Specified Product Produced Patents (Class 205/122)
  • Patent number: 10789898
    Abstract: The present embodiment provides a display method and a display device, wherein the display method includes: receiving an image data of a target picture; acquiring a first voltage signal corresponding to the image data; converting the adjacent first voltage signal into a voltage distributed second voltage signal; driving a pixel unit and responding the pixel unit to display the target picture according to the second voltage signal.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 29, 2020
    Assignees: HKC CORPORATION LIMITED, CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Yu-Jen Chen
  • Patent number: 10704088
    Abstract: DNA synthesis devices, systems, and methods are disclosed. An apparatus can include a synthesizer chip having an array of reaction units in a predetermined pattern, each reaction unit including a reaction surface and a reaction electrode of an IC array of reaction electrodes, and a synthesizer chip controller coupled to the IC array of reaction electrodes configured to address each reaction electrode individually. The apparatus can also include a reagent delivery chip positionable above the synthesizer chip, comprising an array of reagent delivery units arranged in the predetermined pattern, each reagent delivery unit including a reagent electrode of an IC array of reagent electrodes and each reagent delivery unit configured to receive and deliver a droplet of reagent fluid having a volume of 1 picoliter or less, and a reagent delivery chip controller coupled to the IC array of reagent electrodes configured to address each reagent electrode individually.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Xing Su, Grace Credo
  • Patent number: 10665967
    Abstract: A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by ultrasonic welding is provided with a monolithic connector body with a bore. An annular flare seat is angled radially outward from the bore toward a connector end of the connector, the annular flare seat open to the connector end of the connector. An inner conductor cap is provided for interconnection with an inner conductor of the coaxial cable by ultrasonic welding. The ultrasonic welding of each of the inner and outer conductor interconnections may be performed via inner conductor and outer conductor sonotrodes which are coaxial with one another, without requiring the cable and or connector to be removed from their fixture.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: May 26, 2020
    Assignee: CommScope Technologies LLC
    Inventor: Kendrick Van Swearingen
  • Patent number: 10641794
    Abstract: Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: May 5, 2020
    Assignee: DAWON NEXVIEW CO., LTD.
    Inventors: G Jung Nam, Kang San Lee, Dae Sub Lee, Min Su Yang
  • Patent number: 10612150
    Abstract: The SnAg alloy plating solution of the invention is a SnAg alloy plating solution including a water-soluble tin compound, a water-soluble silver compound, and a particular sulfide compound in an amount in the range of 0.25 mol or more and 10 mol or less with respect to 1 mol of silver in the water-soluble silver compound.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: April 7, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koji Tatsumi, Tsukasa Yasoshima, Takuma Katase
  • Patent number: 10593609
    Abstract: A semiconductor device includes: at least one power semiconductor element; a sealing resin disposed so as to seal the power semiconductor element; and a plurality of electrical terminals each electrically connected to the power semiconductor element and each including a protrusion protruding from a surface of the sealing resin. The protrusion includes a first part that is provided on a side of the sealing resin in a protrusion direction of the protrusion and of which a cross-section intersecting the protrusion direction has one of a circular shape and an oval shape.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: March 17, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuji Nishibe, Yasuyuki Kageyama, Yasuyoshi Saito, Shinichi Miura, Yasuhide Yagyu
  • Patent number: 10566286
    Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: February 18, 2020
    Assignee: APPLE INC.
    Inventors: Sanjay Dabral, David A. Secker, Huabo Chen, Zhenggang Cheng
  • Patent number: 10556398
    Abstract: The invention relates to a microarray structure including a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material wherein the structure includes accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalised areas are part of the continuous 3D surface layer and are isolated by the inert material and are interconnected within the structure by the continuous 3D surface layer.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: February 11, 2020
    Assignee: Digital Sensing Limited
    Inventors: Andrew Haynes, David James Bates, Ashton Cyril Partridge, Karthik Kannappan
  • Patent number: 10525436
    Abstract: There is disclosed an electrode array architecture employing continuous and discontinuous circumferential electrodes. There is further disclosed a process for the neutralization of acid generated at anode(s) by base generated at cathode(s) circumferentially located to each other so as to confine a region of pH change. The cathodes can be displayed as concentric rings (continuous) or as counter electrodes in a cross pattern (discontinuous). In this way reagents, such as acid, generated in a center electrode are countered (neutralized) by reagents, such as base, generated at the corners or at the outer ring.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: January 7, 2020
    Assignee: CustomArray, Inc.
