Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

Abstract: A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portions of the substrate, a developer developing said photosensitive layer to form apertures in the photosensitive layer at the defined regions, and a solder applicator applying a solder composition to the apertures to define solder bumps on the integrated circuit at selected portions thereof.

Abstract: A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portions of the substrate, a developer developing said photosensitive layer to form apertures in the photosensitive layer at the defined regions, and a solder applicator applying a solder composition to the apertures to define solder bumps on the integrated circuit at selected portions thereof.

Abstract: The invention relates to an aluminium extrusion alloy comprising in weight percent: Mn 1.0-1.4, Cu 0.2-2.0, Mg 0.1-0.6, Si 0.15-1.0, Fe 0.8 max., Zn 0.25 max., Ti 0.15 max., Cr 0.35 max., Zr and/or V in total 0.25 max., others up to 0.05 each, total 0.15, balance aluminium, and with the proviso that (Cu+Mg)>0.7, and which aluminium extrusion alloy is particularly suitable for application in brazed assemblies, and the invention further relates to a method of its manufacture.

Abstract: A design is disclosed for promoting the formation of weld between a first member and a second member whereby a fin is introduced at the outer corner portion of the first member to minimize the creation of defects such as runout or rollover. While such a design is applicable to any industrial welding operation, this design is of particular interest for welding bases or bit blocks holding cutting bits onto rotatable drums, wheels or chains used in construction or mining operations.

Abstract: A solder bumping method and structure for fine solder bump pitches. The method makes use of a semiconductor device having an input/output pad whose surface is provided with a solderable metal layer that serves as the UBM of the solder bump. A sacrificial layer is formed on the surface of the device to surround the metal layer. A plating seed layer is then formed on the metal layer and the surrounding surface of the sacrificial layer, after which a mask is formed on the seed layer and a via is defined in the mask to expose portions of the seed layer overlying the metal layer and the sacrificial layer. A solder material is deposited on the seed layer exposed within the via. The mask is then removed, followed by removal of a portion of the seed layer that is not covered by the solder material, leaving intact that portion of the seed layer beneath the solder material.

Abstract: The present invention relates to the use of a peelable anti-solder mask as a sealant against potting compound. In certain electrical apparatus, a modular component (300) must be attached to a side of a printed circuit board (PCB) (110) which has previously been exposed to solder. Solder ‘pick up’ is prevented by application of a removable mask (202) over areas of the exposed side of the PCB (110) which will receive the modular component (300). Potting compound is used to protect components of electrical circuits (108) from vibration, moisture and static discharges. The anti-solder mask (202) can be used as a thin gasket to prevent the ingress of potting compound between the modular component (300) and the PCB (110).

Abstract: An epoxy-based soldering flux is used to solder a flip-chip IC device to a metallic bond site on a substrate material. The soldering flux is composed of a thermosetting epoxy resin and a cross-linking agent with inherent flux activity. When heated the cross-linking agent cleans the metal oxides from the metal surfaces on the chip and then reacts with the epoxy resin to form a thermosetting epoxy residue. The flux residue left on the board after soldering does not inhibit the flow of an underfill encapsulant. The underfill binds to the thermosetting residue of the flux which increases adhesion strength preventing delamination of the chip during thermal cycling.

Abstract: A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.

Abstract: A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. A reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. The mask and excess solder paste are removed.

Abstract: The present invention provides a conductive element having good solderability and the manufacturing method thereof. A metal wire having a circular section and tin-plated along its whole circumference is prepared and pressed by a pressing machine from the side directions until the metal wire becomes almost flat. By this, a strip of thin plate-like member is formed. Then, a conductive silicone base adhesive is applied to one surface (one pressed surface) of the plate-like member and dried. Thus, the conductive element comprising the plate-like member and the conductive elastomer joined to the pressed surface thereof is obtained.

Abstract: A method for assembling electronic devices including a plurality of soldering pads for soldering contacts of electronic devices, and at least an insulated zone neighboring at least one of the soldering pads, from which soldering paste is extendible to at least a portion of the insulated zone while applying soldering paste. The method includes the steps of applying soldering paste onto at least a portion of the soldering pads allowing the soldering paste to extend outwardly from at least one soldering pad to locations not in contact with other soldering pads or traces, or to at least a portion of an insulated zone neighboring the soldering pad; and soldering contacts of electronic devices to the circuit board having the portion of soldering pads including the at least one soldering pad.

