Abstract: A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a gate electrode opening; and a mushroom gate electrode structure formed on the semiconductor substrate via the gate electrode opening, the mushroom gate electrode structure having a stem and a head formed on the stem, the stem having a limited size on the semiconductor substrate along a current direction and having a forward taper shape upwardly and monotonically increasing the size along the current direction, the head having a size expanded stepwise along the current direction, and the stem contacting the semiconductor substrate in the gate electrode opening and riding the insulating film near at a position of at least one of opposite ends of the stem along the current direction.

Abstract: An ink composition for ink jet printing is provided which gives a cured object excellent in adhesion to metallic plates, resistance to etchants, and alkali removability and can be stably ejected with an ink jet apparatus. The ink jet composition for etching resists has a viscosity at 25° C. of 3-50 mPa s and includes monomers comprising: either a polymerizable phosphoric ester compound represented by general formula (I); a polyfunctional monomer having two or more ethylenic double-bond groups per molecule and having no phosphoric ester group, the content of the ethylenic double-bond groups being 4×10?3 to 8×10?3 mol/g; and a monofunctional monomer having one ethylenic double-bond group per molecule and having neither phosphoric ester group nor carboxy group. In the formula, X represents C1-3 alkylene, Y represents C2-3 alkylene, and R represents hydrogen or methyl.

Abstract: A method of correcting for pattern run out in a desired pattern in directional deposition or etching comprising the steps of providing a test substrate; providing a stencil of known thickness on the test substrate; providing a stencil pattern extending through the stencil to the test substrate.

Abstract: A processing method for transferring a relief pattern of a mold to a resist includes the steps of compressing the mold having the relief pattern against the resist on a substrate, irradiating an exposure light onto the resist through the mold, vibrating the mold and the substrate relative to each other during the irradiating step, and releasing the mold from the resist.

Abstract: A method of fabricating a single-pole perpendicular magnetic recording head to contain a bevel angle promotion layer that facilitates the fabrication of the bevel angle in a trapezoidal main pole. The bevel angle promotion layer is made of a non-magnetic material that is softer than the material (e.g., Al2O3) that normally underlies the main pole. In one embodiment, the bevel angle promotion layer is formed between an end of the yoke and the air bearing surface (ABS), with the top surface of the bevel angle promotion layer being substantially coplanar with the top surface of the yoke. In other embodiment the bevel angle promotion layer is integrated with a leading edge taper material, which is formed of a magnetic material, to broaden the magnetic flux path between the yoke and the main pole.

Abstract: A housing having a woven appearance includes a substrate and a plurality of groove groups formed on the surface of the substrate. The groove groups define the woven appearance and are formed by etching. The housing may be made by using a film having a lightproof areas and a light-transmissible areas, the lightproof areas defining a woven appearance. The film is placed over a metal substrate having light-sensitive materials formed thereon and radiated with light. The light passing through the light-transmissible areas of the film solidifies the light-sensitive materials. After, removing the film from the substrate and cleaning un-solidified light-sensitive materials from the substrate to expose areas corresponding to the lightproof area, and an etching process is carried out to form the woven appearance on the exposed areas.

Abstract: A method of manufacturing a magnetic write head that provides improved pole critical dimension control, such as improved track width control (improved sigma) and improved flare point control. The method involves a combination of several process improvements, such as photolithographically patterning a P2 pole tip defining photoresist frame using a zero print bias and also using a small flash field. The method also involves the use of a non-reactive ion etch to notch the first pole (P1) using the second pole (P2) as a mask.

Abstract: An example method for manufacturing a magneto-resistance effect element involves irradiating inert gas ions to enhance an adhesive force between an area around an oxide layer and a metallic layer.

Abstract: In one embodiment of the present invention, a method of producing a magnetic head slider comprises the steps of forming, on the air bearing surface of the slider, an air bearing surface overcoat, removing the surface region from a hard amorphous carbon film by the irradiation with an ion beam which is tilted with respect to a normal to the air bearing surface, and forming a rail in the air bearing surface on which the air bearing surface overcoat has been formed. A high density and covering performance are obtained when the angle of irradiating the ion beam is not smaller than about 60 degrees from a normal to the air bearing surface of the magnetic head slider and when the acceleration voltage for the ion beam is not higher than about 300 V in the step of removing part of the air bearing surface overcoat.