    Inventors: Karl Maurer, John J Cooper, Jr., H Sho Fujii, Joseph Leonetti
  • Patent number: 10518288
    Abstract: A method for aerosolising a liquid comprises the steps of: —providing an aperture plate having at least 100 outlet holes per mm2; delivering liquid to the aperture plate; and vibrating the aperture plate to produce an aerosol. The viscosity of the liquid is in the range of from 1 to 15 cP and the surface tension of the liquid is in the range of from 72 to 0.5 mN/m. The output rate of the generated aerosol is greater than 0.01 mL/min.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: December 31, 2019
    Assignee: STAMFORD DEVICES LIMITED
    Inventors: Ronan MacLoughlin, Conor Duffy, Brendan Hogan, Patrick Martin Kelly
  • Patent number: 10392948
    Abstract: Ionic liquid bath plating methods for depositing aluminum-containing layers utilizing shaped consumable aluminum anodes are provided, as are turbomachine components having three dimensionally-tailored, aluminum-containing coatings produced from such aluminum-containing layers. In one embodiment, the ionic liquid bath plating method includes the step or process of obtaining a consumable aluminum anode including a workpiece-facing anode surface substantially conforming with the geometry of the non-planar workpiece surface. The workpiece-facing anode surface and the non-planar workpiece surface are positioned in an adjacent, non-contacting relationship, while the workpiece and the consumable aluminum anode are submerged in an ionic liquid aluminum plating bath. An electrical potential is then applied across the consumable aluminum anode and the workpiece to deposit an aluminum-containing layer onto the non-planar workpiece surface.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: August 27, 2019
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Reza Oboodi, James Piascik, Lee Poandl, Harry Lester Kington
  • Patent number: 10337950
    Abstract: Examples herein relate to detecting a coolant leak. For example, a system includes a nanosensor coupled to an airflow channel in a server. The nanosensor provides a resistance measurement to a controller. The system includes the controller coupled to the nanosensor. The controller detects the coolant leak based on the resistance measurement from the nanosensor.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: July 2, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Tahir Cader, Zhiyong Li, John Franz
  • Patent number: 10287694
    Abstract: The present invention relates to a method for manufacturing an amalgam electrode, an amalgam electrode manufactured by the method, and a method for electrochemical reduction of carbon dioxide using the amalgam electrode.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: May 14, 2019
    Assignee: Sogang University Research Foundation
    Inventors: Woonsup Shin, Mijung Park
  • Patent number: 10279348
    Abstract: One of embodiments is a semiconductor micro-analysis chip for detecting particles in a sample liquid. The chip comprises a semiconductor substrate, a first flow channel provided on the semiconductor substrate to allow the sample liquid to flow therein, a second flow channel provided at a different position from the first flow channel of the semiconductor substrate to allow the sample liquid or an electrolyte solution to flow therein, a contact portion where a portion of the first flow channel and a portion of the second flow channel abut each other or intersect one another with a partition being arranged between the flow channels, and a fine hole provided on the partition of the contact portion to allow the particles to pass therethrough.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: May 7, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hiroko Miki, Hideto Furuyama, Kentaro Kobayashi, Akihiro Kojima
  • Patent number: 10253406
    Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: April 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Laksheswar Kalita, Prerna S. Goradia, Geetika Bajaj, Yogita Pareek, Yixing Lin, Dmitry Lubomirsky, Ankur Kadam, Bipin Thakur, Kevin A. Papke, Kaushik Vaidya
  • Patent number: 10217708
    Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: February 26, 2019
    Assignee: Apple Inc.
