Abstract: A method of forming an undercut microstructure includes: forming an etch mask on a top surface of a substrate; forming, on a top surface of the etch mask, an ion implantation mask having a top surface that is smaller than the top surface of the etch mask and that does not extend beyond the top surface of the etch mask; ion implanting the substrate in the presence of the etch mask and the ion implantation mask so that a damaged region is generated at a depth below an area of the surface that is not masked by the ion implantation mask; and etching the surface of the substrate until the damaged region is removed.

Abstract: A micro-lens array and a method for fabricating a micro-lens includes forming a first lens formation material layer on and/or over a micro-lens formation area of a semiconductor substrate, and then forming a portion of the lens formation material layer as a first micro-lens using a first mask. A second lens formation material layer is formed adjacent to the first micro-lens on and/or over the micro-lens formation area. The second lens formation material layer is also formed as a second micro-lens using a second mask which is a different type from that of the first mask.

Abstract: To provide a pattern forming method including: providing an active species supply source to at least one of a mold structure having a plurality of concave portions in its surface, and an object to be patterned; pressing the side of the mold structure, where the concave portions are provided, against the object so as to encapsulate the active species supply source in the concave portions; and oxidatively decomposing parts of the object which are in positions corresponding to the concave portions, by irradiating the active species supply source with excitation light through one of the mold structure and the object.

Abstract: The present invention provides fabrication methods using sacrificial materials comprising polymers. In some embodiments, the polymer may be treated to alter its solubility with respect to at least one solvent (e.g., aqueous solution) used in the fabrication process. The preparation of the sacrificial materials is rapid and simple, and dissolution of the sacrificial material can be carried out in mild environments. Sacrificial materials of the present invention may be useful for surface micromachining, bulk micromachining, and other microfabrication processes in which a sacrificial layer is employed for producing a selected and corresponding physical structure.

Abstract: A method for manufacturing a magnetic write head having a non-magnetic step layer, non-magnetic bump at the front of the non-magnetic step layer and a write pole with a tapered trailing edge. The tapered portion of the trailing edge of the write pole is formed by a two step process that allows the write pole taper to be formed with greater accuracy and repeatability than would be possible using a single step taper process. An alternative method is also described on how to make a non-magnetic bump structure with adjustable bump throat height prior to Damascene side shield gap formation in a Damascene wrap around shield head.

Abstract: A method for manufacturing a magnetic write head having a tapered write pole as well as a leading edge taper, and independent trailing and side magnetic shields. The method allows the write pole to be constructed by a dry process wherein the write pole material is either deposited by a process such as sputter deposition or electrically plated and the write pole shape is defined by masking and ion milling. The write pole has a stepped feature that can either be used to provide increased magnetic spacing between the trailing shield and the write pole at a location slightly recessed from the ABS or can be magnetic material that increases the effective thickness of the write pole at a location slightly recessed from the ABS. A bump structure can be further built over that stepped feature to enhance field gradient as well as reduce trailing shield saturation.

Abstract: A method and system for fabricating magnetic transducer are described. The method and system include providing a main pole having a bottom, a top wider than the bottom, and a top bevel. A nonmagnetic gap covering the main pole is provided. A portion of the nonmagnetic gap resides on the top of the main pole. A first seed layer is provided. At least a portion of the first seed layer covers the portion of the nonmagnetic gap on top of the main pole. A portion of the nonmagnetic gap on the magnetic recording transducer is removed after the first seed layer is provided. A second seed layer is provided after the portion of the nonmagnetic gap is removed. The second seed layer covers at least the portion of the first seed layer. A wrap-around shield layer is provided on the second seed layer.

Abstract: A method for fabrication of features of an integrated circuit and device thereof include patterning a first structure on a surface of a semiconductor device and forming spacers about a periphery of the first structure. An angled ion implantation is applied to the device such that the spacers have protected portions and unprotected portions from the angled ion implantation wherein the unprotected portions have an etch rate greater than an etch rate of the protected portions. The unprotected portions and the first structure are selectively removed with respect to the protected portions. A layer below the protected portions of the spacer is patterned to form integrated circuit features.

