Abstract: The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds.

Abstract: A system determines relative positions of a semiconductor substrate and a plurality of laser beam spots on or within the semiconductor substrate in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The system comprises a laser source, first and second laser beam propagation paths, first and second reflection sensors, and a processor. The laser source produces at least the first and second laser beams, which propagate toward the substrate along the first and second propagation paths, respectively, which have respective first and second axes that intersects the substrate at respective first and second spots. The reflection sensors are positioned to detect reflection of the spots, as the spots moves relative to the substrate, thereby generating reflection signals. The processor is configured to determine, based on the reflection signals, positions of the spots on or within the substrate.

Abstract: Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser beam generators fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser beam generators fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.

Abstract: The present invention relates to a method of dividing a plane-parallel plate made of a brittle material into a plurality of individual plates having a specified edge length, in which break-off cuts are made along specified scored lines that form a lattice-like pattern by introducing thermally induced stresses by means of a laser beam, and in which, after making the break-off cuts along a first working direction, the resultant plate strips are spaced out at intervals in that a framed stretch film to which the plane-parallel plate is bonded is stretched by means of a vacuum device. The invention also relates to a device with a special clamping table for use in carrying out the method.

Abstract: A laser machining device for forming dots on a substrate includes a light-combining assembly having a first reflection surface and a second reflection surface, a first laser source module, and a second laser source module. The first laser source module emits a first laser beam to the first reflection surface along a first light path. The second laser source module emits a second laser beam to the second reflection surface along a second light path. The light-combining assembly combines the reflected first and second laser beams into a third laser beam to focus on the substrate. The light-combining assembly is moveable between the first laser source module and the second laser source module. The second laser source module is fixed relative to the first laser source module, such that a sum of the length of the first light path and the length of the second light path is maintained constant.

Abstract: A laser cutting apparatus and a laser cutting method are provided which are adapted to concentrate laser light into a silicon substrate to produce a plurality of internal cracks. A light concentrating position, to which laser beams included in the laser light are concentrated, is temporally and spatially displaced to appropriately change lengths of the cracks according to positions in a direction of depth of the substrate. Consequently, the lengths of the internal cracks are controlled to surely lead a crack opening, the starting point of which is the internal crack formed by laser processing, to a predetermined cutting line on a surface of the substrate.

Abstract: Disclosed is a photovoltaic cell, a method of forming the photovoltaic cell, and a system for forming the photovoltaic cell. The photovoltaic cell includes a plurality of layers, at least one scribe disposed within the plurality of layers, and sidewalls delineating the scribe from the plurality of layers. At least a portion of the sidewalls includes material properties substantially consistent with the plurality of layers.

Abstract: Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irradiating at least one location on a multi-layer work piece with a laser beam, ablating material at the at least one location, detecting one or more characteristics of the material ablated at the at least one location and analyzing the one or more characteristics to identify a change in at least one of the one or more characteristics that indicates a change in the type of material being ablated. Related systems are also described.

Abstract: Methods and apparatus for laser marking individual objects with indicia at a marking station wherein a predetermined window exists during which each object can be marked as the objects are conveyed along at least one path at a predetermined speed. In some embodiments, at least first and second lasers positioned adjacent one or more paths are configured to direct a laser beam onto the objects to mark the same with indicia as the objects pass through the marking station, with each of the first and second lasers marking alternate following objects as they pass through the marking station.

Abstract: The present invention refers to a self-assemblable container, preferably manufactured from ecologic materials such as standard fiberboard, comprising as its main structural elements a bottom, two longitudinal sides and two transverse sides of a basically rectangular shape having cauterized perimetrical faces to prevent moisture penetration into the structural elements that make up the container, thus providing long term structural stiffness to the perimetrical faces of the container's structural elements comparable to that of the fiberboard surface. Each of the main structural elements comprises in one side adjacent to another corresponding main structural element, tensile-resistant flexible tabs or receiving slots, the other corresponding main structural element in said side adjacent to the first main structural element respectively comprising slots or flexible tensile resistant tabs, said main structural elements being assembled together by the insertion of the flexible tabs into the receiving slots.

Abstract: A laser processing apparatus is provided with a first laser oscillator for laser CVD and a second laser oscillator for laser repair in a laser oscillation section. Either one of the first or second laser beam is irradiated by switching the first and second laser oscillators by a laser oscillator switch portion of a main body section. An optical path forming member is disposed such that the first or second laser beam, whichever is irradiated, will take the same optical path and reach a sample, after passing a common slit, to perform laser processing on the sample. Further, an objective lens is configured to be switched to an objective lens having a magnification corresponding to a wavelength of the laser beam irradiated from the laser oscillation section by an objective lens switch section of an objective lens section.

