Abstract: A method of manufacturing an orthodontic appliance includes plating a first pattern of a material on a substrate to define a layer. Repeating plating of the first material one or more times forms an additional pattern. A layered structure is built up and forms a portion of the orthodontic appliance. A pattern of a second material different from a first material may be plated on the substrate or on a pattern of the first material. The material may be a sacrificial material that may be later removed. The orthodontic appliance may be an archwire or a self-ligating orthodontic bracket having one or more layered structures formed by plating patterns of the material. Plating may include plating patterns of materials so as to form a movable member in place relative to a bracket body.

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Abstract: A plasma device is disclosed. The plasma device includes: at least one electrode including a nanoporous dielectric layer disposed on at least a portion thereof, the nanoporous dielectric layer including a plurality of pores, wherein at least a portion of the plurality of pores include a catalyst embedded therein.

Abstract: A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.

Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:

Abstract: Composite structural components are disclosed that include electrically conducting fibers providing multiple signal or paths to electrical components disposed on or adjacent the material. The signal paths may therefore be embedded in the structural component as an intrinsic reinforcing element. Also disclosed are materials for making up the structure and fabrics and methods for the production thereof.

Abstract: The formation of substrate electrical connections on thin film heads is one source of resulting surface topography. In accordance with one implementation, such topography can be reduced by a process that includes depositing a first layer of basecoat, creating electrical recessed vias in one or more plating processes, and depositing a second layer of basecoat on top of the electrical vias and on top of the first layer of basecoat. In one implementation, the first and second layers of basecoat have a combined height that is substantially equal to the height of the electrical recessed vias. In one implementation, the resulting topographical features are small enough that they can be planarized without creating a lack of uniformity in the total basecoat thickness across the wafer.

Abstract: There is provided a nanohair structure with the nanowires exposed on a nanotemplate; the method thereof; and a three-dimensional nanostructure-based sensor with ultra-sensitivity and greatly increased three-dimensional surface-to-volume ratio which immobilizes bio-nanoparticles to the nanohair structure and arranges antibodies to the nano surface with the controlled orientation by physical interaction.

Abstract: There is provided a method of manufacturing a wiring substrate. The method includes: (a) forming a first resist layer having first openings therein on a first surface of a support plate, forming first plated films in the first openings by an electrolytic plating method, and removing the first resist layer; (b) forming a second resist layer having second openings therein on the first surface of the support plate, forming second plated films in the second openings by an electrolytic plating method, and removing the second resist layer; (c) forming a wiring layer and an insulating layer such that the wiring layer is electrically connected to the first and second plated films; and (d) removing the support plate to expose the first and second plated films.

Abstract: An eye-mountable device includes an electrochemical sensor embedded in a polymeric material configured for mounting to a surface of an eye. The electrochemical sensor includes a working electrode and a reference electrode that reacts with an analyte to generate a sensor measurement related to a concentration of the analyte in a fluid to which the eye-mountable device is exposed. An example assembly process includes: forming a sacrificial layer on a working substrate; forming a first layer of a bio-compatible material on the sacrificial layer; providing an electronics module on the first layer of the bio-compatible material, forming a second layer of the bio-compatible material to cover the electronics module; and annealing the first and second layers of the bio-compatible material together to form an encapsulated structure having the electronics module fully encapsulated by the bio-compatible material.

Abstract: A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.

Abstract: The present disclosure provides methods and apparatus of fabricating a transducer for use in ultrasound imaging. A substrate is provided. The substrate may be a silicon substrate having a first side and a second side opposite the first side. A transducer membrane is formed over the first side of the substrate. The transducer membrane includes a piezoelectric component. A well is formed in the substrate from the second side. A backing material is dispensed onto a first sidewall of the well in a manner so as to create a capillary effect that causes the backing material to wick down the sidewall, across the back side of the substrate exposed by the well, and up a second sidewall of the well. The transducer membrane is deflected so that the transducer membrane has a concave shape.