    Inventors: Sanjay Dabral, David A. Secker, Huabo Chen, Zhenggang Cheng
  • Patent number: 10088948
    Abstract: Disclosed are a touch panel and a method for manufacturing the same. A touch panel can include a substrate, a transparent electrode base on the substrate, a first transparent electrode on the transparent electrode base and extending in a first direction, and a second transparent electrode on the transparent electrode base and extending in a second direction. A method of manufacturing a touch panel can include preparing a substrate and a transparent electrode base, forming a transparent electrode over the transparent electrode base, and forming an electrode material over the transparent electrode base.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: October 2, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Byung Soo Kim, Keun Sik Lee
  • Patent number: 10060036
    Abstract: A yellow light photolithographic process and an electroplating process are performed multiple times to produce copper plated layers on the aluminum nitride (AlN) substrate. The copper plated layers are plated in sequence into a stack structure with each layer having reduced length. The parameters of the yellow light photolithographic process can be adjusted, such that each copper plated layer is formed horizontally for a predetermined length into a stack structure of step layers tapering off upward, while a predetermined angle is formed by the tangent line passing through edges of the respective step layers, and the surface of the AlN substrate. An adhesion layer, a copper seed layer, a first copper plated layer, a second copper plated layer, a third copper plated layer, and a nickel plated layer are formed in sequence on the AlN substrate, to form a metalized circuit of multi-layer stack.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: August 28, 2018
    Assignee: NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chun-Te Wu, Yang-Kuo Kuo
  • Patent number: 10029908
    Abstract: In described examples, a method of forming a microelectromechanical device comprises: forming a first metallic layer comprising a conducting layer on a substrate; forming a first dielectric layer on the first metallic layer, wherein the first dielectric layer comprises one or more individual dielectric layers; forming a sacrificial layer on the first dielectric layer; forming a second dielectric layer on the sacrificial layer; forming a second metallic layer on the second dielectric layer; and removing the sacrificial layer to form a spacing between the second dielectric layer and the first dielectric layer. Removing the sacrificial layer enables movement of the second dielectric layer relative to the first dielectric layer in at least one direction.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: July 24, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Simon Joshua Jacobs, Molly Nelis Sing, Kelly Jay Taylor
  • Patent number: 10026546
    Abstract: An apparatus includes a substrate and a three-dimensional (3D) wirewound inductor integrated within the substrate. The apparatus further includes a capacitor coupled to the 3D wirewound inductor.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: July 17, 2018
    Assignee: QUALCOMM Incorported
    Inventors: Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim, David Francis Berdy
  • Patent number: 9972782
    Abstract: The invention relates to formulations containing doped conductive polymers, which due to outstanding hole injection characteristics and high conductivity are very suitable for use in organic electronic devices, preferably in organic electroluminescent devices, in particular in the buffer layers thereof. Thus the invention further relates to the use of the formulations according to the invention in organic electronic devices, preferably in electroluminescent devices, in particular in the buffer layers thereof.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: May 15, 2018
    Assignee: Merck Patent GmbH
    Inventors: Heinrich Becker, Susanne Heun
  • Patent number: 9909615
    Abstract: The invention provides a thrust bearing, including a pair of half thrust bearings. Each half thrust bearing includes a bearing alloy layer and a resin slide layer, or a back metal layer, a bearing alloy layer and a resin slide layer. The resin slide layer constitutes a slide surface receiving an axial force of a crankshaft. Each half thrust bearing include thrust reliefs formed adjacent to both circumferential end portions of the sliding surface so that a wall thickness is thinner toward the circumferential end surface. A thrust relief length at an inner end portion of the thrust relief positioned on a rear side of one of the half thrust bearings in a rotational direction is larger than a thrust relief length at an inner end portion of the thrust relief positioned on a front side of the other of the half thrust bearing in the rotational direction.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: March 6, 2018
    Assignee: Daido Metal Company Ltd.
    Inventors: Shiho Tanaka, Yoshihiro Ozawa
  • Patent number: 9909614
    Abstract: The invention provides a bearing device, including a crankshaft, a pair of half bearings each having crush reliefs adjacent to both circumferential ends thereof, a bearing housing having a retaining hole, and one half thrust bearing arranged adjacent to the retaining hole. Each half thrust bearing is configured at least by a bearing alloy layer and a resin slide layer which constitutes a slide surface receiving an axial force of the crankshaft, and thrust reliefs adjacent to both circumferential end portions of the sliding surface so that its wall thickness is made thinner toward the circumferential end surface. A thrust relief length at an inner end portion of the thrust relief positioned on a rear side in the crankshaft rotational direction is formed to be larger than a thrust relief length at an inner end portion of the thrust relief positioned on a front side.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: March 6, 2018
    Assignee: Daido Metal Company Ltd.