Abstract: A design is disclosed for promoting the formation of weld between a first member and a second member whereby a fin is introduced at the outer corner portion of the first member to minimize the creation of defects such as runout or rollover. While such a design is applicable to any industrial welding operation, this design is of particular interest for welding bases or bit blocks holding cutting bits onto rotatable drums, wheels or chains used in construction or mining operations.

Abstract: A stencil (34) facilitates application of solder material (48) to a circuit board (10) carrying a through-hole component (14, 16, 18, 20, 22) and to which a surface mount component is to be mounted. The stencil (34) has a first surface (38) and a second surface (40). The second surface (40) is engageable to a surface (28) of the circuit board (10) having a plurality of electrically conductive pads (30, 32). At least one first aperture (42) is formed between the first and second surfaces (38, 40)of the stencil (34). The stencil (34) has a first thickness (T1) adjacent the first aperture (42) for depositing a first amount of solder material (48) within the first aperture (42) and around a component lead (24) extending from the through-hole component (14, 16, 18, 20, 22) into the first aperture (42). At least one second aperture (44) is formed between the first and second surfaces (38, 40) of the stencil (34).

Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections.

Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

Abstract: In method for soldering metal microstructured plates, stacks of plates and solder layers are prepared by placing the solder layers between each adjacent plate. The thickness of the solder layers range from 3 to 25 &mgr;m. The stack is then soldered by heating it in a vacuum or an inert atmosphere.

Abstract: A method and assembly for preserving solder connections of components mounted on a thin laminate circuit board during wave soldering of leaded components to the circuit board. The method generally entails supporting the circuit board on a pallet with pedestals that contact the surface of the circuit board directly opposite surface-mount components on the board. The pallet also includes an access directly opposite leaded components assembled to the board so that their leads are exposed. The pallet and board assembly are then placed on a wave soldering apparatus and wave soldered while applying and maintaining a force to the circuit board that ensures contact between the pedestals and the surface of the board opposite the surface-mount components, so that the leads of the leaded components are soldered to the circuit board.

Abstract: By the use of a heat exchanger tube not required for adhesion of Zn in advance and a fin not clad with a brazing composition, a heat exchanger core is provided which has corrosion resistance and brazing capability comparable to or higher than those of the conventional counterpart. Applied onto an outer surface of an extruded flattened tube as a heat exchanger tube is a brazing composition derived from a mixture of silicon and fluorine type flux, and a fin formed of an aluminum-based zinc-containing material is prepared. The extruded flattened tube and the fin are then heated at a given temperature so that the same are brought into brazed relation to each other, and a mixed diffusion layer of silicon and zinc is then on the outer surface of the extruded flattened tube.

Abstract: Brazing or soldering materials which effectively improve the wettability of the brazing alloy or solder without using flux and a method of manufacturing such materials are provided. A metallic base is placed on turntable inside a vacuum chamber. A copper target is affixed to a sputtering electrode above the metallic base. Air is removed from the vacuum chamber through a vacuum outlet to increase the vacuum therein to a specific pressure, and carbon tetrafluoride and argon are introduced from a gas inlet to control the sputter pressure. Thereafter, turntable is rotated while a high frequency voltage is applied between the target and the metallic base to form a halide layer, such as a layer of copper fluoride, on a surface of metallic base.

Abstract: Disclosed is a method of preventing a gold plate connector of a printed circuit board (PCB) from being contaminated during a soldering process. The disclosed method prevents the gold plate connector coupled with the printed circuit board from being contaminated during wave soldering of the printed circuit board after spreading flux over the printed circuit board on which electronic components are mounted, and the method includes the steps of: forming a strip mask in a form of a membrane by solidifying a masking solution after spreading the masking solution capable of being solidified over the gold plate connector of the printed circuit board, performing the spreading of the masking solution before the spreading of the flux; and removing the strip mask from the gold plate connector after performing the wave soldering. As a result, it is not necessary to perform a washing operation of the gold plate connector. The washing operation can be troublesome, time-consuming, and inconvenient.

