Abstract: The invention concerns a method and an apparatus for the laser machining of an unfinished object (27). The unfinished object (27) is to be formed into a cutting tool with a cutting edge (60) and a free surface (62). A laser is provided which generates laser beam impulses (24) which are directed by a redirecting arrangement (23) onto a surface (26) of the unfinished object (27). A laser beam impulse (24) reaches at an impact location the surface (26) of the unfinished object (27) under an inclination angle between the laser beam direction (R) of the laser beam impulse (24) and the surface (62) to be formed on the unfinished object (27). The redirecting arrangement (23) is controlled in such a way that the laser beam impulses (24) impact at adjacent impact locations on form and form a pulse zone (55).

Abstract: A laser processing machine that includes a chuck table adapted to hold a workpiece thereon and laser beam irradiation unit for applying a laser beam to the workpiece held on the chuck table. The laser beam irradiation unit includes: a laser beam oscillation section for emitting a pulse laser beam; a defection section for deflecting the pulse laser beam emitted from the laser beam oscillation section; and a concentrator having an ellipsoidal focusing spot forming section for focusing the pulse laser beam deflected by the deflection unit and forming a focusing spot into an ellipse.

Abstract: A system utilizes a laser to remove the mold compound of an IC without damaging the internal die, wire leads, solder connections and any other critical structures encapsulated within the mold compound, thereby leaving them available for the provisional and electrical analysis. A laser beam is focused through appropriate optics onto a plane corresponding to the surface of an IC. A layer of material which is opaque at the wave length of the laser beam is applied at the surface of the IC chip to be ablated prior to each pass of the laser. A spray nozzle may be provided to move in synchronous motion ahead of the laser being to apply coat of the opaque material.

Abstract: A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the substrate at least at approximately the area at which the laser energy is being directed. The assist medium is no longer provided prior to completion of formation of a feature in the substrate created utilizing the laser energy.

Abstract: A laser energy microinscribing system, comprising a semiconductor excited Q-switched solid state laser energy source; a cut gemstone mounting system, allowing optical access to a mounted workpiece; an optical system for focusing laser energy from the laser energy source onto a cut gemstone; a displaceable stage for moving said gemstone mounting system with respect to said optical system so that said focused laser energy is presented to desired positions on said gemstone, having a control input; an imaging system for viewing the gemstone from a plurality of vantage points; and a rigid frame supporting said laser, said optical system and said stage in fixed relation, to resist differential movements of said laser, said optical system and said stage and increase immunity to vibrational misalignments. The laser energy source is preferably a semiconductor diode excited Q-switched Nd:YLF laser with a harmonic converter having an output of about 530 nm.

Abstract: A system, apparatus, and method for a vertical marking system 100 comprising a means for marking 250 and a means for vertical positioning 200 wherein the means for marking 250 is attached with the means for vertical positioning 200. The vertical marking system 100 may include a means for moving the vertical stack of items 300 through the vertical marking system 100 whereby the vertical stack of items may transition from an entry end 320 of the vertical marking system 100 to an exit end 330 of the vertical marking system 100; a programmable control system 100 for adjusting the distance between multiple means for vertical positioning mechanisms; and a means for centering 400 the vertical stack of items in relationship to the means for marking 250.

Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.

Abstract: Embodiments of the present invention generally relate to an automated production line using a common laser scribe module for providing consistent scribe lines in multiple layers during the formation of thin film photovoltaic modules. The common laser scribe module includes a plurality of identical, programmable laser tools configured to emit radiation at a common wavelength. Substrates flowing through the production line are tracked by a system controller, which identifies available laser tools within the common laser scribe module and routes substrates to available tools for scribing features in one or more layers disposed on the substrates. The system controller also sets and controls laser parameters, such as power, pulse frequency, pulse width, and laser pattern, in order to accurately and consistently produce scribed lines in the appropriate material layer of the substrate.

Abstract: An optical element includes: a pit forming portion of a material that forms a pit in the vicinity of each focal point of a predetermined light beam upon condensation, wherein the pits are formed in such a manner that the volume percentage of the pits with respect to the material at distances from a light incident face becomes smaller away from the incident face.