Abstract: A system for marking pellet shaped articles includes a conveyer to convey the pellet-shaped articles along a transport path, and a laser to generate at least one beam to print or etch information on one or more of the pellet-shaped articles. The information includes at least one of alphabetical characters, numeric characters, and/or logos. The information comprises at least one engraving, e.g., two engravings or holes, apertures, etc., that are adjacent one another and at least partially overlapping. The system includes a controller to control x and y or x, y and z coordinates of the beam of the laser relative to the transport path to align the beam with the one or more of the pellet-shaped articles.

Abstract: An exemplary laser cutting device (300) includes a laser source (40), a lens module (51), a sprayer (60), a rotating subassembly (52), and a driving member (55). The lens module is configured for focusing a laser beam emitting from the laser source. The sprayer is rotatably connected to the lens module. The rotating subassembly is connected to the lens module. The rotating subassembly is configured for driving the lens module to rotate, such as to make the laser beam rotate relative to an axis of the laser beam. The driving member is connected to the lens and configured for driving the sprayer to rotate relative to the lens module.

Abstract: A system and method of repairing electrical circuits including employing a laser and at least one laser beam delivery pathway for laser pre-treatment of at least one conductor repair area of a conductor formed on a circuit substrate and employing the laser and at least part of the at least one laser beam delivery pathway for application of at least one laser beam to a donor substrate in a manner which causes at least one portion of the donor substrate to be detached therefrom and to be transferred to at least one predetermined conductor location.

Abstract: Disclosed are systems for scoring non-flat materials including non-flat glass sheets (1000). In one embodiment, a laser scoring system is described. The laser scoring system includes a laser (102) and an optical head (106). The optical head (106) is configured to receive output from the laser (102) and focus the output into an elongated laser beam having a beam waist and an extended focal depth of greater than +/?5 mm relative to the center of the beam waist with a power density sufficient for scoring a material having at least a portion within the extended focal depth. In one aspect the system can include a beam expander (104). The beam expander (104) receives the output from the laser (102), expands the output from the laser to an expanded laser beam, and transmits the expanded laser beam to the optical head (106).

Abstract: An exemplary laser cutting device (300) includes a laser source (40), a lens module (51), a sprayer (60), a first rotating subassembly (52), and a second rotating subassembly (53). The lens module is configured for focusing a laser beam emitting from the laser source. The first rotating subassembly is connected to the lens module and configured for driving the lens module to rotate relative to the laser source. The second rotating subassembly is rotatably connected to the lens module. The sprayer is connected to the second rotating subassembly and driven to rotate relative to the laser source by the second rotating subassembly.

Abstract: A method makes a discrete adjustment to static alignment of a laser beam in a machine for selectively irradiating conductive links on or within a semiconductor substrate using the laser beam. The laser beam propagates along a beam path having an axis extending from a laser to a laser beam spot at a location on or within the semiconductor substrate. The method generates, based on at least one measured characteristic of the laser beam, at least one signal to control an adjustable optical element of the machine effecting the laser beam path. The method also sends said at least one signal to the adjustable optical element. The method then adjusts the adjustable optical element in response to said at least one signal so as to improve static alignment of the laser beam path axis.

Abstract: An apparatus for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method includes depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.

Abstract: A laser processing machine having a laser beam irradiation unit is provided. The laser beam irradiation unit includes: a laser beam oscillation section; a beam splitter adapted to split the laser beam emitted from the laser beam oscillation section into a first laser beam and a second laser beam; a condenser lens adapted to condense the first and second laser beams; a prism adapted to lead the first and second laser beams split by the beam splitter to the condenser lens; a first angle-changing mirror disposed on a first optical path adapted to lead the first laser beam split by the beam splitter; a second angle-changing mirror disposed on a second optical path adapted to lead the second laser beam split by the beam splitter to the prism; and a half-wave plate disposed in the first or second optical path to allow one of respective directions of the first and second polarization planes to be aligned with the other.

Abstract: An optical device wafer processing method including a laser processed groove forming step of applying a laser beam for performing ablation to the front side or back side of a substrate of an optical device wafer along streets, thereby forming a laser processed groove as a break start point on the front side or back side of the substrate along each street, and a wafer dividing step of applying an external force to the optical device wafer after performing the laser processed groove forming step to thereby break the wafer along each laser processed groove, thereby dividing the wafer into individual optical devices. In performing the laser processed groove forming step, an etching gas atmosphere for etching a modified substance produced by applying the laser beam to the substrate is generated, whereby an etching gas in the etching gas atmosphere is converted into a plasma by the application of the laser beam to thereby etch away the modified substance.

