Abstract: A laser inscribing station controls the inscribing position (BP) of a laser beam in terms of two coordinates, one pair of feed and pressure rollers is disposed on both the infeed side and the outfeed side of the station. The credit card is positioned aligned in parallel lateral guide tracks, which are disposed in a turning mechanism together with a transfer conveyor, which displaces the credit card to such an extent that it is inserted in a first transfer position from the pair of infeed rollers into the guide tracks. In a second transfer position, the credit card is is held between the rollers pairs in such a manner that its entire surface is freely accessible for laser inscription. In a third transfer position, the card can be seized by the pair of outfeed rollers.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses and light illumination to a coated surface. Reflected light resulting from the light illumination impinging the coated surface is directed to a photosensitive detector and analyzer. The reflected light is either sensed directly from the coated surface by the photosensitive detector or the reflected light is directed along at least a portion of the common optics path to the photosensitive detector. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the coating removal apparatus is configured as a head component coupled to a body component.

Abstract: At least one exemplary embodiment is directed to a laser processing apparatus that can use the shape of a plurality of reflected light fluxes to adjust the position of workpiece relative to an optical system, where the laser processing apparatus facilitates both the viewing of the workpiece and a focusing of a processing laser into the workpiece.

Abstract: A jig is disclosed for properly positioning an article to be engraved by a laser engraving machine along with a method of using the jig and machine. The jig includes a light source that projects beams of light onto an article to be engraved. The light beams typically intersect and thereby indicate the correct location for the article to be positioned for engraving. A retaining device is provided to engage the article and hold it in the proper place during engraving.

Abstract: According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.

Abstract: A system and associated method of marking a molded vehicle tire with laser engraved information to provide both human visible and machine readable data concerning the tire. Information contained in a barcode on the tire is read at a first station and supplied to a control unit. The physical location of human visible information previously molded into the tire is read from the tire at a second station and supplied to the control unit which uses this information to position a laser located at a third station for engaging additional human visible information pertaining to the manufacture of the tire adjacent the existing visible information to satisfy the Department of Transportation (DOT) tire marking requirements. The additional information also can be laser engraved into the tire in a machine readable encoded format, such as 2D symbols, for subsequent control and verification throughout the life of the tire.

Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate.

Abstract: It is to provide a method for removing a tin defect present on the surface of a glass substrate produced by a float process in a short time without the glass substrate surface being damaged regardless of the glass temperature. A method for removing a tin-containing foreign matter from the surface of glass, which comprises applying to the surface of a glass substrate produced by a float process a pulse laser beam having a transmittance of at least 70% through the glass substrate and having a pulse width, a wavelength and an energy density per unit area on the glass substrate surface which satisfy specific relations, to remove a tin-containing foreign matter present on the rear face opposite to the face irradiated with the pulse laser beam.

Abstract: In a manufacturing process of a semiconductor device, a manufacturing technique of a semiconductor device by which a lithography step that uses a photoresist is simplified is provided. A manufacturing cost is reduced and throughput is improved. An irradiation object is formed over a substrate by sequentially stacking a first material layer and a second material layer. The irradiation object is irradiated with a first laser beam that is absorbed by the first material layer and a second laser beam that is absorbed by the second material layer so that the laser beams overlap. A part or all of the region irradiated with an overlap part of the laser beams is ablated to form an opening.

Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit along with a system to transmit or focus the beam. The unit is mounted on a conditioning arm, such that the laser beam may be directed perpendicular to the plane of the polishing pad, which is next to the polishing platen. The conditioning arm is capable of moving across the polishing table to scan the pad radius, allowing the laser to traverse the pad radius.

Abstract: A method of selectively ablating an undesired material from a substrate includes providing a substrate with two regions; providing laser pulses; tuning a wavelength of the laser pulses to match a desired wavelength characteristic of a material and directing the tuned laser pulses onto the substrate; and controlling a pulse duration, wavelength, or both, of the laser pulses to ablate the undesired material without damaging the substrate or any adjacent material. In another embodiment, an apparatus for repairing a defect on a reflective photomask includes a femtosecond pulse width laser; a harmonic conversion cell; a filter for passing a selected EUV harmonic of the laser light; a lens arrangement configured to direct the selected EUV harmonic of the laser light onto the photomask; and a control unit connected to the laser to control an ablation of the defect on the reflective photomask.

