Abstract: A system for generating a laser machined tool from a substantially cylindrical work piece. The system includes a laser producing a laser beam, a mask positioned within the laser beam for shaping the laser beam into an image, and an optical system for imaging the laser beam image onto the outer surface of the work piece. The system coordinates rotational and translation movements of the work piece with activation of the laser in order to use the laser image for ablating the outer surface of the work piece, creating microstructures within the surface of the work piece to form the cylindrical tool.

Abstract: The present invention relates generally to solar cells, material layers within solar cells, a production method of solar cells, and a manufacturing arrangement for producing solar cells. A solar cell according to the invention includes at least one layer with a surface, produced by laser ablation, wherein the uniform surface area to be produced includes at least an area 0.2 dm2 and the layer has been produced by employing ultra short pulsed laser deposition wherein pulsed laser beam is scanned with a rotating optical scanner including at least one mirror for reflecting the laser beam.

Abstract: A laser beam machining apparatus includes laser beam irradiation unit for irradiating a wafer held on a chuck table with a laser beam, and control unit. The laser beam irradiation unit includes a laser beam oscillator for oscillating a laser beam with such a wavelength as to be transmitted through said wafer, repetition frequency setting section for setting a repetition frequency of pulses in the laser beam oscillated from the laser beam oscillator.

Abstract: A method and apparatus for selective material removal and via drilling for semiconductor applications using an ultrafast laser pulse directly from an ultrafast pulse laser oscillator without amplification are disclosed. The method and apparatus includes techniques to avoid/reduce the cumulative heating effect and to avoid machine quality degrading in multi shot ablation. Also the disclosed method and apparatus provide a technique to change the polarization state of the laser beam to reduce the focused spot size, and to improve the machining efficiency and quality. The disclosed method and apparatus provide a cost effective and stable system for high volume manufacturing and inspection applications.

Abstract: A method of minimizing the deposition of debris onto a sample being ablated. The method comprises: 1) reducing a laser pulse energy to approximately a threshold level for ablation; 2) focusing the energy using an immersion object lens having a final element and 3) ablating a region of the sample using a multitude of laser pulses, each pulse being sufficiently separated in time to reduce a concentration of ablation products in a gas phase.

Abstract: The present invention relates to self-retaining (“barbed”) systems for surgical procedures, methods of manufacturing self-retaining systems for surgical procedures, included their uses and testing. In various embodiments of the invention, a device and method for barbing sutures uses a laser to cut the suture under appropriate temperature and tensile strength conditions. In various embodiments of the invention, a device and method tests the tensile strength and elasticity of a barbed monofilament or multifilament suture. In various embodiments of the invention, a potting material can be used to retain one end of the suture for manufacture or testing.

Abstract: Tuning fork and method in which a pair of elongated tines having front and rear surfaces are disposed symmetrically about an axis, and balancing masses on the front surface of one tine and on the rear surface of the other tine are trimmed to reduce quadrature error and also to maintain mass balance between the tines.

Abstract: The present invention aims to rapidly and easily create processed data for scan controlling a laser light beam, and to create the processed data for the laser processing apparatus at high precision. A setting plane corresponding to a scanning region of a laser marker is displayed on a processed data generating device. A user operates the processed data generating device to arrange the processing pattern on the setting plane. Here, a marker head coincides an optical axis of the laser light beam L on a position corresponding to the reference point of the processing pattern, and photographs a work W with a camera which light receiving axis is coaxial with the optical axis of the laser light beam L. A photographed image monitor displays the photographed image along with a symbol indicating the position of the light receiving axis of the camera.

Abstract: The present invention facilitates improvements in laser ablation of solid samples to be analyzed by an external inductively coupled plasma (ICP) emission spectrometer, ICP/mass-spectrometer (ICP-MS), or flowing afterglow (FAG) mass spectrometer (FAG-MS) for elemental analysis (ICP and ICP-MS) or molecular analysis (FAG-MS). A novel invention mirror-with-hole beam combiner eliminates chromatic aberration in the invention sample view and allows rad-hardening the laser ablation invention for use in a radiation hot cell for analysis of high activity nuclear waste. Many other novel invention rad-hardening attributes facilitate a comprehensive rad-hardened laser ablation system (the world's first).