Abstract: A laser material manipulation system is provided for material processing, such as laser ablation, laser deposition and laser machining. The system includes a laser for emitting laser pulses and a laser imaging device having an array of controllable imaging elements. The laser imaging device receives the laser pulses emitted from the laser, forms a laser image through the controllable imaging elements, and projects the laser image onto a target material which is to be processed. The projected laser image processes the material according to a desired pattern. The laser can be a femtosecond laser. The laser imaging device can be a liquid crystal display (LCD) or a digital micromirror device (DMD). An SEM can be used for monitoring the material distribution and dynamically adjust the laser image according to the monitor result.

Abstract: The invention relates to a device for inscribing identification plates (16) with a laser inscribing device, a support plane (14) for the identification plates (16), a writing head (20) for applying the inscription to the identification plates (16) and a displacement unit (18) for displacing the writing head (20) over the support plane (14). According to the invention, the laser inscribing device comprises a resonator (26) and a fixed pumped light source, physically separate from the resonator (26), connected to the resonator (26) by means of a waveguide (28) and the resonator (26) forms part of the writing head (20), or the laser inscribing device comprises a fibre laser (40) and an optic fibre (42), wherein the optic fibre (42) is connected at the first end thereof to the resonator of the fibre laser (40) for injecting the light emitted thereby and connected at the second end (44) thereof to the writing head (20).

Abstract: A method of manufacturing a light-emitting device using laser scribing to improve overall light output is disclosed. Upon placing a semiconductor wafer having light emitting diode (“LED”) devices separated by streets on a wafer chuck, the process arranges a first surface of semiconductor wafer containing front sides of the LED devices facing up and a second surface of semiconductor wafer containing back sides of the LED devices facing toward the wafer chuck. After aligning a laser device over the first surface of the semiconductor wafer above a street, the process is configured to focus a high intensity portion of a laser beam generated by the laser device at a location in a substrate closer to the back sides of the LED devices.

Abstract: Methods and related systems for fabricating a solar-cell assembly are provided. An example method comprises forming a series of layers and scribing a series of aligned interconnect lines in the layers prior to forming any isolation line related features. The example method provides for the use of contiguously-scribed interconnect lines as compared to an existing method where at least one interconnect line is segmented to avoid scribing through a previously-formed isolation line related feature located where an isolation line is to be scribed. The ability to use contiguously-scribed interconnect lines may improve the throughput of the fabrication process.

Abstract: A laser head is adapted to irradiate an interaction region of an inhabitable structure with laser light to remove material from the structure. The laser head includes a housing. The laser head further includes a connector coupled to the housing and optically coupled to a laser generator. The connector is adapted to transmit laser light from the laser generator. The laser head further includes at least one optical element contained in the housing and optically coupled to the connector. The optical element is adapted to receive laser light from the connector. The laser head further includes a containment plenum coupled to the housing. The containment plenum is optically coupled to the optical element to receive the laser light from the optical element. The containment plenum is adapted to confine the material and remove the material from the interaction region resulting from irradiating the structure with the laser light.

Abstract: A pattern forming apparatus for a light guide panel is provided. The apparatus includes a pattern design system, a control system, a header moving unit including an XY moving unit and a header unit, one or more laser systems, and two or more optical units. The pattern design system has an input of data on a pattern. The control system connects with the pattern design system and transmits a position signal. The XY moving unit mechanically moves up/down and left/right in response to the position signal. The header unit is coupled with the XY moving unit and reflects a scanned laser beam. The laser systems output laser beams by a pulse signal. The optical units each reflect and collect the laser beams.

Abstract: Embodiments of the present invention are directed to methods and systems for micromachining a conical surface. In one embodiment, such a system may include a rotating platform for receiving a long line of laser illumination, a mask having a predetermined pattern comprising a sector of a planar ring, the mask being positioned on the rotating platform, a workpiece stage having a rotational axis for rotating a removably-affixed workpiece comprising a conical surface, wherein the sector comprises the planar image of the conical surface, an excimer laser for producing a laser beam, a homogenizer for homogenizing the laser beam in at least a single direction, at least one condenser lens, a turning mirror and at least one projection lens.

