Abstract: A method for preparing a radioactive, implantable, medical device is provided. The method involves depositing a layer of a radioactive metal that emits beta particles and that has a half-life of between 2 hours and 7 days and a maximum beta energy of between 0.7 and 2.3 MeV onto a metallic surface of the device. In one embodiment, the radioactive metal and a carrier metal are electroplated onto the metallic surface. In another embodiment, a second metallic layer comprising a barrier metal is electroplated onto the radioactive metal layer. A medical device having a metallic surface with a radioactive metallic coating thereon is provided. In one embodiment, the coating comprises a radioactive layer comprising a radioactive metal that emits beta-particles and that has a half-life of between 2 hours and 7 days and an energy level of from about 0.7 MeV to 2.3 MeV and a carrier metal. In another embodiment, the coating further comprises a second layer deposited on the radioactive layer.

Abstract: A metal plate for electromagnetic heating is disclosed which includes a substrate comprising aluminum or aluminum alloys, an intermediate layer formed on at least a portion of one surface of the substrate and comprising zinc or zinc alloys and a conductive layer formed on the intermediate layer for serving as a heat generating body when eddy current induced by high-frequency magnetic flux flows therethrough. Methods of manufacturing a metal plate for electromagnetic heating and a metallic mold for electromagnetic heating are also disclosed.

Abstract: A method of fabricating an emitter plate 12 for use in a field emission device comprising the steps of providing an insulating substrate 18 and forming a first conductive layer 13 on the insulating substrate 18. This is followed by the steps of forming an insulating layer 20 on the first conductive layer 13 and forming a second conductive layer 22 on the insulating layer 20. Then, a plurality of apertures 34 are formed through the second conductive layer 22 and through the insulating layer 20. A lift-off layer 36 is then formed on the second conductive layer 22. The lift-off layer 36 is formed by a plating process wherein the plating bath has a pH between 2.25 and 4.5, and current densities of 1 to 2O mA/cm.sup.2. The method may further comprise depositing conductive material through the plurality of apertures 34 to form a microtip 14 in each of the plurality of apertures 34. The excess deposited conductive material 14' and the lift-off layer 36 are then removed from the second conductive layer 22.

Abstract: In one embodiment, the present invention relates to a method of treating metal foil, involving sequentially contacting a metal foil with an acidic solution; placing the metal foil in a nickel treatment bath and applying a current through the nickel treatment bath, wherein the nickel treatment bath contains at least about two plating zones, about 1 to about 50 g/l of an ammonium salt, and about 10 to about 100 g/l of a nickel compound; and applying a nickel flash layer to the metal foil. In another embodiment, the present invention relates to a metal foil treated according to the method described above.

Abstract: A method for electroplating a silicon substrate in manufacturing a semiconductive device is provided. Electroplating process chamber contacts or fingers used in positioning a silicon substrate or wafer during an electroplating process are plated with a metal layer to prevent oxidation of the contacts. Oxidation of the contacts may result in increased and varying resistance of the contacts and thus nonuniform plating of the silicon wafer and possibly even deplating of a seed layer. A 20 mA/cm.sup.2 current is applied to the contacts which are immersed in an electrolyte solution before loading a silicon wafer. A silicon wafer is then loaded into the electroplating process chamber containing the electrolyte solution. The preplating of the contacts enables the formation of a uniform metal layer on the silicon substrate. Additionally, voltage then may be applied to the contacts after unloading the silicon wafer to reduce oxidation.

Abstract: This self-supported, anisotropic conductive film has a partly annealed polymer layer (46) containing through holes, nail-shaped conductive elements (51) filling the through holes, having a central portion and ends, and the central portion of the nails is made from a hard material (52) and each end respectively of a first and a second meltable materials (44, 54).

Abstract: A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.

Abstract: Methods for forming pastes of dendrites particles coated with an electrically conductive coating are described. A surface is placed in contact with an electrolytic or electroless plating solution. Dendrites are formed on the surface. The dendrites are exposed to another plating solution to plate a coating on the surface of the dendrites. The coated dendrites are removed from the surface to form a powder of coated dendrites. The powder is added to a polymer material to form a paste which is heated to fuse the dendrite surfaces to form a network of interconnected dendrites and further heated to cure the polymer. When the paste is disposed between adjacent electrically conductive surfaces, the coated dendrites fuse to the electrically conductive surface to form electrical interconnections.

