Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.

Abstract: An optical system head of the laser processing machine includes a focusing optical system configured to deflect and condense an incident laser beam so that a target object to be processed is irradiated and a deflecting direction adjusting unit configured to adjust the direction of deflection of the laser beams about at least two axes perpendicular or substantially perpendicular to each other. A nozzle holding head of the laser processing machine includes a cutting nozzle configured to blow a cutting gas at a site of the target object, at which the laser beam is irradiated, and a nozzle position adjusting unit configured to adjust the position of the cutting nozzle in a top plane parallel or substantially parallel to the target object. The optical system head and the nozzle holding head are separately supported by an optical system nozzle support member configured to selectively advance or retract in three axis directions relative to the target object.

Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Abstract: A laser engraving device which can adjust its machining position is disclosed. The device includes a laser machine for supplying laser beam, a guide rod adjacent to and parallel to the laser machine, a galvanometric scanner coupled to the guide rod and being movable with the guide rod, and a driver disposed at an end of the guide rod for driving the guide rod.

Abstract: A deburring system for removing burrs from a surface of a pipe is provided. The deburring system comprises: a shaft having an anterior end; a conduit contained in the shaft for carrying a laser beam generated from a laser; and a directing module to direct the laser beam emanating from the conduit radially from the shaft to the surface of the pipe. The deburring system is shaped to fit inside the pipe.

Abstract: Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.

Abstract: A method and an apparatus for the manufacture of a tool from a blank, such as, a rotational tool which rotates about a longitudinal axis (L) which includes at least one cutting edge and a chip groove. Preferably, the rotational tool is in its operating area in a cross-section thereof radially symmetrical with respect to it's longitudinal axis (L) and manufactured from a cylindrical blank by laser ablation using a laser machining apparatus with a laser scanner with a predetermined pulse area. The laser beam impulses are directed via a positioning arrangement within the pulse area onto a plurality of impact locations disposed along a predetermined pulse path (B). This pulse area is moved, like a tool, along the surface of the blank to form the chip groove and the cutting edge by sublimation of the material.

Abstract: A cylindrical lens (4) diverges a laser beam (L1) in the Y-axis direction (i.e., within the YZ plane) but neither diverges nor converges it in the X-axis direction (i.e., within the ZX plane). An objective lens (5) converges the laser beam (L1) emitted from the cylindrical lens (4) into a point P1 in the Y-axis direction and into a point P2 in the X-axis direction. A pair of knife edges (13) adjust the divergence angle (?) of the laser beam (L1) incident on the objective lens (5) in the Y-axis direction. As a consequence, the cross section of the laser beam (L1) becomes an elongated form extending in the Y-axis direction at the point P2, while the maximum length in the Y-axis direction is regulated. Therefore, locating the point P2 on the front face of a work (S) can form an elongated working area extending in the Y-axis direction by a desirable length on the front face of the work (S).

Abstract: A laser machining system (20) employs a fast positioner (68), such as a pair of galvanometer mirrors (70), that directs a beam axis (24) at a specified velocity to a start position of a cutting path (92) in coincidence with one of multiple laser pulses emitted from a laser (28) a constant laser pulse repetition rate, which runs independently of the relative position of the beam axis (24) with respect to the workpiece (26).

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract: A process is provided for forming shaped air holes, such as for use in turbine blades. Aspects of the disclosure relate to forming shaped portions of air holes using a short pulse laser, forming a metered hole corresponding to each shaped portion, and separately finishing the shaped portion using a short-pulse laser. In other embodiments, the order of these operations may be varied, such as to form the shaped portions and to finish the shaped portions using the short-pulse laser prior to forming the corresponding metered holes.

Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.

Abstract: A recording apparatus includes a rotation driving unit configured to rotate a recording layer forming medium in which a recording layer is formed, a laser irradiation unit configured to apply laser light to the recording layer of the recording layer forming medium, a first slide mechanism configured to change a position of an irradiation spot of the laser light on the recording layer in a first direction parallel to an in-plane direction of the recording layer, and a recording unit configured to perform a recording operation in which the position of the irradiation spot is changed in the first direction by the first slide mechanism while applying the laser light to the recording layer by the laser irradiation unit and rotating the recording layer forming medium by the rotation driving unit, thereby recording a predetermined pattern in consecutive areas including a central portion of the recording layer.