Abstract: The disclosed invention provides tools and techniques for marking data on the surface of solid medications and tracking the medication in various ways using the data. According to preferred embodiments, an optical reader may be used to discern the features of data recorded on the surface of medication in a micromatrix pattern. The data read by the reader is then used in the performance of tracking and/or control tasks.

Abstract: Embodiments of the present invention generally relate to a system used to form solar cell devices using processing modules adapted to perform one or more processes in the formation of the solar cell devices. In one embodiment, the system is adapted to form thin film solar cell devices by accepting a large unprocessed substrate and performing multiple deposition, material removal, cleaning, bonding, testing, and sectioning processes to form one or more complete, functional, and tested solar cell devices in custom sizes and/or shapes that can then be shipped to an end user for installation in a desired location to generate electricity. In one embodiment, the system is adapted to form one or more BIPV panels in custom sizes and/or shapes from a single large substrate for shipment to an end user.

Abstract: Embodiments of the present invention generally relate to a process and apparatus for monitoring and controlling the accuracy and spacing of isolation trenches scribed in a solar module during the fabrication process. In one embodiment, encoder marks, and optionally, encoder lines are scribed into a front contact layer of a solar cell device substrate. The encoder marks and lines may then be used via one or more subsequent scribe modules to control the pulsing and positioning of a laser device to provide accurate and consistent trench lines in various layers of the completed solar module.

Abstract: A surgical system that ablates soft tissue. The system may include a fiber laser oscillator as the gain medium that emits electromagnetic radiation. The system may process the electromagnetic radiation, and direct the electromagnetic radiation on to the soft tissue to be ablated. Due at least in part to the nature of the electromagnetic radiation emitted by the fiber laser oscillator, the system may provide various enhancements, such as a higher power conversion efficiency, a longer lifetime, less heat dissipation, a more compact design, and/or other enhancements, for example. The system may also generate electromagnetic radiation with a relatively high beam quality. This may reduce beam divergence and beam spot size on targeted soft tissue, thereby enhancing power density in the electromagnetic radiation guided to the soft tissue. This enhanced power density may facilitate effective ablation.

Abstract: A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas.

Abstract: An apparatus for producing a personalized 3D object is disclosed. The apparatus, or kiosk, comprises a payment detector, a user input device and a display, an image acquisition system, calculators for calculating a 3D image, a manufacturing device and an exit for delivering the personalized 3D object to the user. The manufacturing device includes a loading device for loading blank 3D objects on a platform, which includes vertical storages and a rotatable tray disposed underneath having a slit therein for receiving the blank 3D objects. The rotatable tray is computer controlled to rotated between various operative positions for loading and unloading the 3D objects.

Abstract: A Plate polarising beam splitter 22 splits an incident laser beam 21 to form a first laser beam 24 and a second laser beam 25. The first laser beam is optically modified using an arcuate reflector 23 so that the first laser beam has a different divergence or convergence from that of the second laser beam. The first laser beam 24 is focussed at a first focus 27 on an optical axis of a focussing lens 26 and the second laser beam is focussed at a second focus 28 on the optical axis for machining a workpiece. The apparatus is suitable for machining with the laser beams steered by a galvanometer scanner.

Abstract: A method of dividing a wafer, comprising the steps of forming a deteriorated layer along streets in the inside of the wafer; affixing an adhesive film to the rear surface of the wafer; affixing the adhesive film side of the wafer to a dicing tape mounted on an annular frame; dividing the wafer into individual devices along the streets where the deteriorated layer has been formed by expanding the dicing tape; forming a dividing groove along the outer periphery of each individual device in the adhesive film by applying a laser beam through the spaces between adjacent devices while the dicing tape is expanded by carrying out the first tape expanding step; and dividing the adhesive film along the dividing grooves by further expanding the dicing tape from the state in which the first tape expanding step has been carried out.

