Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract: Thermoelectric effects that occur during laser trimming of resistors (20) are resolved by taking voltage measurements. The voltage attributed to laser heating on a resistor (20) during a low-power simulated trim (10) is used to determine a relatively thermal-neutral location (18) on the resistor (20). A trimming-to-value operation can then be performed on all like resistors (20). Voltage measurements can also be taken before and after every pulse in a trimming operation to establish thermal deviation information that can be used to offset the desired trim value against which resistor measurement values are compared. Spatially distant or nonadjacent resistors (20) in a row or column can also be trimmed sequentially to minimize heating effects that might otherwise distort resistance values on adjacent or nearby resistors (20).

Abstract: A laser forming system includes a motion system. A mounting fixture is affixed to the motion system for supporting a workpiece. A plenum is affixed to the fixture for surrounding the workpiece. A gas supply is joined in flow communication with the plenum for channeling thereto an inert gas under pressure to fill the plenum. A laser is aligned with the plenum for projecting a laser beam at the workpiece for laser forming thereof inside the plenum.

Abstract: A laser marking method and a laser marking system are provided. The laser marking method includes the following steps. Firstly, a substrate having at least M pattern lines is provided, wherein M is an integer which is larger than or equal to 1. Next, a laser beam is provided. Then, the laser beam is divided into at least two laser sub-beams including a first laser sub-beam and a second laser sub-beam. Afterwards, the second laser sub-beam is aimed at an (N-M)-th pattern line, and an N-th pattern line is marked by the first laser sub-beam, wherein N is an integer which is larger than or equal to M.

Abstract: An apparatus and method for producing an authentication certification for a gemstone, having a processor, a database coupled to the processor, in which are stored data defining laser micro-inscriptions and physical characteristics of a plurality of gemstones, a graphic user interface (GUI) for interacting with and controlling the processor, and a computer output device, presenting in human readable form, information from the database describing for a respective gemstone the laser micro-inscription and physical characteristic information. The output is suitable for authentication of a presumptive gemstone. A corresponding method generates data for the database from the gemstone, and/or authenticates a laser-microinscribed gemstone based on previously stored data.

Abstract: An etching method includes applying a first electromagnetic radiation to an area of structure, thereby altering a characteristic of the structure in the area, and applying a second electromagnetic radiation to the structure, the second electromagnetic radiation configured to selectively ablate the structure based on the characteristic.

Abstract: This is a device for recording graphical data (34) on a medium (10), comprising a laser (9) producing a laser beam (14) to which the medium is sensitive, the laser beam projecting a spot (25) onto the medium (10), the laser (9) being driven in a relative sweeping movement with respect to the medium (10) during recording. It comprises means (32) of converting the grey level of each pixel into a pattern size (20) to be recorded on the medium (10), means (9a) for shaping the laser beam (14) so that the spot (25) projected onto the medium (10) is oblong and means of adjusting the size of the pattern (9b) acting on the switching on and off of the laser (9) and/or the power of the laser beam (14).

Abstract: A semiconductor wafer marking apparatus and a semiconductor wafer marking method includes a laser head unit including a flowcell having a laser radiation region and a laser source radiating laser energy on the laser radiation region in response to an input current. An optical system radiates a laser beam on the semiconductor wafer. A cooling water reservoir stores cooling water. A pipe is disposed in the flowcell and connected to the cooling water reservoir. A marking interlock system detects leakage of cooling water from the pipe, an abnormal temperature of the laser radiation region, and an abnormal input current supplied to the laser source, and generates a marking interlock signal to terminate a marking operation of the semiconductor wafer. A marking unit turns off the laser source to terminate the marking of the semiconductor wafer in response to the marking interlock signal.

Abstract: A multi model registration (MMR) process performed using a computer, for registering a plurality of workpiece vision models representing features on a workpiece that define a marking location thereon, to corresponding part vision models stored on the computer representing features that define a desired part marking location. By this process, respectively corresponding workpiece vision models and part vision models are aligned for guiding a laser to mark the workpiece, the position and orientation of the workpiece being variable relative to that represented by the stored part vision model.

Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

Abstract: The present invention relates to a method for removal of content based stripe and the like on a substrate. More particularly relates to a method of removal of content based stripe and the like, using lasers. The method comprising acts of generating and applying predetermined waves or pulses of the laser beams onto the determined content-based stripe and the like for removal from the substrate.

