Abstract: A wall of a four-piece mold is made by machining cooling channels into one side of a steel backup member. The cooling channels are filled with wax which is then covered with conductive paint or tape. A layer of copper is now electroplated onto the side of the backup member with the cooling channels, and nickel and chromium are plated over the copper in succession. Upon completion of plating, the wax is removed from the cooling channels by melting the wax. Alternatively to machining the cooling channels into the backup member, strips of plastic are adhesively secured to the backup member prior to plating. The plastic strips, which have widths and heights equal to the desired widths and depths of the cooling channels, are placed on the backup member at the intended locations of the cooling channels. Copper is plated onto the backup member to the height of the strips which are then removed to form the cooling channels.

Abstract: A composite material of silicon carbide particles in an aluminum matrix is base coated with a layer of a nickel-boron alloy by an electroless process. The base-coated composite material is heat treated at a temperature of about 450.degree. C. to interdiffuse the base coating with the composite material. A nickel or gold top layer is electrolytically deposited over the base coat on the heat-treated composite material.

Abstract: A method for manufacturing a porous blue light emitting diode comprising the steps of preparing a silicon substrate having a back surface, applying a conducting layer on the back surface, annealing the substrate coated with the conducting layer in an inert gas atmosphere, applying an anti-corrosion layer on the conducting layer, immersing the anti-corrosion layer-applied substrate in a hydrofluoric acid aqueous solution with a concentration of about 5% by volume, applying a voltage to the resulting layers for eroding the anti-corrosion layer-applied substrate to form a porous layer having Si wires on a top surface of the substrate, and oxidizing the porous layer for making sizes of the Si wires small enough for emitting light having a peak occuring at a wavelength shorter than about 520 nm. This method offers a simple and feasible way to fabricate a porous blue light emitting diode.

Abstract: This invention offers a method of manufacturing a matted electrodeposition coating composition which does not mask the hue and the fine pattern which are inherent to the thing to be coated and also offers a method of conducting such an electrodeposition. The invention also relates to a matted electrodeposition coating composition which is characterized in containing (A) an anionic acryl resin having an acetoacetyl group in a side chain, (B) an amine and water, (C) an aldehyde and (D) an alkoxylated methylolmelamine resin with a water dilutability of not more than 4.0 cc and optionally containing (D) an acidic composition with pKa of not more than 1.9 as well as a method of producing a matted electrodeposition coating using the aforementioned composition.

Abstract: Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.

Abstract: A ceramic thermal barrier coating layer for a superalloy article is caused to adhere to the superalloy article by applying platinum to the superalloy article and heat treating at a temperature of 1100.degree. C. to 1200.degree. C. for one hour. This causes aluminum to diffuse from the superalloy article into the platinum to form a platinum enriched outer layer which generally includes a platinum enriched gamma phase and a platinum enriched gamma prime phase. An alumina layer is formed between the platinum enriched outer layer and a ceramic coating. The platinum enriched gamma phase and the platinum enriched gamma prime phase in the outer layer reduces the migration of transition metal elements to the ceramic coating to enable a very pure alumina layer to be formed.

Abstract: The use of a bi-layer thin film structure consisting of aluminum or aluminide on a refractory metal layer as a diffusion barrier to oxygen penetration at high temperatures for preventing the electrical and mechanical degradation of the refractory metal for use in applications such as a capacitor electrode for high dielectric constant materials.

Abstract: A process for manufacturing an iridium and palladium oxides-coated titanium electrode comprises preparing a titanium substrate having a surface, applying iridium and palladium to be formed on the surface of the titanium substrate, and heat-treating the iridium and palladium oxides-applied titanium substrate to obtain an iridium and palladium oxides-coated titanium electrode. This invention provides a process for obtaining a coated titanium electrode having therein a good adhesion between the coating material and the titanium electrode, and having an excellent electrochemical stability and a superior catalytic activity in an acidic environment.