Abstract: A laser is used to both score and emblazon a sheet to thereby provide a scored, emblazoned sheet. That scored, emblazoned sheet is then used to wrap an item (such as, but not limited to, a foodstuff item). By one approach this can comprise providing a plurality of lasers and exposing a substantially taut sheet to this plurality of lasers. So configured, these lasers are used substantially contemporaneously with one another such that each laser both scores and emblazons a corresponding portion of the substantially taut sheet to provide the aforementioned scored, emblazoned sheet.

Abstract: A laser processing apparatus including a laser beam applying unit. The laser beam applying unit includes a laser beam generating unit, a focusing unit, and an optical system for guiding a laser beam from the laser beam generating unit to the focusing unit.

Abstract: Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.

Abstract: A method of carrying out laser processing along processing lines having linear portions and curved portions formed on a workpiece by using a laser beam processing machine comprising a laser beam application means for applying a laser beam to the workpiece held on a chuck table which comprises a condenser for converging a laser beam, having a focal spot changing means for changing the shape of a focal spot between an elliptic spot and a circular spot, comprising the steps of: moving a processing line formed on the workpiece to the application position of a laser beam, activating the focal spot changing means to make an elliptic focal spot and positioning the long axis of the elliptic spot along a linear portion of the processing line when the linear portion of the processing line is located at the application position of the laser beam and activating the focal spot changing means to make a circular focal spot when a curved portion of the processing line is located at the application position of the laser beam.

Abstract: A method of thermally treating a surface of workpiece includes training a laser beam upon the surface and supplying a gaseous mixture to the surface. The mixture is configured with a process gas and at least one heat generating gas capable of having its molecules dissociate while generating an additional thermal energy which substantially raises the temperature of the surface.

Abstract: Laser scribing can be performed on a workpiece such as a substrate with layers formed thereon for use in a solar cell without need to move the workpiece during the scribing process. A series of lasers can be used to concurrently remove material from multiple positions on the workpiece. These laser outputs are directed to the workpiece using an optical system partially attached to a gantry. The gantry can be moved longitudinally and the portion of the optical system attached to the gantry can be moved laterally so that the combined outputs of all lasers can be directed to substantially any position on the workpiece without moving the workpiece.

Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.

Abstract: There is provided a method for creating a micro-topographical surface on biomedical implants that mimics a topography of bone to help facilitate osseointegration of the implant, as well as related devices and resulting implants. For example, a surface topography system is provided that includes a processor and a memory coupled to the processor. The processor is configured to process an image from a scanning electron microscope to determine a surface topography of bone. A surface manipulation device is configured to create the surface topography of bone on a surface of a biomedical implant.

Abstract: An exposure device engraves an image on the surface of a recording medium by scanning and exposing the recording medium with a light beam emitted from an exposure head. The exposure head comprises a light source for emitting a light beam, an exposure lens for causing the light beam to form an image on or close to the surface of the recording medium, a direction changer disposed upstream or downstream of the exposure lens in the direction in which the light beam travels, and/or inside of the exposure lens on the optical path of a light beam having a numerical aperture higher than a given numerical aperture to change the direction of the light beam having a numerical aperture higher than a given numerical aperture in such a manner as not to affect the process of engraving an image on a surface of the recording medium.

Abstract: A laser machining method includes directing pulse laser light onto a surface of a brittle material substrate, and a laser light scanning step for scanning laser light along a scribe-scheduled line. The laser intensity of the pulse laser light is 1.0×108 W/cm2 or greater and 1.0×1010 W/cm2 or less. The value obtained by multiplying the amount of heat input (J/cm2) by the linear expansion coefficient (10?7/K) of the brittle material is in a range of 3000 or greater and 100000 or less. Furthermore, the number of pulses within a square circumscribing the condensed light diameter of the pulse laser light is two or greater.