Abstract: A method of producing a coating on a substrate by electrolytically co-depositing a metal matrix M.sub.1 and particles of CrAlM.sub.2, where M.sub.1 is Ni, Co or Fe or two or all of these elements and M.sub.2 is Y, Si, Ti, Hf, Ga, Nb, Mn, Pt, a rare earth element or two or more of these elements. The co-deposition is carried out at a current density of less than 5mA per square centimeter. Preferably, the co-deposition forms a layer less than 50 microns thick, and occurs at a bath loading of less than 40 grams per liter of the particles. In a preferred embodiment, the particle size distribution in the plating bath is 25 percent between 15 and 12 microns, 45 percent between 12 and 10 microns and 30 percent less than 10 microns. The method is particularly useful for coating a gas turbine part.

Abstract: A wobble plate in a wobble plate compressor has a bevel gear positioned at a central portion thereof. The bevel gear is provided with a centered ball seat. A second bevel gear is supported on the cylinder block and also has a centered ball seat. A bearing ball is seated in both of the ball seats so that the wobble plate nutates about the ball. At least one of the bevel gears is coated with electroless composite plating layer having a self-lubricative material, such as polytetrafluoroethylene (PTFE), dispersed therein. Consequently, the bevel gears have low frictional resistance, high hardness and improved anti-seizure characteristics.

Abstract: The subject of the invention is a process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a step of nickel plating of said surface and a step of nickel removal therefrom, wherein:a preparation of said surface, comprising in succession an operation of cleaning said bare surface, an operation of pickling said bare surface in an oxidizing acid medium and an operation of brightening said bare surface, is carried out;then, an operation of nickel plating of said bare surface is carried out by electroplating, by placing said element as the cathode in an electrolyte consisting of an aqueous nickel sulfamate solution containing from 60 to 100 g/l of nickel;then, after said element has been used, an operation of partially or completely removing the nickel from said surface electrolytically is carried out, by placing said element as the anode in an electrolyte consisting of an aqueous nickel sulfamate solution containing fro

Abstract: Disclosed are a composite material having an anti-wear property and a process for producing the same. The composite material includes a matrix of a low melting point Sn alloy having a melting point of from 80.degree. to 280.degree. C., and metallic dispersing particles dispersed in the matrix in an amount of from 10 to 50% by volume. When the composite material is utilized to make a rough mold for preparing a prototype, it sharply improves the anti-wear property of the rough mold, and it can be re-used for a plurality of times without adversely affecting the sharply improved anti-wear property. The composite material provides the advantageous effect best when the metallic dispersing particles are Fe--C alloy dispersing particles and/or Fe--W--C alloy dispersing particles which were subjected to a surface treatment including an Sn or Ni electroplating followed by a ZnCl.sub.2 .multidot.NH.sub.4 Cl flux depositing.

Abstract: A method of forming a protective coating of a CrRuAl alloy is provided. The substrate to be coated is first plated with a combination of chromium and ruthenium. Next, the coated substrate is aluminized with fine aluminum powder in an aluminum oxide pack at about 1150.degree. C. The coating formed is resistant to atmospheric attack and protects the substrate.

Abstract: The improved method comprises contacting a substrate 5 at least once by a liquid containing the elements that compose a pure metal or an alloy with which the small holes or recesses 3a in the substrate 5 are to be filled or covered, whereby the liquid wets the inner surfaces of said small holes or recesses 3a while, at the same time, said pure metal or said alloy is deposited on the surface of said substrate 5. The method is capable of filling small holes or covering small recesses in the surface of the substrate 5 with improved efficiency while, at the same time, it improves the heat resistance and materials stability of the part that contains the formed filling or covering layer.

Abstract: A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discoloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt by electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).

Abstract: A ceramic thermal barrier coating layer for a superalloy article is caused to adhere to the superalloy article by applying platinum to the superalloy article and heat treating at a temperature of 1100.degree. C. to 1200.degree. C. for one hour. This causes aluminum to diffuse from the superalloy article into the platinum to form a platinum enriched outer layer which generally includes a platinum enriched gamma phase and a platinum enriched gamma prime phase. An alumina layer is formed between the platinum enriched outer layer and a ceramic coating. The platinum enriched gamma phase and the platinum enriched gamma prime phase in the outer layer reduces the migration of transition metal elements to the ceramic coating to enable a very pure alumina layer to be formed.

Abstract: Small, closely spaced deposits of solder materials may be formed with high volumetric accuracy and uniformity of shape by depositing a layer of conductive material over surfaces of a dielectric layer having apertures or recesses (e.g. blind apertures) and conductors and/or pads exposed by those apertures or recesses, masking regions of the conductive material with a further patterned dielectric layer, electroplating solder materials onto regions of the conductive material exposed by the mask, removing the mask and portions of the conductive material by selective etching and reflowing solder away from at least a portion of the surfaces of the apertured dielectric layer. Uniformity of electroplating within blind apertures is enhanced by a combination of fluid jet sparging and cathode agitation. Excess conductor material in the resulting solder deposit can be avoided by replacing conductor material with a constituent component of a solder material in an immersion bath prior to electroplating.