Abstract: A new technique and Method of Direct Coulomb Explosion in Laser Ablation of Semiconductor Structures in semiconductor materials is disclosed. The Method of Direct Coulomb Explosion in Laser Ablation of Semiconductor Structures provides activation of the “Coulomb explosion” mechanism in a manner which does not invoke or require the conventional avalanche photoionization mechanism, but rather utilizes direct interband absorption to generate the Coulomb explosion threshold charge densities. This approach minimizes the laser intensity necessary for material removal and provides optimal machining quality. The technique generally comprises use of a femtosecond pulsed laser to rapidly evacuate electrons from a near surface region of a semiconductor or dielectric structure, and wherein the wavelength of the laser beam is chosen such that interband optical absorption dominates the carrier production throughout the laser pulse.

Abstract: The invention relates to the general field of cutting machines using a laser beam; it relates more particularly to a system of slats for a laser-cutting machine table. These slats (8) each consist of a trough (9) containing a plurality of juxtaposed inserts (10) arranged parallel or substantially parallel to one another, each insert (10) taking the form of a folded thin sheet-metal plate comprising at least two parts connected along a fold line, a first part arranged substantially parallel to the direction of incidence of the laser beam and constituting a support strip whose free upper edge forms a support element for the product (4) to be cut, and a second part which is inclined with respect to the direction of incidence of the laser beam and constitutes an oblique strip for deflecting the laser beam (3).

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.

Abstract: The plate-making apparatus according to an aspect of the present invention includes an exposure head which engraves a surface of a plate material by emitting a light beam toward the plate material; a scanning device which performs exposure scanning by relatively moving the plate material and the exposure head; a correction profile generation device which generates a correction profile for correcting an emission amount of the light beam emitted by the exposure head according to a characteristic difference of the plate material; and an exposure control device which, when a correction profile for a plate material to be used is generated by the correction profile generation device, uses the correction profile for the plate material to be used to control the emission amount of the light beam.

Abstract: An apparatus and method for calibration of laser ablating energy versus ablating depth for a laser ablateable printing plate in relation to materials forming the printing plate, includes a memory for storing data, for each of a plurality of materials, corresponding to correlated different detected depths of each of a plurality of laser ablated areas with ablating energy levels. A first laser ablates a printing image of desired depth in a printing plate formed by a selected one of the materials. A first control device interpolates laser ablating energy levels for the printing image of desired depth in the printing plate formed by the selected material, in accordance with the stored data and the selected material, and controls the laser to laser ablate the printing image in the printing plate of the selected material in accordance with the interpolated laser ablating energy levels.

Abstract: A device transfer method is provided. The device transfer method is disclosed by which, when a laser ablation technique is used to selectively exfoliate devices arranged on a substrate, the energy is transmitted efficiently to transfer the devices with a high degree of accuracy and at a high speed. A laser irradiation apparatus is used which includes a laser light source for generating a laser beam, a reflection section for reflecting the laser beam toward a required direction, and a control section for controlling whether or not the laser beam is to be irradiated in an interlocking relationship with the reflection section. The laser beam is selectively irradiated on a plurality of devices arranged on a transfer source substrate to cause laser ablation such that the selected devices are transferred to a transfer destination substrate by the selective laser ablation.

Abstract: The invention provides methods and systems for the application and reading of micro markings for coding of information for placement on the surfaces of individual very small devices. In preferred embodiments, a two dimensional micro matrix of markings or dots is realized on a scale of a 25 um cell size and smaller.

Abstract: Combined illumination is used to detect the positions of features such as scribe lines in different layers of a workpiece. Because combinations of layers of different material can scatter, reflect, scatter, and/or transmit light in different ways, combining and adjusting such illumination can allow positions of multiple features to be detected concurrently, such that the position of a feature being formed in one layer can be adjusted to a relative position with respect to a feature in another layer, even where those layers are of different materials with different optical properties.

Abstract: A groove pattern is scribed into a silicon-nitride layer on a silicon wafer using four independently scanned, focused beams of laser radiation. Each focused beam is scannable within one of four scan-field positions on a turntable. The wafer is transported incrementally from the first scan-field position to the second, third and fourth scan-field positions. The scanned focused laser beam in each scan-field position scribes a portion of the groove pattern on the wafer, with scribing of the groove pattern being completed at the fourth scan-field position.

Abstract: An apparatus for marking plastic containers, comprising a marking device which applies a marking to the containers and a checking device which checks for the presence of the marking on the container. According to the invention, the checking device comprises a temperature-sensitive sensor.