Abstract: A laser system (99) for patterning a mold insert includes a laser source module (10), a feedback module (20), and a controlling module (30). The laser source module includes a laser source (11) for emitting laser beams, and a lens module (10) with a changeable focal length configured for focusing the laser beams on the surface of the mold insert. The feedback module (20) is configured for receiving the laser beams reflected from the surface of the mold insert and generating a corresponding feedback signal according to the received laser beams. The controlling module is configured for receiving the feedback signal from the feedback module thereby controlling the laser source according to the feedback signal. A method for manufacturing the mold insert is also provided.

Abstract: A staggered laser-etch line graphic system, method, and articles of manufacture are provided. One described method includes the steps of laser engraving a first plurality of lines associated with a first component section of a graphic on a surface of an article; laser engraving a second plurality of lines associated with a second component section of the graphic on the surface of the article; and controlling said laser engraving of the first plurality of lines and said laser engraving of second plurality of lines to reduce the visual impact of a demarcation line separating the first component section of the graphic and the second component section of the graphic.

Abstract: An automatic leveling fixture includes a base, at least one jaw slidably connected to the base, a base plate slidable relative to the base. The at least one jaw has a base plate camming surface engaging the base plate and causing the at least one jaw to move a preselected distance relative to a distance moved by the base plate.

Abstract: A laser engraving mechanism (100) for engraving a workpiece (16) includes an image receiver (12), an image processor (13), an engraving controller (14), and a laser emitting member (15). The image receiver screens the workpiece to form an image of the workpiece and transforms the image of the workpiece into electronic image signals. The image processor is connected to the image receiver. The image processor saves a group of datum coordinates, forms a group of engraving coordinates according to the electronic image signals, and compares the engraving coordinates with the datum coordinates. The engraving controller is connected to the image processor. The laser emitting member is connected to the engraving controller, and the engraving controller instructs the laser emitting member to engrave the workpiece based on a comparison of results between the engraving coordinates and the datum coordinates.

Abstract: The present invention relates to a process for laser scoring of flat glass sheets. The process comprises manipulating a laser beam having a substantially Gaussian intensity profile to produce an elongated heating zone on the glass sheet to be scored, the elongated heating zone having a central portion with a lower temperature than a temperature of an outer portion of the heating zone. An initial crack is made in the glass sheet, the elongated heating zone is traversed across the glass sheet coincident with the initial crack, and the heated glass is thermally shocked by directing a cooled liquid against the heated glass, thus propagating the crack. The scored glass sheet may thereafter be broken by applying bending techniques as are known in the art.

Abstract: A laser scriber with a self-correcting mechanism comprises a laser scribing unit, a detection unit, a control unit and a drive unit. The laser scribing unit scribes a pattern on a solar panel according to a drive signal. The detection unit detects the pattern to generate a correction signal. The control unit corrects a scribing program based on the correction signal. The drive unit generates the above-described drive signal based on the scribing program. A self-correction method of a laser scribing process comprises the steps of: setting a scribing program on a laser scriber; fixing a solar panel to the laser scriber and performing a position calibration procedure; scribing a pattern on the solar panel via the laser scriber based on the scribing program; examining whether the pattern corresponds to a specification or not; and if no, automatically generating a patch program to replace the scribing program.

Abstract: A device (100) for stripping an outer covering (141) of a cable (140) includes a base (110) having a shaft (111) coupled thereto, a laser generator (130) configured for emitting a laser beam and a rotating arm (120). The shaft defines a central axis configured for coaxial alignment with the cable. The laser generator is arranged at rest relative to the rotating arm. The rotating arm includes at least one light directing member configured for directing the laser beam emitted from the laser generator to impinge upon a circumference of the outer covering of the cable. The rotating arm is rotatable relative to the central axis associated with the shaft in a manner such that the circumference of the outer covering of the cable can be impinged upon by the laser beam thus stripping the outer covering of the cable.

Abstract: The invention is directed to a method in which disks, particularly wafers, of brittle material are severed along planned severing lines by a laser by introducing thermal stresses. The temperature gradient required for this and the compressive stresses and tensile stresses resulting from it are generated in that the disk is first cooled proceeding from its underside at least along the planned severing lines toward the upper side of the disk, and the upper side of the disk is then acted upon by a laser beam along the planned severing lines. The description also relates to an apparatus for carrying out the method.