Abstract: A region surrounded by two gate wiring and two drain wiring includes pixels and when there is a defect of short-circuit in adjacent pixel electrodes, the short-circuited portion is removed by irradiating a laser via a mask having a transmission pattern, which corresponds to a pattern of the gate wiring, drain wiring and pixel electrodes in the short-circuited portion. The above short-circuited portion is identified and removed in comparison to a normal pattern, by use of information from an inspection apparatus, and the pattern defect formed on the substrate is automatically repaired. By applying the above method to a manufacturing process of display apparatus, in particular, to a resist pattern forming process, a display apparatus having a highly qualified display property may be achieved.

Abstract: A laser surface treatment for reducing reflection loss on the surface of an optical material is provided. A metal film is formed on the surface of the optical material, and then the metal film is removed from the optical material by irradiation of an ultra-intense short-pulse laser beam having a pulse width of 1 femtosecond to 100 picoseconds, so that a fine periodic structure is formed on the surface of the optical material exposed by the removal of the metal film. The obtained fine periodic structure has asperities with a periodic interval of preferably 50 to 1000 nm, which can be controlled by changing the laser energy density.

Abstract: Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the semiconductor substrate such that a plurality of laterally spaced rows of structures simultaneously pass through the processing window. As the processing window is scanned, the deflector selectively deflects the series of laser pulses among the laterally spaced rows within the processing window. Thus, multiple rows of structures may be processed in a single scan.

Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a pulse laser beam to the workpiece held on the chuck table, and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, wherein the machine further comprises a feed amount detection means for detecting the processing-feed amount of the chuck table and a control means for controlling the laser beam application means based on a detection signal from the feed amount detection means, and the control means outputs an application signal to the laser beam application means for each predetermined processing-feed amount based on a signal from the feed amount detection means.

Abstract: A method and an apparatus of minimizing the deposition of debris onto a sample being ablated. The method comprising the steps of: 1) reducing a laser pulse energy to approximately a threshold level for ablation; and 2) ablating a region of the sample using a multitude of laser pulses, each pulse being sufficiently separated in time to reduce a concentration of ablation products in a gas phase. An apparatus for ablating a region of a sample with a laser beam. The apparatus comprises: 1) a source providing a pulsed laser beam of a certain energy, the source focusing the laser beam on the sample to ablate a region of the sample; and 2) a device for providing a flowing fluid over the region being ablated to remove the ablation products.

Abstract: A method for manufacturing a thin-film solar cell includes providing a first conducting layer on a substrate that has an area at least 0.75 m2. The first conducting layer is located in a deposition portion of the area. An ultraviolet laser beam is applied through a lens to the first conducting layer. Portions of the first conducting layer are scribed form a trench through the layer. The lens focuses the beam and has a focal length at least 100 mm. The focused beam includes an effective portion effective for the scribing and an ineffective portion ineffective for the scribing. The substrate sags and the first conducting layer remains in the effective portion of the focused beam across the area during the step of applying. One or more active layers are provided on the first conducting layer. A second conducting layer is provided on the one or more active layers.

Abstract: The present invention discloses a coating layer removing apparatus and a method for the same. The apparatus of the present invention comprises a transport device displacing an electrode plate; a laser device having a laser head arranged above the displacement path of the electrode plate; and a control center electrically connected to the transport device and the laser device. The method of the present invention comprises mounting an electrode plate on the transport device; using the control center to set the speed of displacing the electrode plate, and program the time interval, count and penetration depths of the laser beams; and using the device of the present invention to form exposed areas equidistantly on the electrode plate. The apparatus of the present invention automatically removes a coating layer with a laser beam without directly contacting the electrode plate. Therefore, the present invention can fast form exposed areas of high quality.

Abstract: A method and a device for producing a tear line in a vehicle interior trim part, in which a laser beam is guided along a tear line and a material ablation in the form of holes with a residual wall thickness is effected. On the side facing the laser beam, the complete extent of the tear line is detected by a stationary matrix camera. In the machining at a machining site, only pixels of a CMOS matrix camera that are known in advance, for which the incidence of a measurement radiation is expected at this machining site, are read out. The laser is preferably scanned and non-adjacent machining sites are machined successively.

Abstract: To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.