Abstract: A method and system for fabricating a perpendicular magnetic recording head, and the head so formed, are described. The method includes depositing an underlayer directly on an insulating layer. The underlayer preferably includes at least one of a nonferromagnetic metal, silicon oxide, and silicon nitride. A pole layer, which has a pole removal rate, is provided on the underlayer. The method and system further include forming a perpendicular magnetic recording pole from the pole layer. The perpendicular magnetic recording pole has a top and a bottom that is narrower than the top. The process of forming the perpendicular magnetic recording pole further includes removing a portion of the pole layer such that a pole removal rate for the pole layer is less than or substantially equal to a removal rate of the underlayer during the removing step.

Abstract: A method of making an imprint template includes providing a transfer layer on a substrate and providing a layer of imprintable medium on the transfer layer, using a master imprint template to imprint a pattern into the imprintable medium, polymerizing the imprintable medium by exposing it to actinic radiation, then etching the resulting polymer layer, the transfer layer and the substrate such that the imprinted pattern is transferred to the substrate, the substrate thereby becoming an imprint template bearing a pattern which is the inverse of a pattern provided on the master imprint template.

Abstract: There is provided a method of making two electrically separated inductors using deposition and wet-etching techniques, which inductors are formed by interwinding one of the inductors within the other inductor on the same planar level. In still another aspect of the invention, there is provided a method of making various levels inductors, each level having at least two electrically separated inductors, using deposition and wet-etching techniques. The inductors on each planar level are formed by interwinding one of the inductors within the other inductor, and then stacking these in a preferred manner. In still another aspect, there is provided a manner of connecting together inductors formed according to the above methods in order to achieve various inductor configurations.

Abstract: A resist composition used for the imprint lithography process, a method for forming resist pattern using the same, an array substrate manufactured using the same, and method of fabricating the array substrate includes an additive and the adhesion promoter inducing the chemical bond of the base layer contacting to the UV curable resin. As a result, it is possible for the resist composition to form a high-resolution pattern and to improve the durability of the mold for molding a UV curable resin.

Abstract: Wire grid polarizers, methods of fabricating a wire grid polarizer and display panels including a wire grid polarizer are provided, the methods include preparing a mold having a lower surface in which a plurality of parallel fine grooves are formed, and arranging the mold on a transparent substrate. The plurality of parallel fine grooves are filled with a conductive liquid ink. A plurality of parallel conductive nano wires are formed on the transparent substrate by curing the conductive liquid ink. The mold is removed.

Abstract: A method and system provide a magnetic transducer that includes an underlayer and a first nonmagnetic layer on the underlayer. The method and system include providing a first trench in the first nonmagnetic layer. The first trench has at least one edge corresponding to at least one side shield. The method and system also include providing a second nonmagnetic layer in the first trench and providing a second trench in the second nonmagnetic layer. The method and system include providing the main pole. At least part of the main pole resides in the second trench. The method and system further include removing at least a portion of the second nonmagnetic layer between the edge(s) and the main pole. The method and system also provide the side shield(s) in the first trench. The side shield(s) extend from at least an air-bearing surface location to not further than a coil front location.

Abstract: At least one hollow zone is formed in a stack of at least one upper layer and one lower layer. The upper layer is patterned to form at least a first hollow region passing through said upper layer. The first hollow region is extended by a second hollow region formed in the lower layer by etching through an etching mask formed on the patterned upper layer. The etching mask is formed by a resin layer, positively photosensitive to an optic radiation of a predetermined wavelength, exposed to the said optic radiation through the stack and developed. The lower and upper layers of the stack are respectively transparent and opaque to said predetermined wavelength so that the patterned upper layer acts as exposure mask for the resin layer.

Abstract: An example method for manufacturing a magneto-resistance effect element includes forming a free magnetization layer and forming a spacer layer. The spacer layer is formed, for example, by forming a non-magnetic first metallic layer and forming a second metallic layer on a surface of the non-magnetic first metallic layer. A first irradiating process includes irradiating, onto the second metallic layer, first ions or plasma including at least one of oxygen and nitrogen and at least one selected from the group consisting of Ar, Xe, He, Ne, Kr, so as to convert the second metallic layer into an insulating layer and to form a non-magnetic metallic path penetrating through the insulating layer and containing elements of the non-magnetic first metallic layer. A second irradiating process includes irradiating second ions or plasma onto the insulating layer. A non-magnetic third metallic layer is formed on the non-magnetic metallic path.

Abstract: A method of chemically milling a workpiece includes depositing a masking material on portions of the workpiece according to a predefined masking pattern such that other portions of the workpiece that are desired to be milled are unmasked. Material from the unmasked desired milling areas of the workpiece is chemically removed.

