Abstract: Provided is a method of producing a two-layered copper-clad laminate with improved folding endurance, wherein the two-layered copper-clad laminate retains folding endurance of 150 times or more measured with a folding endurance test based on JIS C6471 by subjecting the laminate in which a copper layer is formed on a polyimide film through sputtering and plate processing to heat treatment at a temperature of 100° C. or more but not exceeding 175° C. Specifically, provided are a method of producing a two-layered copper-clad laminate (two-layered CCL material) in which a copper layer is formed on a polyimide film through sputtering and plate processing, wherein the rupture of the outer lead part of a circuit can be prevented due to the improvement in folding endurance; and a two-layered copper-clad laminate obtained from the foregoing method.

Abstract: A film forming method performs a film forming process on a target object having on a surface thereof an insulating layer. The film forming method includes a first thin film forming step of forming a first thin film containing a first metal, an oxidation step of forming an oxide film by oxidizing the first thin film, and a second thin film forming step of forming a second thin film containing a second metal on the oxide film.

Abstract: A coated steel sheet includes a corrosion-resistant coating composed of at least one layer selected from the group consisting of a Ni layer, a Sn layer, an Fe—Ni alloy layer, an Fe—Sn alloy layer, and an Fe—Ni—Sn alloy layer disposed on at least one surface of a steel sheet, and an adhesive coating disposed on the corrosion-resistant coating, the adhesive coating containing Zr and further containing at least one metal element selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, in total, at a ratio by mass of 0.01 to 10 with respect to Zr. The coated steel sheet has excellent humid resin adhesion and corrosion resistance, in which streaky surface defects do not occur.

Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.

Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.

Abstract: The present invention relates to an ultra thin copper foil with a very low profile copper foil as a carrier, comprising a carrier foil a release layer and an ultra thin copper foil. The copper foil with the Very Low Profile, smooth on both sides (i.e. VLP copper foil) is used as the carrier foil, the said very low profile copper foil for supporting the ultra thin copper foil can bring advantages of no pinhole, excellent thickness uniformity and low surface roughness. The impact of a release layer on the bond strength between the carrier foil and the ultra thin copper foil is very significant, the release layer is composed of a quaternary metal alloy with peelability.

Abstract: The present invention relates generally to methods for producing a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

Abstract: Devices are formed that combine low resistance for circuit needs with high flexibility for application needs. Embodiments include forming a low resistance layer on a substrate and forming a high flexibility conductive layer on the low resistance layer, wherein the high flexibility conductive layer provides for continuous conductivity of the low resistance layer. Embodiments include forming a pattern in the low resistance and high flexibility conductive layers simultaneously, or forming a pattern in the low resistance layer prior to forming the high flexibility conductive layer.

Abstract: A molecular recognition sensor system is provided incorporating a molecular imprinted nanosensor device formed by the process steps of: (a) fabricating using photolithography a pair of metallic electrodes separated by a microscale gap onto a first electrical insulation layer formed on a substrate; (b) applying a second electrical insulation layer on most of a top surface of said pairs of electrodes; (c) depositing additional metallic electrode material onto said electrode pairs using electrochemical deposition, thereby decreasing said microgap to a nano sized gap between said electrode pairs; (d) electrochemically polymerizing in said nanogap conductive monomers containing a target analyte, thereby forming a conducting polymer nanojunction in the gap between electrode pairs; and (e) immersing resultant sensor device in a solution which removes away the target analyte, and intermittently applying a voltage to the conducting polymer while it is immersed in said solution, thereby swelling and shrinking the co

Abstract: An adhesion solution containing curable amine compounds and curable epoxy compounds are applied to a dielectric material followed by drying the solution and electrolessly plating a thin metal layer on the dielectric material. The composite is then annealed to cure the amine and epoxy compounds. The adhesion solution contains an excess amount of curable amine to curable epoxy. The adhesion solution and method may be used in the manufacture of printed circuit boards.

Abstract: This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devices. For instance, the metal proof mass, which may have a density several times larger than that of silicon, is capable of reducing the quadrature and bias error in a MEMS gyroscope device, and capable of increasing the sensitivity of the MEMS gyroscope device.

Abstract: Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

Abstract: A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.

Abstract: A plastic lead frame with reflection and conduction metal layer includes a base made of a metal catalyst containing or an organic substance containing plastic material, the base further includes a slanted reflection surface formed downwardly on top of the base; an insert slot continuously and staggeringly formed along the circumferential fringe of the base; a molded carrier made of non-metallic catalyst or organic substance containing plastic material accommodated in the insert slot; an interface layer formed on the surface of the base by chemical deposition; an insulation route formed on the surface of the base by ablating part of the interface layer with the laser beam radiation; and a metallic layer formed on the base by electroplating process thereby forming a plastic lead frame of excellent electrical conductivity and high light reflection property.