Abstract: A device for irradiating a laser beam onto an amorphous silicon thin film formed on a substrate. The device includes: a stage mounting the substrate; a laser oscillator for generating a laser beam; a projection lens for focusing and guiding the laser beam onto the thin film; a reflector for reflecting the laser beam guided onto the thin film; a controller for controlling a position of the reflector; and an absorber for absorbing the laser beam reflected by the reflector.

Abstract: A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

Abstract: A cylindrical lens (4) diverges a laser beam (L1) in the Y-axis direction (i.e., within the YZ plane) but neither diverges nor converges it in the X-axis direction (i.e., within the ZX plane). An objective lens (5) converges the laser beam (L1) emitted from the cylindrical lens (4) into a point P1 in the Y-axis direction and into a point P2 in the X-axis direction. As a consequence, the cross section of the laser beam (L1) becomes elongated forms extending in the X- and Y-axis directions at the points P1, P2, respectively. Therefore, when the points P1, P2 are located on the outside and inside of the work (S), respectively, an elongated working area extending in the Y-axis direction can be formed in a portion where the point P2 is positioned within the work (S).

Abstract: Laser systems and methods insert a settling time before and after each tooling action. A peak AOD excursion generally occurs at the transition in velocity between inter-feature moves and tooling moves. This transition occurs both before tooling (on the approach to the tooling location) and after tooling (on the departure from the completed tooling location to the next location). By adding a settling delay on each end of the tooling period, the AOD excursion is allowed to settle to a lower value. This then allows higher inter-tooling velocities (for high throughput) while keeping the AOD travel excursion within the bounds of the system's AOD configuration.

Abstract: An apparatus and method for exposing the surface of a drum to patterned illumination from a pulsed laser source to form a dense, regular array of 3-D microstructures is provided. The method may include locating a mask relative to a target area, projecting a uniform line shaped laser beam through the mask to project an image including a plurality of features of the mask onto the target area, de-magnifying the image, rotating the drum continuously so the surface moves in a first direction perpendicular to the axis of rotation of the drum and simultaneously moving the projected beam in a second direction parallel to the axis of rotation of the drum, tilting the projected array of microstructures to correspond to the helical path followed by the laser beam on the drum surface, and controlling the pulsed laser based on an angular position of the drum.

Abstract: Certain embodiments may include a laser system configured to emit collimated laser light, a beam diverging element configured to diverge the laser light to yield a range of propagation angles with a maximum angle greater than zero, and fiber coupling optics configured to direct the diverged laser light towards a spot of a cross-section of a fiber core of an optical fiber. As another example, certain embodiments may include a laser system configured to emit collimated laser light, a beam shaping element configured to shape the laser light into a beam with an elliptical cross-section, and fiber coupling optics configured to direct the diverged laser light towards a spot of a cross-section of a fiber core of an optical fiber, where the spot's center point is located at a distance from the cross-section's center point.

Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

Abstract: A method for contactless laser welding of a plurality of sheets of material stacked upon one another includes simultaneously delivering a laser beam and a stream of fluid through a laser head and further through an end cap which is removably mounted to the laser head. The end cap is configured with a stationary cylinder, which is coupled to the laser head, and a piston movable relative the cylinder. The piston moves in response to a pressure differential generated by the fluid in chambers above and below the piston. Once the pressure equilibrium is reached between the chambers, the pressure in the chamber below the piston is sufficient to reliably press the sheets of material against one another during a laser welding operation.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: Provided are: a table on which a workpiece is placed, a laser oscillator emitting a laser beam; a light-guide optical system deflecting the beam emitted from the oscillator; a cylindrical extensible bellows surrounding an optical path of the beam after the light-guide optical system deflects the beam; a bend mirror moving in an axial direction of the bellows while extending/contracting the bellows and deflecting the beam having passed through the bellows toward the table; a machining head irradiating the workpiece with the beam deflected by the mirror; an abnormality detector including a beam-sensor light-emitting unit emitting a beam advancing parallel with an axis of the bellows and a beam-sensor light-receiving unit measuring the amount of received light of the beam; and a control device bringing down the laser oscillator when the amount of received light of the beam in the beam-sensor light-receiving unit falls below a first threshold.