Abstract: A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.

Abstract: A method is provided for manufacturing a magneto-resistive device. The magneto-resistive device is for reducing the deterioration in the characteristics of the device due to annealing. The magneto-resistive device has a magneto-resistive layer formed on one surface side of a base, and an insulating layer formed of two layers and deposited around the magneto-resistive layer. The layer of the insulating layer closest to the base is made of a metal or semiconductor oxide. This layer extends over end faces of a plurality of layers made of different materials from one another, which make up the magneto-resistive device, and is in contact with the end faces of the plurality of layers with the same materials.

Abstract: A heat-ray reflective film, containing: a convex-concave portion formed by arranging a plurality of concave portions in one surface of the heat-ray reflective film using the surface as a base plane; and a conductive layer formed on a surface of the convex-concave portion, wherein each of the concave portions has a depth of less than 1 ?m, and the conductive layer has a thickness of 1 ?m or less, and wherein the convex-concave portion contains a slanted side wall, and the heat-ray reflective film satisfies the relationship of: (A/B)×100?20% where A denotes a projected area obtained by vertically projecting the slanted side wall of the convex portion onto a horizontal plane, and B denotes a projected area obtained by vertically projecting the entire concave portion onto a horizontal plane.

Abstract: A method for constructing a magnetoresistive sensor using an etch mask that is resistant to the material removal process used to define the sensor width and stripe height. The method may include the use of a Ta etch mask formed under a photoresist mask, and the use of an ion milling process to define the sensor. The etch mask remains substantially intact after performing the ion milling and therefore is readily removed by a later CMP process. The etch mask layer is also very resistant to high temperatures such as those used in a desired atomic layer deposition of alumina, which is used to deposit conformal layers of alumina around the sensor.

Abstract: A method for forming a pattern includes forming an etching object layer on a substrate, applying a resist on an etching object layer, the resist including a photo-initiator, and a liquid pre-polymer including a vinyl functional group and a hydrophilic functional group, shaping the resist using a mold plate having an imprint formed therein, and hardening the resist to form a resist pattern while the mold plate shaping the resist corresponding to the imprint.

Abstract: An etching resist containing a metallic oxynitride. The etching resist of the present invention can be suitably used, for example, in the production of a molded article for surface-working an optical member such as a microlens sheet, a light diffusing sheet, a non-reflective sheet, a sheet for encapsulating photosemiconductor elements, an optical waveguide, an optical disk, or a photosensor.

Abstract: A perpendicular write head includes a beveled main pole having corners defining a track width and having a planarized surface and encapsulated on either side thereof and below by an alumina layer, the alumina layer having a polished surface and extending above the main pole on either side thereof as steps.

Abstract: A method for manufacturing magnetic recording media is provided, by which a magnetic recording medium that has a recording layer formed in a concavo-convex pattern, a sufficiently flat surface, and good recording/reproducing properties can be manufactured. The method includes the steps of: depositing a first filling material over a workpiece to cover recording elements formed as convex portions of the concavo-convex pattern, and to fill at least part of a concave portion; depositing a detection material over the first filling material; depositing a second filling material over the detection material; and irradiating a surface of the workpiece with a process gas to flatten the surface. In the flattening step, a component of the detection material removed from and flying off the workpiece is detected to stop the irradiation with the process gas based on a result of detecting the component of the detection material.

Abstract: In an MR element, each of a pinned layer and a free layer includes a Heusler alloy layer. The Heusler alloy layer has two surfaces that are quadrilateral in shape and face toward opposite directions. The Heusler alloy layer includes one crystal grain that touches four sides of one of the two surfaces. In a method of manufacturing the MR element, a layered film to be the MR element is formed and patterned, and then heat treatment is performed on the layered film patterned, so that crystal grains included in a film to be the Heusler alloy layer in the layered film grow and one crystal grain that touches four sides of one of the surfaces of the film to be the Heusler alloy layer is thereby formed.