Abstract: The invention is a method for making a master mold to be used for nanoimprinting patterned-media magnetic recording disks. The method uses conventional optical or e-beam lithography to form a pattern of generally radial stripes on a substrate, with the stripes being grouped into annular zones or bands. A block copolymer material is deposited on the pattern, resulting in guided self-assembly of the block copolymer into its components to multiply the generally radial stripes into generally radial lines of alternating block copolymer components. The radial lines of one of the components are removed and the radial lines of the remaining component are used as an etch mask to etch the substrate. Conventional lithography is used to form concentric rings over the generally radial lines. After etching and resist removal, the master mold has pillars arranged in circular rings, with the rings grouped into annular bands.

Abstract: A method for manufacturing a magneto-resistive device. The magneto-resistive device is for reducing the deterioration in the characteristics of the device due to annealing. The magneto-resistive device has a magneto-resistive layer formed on one surface side of a base, and an insulating layer formed of two layers and deposited around the magneto-resistive layer. The layer of the insulating layer closest to the base is made of a metal or semiconductor oxide. This layer extends over end faces of a plurality of layers made of different materials from one another, which make up the magneto-resistive device, and is in contact with the end faces of the plurality of layers with the same materials.

Abstract: In one general embodiment, a method for fabricating magnetic structures using post-deposition tilting includes forming a thin film magnetic transducer structure on a substantially planar portion of a substrate such that a plane of deposition of the thin film transducer structure is substantially parallel to a plane of the substrate. Additionally, the thin film transducer structure is caused to tilt at an angle relative to the plane of the substrate. The thin film transducer is fixed at the angle after being tilted.

Abstract: A method for self aligning a lapping guide with a structure of a write pole. A write pole is formed over a substrate and an electrically conductive material lapping guide material is deposited in a location that is removed from the write pole. A mask is then formed over a portion of the write pole and a portion of the electrically conductive material. A material removal process such as reactive ion etching can then be performed to remove a portion of the magnetic material that is not protected by the mask structure. An magnetic material is then electroplated over the write pole with the write pole, with the mask still in place. In this way, the electroplated material has an edge that is self aligned with an edge of the electrically conductive lapping guide material, both being defined by the same mask structure.

Abstract: A physical vapor deposition (PVD) system and method includes a chamber including a target and a pedestal supporting a substrate. A target bias device supplies DC power to the target during etching of the substrate. The DC power is greater than or equal to 8 kW. A magnetic field generating device, including electromagnetic coils and/or permanent magnets, creates a magnetic field in a chamber of the PVD system during etching of the substrate. A radio frequency (RF) bias device supplies an RF bias to the pedestal during etching of the substrate. The RF bias is less than or equal to 120V at a predetermined frequency. A magnetic field produced in the target is at least 100 Gauss inside of the target.

Abstract: A method for manufacturing a magnetic write head having a leading magnetic shield and a trailing magnetic shield that are arranged to prevent the lost of magnetic write field to the trailing magnetic shield. The write head includes a non-magnetic step layer that provides additional spacing between the trailing magnetic shield and the write pole at a region removed from the air bearing surface.

Abstract: A method in one embodiment includes forming a resist structure above an upper surface of a substrate, wherein a portion of the upper surface of the substrate is a shaping layer, wherein the resist structure has an undercut; depositing a layer of magnetic material above exposed regions of the substrate, wherein a portion of the layer of magnetic material tapers towards the substrate as it approaches the undercut; removing the resist structure; and forming a write pole above the layer of magnetic material. Additional methods are disclosed.

Abstract: Methods for forming an imprint lithography template are provided. Materials for forming the imprint lithography template may be etched at different rates based on physical properties of the layers. Additionally, reflectance of the materials may be monitored to provide substantially uniform erosion of the materials.

Abstract: A method provides a magnetic transducer that includes an underlayer and a nonmagnetic layer on the underlayer. The method includes providing a plurality of trenches in the nonmagnetic layer. A first trench of corresponds to a main pole, while at least one side trench corresponds to at least one side shield. The method also includes providing mask covering the side trench(es) and providing the main pole. At least a portion of the main pole resides in the first trench. The method also includes removing at least a portion of the nonmagnetic layer residing between the side trench(es) and the main pole. The method also includes providing at least one side shield. The shield(s) extend from at least an air-bearing surface location to not further than a coil front location.