Abstract: A method of forming a metal film, the method including: (a) forming a primer layer on a substrate by applying a first polymer including a unit having a cyano group in a side chain; (b) forming a polymer layer on the surface of the primer layer by applying a second polymer, the second polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof and a polymerizable group; (c) applying the electroless plating catalyst or the precursor thereof to the polymer layer; and (d) forming a metal film on the polymer layer by performing electroless plating.

Abstract: A substrate includes an insulating layer and a reflective film. The reflective film includes a conductor layer, a barrier layer and a thin silver film in this order. The surface of the conductor layer is subjected to planarization processing to attain not more than 0.35 ?m. The surface roughness of the barrier layer is not more than 0.2 ?m. The conductor layer is formed on the insulating layer. The thin silver film is formed on the conductor layer with the barrier layer sandwiched therebetween. The thin silver film on the conductor layer has a surface roughness of not more than 0.2 ?m, a gloss level of not less than 0.8 and a reflectivity of not less than 90% for light of a wavelength of 460 nm.

Abstract: A process is described for the fabrication, through electrodeposition, of FexCoyNiz (x=60-71, y=25-35, z=0-5) films that have, in their as-deposited form, a saturation magnetization of at least 24 kG and a coercivity of less than 0.3 Oe. A key feature is the addition of aryl sulfinates to the plating bath along with a suitable seed layer.

Abstract: Methods of producing corrosion-inhibiting aluminum foil products suitable for culinary use involve metallurgical sequestration of aluminum radicals by applying a copper-containing barrier metal layer to a substrate aluminum foil, followed by application of a biocompatible, lipid-based sealant layer to seal any gaps in the barrier layer and provide a non-stick coating. The sealant, which has a vegetable cooking oil, or oil mixture, as its primary ingredient, may also function as a natural antimicrobial and/or anti-fungal agent. Various sealant additives may increase the thermal stability of the oil base, enhance the antimicrobial properties thereof, and increase shelf life. Aluminum foil products include a coated aluminum foil with a copper-containing barrier layer applied to an aluminum substrate layer, with a sealant layer applied to the barrier layer. The coated foil may be wound in a coil around a hollow tube which contains a desiccant.

Abstract: Aluminum-plated components of semiconductor material processing apparatuses are disclosed. The components include a substrate and an optional intermediate layer formed on at least one surface of the substrate. The intermediate layer includes at least one surface. An aluminum plating is formed on the substrate, or on the optional intermediate layer. The surface on which the aluminum plating is formed is electrically-conductive. An anodized layer can optionally be formed on the aluminum plating. The aluminum plating or optional the anodized layer comprises a process-exposed surface of the component. Semiconductor material processing apparatuses including one or more aluminum-plated components, methods of processing substrates, and methods of making the aluminum-plated components are also disclosed.

Abstract: The invention provides a method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, and with a compound having a non-dissociative functional group and a reactive group, the non-dissociative functional group being capable of interacting with a plating catalyst or a precursor thereof, and at least one of the polymer or the monomer having a functional group that reacts with the reactive group in the compound; forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer.

Abstract: The present invention discloses a color filter by copper and silver film, comprising: a lower copper layer; a lower silver layer formed on the lower copper layer; a medium formed on the lower silver layer; an upper copper layer formed on the medium; and an upper silver layer formed on the upper copper layer.

Abstract: Improved battery materials, and a process for producing such improved battery materials are disclosed. The materials and methods employ battery components based on porous lightweight non woven substrate materials that are coated with dispersions comprised of carbon nanotubes, conductive secondary particles (usually with an approximate diameter between about 0.5 nm to 100 microns), a binder and a solvent. The dispersions permeate the substrate's pores, and when cured, the carbon nanotubes form conductive bridges between the conductive secondary particles, and these in turn are held on the substrate by the binder. The net effect is to increase the battery's total active material and energy density. The permeated substrate may then be further treated to achieve the desired conductivity as needed. These materials and methods can produce improved lead acid and silver zinc batteries, as well as other types of batteries.