    Inventors: Shiho Tanaka, Yoshihiro Ozawa
  • Patent number: 9865795
    Abstract: Disclosed are systems, methods, and non-transitory computer-readable storage media for fabrication of silicon on insulator (SOI) wafers with a superconductive via for electrical connection to a groundplane. Fabrication of the SOI wafer with a superconductive via can involve depositing a superconducting groundplane onto a substrate with the superconducting groundplane having an oxidizing layer and a non-oxidizing layer. A layer of monocrystalline silicon can be bonded to the superconducting groundplane and a photoresist layer can be applied to the layer of monocrystalline silicon and the SOI wafer can be etched with the oxygen rich etching plasma, resulting in a monocrystalline silicon top layer with a via that exposes the superconducting groundplane. Then, the fabrication can involve depositing a superconducting surface layer to cover the via.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 9, 2018
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Kevin L. Denis
  • Patent number: 9852874
    Abstract: An electron exit window foil for use with a high performance electron beam generator operating in a corrosive environment is provided. The electron exit window foil comprises a sandwich structure having a film of Ti, a first layer of a material having a higher thermal conductivity than Ti, and a flexible second layer of a material being able to protect said film from said corrosive environment, wherein the second layer is facing the corrosive environment.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: December 26, 2017
    Assignee: TETRA LAVAL HOLDINGS & FINANCE S.A.
    Inventors: Luca Poppi, Anders Kristiansson, Benno Zigerlig, Werner Haag, Kurt Holm, Lars-Åke Näslund
  • Patent number: 9721872
    Abstract: A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: August 1, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert F. Darveaux
  • Patent number: 9693653
    Abstract: A process for manufacturing a cookware article is described comprising the steps of forming, surface hardening, oxidizing and electroforming of very hard silver or silver alloys to coat the interior part of the article. Silver ensures antibacterial and antiviral properties, improved thermal conductivity allowing to cook under the cracking threshold of oils and greases either added to or present in the substances being cooked, inhibits the sticking of food while cooking and facilitates the detachment from the surface of the articles.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: July 4, 2017
    Assignee: SAN LORENZO S.R.L.
    Inventors: Pietro Luigi Cavallotti, Ciro Cacchione
  • Patent number: 9633971
    Abstract: A method of making an assembly can include forming a first conductive element at a first surface of a substrate of a first component, forming conductive nanoparticles at a surface of the conductive element by exposure to an electroless plating bath, juxtaposing the surface of the first conductive element with a corresponding surface of a second conductive element at a major surface of a substrate of a second component, and elevating a temperature at least at interfaces of the juxtaposed first and second conductive elements to a joining temperature at which the conductive nanoparticles cause metallurgical joints to form between the juxtaposed first and second conductive elements. The conductive nanoparticles can be disposed between the surfaces of the first and second conductive elements. The conductive nanoparticles can have long dimensions smaller than 100 nanometers.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: April 25, 2017
    Assignee: Invensas Corporation
    Inventor: Cyprian Emeka Uzoh
  • Patent number: 9540816
    Abstract: A roofing shingle has a shingle body with at least a top layer having a buttlap portion with a butt edge and a headlap portion. An exposure zone extends from the butt edge toward the headlap portion is configured to be exposed to the environment when the roofing shingle is installed on a roof. A shadow formation may be located in the exposure zone of the top layer. The shadow formation and the exposure zone differ from each other in at least one aspect, such as color. The top layer may be substantially rectangular and have no tabs formed along the butt edge. A thickness of the exposure zone and a thickness of the shadow formation may be substantially identical. The shadow formation may be a simulated cut out, slit or slot.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: January 10, 2017
    Assignee: CERTAINTEED CORPORATION
    Inventors: Robert L. Jenkins, Michael D. Shreve
  • Patent number: 9518317