Abstract: A method of forming patterns includes forming a layer composed of a ketene based random copolymer on a substrate, forming a block copolymer on the ketene based random copolymer layer and patterning the ketene based random copolymer layer by removing a part of the block copolymer and a portion of the ketene based random copolymer layer.

Abstract: The present invention provides a method for fabricating a submicron patterned sapphire substrate to be able to apply in GaN light emitting diode. The method includes the following steps: forming an etching stop layer on a sapphire substrate; forming a photoresist layer on the etching stop layer; making a photo mask to contact with the photoresist layer; illuminating the photoresist layer with a beam of light by using the photo mask, and developing the photoresist layer to transfer a submicron pattern from the photo mask to the photoresist layer; etching the etching stop layer by using the photoresist layer with the submicron pattern as a mask to form a first etching stop layer; and etching the sapphire substrate with the first etching stop layer to acquire a submicron patterned sapphire substrate.

Abstract: A method for manufacturing a perpendicular magnetic recording transducer is described. A metallic underlayer, an insulator on the metallic underlayer, and a metal mask on the insulator are provided. The metal mask has an aperture therein. A trench is formed in the insulator. The trench's bottom is narrower than its top and includes part of the metallic underlayer. The top has a width of not more than 0.28 micron. A nonmagnetic seed layer that substantially covers at least the trench bottom and sides and that has a thickness of at least five hundred Angstroms is provided. A perpendicular magnetic pole material is plated on at least part of the seed layer. A CMP is performed, removing part of the perpendicular magnetic pole material. A remaining portion of the perpendicular magnetic pole material forms a perpendicular magnetic recording pole. The nonmagnetic seed layer is a stop layer for the CMP.

Abstract: A method of making a microfluidic module is disclosed that includes forming a fluid flow channel in a self-bonding rebondable polyimide film to provide a channel sheet, the self-bonding rebondable polyimide film having a first mask layer self-bonded thereto; removing the first mask layer from the channel sheet after forming the fluid flow channel; and self-bonding the surface of the channel sheet exposed by removal of the first mask layer to a cover sheet.

Abstract: A method for manufacturing a magnetic write head that avoids the challenges associated with the formation of fence structures during write pole definition. A magnetic write pole material is deposited. A mask structure is deposited over the magnetic write pole material. The mask structure includes a first hard mask, a marker layer, a physically robust, inorganic RIEable image transfer layer, a second hard mask structure over the image transfer layer and a photoresist layer over the second hard mask. A reactive ion etching process can be used to transfer the image of the photoresist mask and second hard mask layer onto the image transfer layer. An ion milling is performed to define the write pole. A layer of non-magnetic material such as alumina is deposited. An ion milling is performed until the marker layer has been reached, and another reactive ion etching is performed to remove the remaining hard mask.

Abstract: A pattern forming method includes performing a first resist development during a first time period to a substrate obtained by coating a resist film having a predetermined thickness onto a predetermined film to be etched, measuring the film thickness of the resist film after the first resist development, writing a predetermined pattern corrected in dimension on the basis of an amount of reduction in thickness of the resist film on the resist film by using a charged particle beam, performing a second resist development during a second time period which is longer than the first time period to the substrate after writing the pattern, and etching the predetermined film to be etched by using the resist film after the second resist development as a mask.

Abstract: A perpendicular magnetic recording (PMR) head is fabricated with a self-aligned pole tip shielded laterally by a separated pair of side shields and shielded from above by an upper shield. The side shields are formed from a shield layer by a RIE process characterized by a mask and gases producing a variety of etch rates. The differential in etch rates maintains the opening dimension within the mask and allows the formation of a wedge-shaped trench within the shield layer that then separates the layer into two shields. The pole tip is then plated within the trench and an upper shield is formed above the side shields and pole.

Abstract: A manufacturing method for a magnetic head includes the steps of: forming a structure on a lower shield, the structure including a lower gap, a main magnetic pole and first and second side gaps; forming first and second side shields; forming an upper gap; and forming an upper shield. In the step of forming the structure, an initial lower gap layer is formed on the lower shield, the initial lower gap layer including a pre-lower-gap portion, and two to-be-removed portions that are located on opposite sides of the pre-lower-gap portion. Then, a protrusion including the main magnetic pole and the first and second side gaps is formed on the pre-lower-gap portion. With the top surface of the protrusion covered with a mask, the initial lower gap layer is etched in part to thereby form the lower gap.