Abstract: A process is provided for plating zinc die cast substrates with an electroless nickel coating comprising depositing an electrolytic zinc layer on the substrate followed by depositing a first electroless nickel layer on the electrolytic zinc layer using a first alkaline electroless nickel bath and then depositing a finish electroless nickel layer on the first electroless nickel layer using an acidic electroless nickel bath. In a preferred embodiment, a second electroless nickel layer is deposited on the first electroless nickel layer using a second alkaline electroless nickel bath. It is preferred that at least one and preferably all of the electroless nickel baths contain an effective amount of antimony ions to enhance bath stability and metal to metal adhesion. Mechanical cleaning of the zinc die casting before plating is preferred.

Abstract: A method of making the compound CuInSe.sub.2 (CIS) by depositing a precursor of the compound at least partly electrolytically on a substrate and forming CuInSe.sub.2 by thermal reaction.

Abstract: This document discloses a method for bonding a calcium phosphate coating to stainless steels or cobalt base alloys for bioactive fixation of artificial implants. The method consists essentially of the following successive steps: applying and thermally diffusing a layer of titanium or its alloys into the stainless steel or cobalt base alloy substrates, applying a calcium phosphate coating and thermally diffusing Ca.sup.2+ and PO.sub.4.sup.-3 ions of the calcium phosphate into the intermediate layer of the titanium or its alloys and finally, the hydrothermal processing of the calcium phosphate coating.

Abstract: A method is provided for preparing a diamond coating on a substrate. The method includes a first step of applying a partial diamond coating having an effective amount of void area therein to the work surface of a substrate. In a follow-up step the void area in the partial coating is filled with binder, preferably metallic binder. In a later step, diamond projecting outwardly from the binder is further grown, to generate a covering portion or a head portion extending over, and in protective relationship with, the binder or binder material. According to the present invention preferred products are also provided.

Abstract: A nickel alloy electroplated cold-rolled steel sheet excellent in press-formability and phosphating-treatability, which comprises: (a) a cold-rolled steel sheet consisting essentially of: carbon (C): up to 0.06 wt. %, silicon (Si): up to 0.5 wt. %, manganese (Mn): up to 2.5 wt. %, phosphorus (P): up to 0.1 wt. %, sulfur (S): up to 0.025 wt. %, soluble aluminum (Sol.Al): up to 0.10 wt. %, nitrogen (N): up to 0.005 wt. %, and the balance being iron (Fe) and incidental impurities; (b) a nickel alloy electroplating layer, formed on at least one surface of the cold-rolled steel sheet, the nickel alloy electroplating layer consisting of nickel alloy particles precipitated at a distribution density of at least 1.times.10.sup.12 /m.sup.2, the nickel alloy particles containing at least one of phosphorus (P), boron (B) and sulfur (S) in an amount of 1 to 15 wt. %, the plating weight of the nickel alloy electroplating layer being 5 to 60 mg/m.sup.

Abstract: A nickel plug (31) filling an aperture in an insulating layer (30), such as polyimide, separating two metallization levels of copper wires (28, 25) is formed by an electroless process in a plating bath (solution) containing ions of hypophosphite and of nickel. In preparation for this electroless process, the copper wires (28, 25) are first plated with a nickel layer (29) by a pseudo-electroless process-that is, a process in which the copper wires (28, 25) are located in contact with an underlying extended chromium layer (14) that is placed in electrical contact (including intimate physical contact) with an auxiliary metallic member (41) that contains nickel, while both the copper wires (28, 25), the chromium layer (14), and at least a portion of the external metallic layer (41) are immersed in a plating solution likewise containing ions of hypophosphite and of nickel.

Abstract: The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques. The method may also be used in single-sided and double-sided circuit board fabrication and for inner layers used in multilayer circuit boards.

Abstract: A method for applying a sequence of protective coatings to steel parts includes the steps of depositing a zinc coating, a chromate coating and a synthetic resin coating. The parts to be coated are supported on a hanger and carried thoughout the entire coating operation by a continous conveyer system. The zinc coating is electrolytically deposited from an alkaline non-cyanide electroplating bath to a thickness of from 0.05 to 0.2 mils. The zinc-coated parts are washed, and while still wet, are sprayed with an aqueous chromating solution. After rinsing and drying, a synthetic resin coating is applied to the chromate-coated parts by electrostatic powder spraying. The parts are then baked in an oven to fuse the resin coating. The method is particularly applicable to refrigerator racks.