Abstract: The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic surface at second area distant from the device. The furnace comprises a frame, a support, a heater, and a shield. The support is secured to the frame and is capable of holding the printed circuit board. The heater is secured to the frame and is capable of heating the printed circuit board while being held by the support. The shield is secured to the frame and is positioned to prevent solder from migrating from the first area to the metallic surface at the second area while the printed circuit board is being heated.

Abstract: A method for depositing corrosion and wear resistant high alloy overlayers on industrial component substrates. Dilution of alloying components from out of the overlayer into the substrate is minimized by use of electroslag surfacing onto horizontally positioned surfaces of the substrate using oscillating wire.

Abstract: A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.

Abstract: An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed pattern of strokes thereby overcoming the surface tension of the flux/substrate surface. The programmed pattern of brush strokes is determined empirically for the specific combination of substrate and chip that is being assembled and is thus repeatable and operator independent. The empirically determined program also determines the amount of flux that will be applied to the substrate for the specific combination of substrate and chip being assembled. The empirically determined program is applied to a mechanical stage that moves the brush and to a flux reservoir by a CPU.

Abstract: A method of applying molten solder to connection surfaces on a substrate. The substrate, which has a surface which can be wetted with solder or at least one area which can be wetted while the rest cannot, is immersed in an organic liquid medium whose boiling point is the same as or above the melting point of the solder. Solder is applied to the surface or the area on the substrate where a terminal is to be formed to produce a solder bump, the quantity of solder to be placed on the connection surface is in the liquid medium, at least at the moment when it makes contact with the surface, and the temperature of the liquid medium is at or above the melting point of the solder.

Abstract: A method for repairing and joining aluminum alloy articles and structures, such as heat exchangers for use in automotive applications. The method utilizes a flux-coated soldering rod (10) that is used to deliver a solder alloy (12) and a flux compound to a region to be repaired. The flux compound has a higher melting temperature than the solder alloy (12), and is present as a coating (14) that sufficiently thermally insulates the alloy (12) to cause the flux compound and the solder alloy (12) to melt nearly simultaneously during the soldering operation. The solder alloy (12) is preferably a zinc-aluminum alloy, while the flux coating (14) preferably contains a cesium-aluminum flux compound such as potassium cesium tetrafluoroaluminate, dispersed in an adhesive binder that will readily volatilize or cleanly burn off during the soldering operation.

Abstract: A pipe coupling joins together adjacent metal pipe segments. The pipe coupling includes a hollow metal body having first and second open ends adapted for receiving respective proximal ends of the adjacent pipe segments. At least one solder groove is formed along an inside surface of the body. A solder alloy is embedded in the solder groove, and is adapted to flow between the body and the adjacent pipe segments when heated. Upon subsequent cooling, the solder alloy joins the adjacent pipe segments and coupling together.

Abstract: The object of the invention consists of a process through which containing metal structures are built and shaped, in one case using steel sheets pre-protected by paints, and made to be electrically conductive by adding aluminium powder, or other equivalent conductive metals having a fusion temperature which is equivalent to the one fusing the sheets to be welded, and whose boiling temperature is higher than their fusion one; in a second case using sheets pre-protected by a thin layer of zinc plating followed by an external film of acrylic resin; it also consists in resorting to the aid of anthropomorphic welding robots, at the end of whose mobile arm is placed the laser beam out put unit connected to the laser source by an optical fibre cable, and also in the fact that the welding is carried out on the internal not visible sides of the containing structures that are being built.

Abstract: So that the brazing of aluminium parts with the use of a flux can be made effectively without employment of a corrodible metallic muffle, furnace inner walls made of carbonaceous refractory sheets are utilized as a brazing space, and an inert atmosphere supplied into this space is protected from the air by furnace outer walls which are made of steel sheets to form a furnace shell and which are made hermetical against the air.