    Abstract: A method for coating a component and forming at least one cooling hole in a component is provided. The method includes providing the component having a surface and including a plurality of apertures formed therein. The method includes masking at least one of the plurality of apertures with a plug comprising a removable material. The method includes applying at least one coating to the surface of the component. The method includes eliminating the plug including removable material leaving open apertures in the surface of the coated component. Also provided is a water-soluble aperture plug including water soluble high temperature resistant filler materials including aluminum oxide, zirconium oxide, magnesium oxide, silicon dioxide, zircon, graphite, tungsten carbide, silicon carbide, silicon nitride, boron nitride, aluminum nitrides and binding agents and dispersants including phosphates, silicates, sugar, salt, gum, resin, polyvinyl alcohol (PVA), polyethylene glycol, and combinations thereof.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: December 13, 2016
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Cem Murat Eminoglu, Canan Uslu Hardwicke, Lawrence Matthew Levy
  • Patent number: 9443659
    Abstract: A solid electrolytic capacitor including a positive electrode including a sintered body of metal particles of tantalum or an alloy of tantalum, a dielectric layer formed on a surface of the positive electrode; and an electrolyte layer formed on the dielectric layer. A CV value (a value of product of capacitance and voltage) of the metal particles is 100000 ?F·V/g or more. The positive electrode includes a surface region and an interior region, the surface region is configured by an outer surface of the positive electrode and a vicinity of the outer surface, and the interior region is an inner part of the positive electrode surrounded by the surface region. An average film thickness of the dielectric layer in the surface region is thicker than an average film thickness of the dielectric layer in the interior region.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: September 13, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasumi Kobayashi, Kazuhiro Takatani, Masaaki Nemoto
  • Patent number: 9384934
    Abstract: An electron exit window foil for use with a high performance electron beam generator operating in a corrosive environment is provided. The electron exit window foil comprises a sandwich structure having a film of Ti, a first layer of a material having a higher thermal conductivity than Ti, and a flexible second layer of a material being able to protect said film from said corrosive environment, wherein the second layer is facing the corrosive environment.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: July 5, 2016
    Assignee: TETRA LAVAL HOLDINGS & FINANCE S.A.
    Inventors: Luca Poppi, Anders Kristiansson, Krister Kristiansson, Benno Zigerlig, Werner Haag, Kurt Holm, Lars-Åke Näslund
  • Patent number: 9179814
    Abstract: A melamine-based foam block for cleaning has lines of frangibility that separate the melamine-based block into pads that are delineated. A melamine-based foam block for cleaning has lines of frangibility that separate the melamine-based foam block into pads that are different sizes and that are delineated.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: November 10, 2015
    Assignee: The Procter & Gamble Company
    Inventors: Michelle Margaret Tekulve, Aaron W. Fromm, Terra Louise Dent, Christopher Lee Henderson
  • Patent number: 9142825
    Abstract: Provided are an electrode lead of a secondary battery where a protection layer for anti-corrosion is selectively formed at an electrode lead portion at the cell outside and a secondary battery including the same. Since a protection layer for anti-corrosion is selectively formed only on an electrode lead portion at the cell outside, the corrosion of the electrode lead may be prevented from an external environment and the resistance of a cell may be reduced simultaneously.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: September 22, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Seung Su Cho, Seung Don Choi, Ho Jin Jeon, Dae Sik Choi, Dae Hong Kwon, You Rim Yoon
  • Patent number: 9054165
    Abstract: Semiconductor devices and methods of manufacturing semiconductor devices. One example of a method of fabricating a semiconductor device comprises forming a conductive feature extending through a semiconductor substrate such that the conductive feature has a first end and a second end opposite the first end, and wherein the second end projects outwardly from a surface of the substrate. The method can further include forming a dielectric layer over the surface of the substrate and the second end of the conductive feature such that the dielectric layer has an original thickness. The method can also include removing a portion of the dielectric layer to an intermediate depth less than the original thickness such that at least a portion of the second end of the conductive feature is exposed.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: June 9, 2015
    Assignee: Micron Technology, Inc.