Abstract: A system for generating a laser machined tool from a substantially cylindrical work piece. The system includes a laser producing a laser beam, a mask positioned within the laser beam for shaping the laser beam into an image, and an optical system for imaging the laser beam image onto the outer surface of the work piece. The system coordinates rotational and translation movements of the work piece with activation of the laser in order to use the laser image for ablating the outer surface of the work piece, creating microstructures within the surface of the work piece to form the cylindrical tool.

Abstract: To provide a piezoelectric resonator in which a casing houses a tuning-fork piezoelectric resonator element and whose failure occurrence caused when shavings of adjustment films scatter and adhere to excitation electrodes is prevented.

Abstract: A laser engraver with scanning function includes an engraving table, a control device, and a scanner. The engraving table includes a working platform and an engraving device disposed on the working platform. The engraving device is capable of moving above the working platform to perform an engraving operation. The control device is connected to the engraving device, and is used for controlling the engraving operation of the engraving device. The scanner is mounted on the engraving device and connected to the control device, and is used for scanning a workpiece placed on the working platform and transmitting scanned information to the control device, such that the control device controls the engraving device to perform an accurate engraving operation at a particular position on the workpiece.

Abstract: A portable engraving system comprises an enclosure adapted to operably accommodate an engraving device, wherein the enclosure comprises an adjustment system. The adjustment system comprises one or more adjustable devices, and the adjustable devices are adapted to adjust a distance between the enclosure and a work surface thereby allowing adjustment of the distance between the enclosure and the work surface, whereby the enclosure is adjustable with respect to the work surface. The enclosure further comprises an opening wherein the engraving device is operably positioned thereto, whereby the work surface is accessible to the engraving device therethrough. The enclosure is positionable adjacent the work surface and operably disposed thereto.

Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

Abstract: According to one embodiment, a pattern forming system includes a patterning tool, a multi-axis robot, and a simulation tool that are coupled to a pattern forming tool that is executed on a suitable computing system. The pattern forming tool receives a contour measurement from the patterning tool and transmits the measured contour to the simulation tool to model the electrical characteristics of a conductive pattern or a dielectric pattern on the measured contour. Upon receipt of the modeled characteristics, the pattern forming system may adjust one or more dimensions of the pattern according to the model, and subsequently create, using the patterning tool, the corrected pattern on the surface.

Abstract: An X & Y orthogonal cut apparatus for scribing a pair of parallel cuts on a planar workpiece, the workpiece plane having an X-axis and a Y-axis, where the apparatus includes a laser device generating at least two beams including a first beam and a second beam, the first beam and the second beam each having an impact point on the workpiece, the first and second impact points being positioned diagonally with respect to the X and Y axes of the workpiece, and at least one actuator to move at least one of the impact points relative to the workpiece and the workpiece relative to the impact points.

Abstract: A device for removing an oblong burr from a molded part including an energy source that introduces energy into the burr for removing the burr by heating. The energy source includes an infrared transmitter that irradiates the oblong burr with infrared radiation, a sleeve for receiving the infrared transmitter with an inner face facing the infrared transmitter and an outer face remote from the infrared transmitter, and an outlet region through which energy may be transported in the direction of the burr. The sleeve has an outer coating with a surface facing the outside, and an inner face facing the infrared transmitter which at least partially encloses the sleeve. Infrared radiation emitted by the energy source is concentrated by a radiation-forming element, so that only the burr is irradiated by the infrared radiation. The radiation-forming element may be formed by a gap in the outer coating.

Abstract: Various embodiments of the present invention provide systems and methods for etching carpets and carpet substrates. More particularly, various embodiments direct a laser beam at a carpet substrate such that energy is transferred to the carpet substrate in the form of heat. This heat alters the portion of the carpet substrate surface struck by the laser. The laser beam is guided along a pre-determined path to create a desired pattern in the carpet substrate. The desired pattern may include variations in the depth of etching of the carpet substrate.

Abstract: A microdissection apparatus includes a laser light source to emit laser light, and a laser light irradiation optical system to irradiate a sample with the laser light from the laser light source. The laser light irradiation optical system includes an active optical element, which is allowed to form a pattern reflecting a necessary area, and sets a laser light irradiation area, to which the laser light is applied, based on the pattern formed on the active optical element.

Abstract: Various methods and systems measure, determine, or align a position of a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be selectively processed by delivering a processing laser beam to a processing laser beam spot. The various methods and systems utilize those structures themselves to perform the measurement, determination, or alignment.