Abstract: A laser welding apparatus includes a laser welding unit including a first lens adapted to focus a laser beam; a second lens adapted to diffuse the laser beam to the first lens; and a third lens adapted to guide the laser beam to the second lens. The relative positions of the first lens, the second lens, and the third lens, are adjusted to adjust a diffusion angle and a beam width of the laser beam entering the first lens. The laser welding apparatus performs: actuating the laser welding unit to travel at a predetermined speed along a predetermined trajectory; directing the laser beam at a first welding spot; adjusting the focal length to focus the laser beam at the first welding spot; holding the laser focal spot size substantially constant; and directing the laser beam at a second welding spot after completion of welding for the first welding spot.

Abstract: A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.

Abstract: A visible laser beam scanned by a galvano-scanner system is aligned at each of positioning points on the top surface of a master work by manual operation to record sensor position signals of position sensors on galvano-scanners. The sensor position signals on each positioning point are recorded to create a drive pattern in accordance with recorded sensor position signals. The drive pattern no longer has optics system error sources including focus error and attachment error as well as errors caused by scale, offset and the like, also eliminating the need for entering a distance as far as the top surface of the work. Therefore, the drive pattern with error components removed can be created with ease.

Abstract: A laser beam processing machine includes a laser beam application device and a controller. The controller controls deflecting of the optical axis of a pulse laser beam from the laser beam application device in the processing-feed direction according to a plurality of processing position coordinates, and according to the frequency of the beam, to ensure that there is a predetermined time interval between pulses applied to the same processing position coordinates. One pulse is applied at a time to each of the plurality of processing position coordinates.

Abstract: A method for forming cavity in substrate includes setting start position on closed loop line having circumference L for substrate, consecutively irradiating laser from laser device upon board for the substrate such that holes are formed, and moving the device in loop from the start position along the line such that penetrating hole is formed through the board. The start position of first loop is set as base position, the moving includes shifting the start position by distance d after each loop and controlling such that the moving satisfies p=?di, m?L/p and M=m×n, where i=1 to n, n represents number of loops, p represents pitch of the holes, m represents number of the holes in loop, ?di is distance from the base position for the start position after i-th loop, and M is number of the holes by the loops.

Abstract: A crankshaft heat treatment device may include a base frame, a jig frame in which a crankshaft is rotatably supported and that is disposed to be able to move in a horizontal direction and in a vertical direction at the base frame, and a laser unit that is disposed in a predetermined fixed position and irradiates laser beam to a pin portion and a journal portion of the crankshaft so as to treat the pin portion and the journal portion with heat.

Abstract: A method for production of safety/rupture discs (1) comprises the steps providing a foil element (1a), selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut (2) in the foil element by directly applying said laser beam to the foil element to remove material from the foil element (1a) thereby obtaining a safety/rupture disc.

Abstract: A patterned circuit, including a hydrophilic substrate, a hydrophobic layer formed on the hydrophilic substrate, and a pattern formed in the hydrophobic layer to expose the hydrophilic substrate.

Abstract: A laser beam propagates along a beam axis for incidence on a work surface mounted on a support. The support operatively connects to a positioning system moving at least one of the laser beam and the target specimen relative to each other to position the laser beam at selected locations on the work surface. At least one force reaction compensation motor is located in a common force plane with, and as close as possible to, a corresponding stage motor. Any moment arm between the compensation motor and the corresponding stage motor is reduced or eliminated, allowing the compensation motor to directly couple and react to stage forces with virtually zero moment arm. Six degrees of freedom can be controlled with only four motors, since each compensation motor is directly coupled and aligned to a corresponding stage motor.

