Abstract: The durability and reliability of a polymer layer/metal layer sensor structure is improved by the incorporation of a metal oxide, e.g., tantalum oxide (Ta.sub.2 O.sub.5), layer between the polymer, e.g., polyimide, and the metal, e.g., platinum. sensor element.

Abstract: Process in which the said surface is pickled and then treated in two steps, a first treatment step of so-called "amorphous" phosphatization, suitable for depositing a coat of at least 0.2 g/m.sup.2, followed by a second treatment step called "nickel plating".In this way, it is possible to limit the amount of sludge at pickling while at the same time obtaining good adhesion of the enamel.In a complete sequence for manufacturing an article formed from direct-on enameled metal sheet, the sheet may be formed after pickling, especially after the first step called phosphatization and before the second step called nickel plating.

Abstract: A method for manufacturing an orifice plate that is built up in multiple layers and includes a complete axial through passage for a fluid. The orifice plate includes inlet openings, outlet openings, and at least one conduit lying between them. The layers or functional planes of the orifice plate are built up on one another by electroplating metal deposition (multilayer electroplating). Orifice plates manufactured in this manner are particularly suitable for use on injection valves in fuel injection systems, in paint nozzles, inhalers, or inkjet printers, or in freeze-drying processes, for spraying or injecting fluids such as beverages.

Abstract: Underplating between a metallic plating base and a photoresist deposited reon can be reduced or eliminated by a method of fabricating a microstructure which includes the steps of:(a) depositing a plating base on the adhesion layer;(b) depositing on the plating base a sacrificial layer of a material that reduces or eliminates underplating on the plating base compared to underplating in absence of the sacrificial layer;(c) depositing a photoresist on the sacrificial layer;(d) exposing, developing and removing the exposed photoresist from the substrate to uncover a portion of the sacrificial layer;(e) removing the sacrificial layer portion from the substrate to uncover a portion of the plating base; and(f) depositing a metallic material on the uncovered plating base under the influence of electrical current.

Abstract: A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed.

Abstract: A composite material of silicon carbide particles in an aluminum matrix is base coated with a layer of a nickel-boron alloy by an electroless process. The base-coated composite material is heat treated at a temperature of about 450.degree. C. to interdiffuse the base coating with the composite material. A nickel or gold top layer is electrolytically deposited over the base coat on the heat-treated composite material.

Abstract: The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.

Abstract: A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed.

Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.

Abstract: A process for producing an organic device includes forming a first electrode and a second electrode on a substrate having an insulating film formed on a surface thereof, etching out the insulating film with the first electrode and the second electrode being used as masks, forming a monomolecular or built-up monomolecular film containing electrolytically polymerizable unsaturated groups directly or indirectly on the surface of the substrate by a chemical absorption method or the Langmuir-Blodgett method.

Abstract: A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer containing a polymeric stabilizer having repeating alkylene oxide groups and a hydrophilic--lipophilic balance of at least 10.

Abstract: A ceramic thermal barrier coating layer for a superalloy article is caused to adhere to the superalloy article by applying platinum to the superalloy article and heat treating at a temperature of 1100.degree. C. to 1200.degree. C. for one hour. This causes aluminum to diffuse from the superalloy article into the platinum to form a platinum enriched outer layer which generally includes a platinum enriched gamma phase and a platinum enriched gamma prime phase. An alumina layer is formed between the platinum enriched outer layer and a ceramic coating. The platinum enriched gamma phase and the platinum enriched gamma prime phase in the outer layer reduces the migration of transition metal elements to the ceramic coating to enable a very pure alumina layer to be formed.

Abstract: The use of a bi-layer thin film structure consisting of aluminum or aluminide on a refractory metal layer as a diffusion barrier to oxygen penetration at high temperatures for preventing the electrical and mechanical degradation of the refractory metal for use in applications such as a capacitor electrode for high dielectric constant materials.

Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an unstable aqueous dispersion essentially free of a dispersing agent using physical dispersion means to maintain the stability of the dispersion.