Abstract: A method of providing a machine readable marking on a substrate being a part of an actuator is described, in which the marking includes at least first and second marks, and the method including repeatedly firing a laser device so that at each of a plurality of row positions of a first area of the substrate, substrate material is heated and displaced thus to provide a depression in the surface of the substrate at least partially surrounded by displaced material, the method including providing a plurality of rows of such depressions in the first area to form the first mark, repeatedly firing a laser device so that at each of a plurality of row positions of a second area of the substrate, substrate material is heated and displaced thus to provide a depression in the surface of the substrate at least partially surrounded by displaced material, the method including providing a plurality of rows of such depressions in the second area to form the second mark, and wherein each depression of the rows of depressions of

Abstract: The invention pertains to a large format, plotter-style automated laser engraver which can be used to engrave various materials. A cabinet body supports a substantially flat work surface which can be raised or lowered as desired. A gantry assembly is mounted in close proximity to such work surface, and facilitates movement of a focused laser assembly to any x/y coordinate along the work surface. A computer controlled wireless focus mechanism is used to regulate the vertical distance between the focused laser assembly and the work surface. Air is provided to cool the work surface during the engraving process.

Abstract: A laser treatment apparatus, configured for treating a workpiece, includes: a first laser generation device, a first optical assembly, a second laser generation device, a second optical assembly, a third laser generation device, and an optical detection device. The first optical assembly is configured for directing a first laser beam generated by the first laser generation device onto a first target of the workpiece. The second optical assembly is configured for directing a second laser beam generated by the second laser generation onto a second target of the workpiece. The first laser beam has a wavelength different from that of the second laser beam. The third laser generation device is configured for generating a third laser beam to strike on the first target and/or the second target. The optical detection device is configured for detecting a reflection part of the third laser beam reflected from the workpiece.

Abstract: A laser engraver comprises a glass laser tube and a modulation mechanism. The glass laser tube is used for outputting laser beam utilized by the laser engraver. The modulation mechanism is provided on the optical path of the output laser beam from the glass laser tube for adjusting the frequency of the output laser beam to achieve optimal engraving effect.

Abstract: A method for laser machining of material using a burst comprised of laser pulses. The method tailors the pulse width, pulse separation duration, wavelength and polarization of the multiple laser pulses included in a burst to maximize the positive effect of thermal and physical changes achieved by previous pulses that have impinged upon the machined material.

Abstract: The present invention relates to an apparatus for the manufacture of a metrological scale comprises a scale substrate (18), at least one laser (20) for producing scale markings on the scale substrate (18), a sensor (30) to detect the depth of the scale markings produced on the scale substrate (18), and a feedback system which uses data from the sensor (30) to adjust parameters of the system to produce scale markings with the desired depth.

Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam capable of passing through the workpiece to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, the laser beam application means comprising a laser beam oscillation means, an optical transmission means for transmitting a laser beam oscillated by the laser beam oscillation means, and a transmitting/converging means having a single condenser lens for converging laser beams transmitted by the optical transmission means, wherein the transmitting/converging means converges a laser beam oscillated from the laser beam oscillation means at two or more focusing points which are displaced in the direction of the optical axis and the processing-feed direction through the single condenser lens.

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract: Embodiments of a method of ablation are disclosed.

Abstract: A method for repairing molds for collapsible connections utilizing a femtosecond laser pulse length. Also provided is a laser source for implementing a multistep profile repair process for the removal of excess material in C4 molds by utilizing the femtosecond laser pulse lengths.

Abstract: An automated wire harness machine is capable of manufacturing a wire harness in an automated process. The wire harness is generally a plurality of bundled, preferably un-stripped, insulated wires. Each un-stripped end portion of each wire is preferably terminated by an electrical terminal in one of a series of electrical connectors of the wire harness. Each connector has at least one wafer which houses a plurality of terminals. The wire harness machine utilizes a pallet that holds all of the wafers of one wire harness. A conveyor transports the pallet and wafers through a series of stations which perform automated manufacturing steps. The first station is a terminal inserter which inserts and locks the terminals within pre-assigned cavities of the wafers. The next station is an automated wire loader which measures, cuts and crimps the two ends of each wire into the respective terminals of the loaded wafer assembly.

Abstract: Systems and methods are disclosed for the disassembly and preferably reassembly of semiconductor device packages. A method of the invention includes steps for excavating a portion of a semiconductor device package to expose a target surface within the interior of the package. The technique further includes steps of focusing a laser at a selected distance from the target surface in order to ablate the package material, exposing the target surface. Preferred embodiments of the invention are disclosed in which a cavity is excavated through the package to expose portions of leadfingers within. A temporary chip mount plate is affixed to an exterior surface of the package to cover one side of the cavity. A chip is attached to the temporary chip mount plate where it is electrically coupled to the leadfingers in the interior of the package. The contents of the cavity are then encapsulated with dielectric mold compound and the temporary chip mount plate is preferably removed to expose the backside of the chip.