Abstract: A system and method for patterning a master disk or “stamper” to be used for nanoimprinting magnetic recording disks uses an air-bearing slider that supports an aperture structure within the optical near-field of a resist layer on a rotating master disk substrate. Laser pulses directed to the input side of the aperture are output to the resist layer. The aperture structure includes a metal film reflective to the laser radiation with the aperture formed in it. The aperture has a size less than the wavelength of the incident laser radiation and is maintained by the air-bearing slider near the resist layer to within the radiation wavelength. The timing of the laser pulses is controlled to form a pattern of exposed regions in the resist layer, with this pattern ultimately resulting in the desired pattern of data islands and nondata islands in the magnetic recording disks when they are nanoimprinted by the master disk.

Abstract: A method of removing an organic, preferably polymeric, light-emitting material (4) from defined areas of a substrate (1) comprises the steps of arranging a shadow mask (5) to overlie the organic material other than in the defined areas, and applying a beam of ions (7) to the defined areas through the mask. The method is useful in forming organic light-emitting diode arrays.

Abstract: At least one hollow zone is formed in a stack of at least one upper layer and one lower layer. The upper layer is patterned to form at least a first hollow region passing through said upper layer. The first hollow region is extended by a second hollow region formed in the lower layer by etching through an etching mask formed on the patterned upper layer. The etching mask is formed by a resin layer, positively photosensitive to an optic radiation of a predetermined wavelength, exposed to the said optic radiation through the stack and developed. The lower and upper layers of the stack are respectively transparent and opaque to said predetermined wavelength so that the patterned upper layer acts as exposure mask for the resin layer.

Abstract: The invention provides a laser etching method for optical ablation working by irradiating a work article formed of an inorganic material with a laser light from a laser oscillator capable of emitting in succession light pulses of a large energy density in space and time with a pulse radiation time not exceeding 1 picosecond, wherein, in laser etching of the work article formed of the inorganic material by irradiation thereof with the laser light from the laser oscillator with a predetermined pattern and with a predetermined energy density, there is utilized means for preventing deposition of a work by-product around the etching position.

Abstract: The invention relates to a method for producing a metallic pressed sheet or an endless strip, whereby a surface structure is produced by applying a mask for partial chemical passivation followed by chemical surface treatment. The invention also relates to a device for implementing said method. In order to significantly improve the reproducibility and the resolution of the mask obtained, the mask is produced from a UV-hardening lacquer which is applied by a suitable device. The resolution is improved by means of a nozzle matrix which sprays the UV-hardening lacquer in dots, the individual dots forming a pattern as a result of the overspraying thereof, thereby forming the mask to be produced. The UV-hardening lacquer is especially advantageous in that it can be removed from the surface very easily after the etching process, and enables a high reproducibility compared to the conventional screen printing methods.

Abstract: A mask fixture for etching an item includes: a top fixture disposed over the item, including a reservoir centered within the top fixture for containing an etchant; a bottom fixture underneath the item to be etched including a recessed surface area centered within the bottom fixture; and an etch-resistant window for holding the item to be etched, the etch-resistant window disposed entirely within the recessed surface area. In addition, a small via centered within and intersecting both the top and bottom fixtures acts as a path for a high intensity light beam.

Abstract: The present invention relates to a photochemical method for manufacturing nanometrically surface-decorated substrates, i.e. the creation of periodic and aperiodic patterns of highly ordered inorganic nanostructures on a substrate. This method is based on the selective photochemical modification of a self-assembled monolayer of metal compound loaded polymer core-shell systems on widely variable substrates. Light exposure through an appropriate mask causes selective chemical modification of the polymer core shell system. By subsequently placing the substrate in an appropriate chemical solution that eradicates the non-modified polymer, the pattern given by the used mask is reproduced on the surface. Finally, the remaining organic matrix is removed and metal salt is transformed to the single metal or metal oxide nanodots by means of gas plasma treatment.