Abstract: Disclosed are methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

Abstract: Provided is a jewelry ring comprising a substrate, a first coating of a metallic nitride or a metallic boride, and an external metallic coating. Also provided is a metallic article comprising a substrate comprising tungsten carbide, cobalt, tungsten, titanium, titanium carbide, zirconium, tantalum or aluminum; a first coating of a metallic nitride or a metallic boride; and an external metallic coating. A method for making a jewelry ring comprising a substrate, a first coating of a metallic nitride or a metallic boride, and an external metallic coating is additionally provided. Further provided is a method for making a metallic article comprising a substrate comprising tungsten carbide, cobalt, tungsten, titanium, titanium carbide, zirconium, tantalum or aluminum; a first coating of a metallic nitride or a metallic boride; and an external metallic coating.

Abstract: A fuel cell includes a unit cell, a cell fixing member and a welding portion. The unit cell includes a first electrode layer, an electrolyte layer surrounding the first electrode layer, a second electrode layer surrounding the electrolyte layer while exposing an end portion of the electrolyte layer, and a coating layer formed by coating a mixture of ceramic and metal on the exposed end portion of the electrolyte layer. The cell fixing member includes a flow tube inserted into the unit cell, a fixing tube provided to an outside of the flow tube, and a connecting portion connecting the fixing tube and the flow tube to each other and to restrict an insertion depth of the electrolyte layer and the first electrode layer. The welding portion fixes and seals the coating layer and the inner circumferential surface of the fixing tube to each other.

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Some gyroscopes include a drive frame, a central anchor and a plurality of drive beams disposed on opposing sides of the central anchor. The drive beams may connect the drive frame to the central anchor. The drive beams may include a piezoelectric layer and may be configured to cause the drive frame to oscillate torsionally in a plane of the drive beams. The gyroscope may also include a proof mass and a plurality of piezoelectric sense beams. At least some components may be formed from plated metal. The drive frame may be disposed within the proof mass. The drive beams may constrain the drive frame to rotate substantially in the plane of the drive beams. Such devices may be included in a mobile device, such as a mobile display device.

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device.

Abstract: Provided is a method for easily and surely removing projections formed on the surface of an active material layer by a vacuum process when producing an electrochemical element electrode. Carried out to produce the electrochemical element electrode are: a first step of forming an active material layer on a current collector by a vacuum process, the active material layer being capable of storing and emitting lithium; a second step of storing the lithium in the active material layer; and a third step of removing projections on the surface of the active material layer storing the lithium.

Abstract: The invention provides a supporting substrate and method for fabricating the same. The supporting substrate includes: a substrate; a first surface metal layer formed on the substrate, wherein the first surface metal layer has a first opening; a second surface metal layer formed on the substrate and disposed oppositely to the first surface metal layer, wherein the substrate has a through hole, and the through hole is formed along the first opening to expose the second surface metal layer; a protective layer formed on the first surface metal layer and the second surface metal layer, wherein the protective layer has a second opening which exposes the through hole; and a conductive bump formed in the through hole, the first opening and the second opening, wherein the conductive bump is electrically connected to the second surface metal layer.

Abstract: A plating catalyst liquid which places little burden on the environment, which does not roughen the surface of a plating target, which can be easily controlled for the amount of plating catalyst applied and which is at low risk of inflammation and is highly safe, and a plating method using the plating catalyst are provided. The plating catalyst liquid includes a palladium compound, water, and a water-soluble combustible liquid serving as a combustible liquid ingredient, has a flash point of 40° C. or more and contains the water-soluble combustible liquid in an amount of 0.1 to 40 wt %.

Abstract: A film formation method includes preparing a substrate formed a Co film as a seed layer on a surface of the substrate, applying a negative voltage to the substrate such that a surface potential of Co is lower than an oxidation potential of the Co, and in a state when the negative voltage is applied to the substrate, dipping the Co film in a plating solution mainly containing copper sulfate solution, thereby a Cu film is formed on the Co film of the substrate by electroplating.

Abstract: A layered composite which has a substrate made of a ferrous material with a PVD/PACVD coating and a corrosion protection layer that is disposed on the PVD/PACVD coating. The PVD/PACVD coating has pores into which the corrosion protection layer protrudes.

Abstract: The present invention provides a dye-sensitized solar cell (DSSC), comprising: a substrate having a first electrode formed thereon; a plurality of nanoparticles adsorbed with dye, overlying the first electrode; a solid electrolyte containing metal quantum dots completely covering the nanoparticles and fully filling the space between the nanoparticles; and a second electrode overlying the solid electrolyte. The present invention further provides a method for forming the dye-sensitized solar cell.

Abstract: This disclosure describes a gold-plated screen-printed electrode for use as an electrochemical sensor.

Abstract: Disclosed herein is a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

Abstract: A method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, at least one of the polymer or the monomer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer.