Abstract: A glass plate cutting machine using a laser beam is provided to solve problems, such as uneven glass section and slanting cutting. By using the glass plate cutting machine of the current invention, the glass plate is irradiated with a first carbon dioxide laser beam of 0.05-2 joule/mm2 on a long oval shaped area of 20-200 mm2 according to an expected cutting line thereof, and immediately cooled with water, to generate a scribe line, which is then further irradiated with a second carbon dioxide laser beam of 0.1-0.5 joule/mm? on the area of 20-200 mm2 thus obtaining a superior glass section.

Abstract: A method is described for accurately positioning laser scribed lines in a thin top layer of material which overcoats one or more other lower layers in which lines have already been scribed for the purpose of making solar panels. This is accomplished by means of an optics unit that generates one or more laser beams in order to scribe one or more lines in the top layer on the panel. An alignment detector system is attached to the optics unit and the detector is displaced from the optics unit by a distance such that the detector measures the position of one of the scribes in the lower layers in the area of the panel that will be scribed at a subsequent time.

Abstract: Laser-scribing systems and translation stages operable to support a workpiece during laser scribing are provided. A laser-scribing system includes a base section, a bed supported by the base section, a laser, a first driving mechanism operable to move a workpiece longitudinally along the bed, and a second driving mechanism. The bed comprises a movable section configured to translate with respect to the base section. The movable section comprises a gap to allow a laser beam to pass through. The laser is positioned to direct the laser beam through the gap. The second driving mechanism is operable to laterally translate the laser and the movable section in order to scribe a pattern on the workpiece.

Abstract: A method and a device for recording information within an information surface region in a data carrier, consisting of a carrier layer and a transparent plastic layer, by means of at least one laser beam of a point-like laser source wherein the laser beam is deflected via at least one deflection surface, in particular a mirrored surface before it impinges on the data carrier, wherein the at least one deflection surface is arranged in a region between the laser source and the data carrier and outside an intermediate region bounded by notional straight connection lines between the laser source and edge regions of the information surface region.

Abstract: Methods and systems for improving the alignment between a previously formed feature and a subsequently formed feature are provided. An exemplary method can include laser scribing a workpiece (104, 550) having a previously formed first feature. The exemplary method includes imaging the workpiece (104, 550) with an imaging device (320, 420, 554, 640) so as to capture a plurality of positions of the first feature on the workpiece (104, 550) relative to the laser-scribing device (100). The exemplary method further includes using the captured positions to align output from the laser-scribing device (100) in order to form a second feature on the workpiece (104, 550) at a controlled distance from the first feature.

Abstract: The invention relates to a method and device for machining a target using a femtosecond laser beam. The invention consists in taking advantage of the deterministic nature of the ablation threshold and the nonlinear dependence thereof through the use of amplitude or phase pupillary filtering using the polarising effect or any other technique in order to reduce significantly the machining dimensions obtained by focusing a laser beam in nanotechnologies. One such filtering process modifies the distribution of the intensity in the focal plane such as to reduce the maximum of the central component of the spectrum of laser pulses while maintaining the bright rings below the deterministic ablation threshold. The invention associates the femtosecond ablation technique with deterministic threshold and the apodisation technique.

Abstract: An apparatus including a base, a linkage extending along a second axis and pivotally connected to the base for pivotal movement about a first axis perpendicular to the second axis, a leg having a first end pivotally connected to the linkage for pivotal movement about the second axis, and a frame secured to a second end of the leg. A stand extends from the base, and a first slide is secured to a distal end of the stand for pivotal movement with respect to the distal end of the stand. A first guide is supported by the first slide for movement with respect to the first slide, and a second slide is secured to an end of the first guide. A second guide is pivotally connected to the frame and supported by the second slide for movement with respect to the second slide. The frame can be used to support a plating mask and is movable along a surface of an imaginary sphere having a center located at the intersection of the first and the second axes.

Abstract: An efficient method of and a system for performing topography measurement facilitates increasing laser machining throughput. Topography measurements at multiple points on a target specimen or continuous real time measurement and monitoring of the target specimen surface topography and target specimen thickness can be performed during a laser machining process. Measurement of the thickness of the target specimen to be laser machined would permit fine tuning of laser energy delivered and result in higher quality target material removal.