Abstract: A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at least one side wall therein, defining an opening in the conductive layer. The conductive layer includes an end portion spaced from the opening, the end portion forming an acute angle with the substantially planar upper surface of the substrate. The at least one side wall is substantially perpendicular to the substantially planar upper surface of the substrate.

Abstract: A structure is provided that is formed with a template defining a pattern having nanoscale features. The template may be positioned on a substrate and include a resist layer having openings formed therein, where the template is configured to accommodate the controlled assembly of nanoscale objects.

Abstract: This invention provides a pattern reversal process for self aligned imprint lithography (SAIL). The method includes providing a substrate and depositing at least one layer of material upon the substrate. A pattern is then established upon the layer of material, the pattern providing at least one exposed area and at least one covered area of the layer of material. The exposed areas are treated to toughen the material and reverse the pattern. Subsequent etching removes the un-toughened material. A thin-film transistor device provided by the pattern reversal process is also provided.

Abstract: A cell tray has a multi-dimensional array of cells in precise, equally spaced wells (cubicles or silos) containing medium of interest. The ordered cell array enables automated processing as well as simultaneous monitoring and analyzing of a large matrix of cells, biological fluids, chemicals and/or solid samples. The invention is an integrated device and is fabricated into substrates similar to microscope slides. The ordered array of cells in precise locations helps in parallel analysis and processing of cells simultaneously. Each cell cubicle or silo in the array is located equidistant from its nearest neighbors in an orthogonal direction. The location of each well can be precisely measured and recorded in an automated processing system. Included in the bottom of each cell well is an optional micro-lens. An array of probes provides parallel cell processing and monitoring capabilities, including microinjection and microscope analysis.

Abstract: A method of manufacturing a micro flux gate sensor and a micro flux gate sensor manufactured according to the method are provided. The method includes operations of forming a lower coil portion of an excitation coil and a magnetic field detecting coil on a wafer, forming connection portions with a certain height at predetermined positions of the lower coil portion, forming a first insulation layer to cover the lower coil portion and the connection portions, forming a magnetic core on the first insulation layer, forming a second insulation layer to cover the magnetic core and forming an upper coil portion electrically connected to the connection portions to form the excitation coil and the magnetic field detecting coil, and forming a third insulation layer to cover the upper coil portion.

Abstract: A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern.

Abstract: The invention is directed to a radiation sensitive compound comprising a surface binding group proximate to one end of the compound for attachment to a substrate, and a metal binding group proximate to an opposite end of the compound. The metal binding group is not radiation sensitive. The radiation sensitive compound also includes a body portion disposed between the surface binding group and the metal binding group, and a radiation sensitive group positioned in the body portion or adjacent to the metal binding group. The surface binding group is capable of attaching to a substrate selected from a metal, a metal oxide, or a semiconductor material.

Abstract: A fine pattern is formed on a surface of a processing object without using photoresist. A wet etching for the processing object in an area to which ultraviolet light is applied is performed by bringing a solution in which nitrous oxide (N2O) is dissolved into contact with the processing object and applying the ultraviolet light to the solution in a vicinity of an area to the processing object other than portions shielded with a mask whereupon a light shielding pattern is formed.

Abstract: A method for fabricating sliders (magnetic heads) with a recessed surface around a magnetic feature such as the active components of the write head on the air-bearing surface (ABS) is described. An embodiment of the method applies a positive photoresist to the exposed ABS surface, a magnetic field is applied, then liquid ferrofluid is applied on top of the photoresist. The pole pieces around the write gap will interact with the applied magnetic field so that the field gradient is highest around the write gap and the mobile ferrofluid will preferentially collect in the areas of the surface having the highest magnetic field gradient. The opaque magnetic particles in the ferrofluid form an optical ferrofluid mask over the photoresist around the write gap. The unmasked surface of the slider is milled which results in the recession of material around the write gap.

Abstract: A method of manufacturing a magnetic head is disclosed. The steps of manufacture include the formation of an underlying layer made of a material whose etching rate of ion beam etching is higher than that of a magnetic alloy used to make a pole layer, and the formation of a magnetic layer, which includes a portion of the magnetic layer to be etched that will be formed into a track width defining portion by making its side surfaces sloped through etching. The magnetic layer is formed such that the portion to be etched is disposed on the underlying layer. The side surfaces of the portion to be etched by the ion beam etching are etched so that the magnetic layer is formed into the pole layer and so that the end face of the track width defining portion located in the medium facing surface has a width that decreases with decreasing distance from the substrate.