Abstract: The present technology relates generally to laser ablation, and more particularly pertains to a system and method for eliminating structure and edge roughness, which is produced during the laser ablation of a material. Ablation of materials using a femtosecond laser beam produces a fine scale periodic structure in the ablated region. The structure consists of residual (i.e. unablated material) and is always perpendicular to the polarization direction of the laser beam. By changing the polarization direction during the ablation process, the structure is averaged over many directions and thus eliminated. This eliminates structure and edge roughness in a material caused by the laser ablation of the material. The method is employed to the repairing of photomasks so as to cause the optical quality thereof to be improved.

Abstract: A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed.

Abstract: The present invention provides a method of and apparatus for marking or inscribing a workpiece (3) with high-energy radiation, more particularly with a laser beam (1), the workpiece (3) having a light-scattering surface (9) and the material of the workpiece (3) being transparent for the radiation wavelength, and a polymer matrix (7) being disposed on the workpiece (3) in such a way that the radiation passes through the workpiece (3) and its light-scattering surface (9) before impinging on the polymer matrix (7), characterized in that the light-scattering surface (9) of the workpiece (3) is wetted with a liquid or viscoelastic medium (11).

Abstract: A spinning-type pattern-fabrication system comprises at least one carry table used to carry objects, an object-fixing device used to fix the objects onto the carry table, and a control system controlling carry table or at least one laser device. The control system controls the laser device to move linearly back and forth to enable the laser device to fabricate patterns on the objects with the laser beam emitted via the laser device.

Abstract: A method of evaluating laser trimming of a semiconductor device having a thin film resistor is disclosed. The method includes the steps of providing the thin film resistor and laser trimming the thin film resistor by creating a first trim cut. The first trim cut bisects the thin film resistor such that the thin film resistor is divided into a first portion and a second portion. Also, the method involves measuring the insulation resistance of the thin film resistor. In addition, the method involves evaluating the trim cut based on the measured insulation resistance.

Abstract: Along a region where a scribe line is formed on a surface of a glass substrate 50, a laser spot is continuously applied for heating at a temperature lower than a softening point of the glass substrate 50, and a region in the vicinity of the heated region is cooled. In this manner, a blind crack is formed along a line to be scribed. A detection unit 40 applies light to the blind crack, immediately after formed in the vicinity of to a cooling spot, through an optical fiber 41. When the blind crack has been formed, part of the light is obtained in the optical fiber 41 because of diffuse reflection. Therefore, detection of the level of this reflected light allows checking as to whether the blind crack has been normally formed or not.

Abstract: A system for multidirectional electromagnetic wave irradiation of an object to be processed has at least one of a side face irradiation prism system capable of irradiating a top face and one, two or more side faces of the object, and a bottom face irradiation prism system capable of irradiating a bottom face of the object. The side face irradiation prism system has an optical path direction changing prism placed so that each of the optical paths through which electromagnetic waves entering the optical path from above travel extends via the optical path direction changing prism to reach the side face of the object, without being obstructed. In this way, a laser machining apparatus or the like can be implemented which can simultaneously irradiate the faces of the object to be processed with electromagnetic waves with accuracy without moving the object to be processed.

Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.

Abstract: A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision. This laser processing method irradiates a substrate 4 with laser light L while using a rear face 21 as a laser light entrance surface and locating a light-converging point P within the substrate 4, so as to form modified regions 71, 72, 73 within the substrate 4. Here, the quality modified region 71 is formed at a position where the distance between the front face 3 of the substrate 4 and the end part of the quality modified region 71 on the front face side is 5 ?m to 15 ?m. When the quality modified region 71 is formed at such a position, a laminate part 16 (constituted by interlayer insulating films 17a, 17b here) formed on the front face 3 of the substrate 4 is also cut along a line to cut with a high precision together with the substrate 4.

Abstract: The invention relates to an installation that is used to perform operations for forming glass or crystal pieces (21), comprising: at least one drive wheel and at least one idler wheel (3); a support element which is driven by the drive wheel; main mandrels (7) which are supported by the support element and which, in turn, each support a first end of a glass or crystal piece (21); and work stations. According to the invention, at least one wheel takes the form of a carousel (2) which comprises secondary mandrels (8), numbering fewer than the main mandrels (7), and which co-operates with the moving support element. Each secondary mandrel (8) opposes a main mandrel (7) along a common axis (23) and supports the second end of the glass or crystal piece.