Abstract: A device for structuring a solar module. A retainer device arranged above the solar modules to be machined comprises retainer means which retain the solar modules. The retention is achieved in a non-contact manner. In a region beneath the solar module a structuring tool is arranged mounted to be mobile in a longitudinal and a transverse direction. The structuring tool can thus machine the complete surface of the solar module.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.

Abstract: A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision. This laser processing method irradiates a substrate 4 with laser light L while using a rear face 21 as a laser light entrance surface and locating a light-converging point P within the substrate 4, so as to form modified regions 71, 72, 73 within the substrate 4. Here, the quality modified region 71 is formed at a position where the distance between the front face 3 of the substrate 4 and the end part of the quality modified region 71 on the front face side is 5 ?m to 15 ?m. When the quality modified region 71 is formed at such a position, a laminate part 16 (constituted by interlayer insulating films 17a, 17b here) formed on the front face 3 of the substrate 4 is also cut along a line to cut with a high precision together with the substrate 4.

Abstract: The present invention is directed to an arrangement for forming one or more separated scores in a surface of a substrate. The arrangement comprises a laser for providing a laser beam, optical guiding means for guiding said laser beam to said surface of said substrate, means for moving said substrate relative to said laser beam in at least one cutting direction for forming said scores, and primary splitting means for splitting said laser beam into a plurality of primary cutting beams for forming said scores parallel to each other. Said primary splitting means are arranged for moving said primary cutting beams relative to each other for adjusting the separation between said parallel scores. The invention is further related to a method for forming one or more separated scores in a surface of a substrate.

Abstract: Techniques are described for laser-scribing a feature on a surface in relation to a reference feature on that surface, such as a feature created by a previous placement of the laser beam. In particular, using a laser beam focusing and deflection system to direct a laser scribing spot onto a surface through an optical path, an optical detection system provides reliable detection of the position of an existing feature on the surface as viewed through the optical path of the deflection system. Based on feedback provided from the detection system to the deflection system, the position of the laser beam may be modified through the deflection system in relation to the viewed feature to scribe a subsequent feature on the surface which tracks the existing feature in real time. A method of scribing to accomplish the objectives is also disclosed.

Abstract: The invention relates to a laser scribing system (10) for structuring substrates, said system being characterised in that the planar rotor (56) together with the laser device (60) has a mass that is essentially less than the mass of the table (20) and the substrate (30) such that the machining speed is increased, and the substrate arranged on the table (20) is still during the machining, or moves in a direction at a constant speed vSubstrat such that vibrations are reduced and the precision of the scribing traces increased. Furthermore, other planar rotors (56) can be mounted with a laser device (60) without changing the structure of the machine such that the productivity is easily increased.; The laser light (65) is also guided, by means of optical fibres, as close as possible to the machining point, reducing the free length of the light beam (65) such that the adjustment requirements for the optical-mechanical components are reduced and the system is more robust.

Abstract: Method of ablating the surface of a substrate including providing a dry substrate and an electrolyte source, ablating the surface of the dry substrate to at least partially remove a native oxide layer, and immersing the ablated dry substrate in the electrolyte source, in which the dry substrate is ablated prior to being introduced into the electrolyte source. Also provided is a method of ablating the surface of a substrate that includes providing a dry substrate and an electrolyte, depositing a portion of the electrolyte on the substrate at a thickness of less than 10 microns and ablating the surface of the substrate with the electrolyte applied thereon. System for use in the ablation of the surface of a substrate are also provided.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto non-adjacent first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Abstract: A method for removing coating from a substrate may include: locating an edge of a substrate; directing a laser beam along a first path to a first position on a surface of the substrate proximate to an edge of the substrate at an angle of incidence suitable to redirect the laser beam along a second path, through the substrate, to a second position on a second surface of the substrate corresponding to the located edge of the substrate, where the second surface can include a coating; and ablating at least a portion of coating at the second position on the second surface of the substrate.

Abstract: The invention concerns a method and an apparatus for the laser machining of an unfinished object (27). The unfinished object (27) is to be formed into a cutting tool with a cutting edge (60) and a free surface (62). A laser is provided which generates laser beam impulses (24) which are directed by a redirecting arrangement (23) onto a surface (26) of the unfinished object (27). A laser beam impulse (24) reaches at an impact location the surface (26) of the unfinished object (27) under an inclination angle between the laser beam direction (R) of the laser beam impulse (24) and the surface (62) to be formed on the unfinished object (27). The redirecting arrangement (23) is controlled in such a way that the laser beam impulses (24) impact at adjacent impact locations on form and form a pulse zone (55).