Abstract: A method for producing a metal film resistor including at least an insulating substrate, a resistor film of copper-nickel alloy formed on the surface of the insulating substrate, and a pair of terminals which are in contact with the resistor film is provided. The method includes a step of depositing the copper-nickel alloy by electroplating from an aqueous pyrophosphate bath containing a copper salt and a nickel salt at a bath temperature of 20.degree.-40.degree. C. and a pH of 6-8.

Abstract: The present invention relates generally to a new structure and method for capped copper electrical interconnects. More particularly, the invention encompasses a novel structure in which one or more of the copper electrical interconnects within a semiconductor substrate are capped to obtain a robust electrical interconnect structure. A method for obtaining such capped copper electrical interconnect structure is also disclosed. These capped interconnects can be a single layer or multi-layer structures. Similarly, the interconnect structure that is being capped can itself be composed of single or multi-layered material.

Abstract: A process for forming an electroconductive thin-film coil element uses an InNi alloy film which is heated to a temperature above its melting point and melted off together with an electrode used for electroplating.

Abstract: There is provided a new method of improving properties of the surface of an internal combustion engine valve made from titanium alloy, which comprises; the steps of (a) forming a surface undercoat layer of nickel on a surface of the engine valve; (b) heating the resulting nickel undercoated valve in vacuum or in an atmosphere of inert gas, at the temperature of 450.degree. C. to 600.degree. C., for one to four hours; (c) forming further a three component coat layer comprising nickel, phosphorus and particles of material selected from the group consisting of silicone carbide, silicone nitride, boron nitride, and the combination thereof, on the surface of the nickel undercoat layer; and (d) heating the resulting coat layer formed on the nickel undercoat layer, at the temperature of 350.degree. C. to 550.degree. C., for one to four hours, so as to make the particles of ceramic material uniformly and homogeneously dispersed in said coat layer.

Abstract: An apparatus and method for simultaneously anodizing the heads of several aluminum pistons includes a plating tank having an array of apertures extending through one of its side walls, one aperture for each piston; and means for securing the head of each piston in its respective aperture. A seal disposed in each aperture ensures that the aperture is sealed upon the securing of the piston therein, with only the piston's head being placed in fluid communication with the interior of the plating tank. An acid electrolyte is directed into the plating tank through electrically-conductive sparging nozzles positioned therein opposite the heads of the pistons, thereby forming an electrolytic cell with the pistons as anodes and the sparging nozzles as cathodes. A power supply simultaneously applies a current to the cell, i.e., across the electrolyte via the pistons and sparger nozzles, to effect electrolytic coating of each piston's head.

Abstract: An improved process is disclosed for deinking waste paper which contains laser, electrostatic, and other non-impact printing toners/inks to produce high quality (high brightness, little to no dirt content) pulp with little or no fiber loss. The process involves attachment of ink particles in the waste paper pulp to a magnetic carrier material with the help of an agglomeration agent followed by removal of the attached ink particles by magnetic separation. The magnetic treatment preferably is conducted at ambient or greater temperature, at neutral to alkaline pH, and at a low pulp consistency. Agglomeration and magnetite addition, followed by exposure of the repulped waste paper to a magnetic field provides near complete ink removal over exposure to the magnetic field without such pretreatment.

Abstract: Method for the manufacture of a photoelectrochemical cell and a cell made by this method. A disadvantage of such cells (1) is the fact that their efficiency is not sufficient for economic use. It is therefore the aim of the invention to avoid this disadvantage. The method according to the invention makes it possible to produce a photoelectrochemical cell (1) comprising a porous electrode (4), the effective surface of which is by a factor 700 greater than that of electrodes of comparable size.

Abstract: A method is disclosed for heating a portion of an article comprised of nickel, formed by electrodeposition, and possessing an internal stress sufficient to shrink the outer cross-sectional dimension upon application of heat, thereby shrinking the outer cross-sectional dimension of the heated portion. The method may be used to couple the article to other members such as end flanges without the use of an adhesive.