Abstract: A system for machining objects using a laser, including a supply of objects, an object support tray, a galvanometric head, a laser source, and a computer on which a shape recognition software is installed. The galvanometric head includes a first wide field camera, with a first filter located at the output of the first camera, a second narrow field camera, with a second filter located at the output of the second camera, guide mirrors, and a lens that displays at least one object or the part to be machined, located on the support tray.

Abstract: A laser beam processing machine comprising a laser beam application means for applying a laser beam to the top surface of the workpiece held on the chuck table, the laser beam application means comprising a processing laser beam oscillation means for oscillating a processing laser beam and a condenser for converging the processing laser beam oscillated by the processing laser beam oscillation means, wherein the laser beam processing machine further comprises a focal point position adjusting means for adjusting the position of the focal point of the processing laser beam converged by the condenser, a height position detection means for applying a detection laser beam to the workpiece through the focal point position adjusting means to detect the height position of the top surface of the workpiece based on its reflected light, and a control means for controlling the focal point position adjusting means based on the detection value of the height position detection means.

Abstract: The invention relates to a method for incorporating a structure (M) into a surface (O) of a workpiece (W) that is transparent in a certain wavelength range. For this purpose the surface (O) to be structured is brought into contact with a target surface (3) containing a target material by means of a laser beam (2), the wavelength of which is within the certain wavelength range, energy is introduced at least at one position through the workpiece (W) and into the boundary region (G) of the surface (O) of the surface (O) to be structured and the target surface (3) such that target material is deposited at the respective position in and/or on the surface (O) to be structured. For this purpose a pulsed laser beam (L) having a pulse repetition rate of more than 10 kHz is used, which is focused such that the focus is positioned on or under the target surface, wherein the laser beam has a power density in the focus of more than 2000 W/mm2.

Abstract: In laser engraving apparatus for engraving a gray-scale image on a plastic ID-card, the laser is a modulatable optically pumped semiconductor laser. Focusing optics focus a beam from the laser into a focal spot about 10 micrometers in diameter. The ID-card is mounted on a turntable which is rotated such that the focal spot sweeps over the ID card. The turntable is translated in a direction transverse to the rotation direction and the laser is modulated such that the engraved gray-scale image is formed by a matrix of parallel black lines of various length and spacing.

Abstract: A non-contact glass shearing device and a method are described herein that vertically scribes or cuts a downward moving glass sheet to remove outer edges (beads) from the downward moving glass sheet. In addition, the non-contact glass shearing device and method can horizontally scribe or cut the downward moving glass sheet (without the outer edges) so that it can be separated into distinct glass sheets.

Abstract: Methods and systems for laser soft marking, especially for semiconductor wafers and devices, are provided. A laser-marking system for marking a semiconductor wafer to form a softmark on the wafer is provided. The system includes a laser subsystem for generating one or more laser pulses and a controller operatively connected to the laser subsystem. The controller sets a laser pulse width of the one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths that affect the depth of a softmark that is to be formed. The mark depth is substantially dependent on the one or more set pulse widths. The controller further sets a pulse energy of the one or more output pulses to selectively provide the one or more output pulses having a set total output energy that is within an acceptable process energy window for producing the softmark.

Abstract: Systems and methods for removing material from a packaged electronic device of the type encapsulated with a protective material that forms an outer surface of the device. An exemplary system includes a stage for placing the device in a first position for receiving laser radiation to remove the material by ablation, and for placing the device in a second position for viewing one or more features along the outer surface of the device. An optical system is configured to provide an exterior image, including one or more features along an exposed surface of the device, while the device remains in the second position. A viewing system displays a captured image of the device, including one or more features interior to the protective surface, overlayed with the exterior image for simultaneous viewing of both images so that a position of a first feature present in the captured image can be viewed in relation to a position of a second feature in the exterior image.

Abstract: The present invention relates to a method for characterizing a material using active pyrometry. The material comprises at least one thin surface layer arranged on a thick substrate. The present invention heats the surface (ZTH) of the material by exposing the material to high-frequency laser pulses, so as to perform a series of temperature increase/decrease thermal cycles, accompanied by a heat build-up from one cycle to the next. The present invention collects the emitted radiation, acquires and processes the signals measured by comparing the measured values to the theoretical values obtained by modelling, so as to obtain thermo-physical properties for characterizing the material. The present invention also relates to a device for implementing the method comprising a high-frequency pulsed laser used as heat source.

