Abstract: A substrate support assembly and method for controlling the temperature of a substrate within a process chamber are provided. A substrate support assembly includes an thermally conductive body comprising a stainless steel material, a substrate support surface on the surface of the thermally conductive body and adapted to support a large area substrate thereon, one or more heating elements embedded within the thermally conductive body, a cooling plate positioned below the thermally conductive body, a base support structure comprising a stainless steel material, positioned below the cooling plate and adapted to structurally support the thermally conductive body, and one or more cooling channels adapted to be supported by the base support structure and positioned between the cooling plate and the base support structure. A process chamber comprising the substrate support assembly of the invention is also provided.

Abstract: A process module tuning method characterizes a process module by gathering data using a process condition measuring device to measure process outputs while inputs are excited. The data is used to identify a dynamic process model. The dynamic process model is then be used to determine process input settings that will produce desired outputs. For multi-zone process modules, the interactions between zones may be modeled.

Abstract: A heating device has a heating chamber 3. An initial temperature distribution is created in a surface of a substrate (wafer W) when the substrate is carried into the heating chamber 3 . . . . Temperature distribution creating means (heating lamps 2) creates a preheating temperature distribution in the substrate supported on a cooling plate 4 at a waiting position before the substrate is carried into the heating chamber 3 so as to level out the initial temperature distribution.

Abstract: A barbecue grill for cooking an object. The barbecue grill includes a first resistive element subassembly energizable for generating heat to cook the object, and a second resistive element subassembly energizable for generating heat to cook the object.

Abstract: A unitary-formed insulation jacket molded to be slidingly engaged around an exterior surface of a conventional baking oven muffle and a method of manufacturing the same. The insulation jacket is vacuum-formed from a slurry that includes high temperature refractory fibers, organic and inorganic binders and filler materials. The insulation jacket has a top wall, a bottom wall, opposing side walls and a rear wall that are substantially continuous and free of joints with each other. The top, bottom, sides and rear walls surround and define an interior cavity which is complementary shaped and sized to tightly fit around the exterior surface of the oven muffle. The walls of the insulation jacket are formed so as to be between ¼ inch and 2 inches thick and preferably are all 1 inch thick. The jacket may be provided with openings in any one of the walls which are complementary positioned to receive components, such as wiring that extends outwardly away from the exterior surface of the muffle, therethrough.

Abstract: A heating/cooling method, a manufacturing method of an image displaying apparatus, a heating/cooling apparatus, and a heating/cooling processing apparatus, in which the heating and cooling of a substrate can be executed at a high speed are provided.

Abstract: A light source including a plurality of flash lamps emits flashes thereby flash-heating a semiconductor wafer held by a thermal diffuser and a hot plate. The current distance of irradiation between the thermal diffuser and the hot plate holding the semiconductor wafer and the light source is so adjusted as to attain predetermined intensity of irradiation. The distance of irradiation between the thermal diffuser and the hot plate and the light source can be changed or corrected by vertically moving the thermal diffuser and the hot plate. The thermal processing apparatus which uses the flash lamps, is thus capable of readily controlling the intensity of irradiation.

Abstract: A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.

Abstract: In a thermal processing apparatus, using a lamp for heating a substrate, an opening is formed for a camera unit, which is used to image portions of an auxiliary ring supporting the substrate, to obtain the position of the center of the auxiliary ring. The camera further images the substrate to determine the center of the substrate before the thermal processing apparatus receives and places the substrate on the auxiliary ring. The thermal processing apparatus moves the substrate so that the center thereof coincides with the center of the auxiliary ring, and thereafter places the former on the latter. Thus, the auxiliary ring can be designed to reduce overlaps of the auxiliary ring and the outer edge of the substrate while overlaps can be uniform over the entire circumference of the substrate to improve temperature uniformity of the substrate.