Abstract: A process for plating an electrically nonconductive substrate by the following sequence of steps:(1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent;(2) a step of treating the electrically nonconductive substrate from said step (1) with a solution containing an anionic surfactant;(3) a step of the electrically nonconductive substrate from said step (2) with a solution containing a palladium compound and at least one nitrogen-containing sulfur compound selected from among thiourea and its derivatives;(4) a step of treating the electrically nonconductive substrate from said step (3) with a reducing solution containing at least one member selected from among sodium borohydride, sodium hypophosphite, hydrazine, dimethylaminoborane, hydroxylamine and glyoxylic acid; and(5) a step of forming an electroplating layer on the electrically nonconductive substrate from said step (4).

Abstract: A method of providing a semiconductor device with an inorganic electrically insulative layer, the device having exposed semiconductor surfaces and electrically conductive metal end terminations, in which the device is reacted with phosphoric acid to form a phosphate on the exposed surfaces of the semiconductor but not on the metal end terminations, and in which the device is thereafter barrel plated in a conventional electrical barrel plating process and the plating is provided only on the end terminations because the phosphate is not electrically conductive.

Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.

Abstract: A method for treating the surface of aluminum alloys having a relatively high copper content is provided which includes the steps of removing substantially all of the copper from the surface, contacting the surface with a first solution containing cerium, electrically charging the surface while contacting the surface in an aqueous molybdate solution, and contacting the surface with a second solution containing cerium. The copper is substantially removed from the surface in the first step either by (i) contacting the surface with an acidic chromate solution or by (ii) contacting the surface with an acidic nitrate solution while subjecting the surface to an electric potential. The corrosion-resistant surface resulting from the invention is excellent, consistent and uniform throughout the surface. Surfaces treated by the invention may often be certified for use in salt-water services.

Abstract: The invention relates to a process for directly electroplating a conductive metal to the inner walls of through-holes in printed-wiring boards. The process comprises steps of providing an aqueous dispersion containing graphite particles with an average particle diameter of 2 .mu.m or less or carbon black particles with an average particle diameter of 1 .mu.m or less; applying this aqueous dispersion to a surface of a nonconductive surface substrate; dipping the nonconductive surface in a strong acidic aqueous solution with pH 3 or lower to form a layer of said particles; and electroplating using the particle layer as a conductive layer.

Abstract: The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.

Abstract: The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.

Abstract: The present invention is directed to a substrate with a coating of titanium suboxide thereon. The coating protects the substrate from corrosion. Typically, the substrate is a current collector for a lead acid battery. The present invention is also directed to a process for forming the coating of titanium suboxide coating on the substrate. A colloidal dispersion of titanium suboxide particles in water is formed. The pH of the colloidal dispersion is brought within the range of 3 or less. The substrate to be coated is then placed in the colloidal dispersion. A positive electrode is also placed in the colloidal dispersion. An electric field is then introduced into the colloidal dispersion to effect electrophoretic deposition of the titanium suboxide on the substrate.

Abstract: A process for electroplating a substrate by coating the substrate with a porous coating of conductive particles having a reducing agent within its pores and electroplating over said coating. The reducing agent causes formation of an initial electroless metal deposit over the conductive particle coating thus enhancing its conductivity. The process is especially useful for the fabrication of printed circuit boards.

Abstract: A composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight carbon (e.g. graphite or carbon black) having a mean particle size within the range of 0.05 to 50 microns; optionally, 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of an anionic dispersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition, and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed.

Abstract: Method of making a cast-to-size mold for molding class A finishes on molded plastic articles including the steps of filling any pores in the molding surface with a conductive thermosetting resin and thereafter electroplating the surface.

Abstract: A method is provided for preparing a diamond coating on a substrate. The method includes a first step of applying a partial diamond coating having an effective amount of void area therein to the work surface of a substrate. In a follow-up step the void area in the partial coating is filled with binder, preferably metallic binder. In a later step, diamond projecting outwardly from the binder is further grown, to generate a covering portion or a head portion extending over, and in protective relationship with, the binder or binder material. According to the present invention preferred products are also provided.

Abstract: Novel aqueous accelerating solutions and methods for their use in connection with metal plating of dielectric materials are disclosed and claimed. The accelerating solutions are mildly basic aqueous solutions including dilute concentrations of copper ions.