Abstract: A slider for magnetic data recording in a thermally assisted recording system. The slider has a slider body and a magnetic recording head formed on a trailing edge of the slider body. A first terminal is formed on a trailing edge surface of the recording head, and a second terminal is formed on a backside surface both the magnetic recording head and the slider body so as to extend across both the magnetic recording head and the slider body. An electrically conductive lead formed within the magnetic recording head connects the first lead with the second lead.

Abstract: A method for manufacturing a sheet heating element includes preparing a sheet member containing a metal or alloy, and performing anodic oxidizing treatment on the sheet member until only a surface layer of the sheet member is oxidized while a center portion thereof is not oxidized.

Abstract: An implant (5, 13) and/or a unit (9), e.g. spacer sleeve, belonging to said implant is/are intended to extend through a hole (4?) formed in a jaw bone (2) and through soft tissue (3) belonging to the jaw bone and to comprise one or more outer layers of principally titanium dioxide. Each layer consists of crystalline titanium dioxide which largely or completely assumes the anatase phase. The invention also relates to a method for production of such a dental implant (5, 13) and/or of a unit (9) belonging to it, which has one or more outer layers of titanium dioxide. The method is an anodic oxidation method in which the part or parts bearing the outer layer(s) is/are applied to electrolyte under voltage, e.g. comprising sulfuric acid and phosphoric acid, and the voltage (U) and the dwell time of the part or parts in the electrolyte are chosen such that titanium dioxide, largely or completely assuming the crystalline anatase phase, is formed.

Abstract: An electrolytic copper plating solution for filling for forming microwiring for ULSI, is characterized in that it has a pH of from 1.8 to 3.0. The electrolytic copper plating solution preferably contains a saturated carboxylic acid having from 1 to 4 carbon atoms at a concentration from 0.01 to 2.0 mol/L.

Abstract: Embodiments of the invention provide analyte sensors having optimized electrodes and/or configurations of electrode elements as well as methods for making and using such sensors. Typical embodiments of the invention include glucose sensors used in the management of diabetes.

Abstract: Provided is a metal card including a metal card sheet made of duralumin and an anodized layer formed by anodizing a surface of the metal card sheet, wherein a background color or pattern of the metal card is determined according to a composition of electrolyte of the anodizing for forming the anodized layer.

Abstract: Embodiments of golf club heads and methods to manufacture such a golf club heads are generally described herein. In some embodiments, the golf club head may include a ball-striking face and a protective aluminum oxide layer coupled to the ball-striking face of the golf club head. The protective aluminum oxide layer is associated with a hardness that is greater than that of the ball-striking face. In further embodiments, golf club heads may include a top portion and at least one of a plurality of interchangeable alignment indicia coupled thereto, which are configured to guide the golf club head relative to a golf ball.

Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.

Abstract: An insulated electric conductor having a copper core, a layer of aluminum formed on the copper core, and a second layer of aluminum in the form of a high-purity aluminum is disclosed. The copper core may be a solid core or may be formed from a plurality of copper strands. The layer of aluminum formed over the copper core is at least partially anodized to form an aluminum oxide dielectric layer. The layer of high-purity aluminum may be formed by evaporation deposition, sputter deposition, or co-extrusion. Once the layer of high-purity aluminum is formed, it is anodized. More than two layers of aluminum may be formed over the copper core.

Abstract: A composite material golf club head is provided having a body made from a first metal and a face insert press fitted to a portion of the body and made from a second metal The metals are chosen so that the first metal is heavier than the second metal. The second metal is disposed towards the front and top of the body, and is preferably hard-anodized. In addition, an interlocking structure, for example rectangular or dove tail shaped channels, is provided in the body so that the face insert becomes embedded in the interlocking structure to anchor the face insert to the body. Portions of the golf club head, such as the face insert or sole plate, are anodized to protect against corrosion. The anodized coating is colored to improve aesthetic characteristics or infused with a polymer to increase or reduce friction. Disclosed herein is a golf club head having a body portion and a face insert. The front of the body portion further comprises a cutout sized and dimensioned to receive the face insert.