Abstract: A scale formation-inhibitory agent used in a welding treatment comprises a polymer selected from the group consisting of polymers having oxygen atoms in the main chain and polymers capable of being thermally depolymerized. The scale formation-inhibitory agent can inhibit the formation of scale on the surface of a metal part to be welded during a welding treatment.

Abstract: A zone of corrosion-resistant material covering a friction stir welded joint surface is provided by applying a layer of corrosion-resistant material over one or both surfaces of the workpieces being joined so that the layer covers at least the weld zone which will be rendered plastic during a friction stir welding operation. The corrosion-resistant material layer is contacted by the friction stir welding tool, and the tool causes shearing and plastic flow of the corrosion-resistant material along the surface of the welded joint. The corrosion-resistant material thus metallurgically bonds with portions of the plasticized metal so as to form a corrosion-resistant zone protecting the welded joint from exposure to corrosive environments.

Abstract: The invention relates to a method for joining coated metallic conductors and the application of the method to production of very high density microjoints as well as to the fabrication of macrojoints. It is characteristic for the invention that the surfaces to be connected are coated with solder metal or solder alloy layers, one on the top of the other. The mating contact areas are heated for a short period of time over the temperature where the base coatings and the top coatings fuse transiently. It is essential that the base coating and the top coating cannot produce intermetallic compounds with each other and that the contact interface between them is as metallic as possible. This kind of contact can be obtained for example by chemical or electrochemical deposition. Moreover, when the topcoat is capable of protecting the base coating, for example bismuth, the joining can be performed under normal atmosphere and without any flux.

Abstract: An integrated solder preform array is composed of a metal or metal alloy suitable for use in a soldering or bonding process. The preform includes a series of discrete solder islands disposed in a desired matrix. Each island contains a hole for receiving a pin, and bridging strands for joining each of said islands in a matrix. The bridging strands are formed of the same solder material as the islands, with the solder preform containing a substantially uniform coating of tin over its entire outer surface for the purpose of improving solder wetting and therefore elimination of unwanted shorting of circuits and other electrical components being soldered.

Abstract: Each microminiature contact pad included in a dense array of pads on an electronic component contains a relatively thick layer of solder. The layer is treated to form a relatively thin brittle protective layer on the surface of the solder. The structure is then brought into contact with a contact pad in a mating array of pads on another component in a thermo-compression bonding step carried out below the melting point of the solder. In that step, the brittle layer is fractured. As a result, solid-state diffusion of conductive material occurs through fissures in the fractured layer, thereby to provide an electrical connection between mating pads on the two components.

Abstract: A method of brazing aluminium parts with a solder of a melting point of 500-630.degree. C. and a flux of a melting point of 550-500.degree. C., the brazing being made by successively heating them at a comparatively low temperature of 580-660.degree. C. under an inert gas atmosphere filled in an elongated muffle which is made of carbon, graphite or carbon fibre-reinforced carbon, wherein the muffle which contributes to keep the atmosphere at a high purity shall not be damaged by the flux liquidized with the heating of the parts, and wherein carbon of the muffle works to keep the atmosphere inert whereby the flux itself is also prevented from oxidation.

Abstract: A valve, which has heat-sensitive parts, has at least one connecting tube to which a pipe is arranged to be soldered using local heating. The connecting tube consists of a material of such low thermal conductivity that the heat-sensitive parts remain below the limit temperature as the heat required for soldering is applied. No cooling measures are therefore needed while the pipe is being joined by soldering.

Abstract: An internally mounted, portable clamping device for preventing distortion during welding of branch fittings on thin walled pipe. The clamping device comprises a pair of generally arc-shaped clamp halves which are inserted into a pipe and engaged by a screw inserted through a branch fitting which has been tack-welded to the outer surface of the pipe. Turning the screw in one direction moves the clamp halves radially apart until they engage and apply a radially tensive force on portions of the inner surface of the pipe immediately adjacent and opposite the fitting, thereby preventing the pipe from distorting during finish-welding of the fitting. The clamp is disengaged by turning the screw in the opposite direction.

Abstract: The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsaturated organic acid according to the Diels-Alder reaction in an aqueous solvent. A volatile basic agent may further be contained in the flux.