Abstract: A method and apparatus for heating semiconductor wafers in thermal processing chambers is disclosed. The apparatus includes a non-contact temperature measurement system that utilizes radiation sensing devices, such as pyrometers, to determine the temperature of the wafer during processing. The radiation sensing devices determine the temperature of the wafer by monitoring the amount of radiation being emitted by the wafer at a particular wavelength. In accordance with the present invention, a spectral filter is included in the apparatus for filtering light being emitted by lamps used to heat the wafer at the wavelength at which the radiation sensing devices operate. The spectral filter includes a light absorbing agent such as a rare earth element, an oxide of a rare earth element, a light absorbing dye, a metal, or a semiconductor material.

Abstract: In accordance with certain embodiments, the present technique includes a system for sealing a lamp including a thermal shield and a thermally susceptible enclosure disposed adjacent the thermal shield. The thermal shield has a first receptacle adapted to receive a first portion of the lamp. The thermally susceptible enclosure comprises a wall about a second receptacle adapted to receive a second portion of the lamp. The wall has a varying thickness in a desired sealing region between the first and second portions of the lamp.

Abstract: A method and apparatus involve providing a supply of nitrogen gas, heating the supply of nitrogen gas to a temperature, and ejecting the heated nitrogen gas through the exhaust line of the baking chamber on a periodic basis. The temperature is between a temperature of the hot plate and a temperature that is less than a glass transition temperature of a film being treated.

Abstract: Provided is an electric oven. The electric oven includes a cavity having an electric component room, a light wave generating unit mounted on a top surface of the cavity, the light wave generating unit including a halogen heater emitting heat and light and a connector coupled to opposite ends of the halogen heater, and a heat discharge unit enclosing and cooling the connector.

Abstract: A food heating appliance is disclosed that comprises a chamber portion and a lid portion that defines a heating chamber. The chamber portion has a perimeter wall extending about the heating chamber and an upper opening into the heating chamber. The perimeter wall is insulated to permit walls are A heating apparatus in the heating chamber comprises a heating element positioned in the heating chamber adjacent to the perimeter wall, and a shield positioned above the heating element to block debris from falling on the heating element. The shield may be sloped downwardly from the perimeter wall toward a center of the heating chamber. A holding tray for smoking material may be positioned adjacent to the heating element. A drip collection tray may be positioned at the bottom of the heating chamber that influences air flow into the heating chamber. Temperature control circuitry provides precise, predictive heating of the food.

Abstract: A bake unit includes a cooling plate for cooling a substrate and a lift pin assembly for loading a substrate on the cooling plate. When a wafer is cooled on the cooling plate, a guide groove is formed at the cooling plate to allow a space between the wafer and the cooling plate to communicate with the exterior. Thus, an inner pressure of the space is maintained to be equal to an outer pressure thereof.

Abstract: An oven using radiant heat at infrared wavelengths optimized for producing rapid and uniform cooking of a wide variety of foods. The infrared oven toasts, bakes, broils, and re-heats food at a much faster speed while maintaining high quality in taste and appearance of the cooked food. Optimal infrared wavelengths of the radiant heat sources are used for the best balance of cooking performance, while also reducing the time required to cook the food. Typically short to medium wavelength infrared radiant energy will result in good performance for toasting and browning of food. Medium to long wavelength infrared radiant energy is well suited for delivering more deeply penetrating radiant energy into the food. This deep penetration of radiant infrared heat energy results in a more thorough internal cooking of the food than with conventional methods of conduction and convection cooking.

Abstract: In an embodiment, heat treatment equipment comprises a process tube, an exhaust duct connected to the process tube, and, during operation, exhausting gases present within the process tube. The heat treatment equipment also comprises a hollow pressure control member interposed between the process tube and the exhaust duct, the pressure control member being operatively connected to the process tube and the exhaust duct respectively, and including one or a number of openings. Negative pressure is avoided in the process tube during heat treatment processes so that unwanted gas and impurities cannot enter the process tube from outside.