Abstract: Disclosed is a dry cleaning apparatus and method for removing contaminants on a surface of a workpiece. The disclosed dry cleaning apparatus comprises a laser cleaning unit having a laser beam generator for generating a laser induced shock wave in the atmosphere, the laser cleaning unit being suitable for removing an inorganic contaminant on the surface of the workpiece using the generated laser induced shock wave; and a flash cleaning unit having a flash generator for generating a flash having pulse wave, the flash cleaning unit being suitable for removing an organic contaminant on the surface of the workpiece using the generated flash.

Abstract: Apparatus for coating a metal support material with a coating material in the form of a web, having a feed device (4) for feeding the support material to a coating bay and having a coating roller (7) cooperating with a counter-pressure roller (8) in order to adhere the metal support material and the coating material in the form of a web to one another by applying pressure forces, by means of an adhesive.

Abstract: A method of directing a pulse of laser energy though a workpiece. The workpiece has: a substrate that transmits the laser energy; focusing elements on a surface of the substrate proximal to the laser that focus the laser energy; and a coating on the substrate distal to the laser that absorbs a portion of the laser energy. Each focusing element focuses the laser energy to a point that removes or ablates a portion of the coating from the substrate to produce a hole in the coating.

Abstract: An object of the present invention is to provide a method of scribing and breaking a substrate made of a brittle material by which good-quality cutting surface of the substrate can be obtained without any defects such as chippings on the substrate.

Abstract: A machine for removing surfaces of semiconductors with integrated circuits, comprising laser emitters, at least one beam of which strikes at least one semiconductor wafer or at least one fragment thereof, for ablation of a surface layer of preset thickness, supports for the at least one wafer or fragment thereof, and movers for the relative movement of the emitters with respect to the at least one wafer or fragment thereof, the movers being adapted to make the emitters follow a path such that the at least one beam emitted thereby travels over the entire surface to be removed of the at least one wafer or fragment thereof.

Abstract: A laser engraving system (10) for engraving a unengraved workpiece (20) and an engraving method are provided. The laser engraving system includes an image processor (12), an engraving controller (13), a mechanical arm (14), and a laser (15). The image processor is configured for building a workpiece model (22) corresponding to an unengraved workpiece, partitioning the workpiece model into at least one section (224), generating at least one two-dimensional pattern (223). The engraving controller receives the signals of the relative position values and the at least one two-dimensional pattern. The mechanical arm is electronically coupled to the engraving controller and controlled by the engraving controller. The laser is electronically coupled to the engraving controller and controlled by the engraving controller in such a manner that the laser engraves an unegraved workpiece according to the at least one two-dimensional pattern.

Abstract: Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.

Abstract: A method for adjusting the relative position of devices of a laser engraver. The method includes an outputting device of the laser engraver to forms a marked point on a non-working piece. Let the outputting device position the center of the marked point and record it. Then an image sensing device of the laser engraver is moved to the marked point and seeks the center of the marked point. Then, the position point that the outputting device is located is recorded after the outputting device moved according to the movement of the image sensing device. Finally, calculating the distance between the center recorded by the outputting device and the position point recorded after the outputting device moved to obtain the precise distance between the image sensing device and the outputting device.

Abstract: A non-contact laser carving process and the equipment. By the orientation of an orienting module, the center of a wafer can be amended and oriented to the orienting module precisely. By the rotation of the orienting module and an optical sensor of a transmission mechanical module, the center of the wafer can be obtained precisely. By the compensation of the optical sensor, a specific boundary position is oriented. No matter what the external diameter of the wafer is, the specific boundary position in the wafer can be carved by laser precisely through the transmission mechanical module cooperated with a laser-carving unit, and a specific number can be carved at the specific boundary position of each wafer. Therefore, the wafer can be efficiently traced and controlled, and the amount of the wafer can be figured out easily to raise the quality of the wafer.

Abstract: A method for producing periodic structures at the surface of a sol-gel type, hybrid organic-inorganic or organic material, characterised in that it includes the step of directly illuminating the material with a laser beam having a uniform intensity profile at near-normal incidence, while moving said material and said laser beam relative to each other.

