizing shaped consumable aluminum anodes are provided, as are turbomachine components having three dimensionally-tailored, aluminum-containing coatings produced from such aluminum-containing layers. In one embodiment, the ionic liquid bath plating method includes the step or process of obtaining a consumable aluminum anode including a workpiece-facing anode surface substantially conforming with the geometry of the non-planar workpiece surface. The workpiece-facing anode surface and the non-planar workpiece surface are positioned in an adjacent, non-contacting relationship, while the workpiece and the consumable aluminum anode are submerged in an ionic liquid aluminum plating bath. An electrical potential is then applied across the consumable aluminum anode and the workpiece to deposit an aluminum-containing layer onto the non-planar workpiece surface.

Abstract: Examples herein relate to detecting a coolant leak. For example, a system includes a nanosensor coupled to an airflow channel in a server. The nanosensor provides a resistance measurement to a controller. The system includes the controller coupled to the nanosensor. The controller detects the coolant leak based on the resistance measurement from the nanosensor.

Abstract: The present invention relates to a method for manufacturing an amalgam electrode, an amalgam electrode manufactured by the method, and a method for electrochemical reduction of carbon dioxide using the amalgam electrode.

Abstract: One of embodiments is a semiconductor micro-analysis chip for detecting particles in a sample liquid. The chip comprises a semiconductor substrate, a first flow channel provided on the semiconductor substrate to allow the sample liquid to flow therein, a second flow channel provided at a different position from the first flow channel of the semiconductor substrate to allow the sample liquid or an electrolyte solution to flow therein, a contact portion where a portion of the first flow channel and a portion of the second flow channel abut each other or intersect one another with a partition being arranged between the flow channels, and a fine hole provided on the partition of the contact portion to allow the particles to pass therethrough.

Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.

Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.

Abstract: Disclosed are a touch panel and a method for manufacturing the same. A touch panel can include a substrate, a transparent electrode base on the substrate, a first transparent electrode on the transparent electrode base and extending in a first direction, and a second transparent electrode on the transparent electrode base and extending in a second direction. A method of manufacturing a touch panel can include preparing a substrate and a transparent electrode base, forming a transparent electrode over the transparent electrode base, and forming an electrode material over the transparent electrode base.

Abstract: A yellow light photolithographic process and an electroplating process are performed multiple times to produce copper plated layers on the aluminum nitride (AlN) substrate. The copper plated layers are plated in sequence into a stack structure with each layer having reduced length. The parameters of the yellow light photolithographic process can be adjusted, such that each copper plated layer is formed horizontally for a predetermined length into a stack structure of step layers tapering off upward, while a predetermined angle is formed by the tangent line passing through edges of the respective step layers, and the surface of the AlN substrate. An adhesion layer, a copper seed layer, a first copper plated layer, a second copper plated layer, a third copper plated layer, and a nickel plated layer are formed in sequence on the AlN substrate, to form a metalized circuit of multi-layer stack.

Abstract: In described examples, a method of forming a microelectromechanical device comprises: forming a first metallic layer comprising a conducting layer on a substrate; forming a first dielectric layer on the first metallic layer, wherein the first dielectric layer comprises one or more individual dielectric layers; forming a sacrificial layer on the first dielectric layer; forming a second dielectric layer on the sacrificial layer; forming a second metallic layer on the second dielectric layer; and removing the sacrificial layer to form a spacing between the second dielectric layer and the first dielectric layer. Removing the sacrificial layer enables movement of the second dielectric layer relative to the first dielectric layer in at least one direction.

Abstract: An apparatus includes a substrate and a three-dimensional (3D) wirewound inductor integrated within the substrate. The apparatus further includes a capacitor coupled to the 3D wirewound inductor.

Abstract: The invention relates to formulations containing doped conductive polymers, which due to outstanding hole injection characteristics and high conductivity are very suitable for use in organic electronic devices, preferably in organic electroluminescent devices, in particular in the buffer layers thereof. Thus the invention further relates to the use of the formulations according to the invention in organic electronic devices, preferably in electroluminescent devices, in particular in the buffer layers thereof.