Abstract: A method of etching a metal by a reactive ion etching process is provided. The etchant gas chemistry for the reactive ion etching process consists essentially of NH3. The process is particularly suitable for etching superalloys, which etch only slowly using conventional metal etching techniques.

Abstract: Embodiments of the present invention include helical, ring bar and tunnel ladder slow wave structures (SWSs). Embodiments of methods of micro-fabricating such SWSs are also disclosed. Embodiments of high frequency electromagnetic devices including such SWSs are also disclosed. Exemplary high frequency electromagnetic devices may include a traveling wave tube, a traveling wave tube amplifier, a back wave oscillator, as part of a linear accelerator, a microwave power module, a klystron or a millimeter-wave power module.

Abstract: A read head for a disk drive and a method of fabricating the read head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures to define the electrically active region of the sensor are described. The invention deposits the GMR and lead layers before milling away the unwanted material. A photoresist mask with a hole defining the active area of the sensor is preferably patterned over a layer of DLC that is formed into a mask. A selected portion of the exposed lead material is then removed using the DLC as a mask defining the active region of the sensor. A photoresist mask pad is patterned to define the full sensor width. The excess sensor and lead material exposed around the mask is milled away. The layers for the hardbias structure are deposited.

Abstract: A main pole forming method is provided. The main pole forming method includes etching an exposed side face of a main pole layer, and the plated foundation film, thereby defining a recording track width. The method also includes etching the nonmagnetic insulating layer, and reattaching a material repelled from the nonmagnetic insulating layer to the side face of the main pole layer and a side face of the plated foundation film.

Abstract: A filter membrane, methods of making such filter membrane and apparatus employing such filter membrane are disclosed, in which the filter membrane is a monolithic polymeric membrane that includes a polymeric filter layer including a micron-scale precision-shaped pores and a polymeric support layer that has a precision-shaped porous support structure for the filter layer. Several methods are disclosed for making such a membrane using micromachining techniques, including lithographic, laser ablation and x-ray treatment techniques. Several filter apparatus employing such a membrane are also disclosed.

Abstract: A GMR read head for a magnetic head, in which the hard bias layers are fabricated immediately next to the side edges of the free magnetic layer, and such that the midplane of the hard bias layer and the midplane of the free magnetic layer are approximately coplanar. The positioning of the hard bias layer is achieved by depositing a thick hard bias seedlayer, followed by an ion milling step is to remove seed layer sidewall deposits. Thereafter, the hard bias layer is deposited on top of the thick seed layer. Alternatively, a first portion of the hard bias seed layer is deposited, followed by an ion milling step to remove sidewall deposits. A thin second portion of the seed layer is next deposited, and the hard bias layer is then deposited.

Abstract: A main magnetic pore layer is formed on an insulating layer flattened into a high-flatness surface, and a yoke layer having a large film thickness is formed under the main magnetic pole layer independently of the main magnetic pole. The main magnetic pole layer has a front end surface formed in a shape with a width size gradually increasing in a direction of track width as the front end surface departs farther away from an auxiliary magnetic pole layer. A perpendicular magnetic recording head can be provided which can suppress the occurrence of fringing in a recording pattern, and can form the main magnetic pole layer with high pattern accuracy, and can satisfactorily introduce a recording magnetic field to a fore end of the main magnetic pole layer.

Abstract: A method for fabrication of microscopic structures that uses a beam process, such as beam-induced decomposition of a precursor, to deposit a mask in a precise pattern and then a selective, plasma beam is applied, comprising the steps of first creating a protective mask upon surface portions of a substrate using a beam process such as an electron beam, focused ion beam (FIB), or laser process, and secondly etching unmasked substrate portions using a selective plasma beam etch process. Optionally, a third step comprising the removal of the protective mask may be performed with a second, materially oppositely selective plasma beam process.