Abstract: A method for forming a solder resist pattern includes laminating a semi-cured thermosetting film on both sides of a substrate and laser ablating the laminated thermosetting film according to a solder resist mask pattern. The method is applicable to multilayer printed circuit boards, which are fabricated either by the buildup process or the parallel process. Lower manufacturing costs and improved accuracy of the solder resist pattern can be achieved due to the simplified process.

Abstract: Multiple laser beams selectively irradiate electrically conductive structures on or within a semiconductor substrate. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. One method propagates first and second laser beams along respective first and second propagation paths having respective first and second axes incident at respective first and second locations on or within the semiconductor substrate at a given time. The first and second locations are either on a structure in their respective rows or between two adjacent structures in their respective rows, which are distinct. The second location is offset from the first location by some amount in the lengthwise direction of the rows. The method moves the laser beam axes substantially in unison in the lengthwise direction of the rows relative to the semiconductor substrate, so as to selectively irradiate structures in the rows with the laser beams.

Abstract: A method of laser micro-machining, by means of a laser, a work piece (31) of the type described comprising the steps of: locating the workpiece on a carrier forming a part of a transport system whereby the carrier can be displaced along a path (P) parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by means of an output beam from the laser at a working datum position (A) defined relative to the path which path is established by means of the transport system to traverse the first datum position; a plane defined by the X- and Y-Axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser characterized by the steps of: maintaining distance between the datum position and a current first surface position of the work-piece in the vicinity of the datum position; and varyi

Abstract: A system for the laser scribing of semiconductor devices includes a laser light source operable to selectably deliver laser illumination at a first wavelength and at a second wavelength which is shorter than the first wavelength. The system further includes a support for a semiconductor device and an optical system which is operative to direct the laser illumination from the light source to the semiconductor device. The optical system includes optical elements which are compatible with the laser illumination of the first wavelength and the laser illumination of the second wavelength. In specific instances, the first wavelength is long wavelength illumination such as illumination of at least 1000 nanometers, and the second wavelength is short wavelength illumination which in specific instances is 300 nanometers or shorter. By the use of the differing wavelengths, specific layers of the semiconductor device may be scribed without damage to subjacent layers. Also disclosed are specific scribing processes.

Abstract: A machining apparatus in which the machining efficiency can be improved even if characters are machined in a printed circuit board. A coordinate transformation unit is provided for transforming central coordinates of each dot d of each character of a character string into coordinates in a machining coordinate system with which the holes will be machined. Prior to machining, based on a character string and position information of the character string described in a machining program, central coordinates of each dot of each character of the character string are transformed into coordinates in the machining coordinate system with which the holes will be machined. Each dot d is regarded as a hole and machined. The number of times of movement of a table can be thus minimized so that the machining efficiency can be improved.

Abstract: Embodiments of the present invention comprise an apparatus for laser marking individual objects with indicia at a marking station wherein a predetermined window exists during which each object can be marked as the objects are conveyed along at least one path at a predetermined speed, the apparatus comprising, at least first and second lasers positioned adjacent one or more paths configured to direct a laser beam onto the objects to mark the same with indicia as the objects pass through the marking station, with each of the first and second lasers marking alternate following objects as they pass through the marking station.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto distinct first and second structures in the row. The second spot is offset from the first spot by some amount in a direction perpendicular to the lengthwise direction of the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Abstract: A method for profiling the perimeter border of a semiconductor chip, characterized by the following steps: the semiconductor chip is supported near to the perimeter border on supporting points which are spaced apart in the perimeter direction of the semiconductor chip, laser beams are directed to the perimeter border with the aid of at least two lasers or of two lens systems coupled with at least one laser, which are arranged on the perimeter of the laser chip, the lasers or lens systems and the semiconductor chip are rotated in relation to each other around the centre of the semiconductor chip, and the lasers or lens systems are moved in a plane vertical to the rotational plane such that portions of the perimeter border between the supporting points are profiled by laser irradiation, subsequently, the supporting points on the semiconductor chip are changed and the remaining border portions of the perimeter border are profiled, and during profiling, the hitting point of the laser beams on the perimeter border

Abstract: This is an invention which addresses the need of the RFID industry to produce antennas which do not detune due to the proximity of other antennas. This invention also addresses the problem of reading RFID transponders which are not in a perpendicular orientation to the interrogator. This invention also addresses the need of the RFID industry to increase the read range of RFID antennas. Although this invention focuses primarily on the interrogator side of antenna gain and range enhancement it is equally applicable to the antenna portion of the base metal material which comprises the antenna structure of a transponder. The useful, non-obvious and novel steps of this invention include a laser ablation process applied to the base metal material, whether copper or aluminum, for the purpose of creating three dimensional nano structures on the surface of the base metal material.