Abstract: Disclosed herein is an apparatus for cutting a glass plate. The apparatus comprises a cracking means for forming a minute crack at a point on the glass plate where the cutting is started, at least one scribing means using a laser beam absorbed by the glass plate, at least one quenching means using a quenching fluid after irradiation of the laser beam, a breaking means using the laser beam. The breaking means comprises a laser oscillator, a reflection mirror and a focusing lens. The focusing lens has at least two or more focal lengths. The apparatus may further apparatus further comprise a photo mask formed with light transmission openings for transmitting a part of the laser beam to be irradiated on the glass plate instead of the focusing lens. With the apparatus of the present invention, the problems caused by the conventional lens, such as a reduced straightness of a cutting line or a rough cutting plane, can be prevented, thereby providing a clean cutting plane.

Abstract: Methods and systems for use during laser-scribing of a workpiece are provided. Some of the methods and systems provided use an imaging device to control the formation of a laser-scribed feature so as to more closely align with a previously-formed feature. Some of the methods and systems provided use an imaging device for inspection of a laser-scribed feature and/or process control. Some of the methods and systems provided use an imaging device to detect and avoid a workpiece defect during the formation of a laser-scribed feature.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: Methods and systems use laser pulses to process a selected structure on or within a semiconductor substrate. The structure has a surface, a width, and a length. The laser pulses propagate along axes that move along a scan beam path relative to the substrate as the laser pulses process the selected structure. The method simultaneously generates on the selected structure first and second laser beam pulses that propagate along respective first and second laser beam axes intersecting the selected structure at distinct first and second locations. The first and second laser beam pulses impinge on the surface of the selected structure respective first and second beam spots. Each beam spot encompasses at least the width of the selected link. The first and second beam spots are spatially offset from one another along the length of the selected structure to define an overlapping region covered by both the first and the second beam spots and a total region covered by one or both of the first and second beam spots.

Abstract: A direct-write laser lithography system comprises a reel-to-reel feed system in a vacuum chamber that presents the clear film-side of a single-sided metal-clad tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by rotating mirrors, and is intense enough to ablate the metal but not so strong as to destroy the tape substrate. In one instance, two specialized lasers are used, one set to ablate large field areas, and the other tuned to scribe fine features and lines. The ablated metal blows off in a downward direction and is collected for recycling.

Abstract: Disclosed are systems and methods for separating a glass sheet along a predetermined line. Laser beams are generated and shaped into elongated laser beams. Arm members are provided that are pivotally coupled together to form a chain of arm members. Each elongated laser beam is directed therefrom a respective laser beam toward the glass sheet to form a contiguous chain of elongated laser beams thereon a surface of the glass sheet. The arm members can be moved to move the contiguous chain of elongated laser beams along the predetermined line to scoring the glass sheet along the predetermined line.

Abstract: Disclosed are systems for scoring non-flat materials including non-flat glass sheets (1000). In one embodiment, a laser scoring system is described. The laser scoring system includes a laser (102) and an optical head (106). The optical head (106) is configured to receive output from the laser (102) and focus the output into an elongated laser beam having a beam waist and an extended focal depth of greater than ±5 mm relative to the center of the beam waist with a power density sufficient for scoring a material having at least a portion within the extended focal depth. In one aspect the system can include a beam expander (104). The beam expander (104) receives the output from the laser (102), expands the output from the laser to an expanded laser beam, and transmits the expanded laser beam to the optical head (106).

Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

Abstract: A wafer laser processing method for forming deteriorated layers along a plurality of streets in the inside of a wafer having a device area where a plurality of areas are sectioned by the plurality of streets arranged in a lattice pattern on the front surface and devices are formed in the sectioned areas and having a peripheral excess area surrounding the device area, the surface of the device area being formed to be higher than the surface of the peripheral excess area, by applying a laser beam to the front surface of the wafer along the streets with its focal point set to the inside of the wafer, comprising a first deteriorated layer forming step for forming a deteriorated layer along the streets in the insides of the peripheral excess area and the device area by applying a laser beam to the peripheral excess area and the device area along the streets with its focal point set to the insides of the peripheral excess area and the device area from the front surface side of the wafer; and a second deteriorated l

Abstract: A method for adjusting the relative position of devices of a laser engraver. The method includes an outputting device of the laser engraver to forms a marked point on a non-working piece. Let the outputting device position the center of the marked point and record it. Then an image sensing device of the laser engraver is moved to the marked point and seeks the center of the marked point. Then, the position point that the outputting device is located is recorded after the outputting device moved according to the movement of the image sensing device. Finally, calculating the distance between the center recorded by the outputting device and the position point recorded after the outputting device moved to obtain the precise distance between the image sensing device and the outputting device.