Abstract: The invention is a method for making a master mold to be used for nanoimprinting patterned-media magnetic recording disks. The method uses conventional optical or e-beam lithography to form a pattern of generally radial stripes on a substrate, with the stripes being grouped into annular zones or bands. A block copolymer material is deposited on the pattern, resulting in guided self-assembly of the block copolymer into its components to multiply the generally radial stripes into generally radial lines of alternating block copolymer components. The radial lines of one of the components are removed and the radial lines of the remaining component are used as an etch mask to etch the substrate. Conventional lithography is used to form concentric rings over the generally radial lines. After etching and resist removal, the master mold has pillars arranged in circular rings, with the rings grouped into annular bands.

Abstract: The present invention relates to a method for adjusting the resonant frequencies of a vibrating microelectromechanical (MEMS) device. In one embodiment, the present invention is a method for adjusting the resonant frequencies of a vibrating mass including the steps of patterning a surface of a device layer of the vibrating mass with a mask, etching the vibrating mass to define a structure of the vibrating mass, determining a first set of resonant frequencies of the vibrating mass, determining a mass removal amount of the vibrating mass and a mass removal location of the vibrating mass to obtain a second set of resonant frequencies of the vibrating mass, removing the mask at the mass removal location, and etching the vibrating mass to remove the mass removal amount of the vibrating mass at the mass removal location of the vibrating mass.

Abstract: It is an object of the present invention to provide a method of manufacturing a semiconductor device that reduces the deterioration in processed configuration and the pattern roughness of a film to be processed, and is close to the original design and applicable to a dual damascene step and the like. The manufacturing method comprises a processing mask layer forming step of forming a processing mask layer (a lower organic film and a middle layer) comprising at least one film, and hardening treatment for at least one film of the processing mask layer by applying a film and heat hardening treatment; a processing mask layer etching step of applying a resist film for exposure to the processing mask layer, exposing and developing it to form a resist pattern, and etching the processing mask layer using the resist pattern as a mask; and a film to be processed etching step of etching the film to be processed using the pattern of the processing mask layer formed at the processing mask layer etching step as a mask.

Abstract: An exemplary method for manufacturing printed circuit boards is provided. In the method, a copper clad substrate having a copper layer thereon is provided. A surface of the copper layer is roughened by applying an atmospheric pressure plasma thereto. A photoresist layer is formed on the roughened surface of the copper layer. The photoresist layer is exposed. The photoresist layer is developed to form a patterned photoresist layer, thereby exposing portions of the copper layer. The exposed portions of the copper layer exposed are removed so that the remaining portions of the copper layer form electrical traces. The patterned photoresist layer is removed.

Abstract: Methods of preparing graphene nano ribbons may include forming a graphene sheet on at least one surface of a substrate, forming a plasma mask having a nano pattern on the graphene sheet, and forming a nano pattern on the graphene sheet by plasma treating a stack structure on which the plasma mask is formed.

Abstract: Fully monolithic gimbal-less micro-electro-mechanical-system (MEMS) devices with large static optical beam deflection and fabrications methods are disclosed. The devices can achieve high speed of operation for both axes. Actuators are connected to a device, or device mount by linkages that allow static two-axis rotation in addition to pistoning without the need for gimbals, or specialized isolation technologies. The device may be actuated by vertical comb-drive actuators, which are coupled by bi-axial flexures to a central micromirror or device mount. Devices may be fabricated by etching an upper layer both from the top side and from the bottom side to form beams at different levels. The beams include a plurality of lower beams, a plurality of full-thickness beams, and a plurality of upper beams, the lower, full-thickness and upper beams That form vertical combdrive actuators, suspension beams, flexures, and a device mount.

Abstract: A method of fabricating an electron source having a self-aligned gate aperture is disclosed. A substrate is deposited on a first conductive layer. Over the first conductive layer an emitter layer is deposited. The emitter layer includes one or a plurality of spaced-apart nano-structures and a solid surface with nano-structures protruding above the surface. An insulator is conformally deposited over the emitter layer surface and forms a post from each protruding nano-structure. A second conductive layer is deposited over the insulator and the second conductive layer and the insulator are removed from the nano-structures such that apertures are formed in the second conductive layer and at least the ends of the nano-structures are exposed at the centers of said apertures.