Abstract: The formation of whiskers during tin or tin-lead solder electroplating of a copper base alloy substrate in a methane sulfonate solder plating bath is inhibited by passivating the surface of the substrate prior to electroplating. Preferred passivating solutions include an aqueous solution of sodium dichromate and phosphoric acid, and an aqueous solution of chromic acid and phosphoric acid. Passivation is preferably followed by treatment with a basic solution having a pH of at least 8.

Abstract: A method for making a light weight circuit module includes steps of providing a substrate, drilling through holes in the substrate and plating the through holes with a metal. The substrate is a rigid planar substrate and having metallization on both sides. The method also includes steps of drilling through holes in the substrate and plating the through holes with a metal. The method also includes steps of preparing a patterned photoresist layer on at least one of the two sides, etching the metallization on the at least one side in accordance with the patterned photoresist layer, drilling support holes, filling the support holes with a material chemically distinct from the substrate, stripping the patterned photoresist layer from the at least one side and chemically removing the substrate from the metallization.

Abstract: A closely adherent metal coating having a uniform thickness and substantially free from pinholes is formed on the porous surface of a bonded magnet to improve its oxidation and corrosion resistance without lowering its magnetic properties. The coating is formed by electroplating from an aqueous solution not containing chlorine, and having a pH of 5 or above. More particularly, the solution contains mainly nickel sulfate, an electrolyte in the form of an organic acid salt not containing chlorine, and a basic electrolyte not containing chlorine, and forms a nickel coating on the magnet surface.

Abstract: A method for coating a dielectric ceramic piece by a layer of electrical conductivity whereby the method consists of coating the ceramic piece with an electrically conductive paste and of growing a metal layer of good electrical conductivity upon this layer.

Abstract: A method for treating the surface of an aluminum-based material so as to make the surface resistant to corrosion includes the steps of contacting the surface with an aqueous cerium non-halide solution and then contacting the surface with an aqueous cerium halide solution. These steps may optionally be followed by a step of positively charging the metal surface while in contact with an aqueous molybdenum solution.

Abstract: A method of joining a metal member to a resin member comprising electroforming a roughened surface on a metal member, thereby producing a countless number of minute pores on the surface of the metal member. The cross section of each pore is generally in a shape of a dovetail.

Abstract: A zinc-based temporary electrical connection (e.g., a microfuse) useful in electroplating isolated conductor (i.e., copper) structures and copper/polyimide high-density interconnect structures are disclosed. The microfuse includes a zinc conductor layer, and in some embodiments, additional silicon adhesion and silicon protection layers. The microfuse is conductive, and therefore useful in an electroplating process, until it is treated (e.g., heated to about 400.degree. C. for one hour), to convert it into an insulator due to zinc oxidation, and remains in this state.

Abstract: Engine components of steel or superalloy subject to wear from alternating friction at medium temperatures in the region of 700.degree. C. are provided with a protective wear-resistant coating bya) electrophoretic deposition of a metal-ceramic structure comprising a mixture of from 85% to 50% of metallic powder and from 15% to 59% of ceramic powder, the metallic powder being a cobalt-based superalloy of type KC 25 NW or of M Cr Al Y wherein M represents at least one metal chosen from the group consisting of Ni, Co and Fe with the possible addition of Ta, and the ceramic powder being an oxide such as Al.sub.2 O.sub.3 or Cr.sub.2 O.sub.3, a carbide such as SiC or Cr.sub.3 C.sub.2, a nitride such as BN or TiN, or a boride such as TiB.sub.2 ;b) electrolytic pre-nickeling said deposit in an electrolysis bath at a pH between 6 and 8, andc) electrolytic nickeling said pre-nickeled deposit in an acid bath of sulphamate type.

Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

Abstract: Method for pretreating the connecting elements of a gas-tight pipe connection of the type including an internally threaded coupling for being screwed to externally threaded spigots at pipe ends to be joined, a metallic sealing seat, and an abutment shoulder. Only the coupling, on its innerside, is provided with a covering while leaving the spigots bare. After cleaning threaded and sealing regions of the connecting elements but before screwing together such connecting elements, a lubricant is applied to the cleaned threaded and sealing regions.

Abstract: An optical quality film is transferred from a master optical surface to a condary substrate by means of a replication technique using a master optical surface as a mold.