Abstract: A method of electrocoating an electroconductive substrate utilizes an aqueous electrocoating composition containing an electrodepositable water dispersible film forming polymer and a pigment grind composition. The pigment grind composition contains pigment, electrodepositable water dispersible acrylic polymer and a reactive diluent. The reactive diluent has a number average molecular weight of between about 200 and about 2500 and is selected from polyalkylene glycols, polyalkylene glycol ethers, glycol ether formals or mixtures of these. The pigment grind composition has a volatile organic content of less than two pounds per gallon. The method is particularly suitable for anodic electrodeposition.

Abstract: A process for producing a light absorption layer of a solar cell is disclosed, in which prior to heat-treatment, at least two of the following steps are performed in combination: (1) electrodeposition of a copper layer including selenium particles, (2) electrodeposition of an indium layer including selenium particles, (3) electrodeposition of a copper layer not including selenium, and (4) electrodeposition of an indium layer not including selenium. Control of copper, indium, and selenium contents becomes easier with this process.

Abstract: A method for forming an electrical interconnect on a substrate. At least one pad (14) is formed on a substrate (11). The pad (14) is formed having a non-wetting surface (12) and a wettable surface (13). Photoresist (44) is patterned on a substrate (41) forming a cavity on a pad (46) leaving a non-wetting surface (42) and a wettable surface (43) exposed. Interconnect material (56) is formed on a non-wetting surface (52) and a wettable surface (53) of pad 57. Interconnect material (56) is reflowed forming an interconnect ball (74) on a wettable surface (73). Surface tension causes interconnect material (56) when reflowed to flow from a non-wetting surface (72) to the wettable surface (73) and ball up to form the interconnect ball (74).

Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form through holes through the web.

Abstract: Processes and techniques are described for concurrent electroplating of yttrium, barium and copper from aqueous solution onto a desired substrate (e.g., nickel, nichrome or silver). Compounds of these elements are dissolved in aqueous solution with a complexing agent meeting defined criteria and then are placed in a plating cell in which the cathode is the substrate on which the elements are to be deposited. After the elements have been deposited, they are oxidized to provide the desired perovskite structure. The process may be continuous or non-continuous.

Abstract: A method of forming solid metal vias extending between the top and bottom surfaces of a substrate with the ends of the vias being substantially coplanar with the top and bottom surfaces. The method includes the steps of forming holes through the substrate, plating the interior of the holes with excess metal to fill the holes and extend beyond the ends of the holes, heating the substrate to cause the metal to melt and consolidate to form solid vias with domed ends, and lapping the top and bottom surfaces of the substrate to remove the domes. Conductive layers may then be formed over the vias. These layers may have windows over a portion of each via to provide an escape route for expanding fluids during further processing of the substrate.

Abstract: A process for forming a hard surface coating on titanium alloys includes providing a piece of material containing titanium having at least a portion of one surface to be hardened. The piece having a portion of a surface to be hardened is contacted on the backside by a suitable heat sink such that the melting depth of said surface to be hardened may be controlled. A hardening material is then deposited as a slurry. Alternate methods of deposition include flame, arc, or plasma spraying, electrodeposition, vapor deposition, or any other deposition method known by those skilled in the art. The surface to be hardened is then selectively melted to the desired depth, dependent on the desired coating thickness, such that a molten pool is formed of the piece surface and the deposited hardening material. Upon cooling a hardened surface is formed.

Abstract: A ceramic substrate is provided with filled via holes for electrical or thermal feedthrough to or from an electronic device, each via hole having at least one dimension from about 4 to about 50 mils. The via holes are filled with copper, silver or gold for high conductivity and the filling is without visible voids at a magnification of 1000 diameters. The filling is preferably hermetic and is achieved by first electrodepositing metal into the holes and extending therefrom as dumbbell shaped plugs and then heating the substrate to the melting point of the metal so that metal from the dumbbell ends enters the connecting portion within the via hole to seal any aperture therein.

Abstract: Substrates comprising blends of at least one polyphenylene ether and at least one poly(alkenylaromatic compound) (e.g., polystyrene) are treated with aqueous tetravalent cerium in a concentration of at least about 0.1 M, preferably acidified with nitric acid, to improve adhesion to metal coatings subsequently deposited nonelectrolytically; for example, by electroless deposition. The metallized articles are heat treated following metal deposition. Further metal coatings may be deposited, preferably followed by further heat treatment.