Abstract: A method of forming an undercut microstructure includes: forming an etch mask on a top surface of a substrate; forming, on a top surface of the etch mask, an ion implantation mask having a top surface that is smaller than the top surface of the etch mask and that does not extend beyond the top surface of the etch mask; ion implanting the substrate in the presence of the etch mask and the ion implantation mask so that a damaged region is generated at a depth below an area of the surface that is not masked by the ion implantation mask; and etching the surface of the substrate until the damaged region is removed.

Abstract: Transparent structures, electrochromic devices, and methods for making such structures/devices are provided. A transparent structure may include a transparent substrate having a plurality of micro- or nano-scale structures, at least one substance configured to block near-infrared or infrared radiation and partially cover at least substantial portions of the substrate and the plurality of micro- or nano-scale structures, and at least one photocatalyst configured to at least partially cover an outermost surface of the transparent structure.

Abstract: In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.

Abstract: A method of manufacturing a component, including providing a three-dimensional computer model of the component to be produced; deconstructing the three-dimensional computer model by defining a plurality of model slices; forming a plurality of metallic foils, where each foil corresponds to a specific model slice; assembling the plurality of formed foils in a tool to form a three-dimensional component stack; and bonding the three-dimensional component stack to form the component. Characteristics of the foils may differ in various portions of the stack, such as being a different material, having a different thickness, or having a different grain orientation. The control of dimensional tolerances of internal structures, such as cooling passages, in three dimensions is devolved into two separate steps of 1) selecting a thickness of each slice/foil, and 2) controlling in two dimensions a material removal process applied to the respective foil.

Abstract: The present invention relates to a door skin comprising an exterior surface having outer portions lying on a first plane, spaced grooves recessed from the plane of the outer portions, and tonal portions having a planar area and a plurality of spaced depressions recessed from the plane of said planar area. The present invention is also directed to a method of etching a plate, for use with a molded die set, for embossing a wood grain pattern in the door skin, and the etched plate formed therefrom.

Abstract: A manufacturing method of an MR element in which current flows in a direction perpendicular to layer planes, includes a step of forming on a lower electrode layer an MR multi-layered structure with side surfaces substantially perpendicular to the layer lamination plane, a step of forming a first insulation layer on at least the side surfaces of the formed MR multi-layered structure, a step of forming a second insulation layer and a magnetic domain control bias layer on the lower electrode layer, and a step of forming an upper electrode layer on the MR multi-layered structure and the magnetic domain control bias layer.

Abstract: Prior art designs of single pole writers have been limited by premature saturation at the tip. This limits the head field that can be achieved without simultaneously widening the write profile. This problem has bee solved by means of a vertical main pole whose thickness has its conventional value a short distance from the tip but that tapers down to a significantly reduced value as it approaches the tip. A process for manufacturing this tapered tip design is also presented.

Abstract: A method comprises an opposing step of arranging a light-shielding film 50 having a recessed surface 52 and a pinhole 54 formed within the recessed surface 52 such that an end face 54X of the pinhole 54 of the light-shielding film 50 on the recessed surface 52 side and a light exit surface 4B oppose each other, while the shortest distance A52 between the light-shielding film 50 and a medium-opposing surface S in a thickness direction of the light-shielding film 50 is shorter than the shortest distance A54 between the end face 54X of the pinhole 54 on the side opposite from a transparent substrate 58 and the light exit surface 4B; a light-emitting step of causing a light-emitting device 3 to emit emission light 3A; and a detecting step of detecting the light transmitted through the pinhole 54 after being emitted from the light exit surface 4B.

Abstract: A method of manufacturing a member with concave portions includes preparing a base material, forming a mask formation film on the base material, forming a number of openings in the mask formation film by laser irradiation treatments using a branching filter, and etching the base material to form the concave portions in the base material. The branching filter branches laser light into first laser beams and second laser beams. Each of irradiation regions of the mask formation film sequentially is subjected to the laser irradiation treatment, so that first openings are formed by the first laser beams and second openings are formed by the second laser beams. Each of the irradiation regions has portions where no opening is formed by the first beams of the laser irradiation treatment for the irradiation region while openings will be formed by the second laser beams in one or more of the subsequent laser irradiation treatments.