Abstract: A method of fabrication of a magnetic head including a read head sensor includes providing a read sensor stack having a front edge, a rear edge, a right side edge and a left side edge, and at least one pinning layer. The left side edge, right side edge, front edge and rear edge of the sensor stack are milled. The read sensor stack is annealed in a magnetic field to set the final orientation of the pinning layer, and the read sensor stack is encapsulated in overcoat material having a front surface. A projected final ABS boundary is established which lies within the overcoat material. A trim range is established relative to the projected final ABS boundary. The front surface of the overcoat material is lapped until the overcoat front surface is within the trim range. Residual overcoat material is then removed by ion beam etching.

Abstract: A magnetic head fabrication process in which a stencil layer is deposited upon a plurality of sensor layers. A photoresist mask in the desired read track width is fabricated upon the stencil layer. A reactive ion milling step is then conducted to remove the unmasked portions of the stencil layer. Where the stencil layer is composed of an organic compound, such as Duramide and/or diamond-like-carbon, a reactive ion milling step utilizing oxygen species produces a stencil of the present invention having exceptionally straight side walls with practically no undercuts. Thereafter, an ion milling step is undertaken in which the sensor layers that are not covered by the stencil are removed. The accurately formed stencil results in correspondingly accurately formed side walls of the remaining central sensor layers. A magnetic head sensor structure having a desired read track width and accurately formed side walls is thus fabricated.

Abstract: A method for producing an article having a decorative coating includes depositing at least a first coating layer onto at least a portion of a substrate using a physical or chemical vapor deposition method in a vacuum chamber at sub-atmospheric pressure, the first coating layer comprising a first material having a first color. The method also includes patterning the first coating layer using a non-uniform patterning process to form a patterned coating layer having penetrations through which a portion of an underlying surface is visible, the underlying surface comprising a second material and having a second color that is visually contrasting to the first color. The patterned first coating layer comprises a decorative pattern comprising features distinguishable by an unaided human eye.

Abstract: Methods for fabricating sublithographic, nanoscale linear microchannel arrays over surfaces without defined features utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Embodiments of the methods use a multilayer induced ordering approach to align lamellar films to an underlying base film within trenches, and localized heating to anneal the lamellar-phase block copolymer film overlying the trenches and outwardly over the remaining surface.

Abstract: The present invention relates to a door skin comprising an exterior surface having outer portions lying on a first plane, spaced grooves recessed from the plane of the outer portions, and tonal portions having a planar area and a plurality of spaced depressions recessed from the plane of said planar area. The present invention is also directed to a method of etching a plate, for use with a molded die set, for embossing a wood grain pattern in the door skin, and the etched plate formed therefrom.

Abstract: A method of forming an image. The method includes: a transfer layer on a substrate; forming on the transfer layer, an etch barrier layer; pressing a template having a relief pattern into the etch barrier layer; exposing the etch barrier layer to actinic radiation forming a cured etch barrier layer having thick and thin regions corresponding to the relief pattern; removing the template; removing the thin regions of the cured etch barrier layer; removing regions of the transfer layer not protected by the etch barrier layer; removing regions of the substrate not protected by the transfer layer and any remaining etch barrier layer; and removing remaining transfer layer. The transfer layer may be removed using a solvent, the etch barrier layer may include a release agent and an adhesion layer may be formed between the transfer layer and the etch barrier layer. A reverse tone process is also described.

Abstract: A method of forming a planarized photoresist coating on a substrate having holes with different duty ratios is described. A first photoresist preferably comprised of a Novolac resin and a diazonaphthoquinone photoactive compound is coated on a substrate and baked at or slightly above its Tg so that it reflows and fills the holes. The photoresist is exposed without a mask at a dose that allows the developer to thin the photoresist to a recessed depth within the holes. After the photoresist is hardened with a 250° C. bake, a second photoresist is coated on the substrate to form a planarized film with a thickness variation of less than 50 Angstroms between low and high duty ratio hole regions. One application is where the second photoresist is used to form a trench pattern in a via first dual damascene method. Secondly, the method is useful in fabricating MIM capacitors.