Abstract: A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before or simultaneously with last anodic oxidation step. The treated metal according to the invention is protected even at high temperatures and under conditions of thermal cycling.

Abstract: The invention relates to an improved process and apparatus for electroplating an object and removing the excess electroplating solution from the electroplating object. The improvement comprises performing the electroplating process utilizing an apparatus and in a manner which eliminates all waste rinse solution and which provides substantially complete recovery of the chemicals utilized, but not used up, in the plating process.

Abstract: Ceramic films and coatings, single or multi-layered, including superlattice, infiltrated with boride, carbide, nitride, oxynitride, and silicide were formed by methods which comprises of an electrochemical coating of a ceramic precursor by a constant or an amplitude-modulated electric current with a DC component in a medium containing at least one of the ionic species for the composition of the ceramic precursor, following single or multiple infiltration in a medium containing at least one of the compounds selected from a B-containing compounds, a C-containing compounds, a N-containing compounds, a Si-containing compounds, and a mixture thereof, by heating means selected from radio-frequency, microwave, thermal, flame, plasma, laser, and a mixture thereof.

Abstract: Electrodepositable compositions comprising active hydrogen-containing ionic resins, capped polyisocyanate curing agents and triorganotin catalysts are disclosed. The catalysts are liquid, can be easily incorporated into the electrodepositable compositions and surprisingly exhibit good catalytic activity at low levels.

Abstract: Addition polymer substrates comprising structural groups derived from olefinic nitriles and conjugated dienes, especially ABS resin substrates, are treated with aqueous tetravalent cerium in a concentration of at least about 0.1 M, preferably with a tetravalent cerium solution, to improve adhesion to metal coatings subsequently deposited non-electrolytically; for example, by electroless deposition. The metallized articles are heat treated following metal deposition. Further metal coatings may be deposited, preferably followed by further heat treatment.

Abstract: Highly conformal layers of either titanium, Ti, titanium nitride, TiN, or titanium oxide, TiO.sub.x, are formed on exposed surfaces of silicon substrates by first forming a very thin chemical vapor deposition (CVD) layer of either doped polysilicon or a chosen metallic silicide, such as titanium silicide, tungsten silicide, tantalum silicide, or molybdenum silicide on the exposed silicon surfaces and any masking material remaining thereon. Thereafter, the layered structure is transferred to an electroplating bath wherein a layer of titanium is plated on the surfaces of the metallic silicide film using either an aqueous electroplating solution, a non-aqueous solution or a molten salt solution. Then, the structure is transferred to either an anneal furnace or to a rapid thermal processor (RTP) and heated to a predetermined elevated temperature for a predetermined time in the presence of nitrogen, using either nitrogen gas, N.sub.2, or ammonia, NH.sub.

Abstract: An internal combustion engine valve (100) is provided having a stem (4) onto which a plating or coating of trivalent chromium is electrodeposited and which is then heated at a temperature of at least about 150.degree. F. for at least about 3 hours to provide a wear resistant surface that is superior to coatings of hexavalent chromium heretofor used for such purpose.

Abstract: Processes and techniques are described for concurrent electroplating of yttrium, barium and copper from aqueous solution onto a desired substrate (e.g., nickel, nichrome or silver). Compounds of these elements are dissolved in solution and then placed in a plating cell in which the cathode is the substrate on which the elements are to be deposited. After the elements have been deposited, they are oxidized to provide the desired perovskite structure. The process may be continuous or non-continuous.

Abstract: A copper substrate is immersed into a solution in which a Y-Ba-Cu-O series oxide superconducting fine powder is dispersed into an acetone solution and an electric field is applied thereto. A coating deposited on the copper substrate by electrophoresis is sintered with high temperature in vacuum or in an inert gas atmosphere and then subjected to heat-treatment for oxygen composition ratio in an atmosphere of oxygen or air under 500.degree. C. This method prevents occurrence of a CuO layer, which would conventionally be formed at an interface between a Y-Ba-Cu-O film and a Cu substrate disadvantageously, and moreover enables fabrication of superconducting coatings having satisfactory characteristics.