Abstract: A food heating or cooking appliance has at least one electrical heating element within its interior that is adjustable in position so as to be able to be moved close to thin or small food items under the control of a manually actuated control. A separator plate that extends across the interior chamber of the appliance from side to side and from front to back is movable with the heating element to enable adjustment of the volumetric size of the cooking chamber containing the heating element and the food to be heated or cooked. A manual actuator, a knob or lever, for example, moves the heating element and the separator plate through a motion transfer bar that extends across the width of the appliance and is attached to a linkage on each side of the appliance to communicate movement to a pair of movable supports supporting the rod-like heating element at each of its ends and the separator plate at opposite edges.

Abstract: A heat treatment apparatus for use in batch heating/wafer processing is provided, which comprises a process chamber for receiving a wafer boat, at least a heating element comprising a substrate body configured to form an electrical heating circuit for at least one heating zone and encapsulated in a continuous overcoat layer, a heat reflector comprising a heat reflective surface disposed on the heating element, and the heating element has a ramp rate of at least 1° C. per second for heating the wafers in the wafer boat.

Abstract: A heating cooker (100) for heating to process an object placed on a mounting base of a heating chamber (51) including at least a single piece of a rod-like heater arranged along a face member forming the heating chamber (51) and a heat shielding member provided along a longitudinal direction of the rod-like heater between the rod-like heater and the face member (53a) on an outer side of the heating chamber (51).

Abstract: An apparatus for heating a thermoplastic film moving along a path has a radiant heater to one side and generally above the path directed at the film so that the heater heats the passing film, a reflector to an opposite side and generally below the path opposite the heater, and a coller connected to the reflector for cooling it to a temperature below a melting point of the film.

Abstract: A heating cooking device includes a housing having a wall portion; a first base material provided in at least a portion of the wall portion; and optionally a second base material formed on the first base material; a heat ray reflector formed on the conductive base material, including a first transparent conductive film formed on the first base material and a second transparent conductive film that is provided on the first transparent conductive film, where the second transparent conductive film has a higher heat resistance than that of the first transparent conductive film.

Abstract: A method and system for inductively coupling energy to a heating filament (7A?, 7B?, 7C?, 7A, 7B, 7C) in a thermal processing environment. By applying AC power to a coil antenna (11) and inductive coupling to a filament (e.g., a halogen lamp filament), a number of connections that are subject to fatigue is reduced, thereby increasing the reliability of the heater (2A, 2B). Such an environment can be used to process semiconductor wafers (3) and liquid crystal displays.

Abstract: A heater includes a heating member formed in a plate shape that includes a substrate-heating surface on which a substrate is mounted and a heating member rear surface which is on the opposite side of the substrate-heating surfaces. The heater also has a resistance heating element embedded therein. An auxiliary member is placed on the side of the heating member rear surface of the heating member and has an opposing surface which opposes the heating member rear surface. A planar gas path for gas ejected on the substrate-heating surface is formed between the heating member rear surface and the opposing surface.

Abstract: A vacuum thermal annealing device is provided having a temperature control for use with various materials, such as semiconductor substrates. A vacuum is used to remove air and outgas residual materials. Heated gas is injected planar to a substrate as pressure is quickly raised. Concurrent with the heated gas flow, a chamber wall heater is turned on and maintains a temperature for a proper annealing time. Upon completion of the annealing process, the chamber wall heater shuts down and air is forced around the chamber wall heater. Additionally, cool gas replaces the heated gas to cool the substrate.

Abstract: A method for manufacturing an image display panel includes the steps of heating a substrate for the image display panel having a different-emissivity member on at least a part of one surface of the substrate, with the member having an emissivity different from that of the substrate, and then placing a cooling plate opposite the heated substrate to absorb radiation heat from the substrate to cool the substrate. The cooling plate has a different-emissivity area in a pattern that can suppress a temperature distribution that may be created in the substrate if the substrate is cooled using a cooling plate with a uniform emissivity, with the different-emissivity area having an emissivity different from that of other areas.