Abstract: A method for processing a workpiece with a processing device which has a processing head which can be moved at a defined speed and distance from a surface of the workpiece, the method comprising at least partially detecting a surface topography of the workpiece to be processed, determining a minimum desired operating distance of the processing head from the workpiece with reference to the detected surface topography of the workpiece and a trailing spacing of the processing head associated with the defined speed, and processing the workpiece with the processing head at the established minimum desired operating distance of the processing head from the workpiece.

Abstract: An engraving laser assembly comprises a tubular rail defining a plenum in an interior of the rail. A carriage is operatively associated with to the tubular rail for axial movement along the rail. A focusing optic is mounted to the carriage for focusing a laser beam to a focal point on an engraving plane operatively with the carriage. A gas inlet is operatively associated with the tubular rail and the inlet is configured for attachment to a source of pressurized gas to provide pressurized gas to the plenum. A plurality of holes are provided in the tubular rail in fluid communication with the plenum. The holes are configured so that, with a source of pressurized gas attached to the gas inlet, a stream of pressurized gas is directed from each hole toward the engraving plane.

Abstract: A roll former for forming a sheet into a continuous multi-tubular reinforcement beam. The roll former includes a first set of rollers that are configured to bend the sheet to form a common center wall in generally perpendicular orientation relative to first and second lateral portions of the sheet that extend in opposing directions from respective first and second radiused ends of the common center wall. The first set of rollers also form radiused edges on the first and second lateral portions. A second set of rollers is configured to form a channel rib longitudinally along each of the first and second lateral portions. A third set of rollers is configured to bend the first and second lateral portions simultaneously and equally to abut the first and second radiused edges with the respective first and second radiused ends of the common center wall to define adjacent tubes of the beam.

Abstract: A head for the continuous precision machining on three-dimensional bodies includes a fastening means to a flange of a machining equipment, having a first mechanical rotation axis, an intermediate means having a second mechanical rotation axis in series to the first mechanical rotation axis. The second mechanical rotation axis is orthogonal to the first mechanical rotation axis which intersects at a point of intersection. A terminal processing means has in series with the first and second mechanical rotation axes a third mechanical translating axis. The intermediate means has an arc configuration of a circumference with its centre at the point of intersection. The first mechanical rotation axis and the third mechanical translating axis are radially oriented to the arc.

Abstract: A laser processing apparatus includes worktable for loading a workpiece, a laser emitter, a user interface, a detecting unit, and a controller. The user interface allows inputting a thickness value of the workpiece. The detecting unit includes a signal emitter, a signal receiver for receiving signals emitted by the signal emitter, and a lifting unit. The workpiece is positioned between the signal emitter and the signal receiver. The controller controls the lifting device to adjust a height of the signal emitter and signal receiver relative to the worktable to be equal to a sum of the input thickness value and a focal length of the laser emitter. The controller controls the driving device to adjust a height of the laser emitter relative to the worktable if the signal receiver receives the signals and stop to adjust the laser emitter if the signal receiver does not receive the signals.

Abstract: A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

Abstract: This method for forming ventilation holes in an electrode plate includes: a roughening step of roughening a surface of an electrode plate for a plasma processing apparatus such that a center line average roughness Ra becomes in a range of 0.2 ?m to 30 ?m; and a ventilation hole forming step of irradiating a laser beam having a wavelength within a range of 200 nm to 600 nm on a roughened surface of the electrode plate so as to form ventilation holes in the electrode plate which pass through the electrode plate in a thickness direction, wherein in the ventilation hole forming step, a focus spot of the laser light is swirled along a planar direction of the electrode plate so as to form a circular irradiation area, and while moving the irradiation area along a planar direction of the electrode plate in a circular movement, the focus spot of the laser light is shifted in a thickness direction of the electrode plate.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: A method and apparatus for targeting a beam of radiation is provided. A beam steering mirror and a beam capture mirror are movably disposed along an optical pathway. A controller moves the beam steering mirror and the beam capture mirror in an x-y plane, and rotates the mirrors, to target the beam to a target location on a surface, while keeping the optical path length substantially constant for all target locations on the surface. The surface is rotated by a rotational actuator to bring all target locations to positions accessible by the beam targeting optics. Imprecision in targeting and optical path length may be compensated by providing an actuated aperture at the beam entry point and/or a variable focus lens with an optical range finding detector, all in communication with the controller.