Abstract: A method for preparing decorative lacquered Ti-based articles is disclosed, which method comprises the steps of: (a) heating to 900.degree. to 1300.degree. in vacuum a base of titanium or its alloy whose surface serves as a base material, to grow the crystal grains on the surface of the base while simultaneously thermally etching the surface, so as to make the base surface uneven; (b) cooling the base; (c) etching the surface of the base with an etchant to enlarge the unevenness of the surface; (d) anodizing the base; (e) applying an undercoat onto the surface of the base; (f) optionally heating the undercoat to cure the same; and (g) further applying a coating onto the undercoat and then drying it. The method makes it possible to prepare decorative lacquered Ti-based articles having a Raden-, Hyomon- or Heidatsu, Kyushitsu- or Makie-like appearance utilizing titanium or its alloy as a base material.

Abstract: A method for manufacturing a heat transfer surface is disclosed wherein the surface of powder or string-shaped copper core material is coated with a coating material of a nickel compound or silver so as to form a coat treatment material which is deposited on a substrate. The coating material has a lower fusing point than the core material, and the coat treatment material is heated to a temperature between the fusing points of the core material and the coating material such that only the coating material is caused to fuse to the substrate so as to form a porous heat transfer material which exhibits improved bending strength.

Abstract: This invention is concerned with production of electrical devices comprising an electrodeposited conductive region free from cracking defects. In the production of a contact portion of the device from a metal strip electroplated with a conductive stripe of an alloy, the stripe exhibited, upon stamping and forming operation, cracked areas. Typically, the stripe coating on the metal strip, such as a copper bronze material, includes a layer of nickel, a layer of palladium alloyed with nickel, cobalt, arsenic or silver, and a flash coating of hard gold. The cracking defects were eliminated by subjecting the plated strip to an annealing treatment prior to the stamping and forming operation. After the heat-treatment, the stripe was free from cracks and separations between the successive layers.

Abstract: The present invention relates to a lead frame material for a semiconductor, which comprises a copper or copper alloy matrix having a layer obtained by applying an Ag-plating of a thickness of from 0.005 to 0.5 .mu.m on the surface of the matrix and diffusing Ag into the matrix by heat treatment.

Abstract: A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before the last anodic oxidation step. The treated metal according to the invention is protected even at high temperatures and under conditions of thermal cycling.

Abstract: A method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin and, if required, further applying an electrolytic copper plating successively thereto, wherein heat treatment is applied to the substrate after the electroless copper-plating treatment within a temperature range from 120.degree. to 420.degree. C. The metal plating layer has an excellent adhesion capable of withstanding thermal shocks. The substrate can be used for producing electronic parts having high reliability with stable operationability.

Abstract: Disclosed is a method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin, wherein the surface of a polyimide resin is first etched so as to form a hydrophilic denatured layer on the surface of the said polyimide resin and, after a catalyst is imparted to the substrate, the substrate is copper-plated and thereafter heat-treated at a temperature of 120.degree. C. or higher thereby to modify the hydrophilic denatured layer to a heat-resistant copper-diffusion preventing layer.

Abstract: A method for the manufacture of a metal-coated steel strip with improved surface structure, wherein the strip is electrolytically coated with one or more metal coatings and the last-applied coating is temporarily melted by supplying heat to the strip (melting-on), is characterized in that the heat supplied to the strip for effecting the melting-on is generated at least in part by an electric current which is at all times non-zero. The heat supplied to effect the melting-on substantially continously compensates heat loss from the strip to the surroundings during the melting-on, and may for example be generated by electrical resistance heating using only a direct current or using an alternating current on which is superimposed a direct current. The strips produced are free of the so-called woodgrain effect.

Abstract: Disclosed is a process for anodically oxidizing aluminum alloy surfaces as a pretreatment for structural adhesive bonds or laminates. The process is comprised of anodically oxidizing aluminum and its alloys in phosphorous acid containing electrolyte to form a porous film comprised of Al, O and P. This film provides a very effective substrate for adhesively bonding aluminum articles and laminates.