Abstract: Disclosed is a baseball and/or softball bat warmer system. Each individual bat heater includes an elongated outer tubular member having a closed bottom surface. An inner tubular member is spaced inwardly from the outer tubular member forming a space therebetween. A radiation type heating element is positioned between the inner and outer members so that it extends around the barrel portion of the bat for even heating thereof. The system also utilizes a heat seal positioned on the upper portion of the outer tubular member to protect the handle and grip portion of the bat from excessive heat.

Abstract: Reflection intensities of a standard wafer with a known reflectance, a plain wafer on which no pattern is formed, and a semiconductor wafer to be processed practically are measured by using an optical measuring system. Their respective reflection intensities are subjected to spectral resolution processing. The optical energy value absorbed by the plain wafer is calculated from the reflection intensity of the standard wafer and the reflection intensity of the plain wafer. The absorbed optical energy value for the wafer is calculated from the reflection intensity of the standard wafer and the reflection intensity of the processing object wafer. Based on these, the optical energy absorption ratio of the processing object wafer to the plain wafer is calculated. From this optical energy absorption ratio and the optimum energy value of light irradiated to the plain wafer, the optimum energy value to be irradiated to the processing object wafer is calculated.

Abstract: A heating chamber which can be used during a reflow process to form a metal wiring having a multi-layered writing structure and a method of heating a wafer using the same, are provided. The heating chamber is movable upward and downward between the upper process position and the lower loading position, and includes a pedestal having a supporting surface for supporting a wafer, a cover installed above the pedestal to form a processing area together with the supporting surface when the pedestal is placed in its raised process position and a heating unit for heating the waver. In the method of heating the wafer, the temperature in the processing area is maintained suitable for heating the wafer before the wafer is loaded onto the supporting surface, the wafer is loaded onto the supporting surface and the loaded wafer is heating in the processing area.

Abstract: An oven for providing radiant and impingement heat to a food item. The oven includes a fan mechanism for drawing air around the radiant heat elements of the oven. The air is then delivered to an impingement tray located adjacent the food item. The air is forced through a series of apertures and onto the food item. At the same time the oven is also being heated by the radiant heat elements. This allows greater heat to be applied to specific locations on the food item. An external heat source is not required to heat the air as the air is heated by the existing radiant heat elements.

Abstract: A heater for the non-contact heating of an object, such as a substrate for material deposition, includes a housing defining a deposition cavity and a source of radiation outside the deposition cavity. A reflector is optically coupled to the source of radiation to collect the radiation and to focus it on the radiation path. The reflector may have different shapes. If, for example, the reflector is an ellipsoidal reflector, the source of radiation then is mounted in a first focus, the substrate is located in the other focus, and the radiation path is positioned on the main focal axis of the ellipsoidal reflector. The radiation from the source of radiation is delivered to the substrate inside the deposition cavity through a radiation path(s) formed in the housing wall to heat the substrate to the temperature Ts, so that T1<Ts<T2, where T1 is the temperature of the housing wall, while T2 is the effective temperature of the source of radiation.

Abstract: An apparatus and method for uniformizing the temperature distribution across a semiconductor wafer during radiation annealing of process regions formed in the wafer is disclosed. The method includes forming a silicon layer atop the upper surface of the wafer and irradiating the layer with one or more pulses of radiation having wavelengths that are substantially absorbed by the silicon layer. The silicon layer acts to uniformly absorb the one or more radiation pulses and then transfers the heat from the absorbed radiation to the process regions across the wafer.

Abstract: An apparatus and a method for controlling the temperature of a substrate during substrate processing. The apparatus comprises a substrate table having a thermal surface supporting the substrate. The apparatus also comprises a first thermal assembly arranged in the substrate table and comprising a plurality of thermoelectric modules, each of the plurality of thermoelectric modules having a thermoelectric surfaces such that the plurality of thermoelectric modules defines a plurality of thermoelectric surfaces. In this apparatus, the plurality of thermoelectric surfaces is in thermal communication with the thermal surface and includes various shapes of thermoelectric surfaces, and the plurality of thermoelectric surfaces is configured to substantially completely underlie the thermal surface.