    Inventor: David S. Pratt
  • Patent number: 9045839
    Abstract: The present techniques provide electrochemical devices having enhanced electrodes with surfaces that facilitate operation, such as by formation of a porous nickel layer on an operative surface, particularly of the cathode. The porous metal layer increases the surface area of the electrode, which may result in increasing the efficiency of the electrochemical devices. The formation of the porous metal layer is performed in situ, that is, after the assembly of the electrodes into an electrochemical device. The in situ process offers a number of advantages, including the ability to protect the porous metal layer on the electrode surface from damage during assembly of the electrochemical device. The enhanced electrode and the method for its processing may be used in any number of electrochemical devices, and is particularly well suited for electrodes in an electrolyzer useful for splitting water into hydrogen and oxygen.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: June 2, 2015
    Assignee: General Electric Company
    Inventors: Guillermo Daniel Zappi, Kenneth Paul Zarnoch, Christian Andrew Huntley, Dana Ray Swalla
  • Publication number: 20150147136
    Abstract: A fixing element for components of an assembly, comprising a rod which is formed by a cylindrical shaft and an end, the rod being a metal component which is at least partially surface-treated by means of anode oxidation and coated over at least a portion of the cylindrical shaft with a lubricating coating. Such a fixing element enables the electrical continuity to be ensured with the components during mounting with moderate interference in the assembly.
    Type: Application
    Filed: November 19, 2014
    Publication date: May 28, 2015
    Inventors: Jean-Philippe MAUREL, Frederic LABAL, Jean-Luc MARTRES
  • Publication number: 20150145627
    Abstract: Disclosed herein is a coil component capable of being protected from static electricity without loss of a main magnetic flux loop. The coil component includes: a magnetic substrate; a coil layer disposed on the magnetic substrate and having conductor patterns installed therein; and an electrostatic discharge (ESD) protecting layer disposed on the coil layer and discharging static electricity introduced into the conductor patterns.
    Type: Application
    Filed: September 22, 2014
    Publication date: May 28, 2015
    Inventors: Won Chul SIM, Ju Hwan YANG
  • Publication number: 20150140357
    Abstract: A contact layer for an electrical contact is disclosed having bismuth and being tin-free.
    Type: Application
    Filed: January 30, 2015
    Publication date: May 21, 2015
    Applicant: TYCO ELECTRONICS AMP GMBH
    Inventors: Helge Schmidt, Stefan Thoss
  • Publication number: 20150114429
    Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include at least one quaternary base, at least one amine, at least one corrosion inhibitor, and at least one solvent. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device while being compatible with barrier layers.
    Type: Application
    Filed: May 17, 2013
    Publication date: April 30, 2015
    Applicants: ATMI Taiwan Co., Ltd., Advanced Technology Materials, Inc.
    Inventors: Shrane Ning Jenq, Karl E. Boggs, Jun Liu, Nicole Thomas
  • Publication number: 20150116908
    Abstract: A method of fabricating electrodes having protruding nanofeatures includes growing metal oxide nanofeatures on a metal or metal alloy wire using a heat treatment in an oxidizing environment. An electrically conducting material is deposited on the nanofeatures to form coated nanofeatures. An electrochemically active material (active material) is deposited to form a coating onto the coated nanofeatures to form at least one nanofeatured electrode. An energy storage coaxial cable (ESCC) can be formed from a first nanofeatured electrode and a second nanofeatured electrode, wherein the first nanofeatured electrode is configured as a linear electrode and the second nanofeatured electrode is configured as a tubular electrode, and the ESCC includes an ion porous separator and an electrolyte between the first nanofeatured electrode as an inner electrode and the second nanofeatured electrode as an outer electrode.
    Type: Application
    Filed: October 23, 2014
    Publication date: April 30, 2015
    Inventors: JAYAN THOMAS, ZENAN YU
  • Publication number: 20150109704
    Abstract: A suspension substrate of the present invention includes an insulating layer, a spring material layer, and a plurality of wirings, wherein one wiring of the plurality of wirings includes a head-side wiring part and a plurality of division wiring parts, respectively bifurcated from the head-side wiring part. The spring material layer includes a spring-material-layer main body, a first spring-material-layer separated body and a second spring-material-layer separated body. The division wiring parts of the one wiring are respectively connected with the first spring-material-layer separated body, via a pair of conductive connection parts, respectively extending through the insulating layer. The first spring-material-layer separated body is located on one side relative to the longitudinal axis, while the second spring-material-layer separated body is located on the other side relative to the longitudinal axis.
    Type: Application
    Filed: August 18, 2014
    Publication date: April 23, 2015
    Inventor: Yoichi MIURA
  • Publication number: 20150108002
    Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.