Abstract: The invention provides a thrust bearing, including a pair of half thrust bearings. Each half thrust bearing includes a bearing alloy layer and a resin slide layer, or a back metal layer, a bearing alloy layer and a resin slide layer. The resin slide layer constitutes a slide surface receiving an axial force of a crankshaft. Each half thrust bearing include thrust reliefs formed adjacent to both circumferential end portions of the sliding surface so that a wall thickness is thinner toward the circumferential end surface. A thrust relief length at an inner end portion of the thrust relief positioned on a rear side of one of the half thrust bearings in a rotational direction is larger than a thrust relief length at an inner end portion of the thrust relief positioned on a front side of the other of the half thrust bearing in the rotational direction.

Abstract: The invention provides a bearing device, including a crankshaft, a pair of half bearings each having crush reliefs adjacent to both circumferential ends thereof, a bearing housing having a retaining hole, and one half thrust bearing arranged adjacent to the retaining hole. Each half thrust bearing is configured at least by a bearing alloy layer and a resin slide layer which constitutes a slide surface receiving an axial force of the crankshaft, and thrust reliefs adjacent to both circumferential end portions of the sliding surface so that its wall thickness is made thinner toward the circumferential end surface. A thrust relief length at an inner end portion of the thrust relief positioned on a rear side in the crankshaft rotational direction is formed to be larger than a thrust relief length at an inner end portion of the thrust relief positioned on a front side.

Abstract: Disclosed are systems, methods, and non-transitory computer-readable storage media for fabrication of silicon on insulator (SOI) wafers with a superconductive via for electrical connection to a groundplane. Fabrication of the SOI wafer with a superconductive via can involve depositing a superconducting groundplane onto a substrate with the superconducting groundplane having an oxidizing layer and a non-oxidizing layer. A layer of monocrystalline silicon can be bonded to the superconducting groundplane and a photoresist layer can be applied to the layer of monocrystalline silicon and the SOI wafer can be etched with the oxygen rich etching plasma, resulting in a monocrystalline silicon top layer with a via that exposes the superconducting groundplane. Then, the fabrication can involve depositing a superconducting surface layer to cover the via.

Abstract: An electron exit window foil for use with a high performance electron beam generator operating in a corrosive environment is provided. The electron exit window foil comprises a sandwich structure having a film of Ti, a first layer of a material having a higher thermal conductivity than Ti, and a flexible second layer of a material being able to protect said film from said corrosive environment, wherein the second layer is facing the corrosive environment.

Abstract: A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.

Abstract: A process for manufacturing a cookware article is described comprising the steps of forming, surface hardening, oxidizing and electroforming of very hard silver or silver alloys to coat the interior part of the article. Silver ensures antibacterial and antiviral properties, improved thermal conductivity allowing to cook under the cracking threshold of oils and greases either added to or present in the substances being cooked, inhibits the sticking of food while cooking and facilitates the detachment from the surface of the articles.

Abstract: A method of making an assembly can include forming a first conductive element at a first surface of a substrate of a first component, forming conductive nanoparticles at a surface of the conductive element by exposure to an electroless plating bath, juxtaposing the surface of the first conductive element with a corresponding surface of a second conductive element at a major surface of a substrate of a second component, and elevating a temperature at least at interfaces of the juxtaposed first and second conductive elements to a joining temperature at which the conductive nanoparticles cause metallurgical joints to form between the juxtaposed first and second conductive elements. The conductive nanoparticles can be disposed between the surfaces of the first and second conductive elements. The conductive nanoparticles can have long dimensions smaller than 100 nanometers.