Abstract: A coordinate detecting device includes a resistive film formed on a substrate and a common electrode for applying a voltage to the resistive film, wherein a potential distribution is created in the resistive film, an electric potential of the resistive film at a contact position is detected, and a position of the contact position of the resistive film is detected. In a manufacturing apparatus, a laser light source irradiates laser light to remove a part of the resistive film to form a resistive film removed part, an optical system converges the laser light, a plurality of probes measure electric potentials of a surface of the resistive film with the common electrode providing the voltage to the resistive film, an X-Y table moves the substrate at least two-dimensionally, and a control part controls the X-Y table and the laser light source.

Abstract: A laser processing apparatus is provided with a first laser oscillator for laser CVD and a second laser oscillator for laser repair in a laser oscillation section. Either one of the first or second laser beam is irradiated by switching the first and second laser oscillators by a laser oscillator switch portion of a main body section. An optical path forming member is disposed such that the first or second laser beam, whichever is irradiated, will take the same optical path and reach a sample, after passing a common slit, to perform laser processing on the sample. Further, an objective lens is configured to be switched to an objective lens having a magnification corresponding to a wavelength of the laser beam irradiated from the laser oscillation section by an objective lens switch section of an objective lens section.

Abstract: A device and method for steering a laser beam to a focal point in target tissue requires generating a laser beam. Diversions of the laser beam from a central beam path are minimized by a sequential arrangement of optical steering components. In order, the beam is first directed to the center of a z-scanning apparatus which will move the focal point in the medium in a z-direction. The beam is then passed to the center of a first galvanometric mirror which introduces focal point movements in the x-direction. A second galvanometric mirror then compensates for the x-direction movement by redirecting the beam to the center of a third galvanometric mirror where focal point movements in the y-direction are introduced.

Abstract: A method selectively processes structures on a workpiece with laser pulses. The structures are arranged in a linear pattern having approximately equal pitch. The pulses propagate along a laser beam propagation path terminating at a laser beam spot on the workpiece. The method fires a first processing pulse when the spot coincides with a first structure location, selectively blocks or clears the propagation path during the first pulse, moves the workpiece and the spot relative to one another such that the spot moves toward a second structure location at a speed less than the product of the laser's PRF and the pitch, fires a dummy pulse before the spot reaches the second structure location, blocks the propagation path during the dummy laser pulse, fires another processing pulse when the beam spot coincides with the second structure location, and selectively blocks or clears the propagation path during the second processing pulse.

Abstract: A method for forming microstructure cavities in a glass substrate includes directing a first laser pulse onto the glass substrate thereby forming a first microstructure cavity having a tapered configuration. The first laser pulse may have first spot area on the surface of the glass substrate. A second laser pulse having a second spot area on the surface of the glass substrate may be directed onto the glass substrate thereby forming a second microstructure cavity having a tapered configuration. The second spot area may be substantially the same as the first spot area and may overlap the first spot area such that a portion of the sidewall disposed between first microstructure cavity and the second microstructure cavity is ablated. After the portion of the sidewall is ablated, the diameter of each of the first and second microstructure cavities may be less than the diameter of the first spot area.

Abstract: Laser scribing can be performed on a workpiece (104) such as substrates with layers formed thereon for use in a solar panel without need to rotate the workpiece (104) during the scribing process. A series of lasers (602, 622) can be used to concurrently remove material from multiple positions on the workpiece (104). Each laser (602, 622) can have at least one scanning device (614, 630, 632) positioned along a beam path thereof in order to adjust a position of the laser output relative to the workpiece (104). By adjusting the beam or pulse positions using the scanning devices (614, 630, 632) while translating the workpiece (104), substantially any pattern can be scribed into at least one layer of the workpiece (104) without the need for any rotation of the workpiece (104).

Abstract: Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.

Abstract: By means of the method and the apparatus in accordance with the invention, coated spectacle lenses are processed to form at the latter joining surfaces which permit a reliable adhesive bonding of the lenses to the bridge and the lugs of rimless spectacles. The method provides that for the respective spectacle lens two processing areas are predetermined with the shape, size and location thereof at the lens and that in the two predetermined processing areas the coating at the lens is locally removed by irradiation by a laser beam.

Abstract: A method and an apparatus for creating a scribe line are provided, so that a brittle material substrate can be divided into pieces along highly straight scribe lines. The surface of a brittle material substrate is heated with a laser beam along a line along which a scribed line is created at a temperature lower than the point at which the brittle material substrate softens, and the heated region is cooled immediately after heating so that a first crack is created, and after that, a cutter is moved over the surface of the substrate in a pressed state along the scribe line, and thus, a crack which is deeper than the first crack is created in the substrate.