Abstract: The present invention is to provide a method of trimming during short time without any difficulty of controlling a device for trimming and a trimming device having a simple structure. The method of manufacturing a resister device comprises: trimming a resister element 5 including a resister film 4 in order to adjust a resister value of the resister element 5, the resister film 4 contacting a pair of electrodes 3 for a resister formed on a substrate 2. A region of the substrate located in a position of a side portion 6 and along with the resister film 4 is heated in the trimming, the position being on a surface where the electrodes 3 for a resister and the resister film 4 are formed. The heating is performed by laser beam irradiation. The side portion 6 is irradiated by a laser beam to form a concave portion 7.

Abstract: A thermal edge finishing process includes preheating at least one cut edge of a glass sheet, laser finishing the edge to a single full continuous radius from a position orthogonal to the edge and in-plane with the glass sheet while continuing to heat the glass, and localized annealing of the edge to reduce residual stress from the laser/thermal treatment of the edge. By the present process, edge stress is reduced considerably, such as to less than 3000 psi, and more preferably to less than 2500 psi, and to as low as 1000 psi in the first 1 mm along the treated edge.

Abstract: A shape with a substantially perfect circle is obtained as a processed shape such as a modified shape or a worked shape at a light focus point in a cross-section in a direction parallel to an advance direction of a femtosecond laser light beam. A section in a direction perpendicular to an advance direction of a laser light beam emitted from a femtosecond laser (10) is formed in a predetermined shaped. The laser light of which sectional shape in the direction perpendicular to the advance direction is formed in the predetermined shape is entered into a lens (14). The light is focused by the lens inside a transparent material (100) and processes the inside of the transparent material.

Abstract: The invention provides a method of making a metal casing, including the following steps: (a) providing a roll of metal sheet; (b) sequentially pulling out a part of metal sheet from the roll of metal sheet; (c) etching a plurality of holes on the part of metal sheet; and (d) forming the part of metal sheet into the metal casing. Step (d) includes: implementing a surface treatment on the part of metal sheet and press forming the part of metal sheet into the metal casing. Therein the steps of the surface treatment and the press forming can be exchanged. Therefore, the method continuously makes the metal casing and avoids management problems of intermediate products induced in the process of a traditional production.

Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.

Abstract: A method for manufacturing a piezoelectric resonator is provided including: forming a resonator element having a plate-like base and a plurality of arms extending laterally from the base on a substrate made of crystal; emitting laser light for irradiating one surface and the other surface of the arms with laser light and for removing a region irradiated with the laser light, so as to form a groove having a predetermined cross sectional shape perpendicular to the longitudinal direction of the groove; forming a driving electrode on the resonator element.

Abstract: When capacity coupling between an output gate electrode (OG) and a last-stage transfer electrode is large at an output end of a CCD shift register, an electric potential of the OG is varied according to transfer clocks with the result that noise is liable to generate in an output signal. As measures for this, convex portions projecting horizontally are formed in those positions of the last-stage transfer electrode and the OG, which correspond to a channel region, and overlap between the electrodes is caused only on the convex portions. A clearance is formed between the OG and the transfer electrode except those locations, in which the convex portions are provided. In that location, in which the OG and the transfer electrode, respectively, are extended relatively lengthily toward wirings, the electrodes do not overlap each other. In this manner, capacity coupling between the electrodes is reduced.

Abstract: Disclosed herein is a processing apparatus using a laser beam, which includes a holder for holding a workpiece, and laser beam applicator for irradiating the workpiece, held by the holder, with a pulsed laser beam capable of passing through the workpiece, thereby deteriorating the workpiece. The laser beam applicator includes a pulsed laser beam oscillator and a transmitter/focuser for transmitting and focusing the pulsed laser beam oscillated by the pulsed laser beam oscillator. The transmitter/focuser focuses the pulsed laser beam, with a time difference provided, to at least two focus points that are displaced in the optical axis direction.

Abstract: A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.

Abstract: The present invention relates to an apparatus and a method for marking an object, particularly a vehicle, by disrupting the material of the interior or surface of the object. The system comprises a laser emitter (102), a laser beam delivery means (104) which can be flexible, and a marking heading (105) which is light enough to be carried by an operator. The laser marking system is very flexible in use, allowing many parts of objects, particularly vehicles, to be marked.