Abstract: A method for the formation of an electrolyte layer of solid electrolytic capacitors is provided. The method comprises: (1) forming an oxide film with dielectric properties on the surface of a porous electrode made of a valve metal, the electrode being electrically connected to an anode lead made of a valve metal, (2) impregnating the electrode, on which the oxide film has been formed, with a solution of manganese nitrate, (3) electrostatically depositing electrolyte powder particles on the surface of the electrode which has been impregnated with the solution, and (4) pyrolyzing the manganese nitrate to manganese dioxide to form an electrolyte layer on the surface of the oxide film.

Abstract: A method for fabricating conductors in dielectric trenches in a self-aligned manner. Interconnect modules with a high conductor density are achieved by using a copper-polyimide system as a versatile packaging approach. A photosensitive polyimide is applied to a substrate and lithographically patterned to form polyimide steps having a characteristic positive slope, between which are defined trenches in which the substrate is exposed. A thin electroplating seed layer is deposited over the polyimide steps and the substrate. Copper is electroplated into trenches, but does not plate onto the tops of the polyimide steps, since the electroplating seed layer at that location is not electrically connected to the electroplating seed layer in the bottom of the trenches. The electroplating seed layer on top of the polyimide steps is then removed by chemical etching, plasma machining, or ion-milling.

Abstract: An electrodeposition method wherein a conductive substrate such as, for example, a metal fastener is first coated by means of an anodic electrodeposition process, then subjected to thermal curing, and then subjected to a cathodic electrodeposition process. The anodic electrodeposition process is carried out until the coating insulates the substrate at which point the coating process stops. The curing step lowers the dielectric strength of the anodically deposited coating, thereby allowing the substrate to accept a cathodically deposited top coat. The resultant coated substrate demonstrates superior corrosion resistance properties and improved cosmetic appeal.

Abstract: Aluminum articles are provided with enhanced surface protection by initially abrading the surface to produce a surface microroughness of 400-700 microinches (RMS), and hard anodizing the roughened surface to a depth of at least 0.0020 inch. The anodized surface is then coated with a protective material to a thickness of 0.0005-0.015 inch. The protective coating materials may be fusible polymers which are fused on the surface or fluid organic coating compositions which are dried on the surface.

Abstract: Flow dividers for dividing a hot gas flow into serveral partial flows through parallel internal channels are used in heat exchangers and as catalyst carriers, and can be produced by shaping the flow divider from metallic aluminium through extrusion or winding, then converting it to hydrated aluminium oxide through anodic oxidation while it is slowly moving down into an electrolyte (4), and finally converting it to alpha-alumina through heat treatment.

Abstract: Engine components of steel or superalloy subject to wear from alternating friction at medium temperatures in the region of 700.degree. C. are provided with a protective wear-resistant coating bya) electrophoretic deposition of a metal-ceramic structure comprising a mixture of from 85% to 50% of metallic powder and from 15% to 59% of ceramic powder, the metallic powder being a cobalt-based superalloy of type KC 25 NW or of M Cr Al Y wherein M represents at least one metal chosen from the group consisting of Ni, Co and Fe with the possible addition of Ta, and the ceramic powder being an oxide such as Al.sub.2 O.sub.3 or Cr.sub.2 O.sub.3, a carbide such as SiC or Cr.sub.3 C.sub.2, a nitride such as BN or TiN, or a boride such as TiB.sub.2 ;b) electrolytic pre-nickeling said deposit in an electrolysis bath at a pH between 6 and 8, andc) electrolytic nickeling said pre-nickeled deposit in an acid bath of sulphamate type.

Abstract: Metallic patterns, such as printed circuits, are prepared by immersing metal substrates, bearing electrodeposited films and resist films in patterned areas, into an aqueous solution or dispersion of a hardening agent so that the hardening agent diffuses only into the electrodeposited film. This is followed by curing the hardening agent by heat or irradiation to render it resistant to the solvent used to remove the resist film and to the etchant solution for the metal exposed when the resist film is removed.