Abstract: A roofing shingle has a shingle body with at least a top layer having a buttlap portion with a butt edge and a headlap portion. An exposure zone extends from the butt edge toward the headlap portion is configured to be exposed to the environment when the roofing shingle is installed on a roof. A shadow formation may be located in the exposure zone of the top layer. The shadow formation and the exposure zone differ from each other in at least one aspect, such as color. The top layer may be substantially rectangular and have no tabs formed along the butt edge. A thickness of the exposure zone and a thickness of the shadow formation may be substantially identical. The shadow formation may be a simulated cut out, slit or slot.

Abstract: A method for coating a component and forming at least one cooling hole in a component is provided. The method includes providing the component having a surface and including a plurality of apertures formed therein. The method includes masking at least one of the plurality of apertures with a plug comprising a removable material. The method includes applying at least one coating to the surface of the component. The method includes eliminating the plug including removable material leaving open apertures in the surface of the coated component. Also provided is a water-soluble aperture plug including water soluble high temperature resistant filler materials including aluminum oxide, zirconium oxide, magnesium oxide, silicon dioxide, zircon, graphite, tungsten carbide, silicon carbide, silicon nitride, boron nitride, aluminum nitrides and binding agents and dispersants including phosphates, silicates, sugar, salt, gum, resin, polyvinyl alcohol (PVA), polyethylene glycol, and combinations thereof.

Abstract: A solid electrolytic capacitor including a positive electrode including a sintered body of metal particles of tantalum or an alloy of tantalum, a dielectric layer formed on a surface of the positive electrode; and an electrolyte layer formed on the dielectric layer. A CV value (a value of product of capacitance and voltage) of the metal particles is 100000 ?F·V/g or more. The positive electrode includes a surface region and an interior region, the surface region is configured by an outer surface of the positive electrode and a vicinity of the outer surface, and the interior region is an inner part of the positive electrode surrounded by the surface region. An average film thickness of the dielectric layer in the surface region is thicker than an average film thickness of the dielectric layer in the interior region.

Abstract: An electron exit window foil for use with a high performance electron beam generator operating in a corrosive environment is provided. The electron exit window foil comprises a sandwich structure having a film of Ti, a first layer of a material having a higher thermal conductivity than Ti, and a flexible second layer of a material being able to protect said film from said corrosive environment, wherein the second layer is facing the corrosive environment.

Abstract: A melamine-based foam block for cleaning has lines of frangibility that separate the melamine-based block into pads that are delineated. A melamine-based foam block for cleaning has lines of frangibility that separate the melamine-based foam block into pads that are different sizes and that are delineated.

Abstract: Provided are an electrode lead of a secondary battery where a protection layer for anti-corrosion is selectively formed at an electrode lead portion at the cell outside and a secondary battery including the same. Since a protection layer for anti-corrosion is selectively formed only on an electrode lead portion at the cell outside, the corrosion of the electrode lead may be prevented from an external environment and the resistance of a cell may be reduced simultaneously.

Abstract: Semiconductor devices and methods of manufacturing semiconductor devices. One example of a method of fabricating a semiconductor device comprises forming a conductive feature extending through a semiconductor substrate such that the conductive feature has a first end and a second end opposite the first end, and wherein the second end projects outwardly from a surface of the substrate. The method can further include forming a dielectric layer over the surface of the substrate and the second end of the conductive feature such that the dielectric layer has an original thickness. The method can also include removing a portion of the dielectric layer to an intermediate depth less than the original thickness such that at least a portion of the second end of the conductive feature is exposed.

Abstract: The present techniques provide electrochemical devices having enhanced electrodes with surfaces that facilitate operation, such as by formation of a porous nickel layer on an operative surface, particularly of the cathode. The porous metal layer increases the surface area of the electrode, which may result in increasing the efficiency of the electrochemical devices. The formation of the porous metal layer is performed in situ, that is, after the assembly of the electrodes into an electrochemical device. The in situ process offers a number of advantages, including the ability to protect the porous metal layer on the electrode surface from damage during assembly of the electrochemical device. The enhanced electrode and the method for its processing may be used in any number of electrochemical devices, and is particularly well suited for electrodes in an electrolyzer useful for splitting water into hydrogen and oxygen.