Abstract: A device for the exact manipulation of material, especially of organic material, includes a pulsed laser system with a radiation source, said radiation source being a cavity-dumped fs oscillator.

Abstract: Techniques are described for laser-scribing a feature on a surface in relation to a reference feature on that surface, such as a feature created by a previous placement of the laser beam. In particular, using a laser beam focusing and deflection system to direct a laser scribing spot onto a surface through an optical path, an optical detection system provides reliable detection of the position of an existing feature on the surface as viewed through the optical path of the deflection system. Based on feedback provided from the detection system to the deflection system, the position of the laser beam may be modified through the deflection system in relation to the viewed feature to scribe a subsequent feature on the surface which tracks the existing feature in real time. A method of scribing to accomplish the objectives is also disclosed.

Abstract: A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features.

Abstract: A boroscope includes a working head having first and second ends. A first optical fibre extends through the boroscope to a position between the first and second ends. A second optical fibre extends through the boroscope to the second end of the working head. A laser optical fibre extends through the boroscope. At least one lens is arranged between the first end and the second end of the working head and a mirror is gimballed to the second end of the working head. The laser optical fibre directs laser light transmitted through the laser optical fibre onto the lens and then onto the mirror. A first LED is arranged at a position between the first end and the second end of the working head and a second LED is arranged at the second end of the working head and an actuator devices adjust the position of the mirror.

Abstract: A wafer is divided by setting the focal point of a laser beam inside the wafer at positions corresponding to division lines, thereby forming modified layers inside the wafer along the division lines. Each modified layer has a thickness ranging from the vicinity of the front side of the wafer to the vicinity of the back side of the wafer. An etching gas or an etching liquid is supplied to the wafer to erode the modified layers, thereby dividing the wafer into individual devices. The modified layers are not crushed, so fine particles are not generated in dividing the wafer. Accordingly, fine particles do not stick to the surface of each device and cause a reduction in quality. Further, since the modified layers are removed by etching, it is possible to prevent a reduction in die strength of each device due to the remainder of the modified layers.

Abstract: A laser annealing apparatus used in a crystallization process of an amorphous silicon thin film. The laser annealing apparatus includes a laser beam generation unit generating a laser beam, an optical system dividing the laser beam into a plurality of linear laser beams and including a focusing lens focusing the linear laser beams and projecting the focused linear laser beam on a substrate to be processed, and a focusing lens adjustment device adjusting a perpendicular distance and a rotation angle of the focusing lens relative to the substrate.

Abstract: A pulsed machining method for the optimized machining of a contour which is characterized in that the instantaneous frequency ratio of ? of the pulse frequency of tool fL and of the rotational frequency of tool fCNC is optimized to achieve a highest possible degree of coverage of the individual machining pulses in the context of a shortest possible machining duration and without a direct concatenation of the machining pulses. It is especially preferred that this be achieved in that frequency ratio ? is an irrational number, thus cannot be expressed by the ratio of two whole numbers. By applying the method according to the present invention, a considerable time savings is achieved since there is no longer a need for time-consuming preliminary trials to ascertain an at least sufficient frequency ratio ?.

Abstract: Methods of additive manufacturing a superalloy component are disclosed. In one method a powder bed of superalloy powder is selectively scanned with a focused laser beam in a line-by-line manner; and the spacing between adjacent scan lines is no more than twice the layer thickness being formed. In another method a compressive stress treatment is applied to the surface of the final component prior to separation of said component from the substrate. In a further method a superalloy component is formed on a substrate and the method includes Hot Isostatic Processing of the component wherein the mass of the substrate is reduced prior to the Hot Isostatic Processing. The methods may be combined in a multi-step process.