Abstract: A thermal interface material (1) comprises a bulk polymer (2) within which is embedded sub-micron (c. 200 to 220 nm) composite material wires (3) having Ag and carbon nanotubes (“CNTs”) 4. The CNTs are embedded in the axial direction and have diameters in the range of 9.5 to 10 nm and have a length of about 0.7 ?m. In general the pore diameter can be in the range of 40 to 1200 nm. The material (1) has particularly good thermal conductivity because the wires (3) give excellent directionality to the nanotubes (4)—providing very low resistance heat transfer paths. The TIM is best suited for use between semiconductor devices (e.g. power semiconductor chip) and any type of thermal management systems for efficient removal of heat from the device.

Abstract: Disclosed herein are a touch panel and a method for manufacturing the same, the touch panel including: a transparent substrate; a photosensitive ink layer patterned on the transparent substrate and having electric conductivity; and electrode patterns formed at corresponding positions on the patterned photosensitive ink layer, and the method including: preparing a transparent substrate; coating a photosensitive ink having electric conductivity on the transparent substrate to form a photosensitive ink layer; patterning the photosensitive ink layer; and forming electrode patterns on the patterned photosensitive ink layer.

Abstract: To provide a space image forming element realizing higher reflectance and larger area by making aperture ratio and transmittance higher and a method of manufacturing the same, thereby realizing high reflectance and, as a result, formation of an image having high brightness in the air. In a space image forming element of the present invention, a light transmission region is configured by a transparent pattern formed by exposure process using a transparent resist. By forming a metal layer between adjacent transparent patterns, a mirror-face region is formed in the interface between a side wall of the transparent pattern and the metal layer. The metal layer has a two-layer structure. The second metal layer is formed by electroplating using the metal in the first layer as an electrode.

Abstract: A method of manufacturing a boundary acoustic wave device includes the steps of forming an electrode on a first medium layer, forming a second medium layer so as to cover the electrode on the first medium layer, and forming a sound absorbing layer on an external surface of the second medium layer. The sound absorbing layer has an acoustic velocity of transverse waves that is lower than an acoustic velocity of transverse waves of the second medium layer.

Abstract: A wide range tunable capacitor bank is provided. The capacitor bank comprises a variable capacitor, the capacitance value of which is adjustable within a predetermined capacitance range defined by a minimum capacitance value and a maximum capacitance value. The capacitor bank further comprises one or more switched capacitors each electrically connected in circuit to the variable capacitor. The variable capacitor is configured to allow the capacitance value thereof to be adjusted within the predetermined capacitance range and the one or more switched capacitors are configured to be selectively actuated to permit continuous tuning of the capacitor bank over a second capacitance range that is greater than the predetermined capacitance range. Applications in which the capacitor bank may be implemented, and a method of fabricating an integrated system comprising a plurality of passive components, such as, for example, those of the capacitor bank and high quality factor inductors, are also provided.

Abstract: Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers.

Abstract: A method of forming a colored appearance suitable for forming a colored appearance for a conductive casing of a connector is provided. The conductive casing has a body and at least one lead. The lead extends from the body. The method of forming a colored appearance includes the following steps. A surface of the conductive casing is roughened. A conductive metal layer is formed on the roughened surface of the conductive casing. A shielding layer is formed on a part of the conductive metal layer located on the lead. A colorful conductive layer is formed on the conductive casing. The shielding layer and a part of the colorful conductive layer located on the shielding layer are removed to expose the part of the conductive metal layer on the lead. Therefore, the conductive casing has a colored appearance.