Abstract: The invention is a method of determining a set temperature profile of a method of controlling respective substrate temperatures of plurality of groups in accordance with respective corresponding set temperature profiles. The invention includes a first heat processing step of controlling respective substrate temperatures of a plurality of groups in accordance with respective predetermined provisional set temperature profiles for first-batch substrates that are classified into the plurality of groups, and of introducing a process gas to conduct a heat process to form films on the substrates; a first film-thickness measuring step of measuring a thickness of the films formed on the substrates; and a first set-temperature-profile amending step of respectively amending the provisional set temperature profiles based on the measured thickness, in such a manner that a thickness of films formed during a heat process is substantially the same between the plurality of groups.

Abstract: A wafer processing method for use with a wafer processing apparatus having a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto the liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck. The method enables performance of wafer processing while letting a wafer be mounted on the ceramic plate by a wafer transport. The method includes causing the wafer transport to transport the wafer onto the ceramic plate, pre-heating the wafer while the wafer is held on the ceramic plate for a predetermined length of time, and mounting the preheated wafer on the ceramic plate.

Abstract: A method and apparatus for heating semiconductor wafers in thermal processing chambers. The apparatus includes a non-contact temperature measurement system that utilizes radiation sensing devices, such as pyrometers, to determine the temperature of the wafer during processing. The radiation sensing devices determine the temperature of the wafer by monitoring the amount of radiation being emitted by the wafer at a particular wavelength. In accordance with the present invention, a spectral filter is included in the apparatus for filtering light being emitted by lamps used to heat the wafer at the wavelength at which the radiation sensing devices operate. The spectral filter includes a light absorbing agent such as a rare earth element, an oxide of a rare earth element, a light absorbing dye, a metal, or a semiconductor material.

Abstract: A method of effecting high temperature vacuum heating and cooling suitable for conducting heat treatment to be performed on components used in a display apparatus. The heating/cooling method includes the steps of: heating a plate-like member placed in a reduced pressure atmosphere in a chamber by heating means opposed to the plate-like member; and cooling the plate-like member by a cooling plate which is opposed to the plate-like member, with the heating means therebetween, the cooling plate having a heat reflecting function. The cooling plate has an emissivity of not less than 0.50 but not more than 0.80 so as to minimize a sum of a requisite time for the heating step and a requisite time for the cooling step.

Abstract: A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.

Abstract: A rapid thermal processing (RTP) system including a transmission pyrometer monitoring the temperature dependent absorption of the silicon wafer for radiation from the RTP lamps at a reduced power level. A look-up table is created relating unnormalized values of photodetector photocurrents with wafer and radiant lamp temperatures. A calibrating step measures the photocurrent with known wafer and lamp temperatures and all photocurrents measured thereafter are accordingly normalized. The transmission pyrometer may be used for closed loop control for thermal treatments below 500° C. or used in the pre-heating phase for a higher temperature process including radiation pyrometry in closed loop control. The pre-heating temperature ramp rate may be controlled by measuring the initial ramp rate and readjusting the lamp power accordingly. Radiation and transmission pyrometers may be included in an integrated structure with a beam splitter dividing radiation from the wafer.

Abstract: A method, apparatus, and system including a reflecting device having a plurality of reflecting zones with associated reflectivities for reflecting light from a flash lamp, are described herein.

Abstract: The present invention is a thermal processing unit that includes: a tubular processing container; an object-to-be-processed holding unit that holds a plurality of objects to be processed in a tier-like manner and that can be inserted into and taken out from the processing container; a process-gas introducing unit that introduces a predetermined process gas into the processing container; a heating unit provided in the processing container, the heating unit heating the plurality of objects to be processed held by the object-to-be-processed holding unit when the object-to-be-processed holding unit is inserted into the processing container; and a container cooling unit that cools an outside wall surface of the processing container.