Abstract: For forming the separating lines, (5, 6, 7) which are produced in the functional layers (2, 3, 4) deposited on a transparent substrate (1) during manufacture of a photovoltaic module with series-connected cells (C1, C2, . . . ), there are used laser scanners (8) whose laser beam (14) produces in the field (17) scanned thereby a plurality of adjacent separating line sections (18) in the functional layer (2, 3, 4). The laser scanners (8) are then moved relative to the coated substrate (1) in the direction (Y) of the separating lines (5, 6, 7) by a distance corresponding at the most to the length (L) of the scanned field (17) to thereby form continuous separating lines (5, 6, 7) through mutually flush separating line sections (18).

Abstract: The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.

Abstract: A substrate labeling system includes a first laser assembly having a first laser and a first lens, a second laser assembly having a second laser and a second lens, and a controller for directing the first laser and the second laser incident on a portion of a subsurface of a substrate to mark the substrate without generating particle defects on a surface of the substrate.

Abstract: An engraving laser assembly comprises a tubular rail defining a plenum in an interior of the rail. A carriage is operatively associated with to the tubular rail for axial movement along the rail. A focusing optic is mounted to the carriage for focusing a laser beam to a focal point on an engraving plane operatively with the carriage. A gas inlet is operatively associated with the tubular rail and the inlet is configured for attachment to a source of pressurized gas to provide pressurized gas to the plenum. A plurality of holes are provided in the tubular rail in fluid communication with the plenum. The holes are configured so that, with a source of pressurized gas attached to the gas inlet, a stream of pressurized gas is directed from each hole toward the engraving plane.

Abstract: An improved face for a golf club head includes shallow and deep markings configured to provide a pleasing appearance when viewed head on, and to frame the central region of the impact surface of the face when viewed at address. Use of only shallow markings in the central region of the impact surface prevents existence of stress fractures resulting from use of deep markings in the central region. This allows for a face thinner than those incorporating conventional grooves in the central regions of their impact surfaces, resulting in both superior resistance to cracking and improved C.O.R. Specified methods of manufacture are particularly suited for making clubs incorporating these shallow and deep markings.

Abstract: A process for preweakening the inside of an automotive trim piece cover layer of various constructions by use of a laser beam so as to enable formation of an air bag deployment opening in the trim piece formed at the time the air bag deploys. The laser beam impinges the inside surface of the cover to form a groove scoring or spaced perforations to form a preweakening pattern. A robot arm may be used to move a laser generator so as to form the preweakening pattern. The laser beam can be controlled in accordance with sensed conditions to achieve accurate preweakening, and may also be used to trim substrate panels and to perform other cutting operations.

Abstract: The present invention provides a laser drilling system for drilling holes or cavities in a solid, in particular a solid dosage form. The system includes a loading zone, firing zone, inspection zone and delivery zone. The system also includes optional components such as a process validation system, solids detector, color detector, solids rejection/repositioning means, accepted products receptacle, rejected products receptacle and/or solids inspection system. Operation of the laser device in the firing zone and of other optional equipment is synchronized with movement of a continuous solids indexer by way of an electronic synchronizer. A solids handling system includes an optional fill level detector that directly or indirectly controls solids loading means that fills a solids reservoir. The system can be run continuously, semicontinuously or batchwise.

Abstract: The present invention is directed to a laser marking device, system and method for its use.

Abstract: A system and method for adjustable laser mark depth is provided. In one embodiment, the system is used in Nd—YAG laser marker for wafer processing in the semiconductor industry, with smart control of the mark depth and expanded work range between the deep mark and the light mark.

Abstract: A method, comprises drilling a set of one or more microvias in a semiconductor package with an aperture, wherein drilling the set of microvias comprises to use an aperture that has a phase shift region to reduce a spot size of a drilling beam that is used to form the set of microvias.

Abstract: The invention relates to a laser ablation coating method, where the laser ablation is carried out in a space with 10?3 atmospheres at most. A low vacuum level enables an advantageous industrial production of surfaces without remarkably weakening the quality features of the deposited surfaces. The invention also relates to a method for producing nano particles, so that target material is ablated by pulse laser for generating nano particles in a space with 10?3 atmospheres at most.

Abstract: An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.