Abstract: A method for manufacturing a magnetic write pole of a magnetic write head for perpendicular magnetic recording. A magnetic write pole material is deposited, followed by union milling hard mask, a polymer mask under-layer followed by a dielectric hard mask material, followed by a photoresist. The photoresist is patterned to define a write pole shape and the shape of the patterned photoresist is transferred onto the underlying dielectric hard mask by a novel reactive ion etching that is performed in a chemistry that includes one or more fluorine containing gases and He. The presence of He in the reactive ion etching tool helps to improve the profile of the patterned dielectric hard mask. In addition, RIE parameters such a gas ratio (e.g. CF4 to CHF3 gas ratio) and power ratio (e.g. source power to bias power) are adjusted to optimize the profile of the patterned dielectric mask.

Abstract: A ratchet includes multiple ratchet teeth defined in the outer periphery thereof and a coated layer is coated along the outer periphery of the ratchet. A laser device is used to generate a laser beam to remove a part of the coated layer to defined openings in the coated layer and the ratchet teeth protrude from the openings.

Abstract: In a method for manufacturing a connecting contact for an electrode of an electrochemical store, the electrode having a first material, a contact element made of a second material is provided, the contact element having a section coated using the first material, and the coated section is electrically and mechanically connected to the electrode to manufacture the connecting contact.

Abstract: The invention refers to a deposition apparatus comprising a crucible (1) and heating means (2) arranged for heating evaporation material (3) inside the crucible (1), whereby the crucible (1) comprises a metallic body (11) and a protection layer (13) comprising titanium oxide (TixOy), which is covering at least a part of the inside surface (12) of the metallic body (11). Furthermore, the invention refers to a method for producing a crucible for such a deposition apparatus.

Abstract: This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace over the first conductive trace with an interlayer dielectric between a portion of the first conductive trace and the second conductive trace. One or more vias are provided within the interlayer dielectric to provide electrical connection between the first conductive trace and the second conductive trace. A width of the vias is greater than a width of at least one of the conductive traces.

Abstract: The present invention provides a pH sensing apparatus that includes a flexible polymer substrate, one or more amorphous iridium oxide film sensor electrodes disposed on the flexible polymer substrate, and a reference electrode corresponding to each amorphous iridium oxide film sensor electrode. Each reference electrode is disposed on the flexible polymer substrate in close proximity to the corresponding amorphous iridium oxide film sensor electrode. The amorphous iridium oxide film sensor electrodes provide a potential in reference to the reference electrodes that varies according to a pH of a substance contacting the amorphous iridium oxide film sensor electrodes and the reference electrodes.

Abstract: As a substrate for an LED module and a method for manufacturing the same, they teach a substrate for an LED module and a method for manufacturing the same which including a base substrate, an insulating layer formed on a remaining region except a chip mounting region A in the base substrate, an electrode layer formed on the insulating layer, an oxide layer formed on the chip mounting region A of the base substrate and a high reflection layer formed on a top surface of the oxide layer.

Abstract: An electronic device includes a substrate, an electrode formed on the substrate, and a movable portion provided above the electrode, the movable portion being elastically deformable, in which the movable potion includes a shape memory alloy film.

Abstract: Various embodiments of surface-modified devices, components, and associated methods of manufacturing are described herein. In one embodiment, an implantable device suitable for being implanted in a patient includes an implantable material having a utile shape and a surface and a modification material deposited on at least a portion of the surface of the implantable material. The modification material has a release rate in an implantation environment in the patient. The modification material at the release rate is effective as bactericidal without being cytotoxic to the patient.

Abstract: A method of manufacturing an inductor for a microelectronic device comprises providing a substrate (610), forming a first plurality of inductor windings (111, 211, 411, 620, 2030) over the substrate, forming a magnetic inductor core (112, 212, 412, 810) over the first plurality of inductor windings, and forming a second plurality of inductor windings (113, 213, 413, 1010) over the magnetic inductor core. In another embodiment, the method comprises forming the inductor on a sacrificial substrate (1610) such that the inductor can subsequently be mounted onto a carrier tape (1810). In yet another embodiment, a method of manufacturing a substrate for a microelectronic device comprises forming an inductor within a build-up layer (101, 102, 103, 104) of a substrate.