    Type: Application
    Filed: December 16, 2014
    Publication date: April 23, 2015
    Inventors: Kieun Kim, Adam L. Cohen, Willa M. Larsen, Richard Chen, Ananda H. Kumar, Ezekiel J.J. Kruglick, Vacit Arat, Gang Zhang, Michael S. Lockard, Christopher A. Bang, Jeffrey A. Thompson
  • Publication number: 20150101596
    Abstract: A photo-resist (21) is applied in a pattern of vertical columns having the dimensions of holes or pores of the aperture plate to be produced. This mask pattern provides the apertures which define the aerosol particle size, having up to 2500 holes per square mm. There is electro-deposition of metal (22) into the spaces around the columns (21). There is further application of a second photo-resist mask (25) of much larger (wider and taller) columns, encompassing the area of a number of first columns (21). The hole diameter in the second plating layer is chosen according to a desired flow rate.
    Type: Application
    Filed: May 24, 2013
    Publication date: April 16, 2015
    Applicant: Stamford Devices Limited
    Inventor: Brendan Hogan
  • Publication number: 20150102007
    Abstract: Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal. In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.
    Type: Application
    Filed: December 18, 2014
    Publication date: April 16, 2015
    Inventor: W. Dennis Slafer
  • Publication number: 20150083601
    Abstract: Methods of forming near field transducers (NFTs) including electrodepositing a plasmonic material.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 26, 2015
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: Lien Lee, Jie Gong, Venkatram Venkatasamy, Yongjun Zhao, Lijuan Zou, Dongsung Hong, Ibro Tabakovic, Mark Ostrowski
  • Publication number: 20150085974
    Abstract: An X-ray mask structure includes a unibody support substrate having at least one thinned portion surrounded by a wall portion, a top layer disposed on the at least one thinned portion of the support substrate, and a plurality of X-ray absorber patterns disposed on the top layer over the at least one thinned portion. The top layer and the at least one thinned portion form a laminated membrane, wherein the at least one thinned portion and the wall portion provide mechanical support for the top layer, and the laminated membrane provides mechanical support for the plurality of X-ray absorber patterns.
    Type: Application
    Filed: November 15, 2013
    Publication date: March 26, 2015
    Applicant: NATIONAL SYNCHROTRON RADIATION RESEARCH CENTER
    Inventor: Bor Yuan SHEW
  • Patent number: 8980076
    Abstract: A method of fabricating a magnetic recording disk including providing a magnetic recording layer having a pattern of raised areas and recessed areas formed thereon and providing a mask layer on the raised areas of the magnetic recording layer. The method further including electrodepositing a first protection layer on the magnetic recording layer, removing the mask layer, and depositing a second protection layer above the first protection layer.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: March 17, 2015
    Assignee: WD Media, LLC
    Inventors: Andrew Homola, Chunbin Zhang, Paul C. Dorsey, David Treves
  • Publication number: 20150053851
    Abstract: An optical encoder light shielding plate has a plurality of bridge parts provided in parallel, each of the plurality of bridge parts having a metallic layer, and a slit formed between the plurality of bridge parts. The slit is configured to have light incident therefrom. In the metallic layer, a master-side surface on an exposed surface side of a conductive master body is arranged on a light incident direction side. The metallic layer is obtained such that a plurality of cavities are provided in parallel on the exposed surface of the conductive master body. A voltage is applied while the conductive master body is dipped in an electrolytic solution. The metallic layer is electrodeposited on the exposed surface of the conductive master body in the cavities.
    Type: Application
    Filed: July 31, 2014
    Publication date: February 26, 2015
    Inventors: Rikuo Kawamura, Hideaki Ozaki, Hirotada Teranishi, Takahiro Sakai
  • Publication number: 20150053565
    Abstract: The embodiments herein relate to methods and apparatus for filling features with copper by a bottom-up fill mechanism without the use of organic plating additives. In some cases, filling occurs directly on a semi-noble metal layer, without the deposition of a copper seed layer. In other cases, the filling occurs on a copper seed layer. Factors such as the polarization of electrolyte, the use of a complexing agent, electrolyte pH, electrolyte temperature, and the waveform used to deposit material may contribute to promoting the bottom-up fill.
    Type: Application
    Filed: August 26, 2013
    Publication date: February 26, 2015
    Applicant: Lam Research Corporation
    Inventors: Huanfeng Zhu, Jonathan D. Reid