Abstract: Embodiments of the present invention are directed to methods and systems for micromachining a conical surface. In one embodiment, such a system may include a rotating platform for receiving a long line of laser illumination, a mask having a predetermined pattern comprising a sector of a planar ring, the mask being positioned on the rotating platform, a workpiece stage having a rotational axis for rotating a removably-affixed workpiece comprising a conical surface, wherein the sector comprises the planar image of the conical surface, an excimer laser for producing a laser beam, a homogenizer for homogenizing the laser beam in at least a single direction, at least one condenser lens, a turning mirror and at least one projection lens.

Abstract: The present disclosure relates to apparatuses and systems for laser scribing a vertically-oriented workpiece. In many embodiments, a laser-scribing apparatus includes a frame, a first fixture coupled with the frame, a second fixture coupled with the frame, a laser operable to generate output able to remove material from at least a portion of the workpiece, and a scanning device coupled with the laser and the frame. The first fixture is configured for engagement with a first portion of the workpiece. The second fixture is configured for engagement with a second portion of the workpiece. When the workpiece is engaged by the first and second fixtures the workpiece is substantially vertically oriented. The scanning device is operable to control a position of the output from the laser relative to the workpiece.

Abstract: Mastering tools and systems and methods for forming a plurality of cells on the mastering tools are provided. In particular, the systems vary the geometry of the cells or the placement of the cells, or both, for forming a textured surface on a mastering tool.

Abstract: During the production of a swage in a workpiece in which material is removed in layers by means of a laser beam the side walls of the swage are processed by means of a laser beam and/or a processing means and/or ultrasonic waves.

Abstract: Ultrashort pulse laser processing bores, welds or cuts objects (work pieces) by converging ultrashort laser pulses by a lens on the objects (work pieces) positioned at the focus and heating small spots or narrow lines on the objects (work pieces). Shortage of a focal depth of the lens prevents the ultrashort pulse laser processing from positioning the object (a work piece) and forming a deep, constant-diameter cylindrical hole. Z-parameter is defined to be Z=2fc?t/?i2, where ?t is a FWHM pulse width of the ultrashort pulse laser, ?i is a FWHM beam diameter of the ultrashort pulse, f is a focal length of the lens and c is the light velocity in vacuum. Selection of an optical system including a diffraction-type lens which gives the Z-parameter less than 1 (Z<1) prolongs the focal depth. Expansion of the focal depth facilitates the positioning of objects (work pieces) and enables the ultrashort pulse laser apparatus to bore a deep, constant-diameter cylindrical hole.

Abstract: The present invention relates to the apparatus, system and method for dicing of semiconductor wafers using an ultrafast laser pulse of femtosecond and picosecond pulse widths directly from the ultrafast laser oscillator without an amplifier. Thin and ultrathin semiconductor wafers below 250 micrometer thickness, are diced using diode pumped, solid state mode locked ultrafast laser pulses from oscillator without amplification. The invention disclosed has means to avoid/reduce the cumulative heating effect and to avoid machine quality degrading in multi shot ablation. Also the disclosed invention provides means to change the polarization state of the laser beam to reduce the focused spot size, and improve the machining efficiency and quality. The disclosed invention provides a cost effective and stable system for high volume manufacturing applications.

Abstract: A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed.

Abstract: A laser inscribing station controls the inscribing position (BP) of a laser beam in terms of two coordinates, one pair of feed and pressure rollers is disposed on both the infeed side and the outfeed side of the station. The credit card is positioned aligned in parallel lateral guide tracks, which are disposed in a turning mechanism together with a transfer conveyor, which displaces the credit card to such an extent that it is inserted in a first transfer position from the pair of infeed rollers into the guide tracks. In a second transfer position, the credit card is is held between the rollers pairs in such a manner that its entire surface is freely accessible for laser inscription. In a third transfer position, the card can be seized by the pair of outfeed rollers.