Abstract: A contamination removal system for continuous cleaning of contamination from an exposed contaminated surface of a substrate by creating and moving a laser induced shock wave array across the contaminated surface includes a laser beam source and laser beam delivery assembly receiving a beam generated at the laser beam source and directing the beam for the generation of a shock wave array. The beam delivery assembly includes mirrors and beam splitters which split the laser beam into many laser beams. The contamination removal system also includes a control assembly composed of an analog or digital controller and a motion controller linked to the operating components of the present system and ensuring proper operation thereof. A substrate motion control/holder assembly supports the substrate adjacent the beam delivery assembly.

Abstract: Methods and systems process a semiconductor substrate having a plurality of structures to be selectively irradiated with multiple laser beams. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects a first target location on or within the semiconductor substrate. The method also generates a second laser beam that propagates along a second laser beam axis that intersects a second target location on or within the semiconductor substrate. The second target location is offset from the first target location in a direction perpendicular to the lengthwise direction of the rows by some amount such that, when the first target location is a structure on a first row of structures, the second target location is a structure or between two adjacent structures on a second row distinct from the first row.

Abstract: A laser beam machining method wherein machining areas in which to form machined grooves and machining start point areas in which to form shallow grooves shallower than the machined grooves are alternately set in each of streets formed on a wafer, and the machined grooves and the shallow grooves are continuously formed by scanning an irradiation point of a laser beam along each of the streets.

Abstract: An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the laser head. The apparatus further includes a controller electrically coupled to the laser base unit. The controller is adapted to transmit control signals to the laser base unit in response to user input.

Abstract: Methods and systems process a semiconductor substrate having a plurality of structures to be selectively irradiated with multiple laser beams. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects a first target location on or within the semiconductor substrate. The method also generates a second laser beam that propagates along a second laser beam axis that intersects a second target location on or within the semiconductor substrate. The second target location is offset from the first target location in a direction perpendicular to the lengthwise direction of the rows by some amount such that, when the first target location is a structure on a first row of structures, the second target location is a structure or between two adjacent structures on a second row distinct from the first row.

Abstract: A method and apparatus for laser engraving a three-dimensional pattern on a surface. A moveable laser head having a plurality of laser beams is provided. Preferably, the number of laser beams is four. Each beam is capable of being individually adjustably controllable. A carriage slideway is provided. The carriage slideway has a carriage axis whose length corresponds to the width of the roller that is to be engraved. The apparatus also has a laser slideway with an axis that is perpendicular to the carriage axis. The laser slideway is mountable to the carriage slideway such that the laser slideway is controllable to slide along the carriage axis slideway. The moveable laser head is mounted to the laser slideway such that the laser head is controllable to slide along the laser axis of the laser slideway. An indexing roller mechanism is provided when engraving rollers. When engraving flat surfaces, a second carriage slideway is substituted for the indexing roller mechanism.

Abstract: An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The waveform has a sub-nanosecond rise time. The system also includes a gain-switched, pulsed semiconductor seed laser for generating a laser pulse train at a repetition rate. The drive waveform pumps the laser so that each pulse of the pulse train has a predetermined shape. Further, the system includes a laser amplifier for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulses.

Abstract: A blade for rotating equipment. The blade includes a root and an airfoil with a leading edge attached to the root. The blade may include a laser shot peened root patch extending along the leading edge and the root.

Abstract: A device for depositing a wipe-proof and rub-proof marking or code marking, in particular a two-dimensional matrix or line coding onto glass receptacles such as glass ampoules, glass bottles, vials and likewise, comprises a transport means having a drive, with one or more accommodating devices for objects to be inscribed, a laser system arranged at a distance to the transport means with a laser source for producing a laser light beam of a wavelength <380 nm, said laser light beam in operation being directed onto the transport path and defining an impingement point in the region of at least one accommodating means moved along the transport path, means in order to deflect the laser light beam in a first and in a second direction continuously or in certain incremental intervals, and at least one control unit comprising a memory unit and a microprocessor which is in connection with the laser system and the deflection means, for controlling at least the deflection system and the laser system.

Abstract: To enable the amount of air capable of bringing smoke to the vicinity of a discharge opening of a gas discharge chamber to be sent into the gas discharge chamber. A cutting machine has gas discharge chambers arranged side by side by partitioning the inside of a table, blower openings each provided on one end side of a gas discharge chamber, gas discharge openings each provided on the other side of the gas discharge chamber, and fans for sending air, while moving to the outside of the table, to at least one gas discharge chamber from the blower opening of the gas discharge chamber and arranged in the direction of the movement. The fans are arranged at intervals such that two or more fans face the blower opening of one gas discharge chamber, and the two or more fans can simultaneously send air to the one gas discharge chamber.