Abstract: A light irradiation heat treatment apparatus and method may use a plane-shaped light irradiation heating component, facing one surface of a workpiece supported in a furnace, to raise the temperature of the workpiece. The temperature of the workpiece is raised by setting an intensity distribution for light irradiated from the light irradiation heating component in accordance with the resistivity of the workpiece. Thereafter, the workpiece is irradiated with light having the set light intensity distribution to raise its temperature.

Abstract: Flash lamp apparatuses that generate electromagnetic radiation with wavelengths greater than and/or less than a defined range of wavelengths are disclosed.

Abstract: A chamber has a wall surface fitted with a liner. The liner is removably provided to the chamber with no fixed relation therebetween. By simply opening a light source to remove a heat diffusion plate, a hot plate and a tubular member from the chamber, the liner can be easily detached accordingly from the chamber. When a semiconductor wafer cracks to litter the chamber with its fragments, the chamber can be easily cleaned by simply detaching the liner. The liner has an outer surface subjected to surface roughening by honing. When a flash lamp emits flashlight of considerably high intensity, the roughened outer surface of the liner serves to block this flashlight. As a result, the metal surface inside the chamber is prevented from being exposed to the flashlight emitted from the flash lamp.

Abstract: A heating stage according to the present invention comprises a flat stage portion on which a work piece is placed, a glass section having cylindrical portion in which two or more lamps are disposed as a heating unit, and a metal section having a cylindrical portion and a bottom portion forming an inner space by fixing the metal section and the glass section integrally wherein the inner space is under reduced pressure, and inert gas is filled.

Abstract: A processing system for thermally treating a substrate including a temperature controlled thermal treatment chamber and a temperature controlled substrate holder for supporting a substrate for thermal treatment. The substrate holder is thermally insulated from the thermal treatment chamber. A method for thermally treating a substrate is also provided.

Abstract: A heat treatment apparatus enables a rapid temperature rise of an object to be processed while giving an excellent economical efficiency. A heating unit heats an object to be heated by irradiating a light onto the object. A plurality of lamps are provided in a lamp house. The lamps include at least one first lamp and a plurality of second lamps each having an irradiation area smaller than that of the first lamp. The lamp house has a first lamp accommodation part at a center thereof and a second lamp accommodation part surrounding the first lamp accommodation part so that the first lamp accommodation part accommodates the first lamp and the second lamp accommodation part accommodates the second lamps.

Abstract: A magnetic ring of ferromagnetic is attached to a wire for supplying electric power to a flash lamp. The magnetic ring is removable and is easily attachable to and detachable from the wire. When turning on the flash lamp, a high electrical current momentarily flows through the wire and intense magnetic fields occur around the wire, so that the magnetic ring attached around the wire is momentarily magnetized. As the result, induced electromotive force is generated and the current momentarily flowing through the wire is weakened, so that the irradiation intensity of the flash lamp is slightly lowered. In contrast, if desired to slightly increase the irradiation intensity of the flash lamp, the magnetic ring may be detached from the wire.

Abstract: The present invention comprises a fully automated, fabrication compliant furnace with the advantages of the horizontal and most of the advantages of the vertical furnace. One embodiment of the present invention is that it implements a multi-degree motion robot arm to move wafers from a loading area to a WIP station where the wafers are then loaded into wafer boats on a rotating cantilever system or directly onto a specialized and reconfigurable paddle designed to hold wafers. The wafers may be loaded in the horizontal processing position as well as the vertical processing position. Multiple levels of the semi-toroidal horizontal processors allow for multiple batches of wafers to be loaded, processed, cooled and unloaded by the robot arm. The present invention reduces the footprint of the traditional horizontal or vertical furnaces, increases capacity and throughput, and allows for direct tube transfer.

Abstract: A radiant heating arrangement with a high infrared heating capacity for treatment chambers provides a vacuum-compatible radiant heating system with which it is possible to achieve considerable radiation levels reliably. The radiant heating arrangement includes a tube that is permeable to infrared radiation. The tube extends into the treatment chamber and penetrates the wall of the chamber with at least one end. A source of infrared radiation is situated inside the tube with the inside of the tube being isolated from the atmosphere inside the treatment chamber.