Abstract: A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Abstract: In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

Abstract: Methods for electrochemically synthesizing polymers are provided in which a cleavable linker is coupled to the surface of at least one electrode of an array of electrodes on a substrate and a polymer coupled to the cleavable linker is synthesized through a series of monomer addition cycles. Polymers that are synthesized include nucleic acids and peptides. Cleavable linkers include linkers that can be cleaved under conditions such as reducing, oxidizing, acidic, and or basic conditions. Additionally, provided are devices that comprise an array of individually addressable electrodes having surface-attached cleavable linker molecules.

Abstract: An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.

Abstract: A threaded tubular component for drilling or working hydrocarbon wells, including at one of its ends a threaded zone produced on its outer or inner peripheral surface depending on whether the threaded end is male or female in type, in which at least a portion of the end is coated with at least one lubricating dry film including at least 65% by weight of a polyaryletherketone, and a process for depositing the film.

Abstract: A flexure 11 has a substrate 13 made of a thin conductive metal plate, a base insulating layer 31 made of flexible resin formed on the substrate, wiring patterns 15 formed on the base insulating layer and connected to a slider mount 17, and a cover insulating layer 33 formed over the wiring patterns. The flexure 11 is substantially coated with a conductive polymer layer 39 having a thickness in the range of 18 to 130 nm. The flexure 11 prevents electrostatic accumulation and ion migration that are trade-offs.

Abstract: A method of forming interconnects for three dimensional integrated circuits comprises attaching a metal layer on a first carrier, attaching a first side of a packaging component on the metal layer, wherein the packaging component comprises a plurality of through vias. The method further comprises filling the plurality of through vias with a metal material using an electrochemical plating process, wherein the metal layer functions as an electrode for the electrochemical plating process, attaching a second carrier on a second side of the packaging component, detaching the first carrier from the packaging component, forming a photoresist layer on the metal layer, patterning the photoresist layer and detaching exposed portions of the metal layer.

Abstract: An electrode to be used for an electrostatic lens, wherein the electrode at least includes: a first substrate having a first through-hole and a second substrate having a second through-hole; the first substrate having a thickness smaller than the second substrate; the first through-hole having a diameter smaller than the second through-hole; the second substrate having a specific resistance smaller than the first substrate, wherein the first substrate and the second substrate are superimposed so that the first through-hole and the second through-hole are aligned relative to each other. Notching taking place near any of the through-holes in a dry etching process can be reduced, and thus, the through-holes can be formed accurately.

Abstract: A method of forming a wire includes providing a first wire section comprising a first material and providing a second wire section comprising a second material different from the first material. A joining section is formed having a first end and a second end such that the first end of the joining section comprising a material that is compatible with the first material and such that the second end of the joining section comprising a material that is compatible with the second material. The first wire section is welded to the first end of the joining section and the second wire section is welded to the second end of the joining section. Forming the joining section includes forming the joining section via a process selected from a group comprising electrodeposition, three-dimensional printing, direct typing process, LIGA, lithography and stacking processes.

Abstract: A method of manufacturing an electrical conductor includes providing a substrate layer, depositing a graphene layer on the substrate layer and selectively depositing boundary cappings on defects of the graphene layer to inhibit corrosion of the substrate layer at the defects. Optionally, the boundary cappings may include nano-sized crystals deposited only at the defects. The selectively depositing may include electrodepositing boundary cappings on exposed portions of the substrate layer at the defects. The selectively depositing may include reacting boundary capping material with exposed portions of the substrate layer at the defects to deposit the boundary cappings only at the defects.

Abstract: A method includes (a) contacting at least a portion of a substrate material with a solution comprising a source of copper, wherein the solution is essentially free of a source of a group IIIB metal and a source of a group IVB metal; and (b) after step (a), contacting at least a portion of the substrate with an electrodepositable coating composition comprising (i) a film-forming resin and (ii) a source of yttrium.