Abstract: The present invention relates to the manufacture of karat gold jewelry items. The invention provides a method for manufacturing karat gold jewelry comprising producing a non metallic material form corresponding to the shape and size of the desired jewelry item, the form being molded in a metal die. Treating the surface of the non metallic material form to make the surface electrically conductive and receptive to an electroplating process; and adding a layer of karat gold not less than 15 micron thickness to the treated form by means of an electroplating process to produce a jewelry item.

Abstract: A method for fabricating a device includes providing a substrate including at least one contact and applying a dielectric layer over the substrate. The method includes applying a first seed layer over the dielectric layer, applying an inert layer over the seed layer, and structuring the inert layer, the first seed layer, and the dielectric layer to expose at least a portion of the contact. The method includes applying a second seed layer over exposed portions of the structured dielectric layer and the contact such that the second seed layer makes electrical contact with the structured first seed layer. The method includes electroplating a metal on the second seed layer.

Abstract: The invention relates to a method for the production of a hardened component made of a hardenable steel, wherein the steel strip is exposed to a temperature increase in an oven, and is thus exposed to an oxidizing treatment such that a surface oxide layer is created, and subsequently a coating using a metal or a metal alloy is carried out. The strip is heated and at least partially austenitized for producing an at least partially hardened component, and subsequently cooled and thereby hardened. The invention also relates to a steel strip produced according to said method.

Abstract: This invention provides a metal material with a bismuth coating being enables the subsequent coating to be accomplished at a high throwing power, and has excellent corrosion resistance, coating adhesion, and, being able to be produced with reduced damage to the environment, the metal material having a surface and a bismuth-containing layer deposited on at least a part of the surface of the metal material, wherein a percentage of bismuth atoms in number of atoms in the surface layer of the metal material with a bismuth coating is at least 10%.

Abstract: A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material (120, 220, 920) as a build-up layer of the substrate, applying a primer (140, 240, 940) to a surface (121, 221, 921) of the dielectric material, and forming an electrically conductive layer (150, 250, 950) over the primer. In another embodiment, the method comprises providing the dielectric material, forming the feature extending into the dielectric material, forming the electrically conductive layer over the dielectric material, applying the primer to a surface of the electrically conductive layer and attaching a dielectric layer (960) to the primer.

Abstract: A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.

Abstract: A molecular recognition sensor system is provided incorporating a molecular imprinted nanosensor device formed by the process steps of: (a) fabricating using photolithography a pair of metallic electrodes separated by a microscale gap onto a first electrical insulation layer formed on a substrate; (b) applying a second electrical insulation layer on most of a top surface of said pairs of electrodes; (c) depositing additional metallic electrode material onto said electrode pairs using electrochemical deposition, thereby decreasing said microgap to a nano sized gap between said electrode pairs; (d) electrochemically polymerizing in said nanogap conductive monomers containing a target analyte, thereby forming a conducting polymer nanojunction in the gap between electrode pairs; and (e) immersing resultant sensor device in a solution which removes away the target analyte, and intermittently applying a voltage to the conducting polymer while it is immersed in said solution, thereby swelling and shrinking the co

Abstract: The process for the application of a metal layer on a substrate by deposition of a metal from a metal salt solution comprises the presence of exfoliated graphite in the substrate surface.

Abstract: The invention concerns multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. A thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.

Abstract: A conductive ink formulation comprising silver, at least one first solvent, and a cross link wherein the cross link agent is present in an amount of about 1.5 wt % to about 6 wt % based on total weight of the formulation. The conductive ink formulation is suitable for printing on polymer film substrates, in particular with a gravure printing method. The polymer film substrates may be then applied to other substrates, for example glass substrates, by any suitable process such as lamination.

Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

Abstract: A plastic lead frame with reflection and conduction metal layer includes a base made of a metal catalyst containing or an organic substance containing plastic material, the base further includes a slanted reflection surface formed downwardly on top of the base; an insert slot continuously and staggeringly formed along the circumferential fringe of the base; a molded carrier made of non-metallic catalyst or organic substance containing plastic material accommodated in the insert slot; an interface layer formed on the surface of the base by chemical deposition; an insulation route formed on the surface of the base by ablating part of the interface layer with the laser beam radiation; and a metallic layer formed on the base by electroplating process thereby forming a plastic lead frame of excellent electrical conductivity and high light reflection property.

Abstract: The invention relates to a method for the application of a coating to workpieces and/or materials, comprising the following steps: applying an adhesive layer; and applying a high-strength top layer by plasma coating.

Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A transition layer is on the cathode wherein the transition layer has a blocking layer. A plated layer is on the transition layer. The cathode is electrically connected to a cathode termination through the transition layer.