Abstract: A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coefficient of thermal expansion; providing a block fabricated from a third material having a coefficient of thermal expansion; positioning the block on one side of the backing plate; positioning the target on the other side of the backing plate; and subjecting the target, backing plate and block to elevated temperature and pressure to bond the target, backing plate and block together. The third material is selected so as to have a coefficient of thermal expansion which counteracts the effects of the coefficients of thermal expansion of the first and second materials. The third material may be selected so as to have a coefficient of thermal expansion which is approximately the same as the coefficient of thermal expansion of the first material.

Abstract: A friction welding apparatus and a method for its use is disclosed where the apparatus includes a plurality of interchangeable components including a drive means, an actuator assembly, a support system and a control system, the combination operable to friction weld a workpiece to a valve body. The apparatus features a means to maintain a positive fluid pressure within the weld chamber during burn-off and upset phases. Such a means is provided to keep out explosive gases emitted by one of the members being welded. The apparatus features a means to maintain a positive fluid pressure within the weld chamber during burn-off and upset phases. Such a means is provided to keep out explosive gases emitted by one of the members being welded.

Abstract: An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board). The assembly's projecting conductive leads are soldered. An encapsulant material (e.g., polymer resin) is used to provide reinforcement for the solder-lead connections, the encapsulant material being dispensed only along opposing sides of the package's housing which do not include projecting leads (and which are oriented substantially normal to the stresses imposed on the package during operation wherein high temperatures are attained). This dispensing may follow solder reflow and solidification. The invention is particularly useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

Abstract: To weld a flat conductor to another bonding member reliably without leaving a welding scar, a conductive protective member, such as copper plate or the like, with a higher strength than that of a low strength conductive member is placed between the low strength conductive member such as a flat conductor and the horn tip or the anvil to perform welding with the low strength conductive member sandwiched between the protective member and another bonding member such as stranded conductor or the like.

Abstract: In a bonding station the parts of the apparatus to be bonded are retained at a thermal bias temperature at a permitted level and a thermal check valve interface is provided between the bonding location and the part of the station that would serve as a conduction heat sink, thereby thermally insulating other uninvolved parts of the structure and and confining the bonding heat to the bonding region. Such confinement reduces the dwell time that the bond must remain at the bonding temperature. The bonding station has a number of features: the parts to be bonded are maintained on a support member that is provided with a heat biasing capability that can establish the assembly at a specified temperature; a retention capability, such as the use of vacuum, is provided to maintain registration and thermal contact of the part with the support; and a thermal check valve capability is provided to control the rate of heat flow through the support member so that locallized heat is controlled in dissipation.

Abstract: Electroplated steel sheet suitable for soldering is provided herein by coating the plated steel sheet with a post-treatment solution in the range of 0.02 to 2 .mu.m in dry thickness. The post-treatment solution contains from 2 to 100 g/l of at least one water-soluble or water-dispersed material. The post-treatment solution may further contain chromium ion, hereafter referred to as Cr.sup.6+, from 0.01 to 3 g/l, and/or organic amine soap from 10 to 100 g/l. A suitable pH value of the post-treatment solution is from 3 to 10.

Abstract: Special alloys of the kind responding to the formula of 95% Sn 5% Sb or 52% Sn 45% Pb 3% Sb having a melting point greater than 183.degree. C. are used in one of the preferred embodiments of the invention within this application as a first improvement in the welding of printed circuit boards. These alloys improve the quality of welding, as well as its influence on the long-term running of a service box, to the same as the life span of a car.

Abstract: An outer-lead bonding apparatus according to the present invention comprises:(1) a punching die to stamp out chips from a film carrier tape,(2) a mounter to mount TAB chips on a substrate,(3) a first cover to enclose the mounter,(4) a second cover to enclose the punching die,(5) a pressure regulator to supply higher air pressure than outer air into inside space of the first cover, and(6) a exhaust to exhaust air from inside space of the second covering means. The outer-lead bonding apparatus of this invention keeps the environment around the mounter clean with air supplied from a pressure regulator and also by exhausting the air polluted by the punching operation through the exhaust. Neither products nor outer environment is thus contaminated.

Abstract: A method of applying a tacking agent to a printed circuit board. The printed circuit board (10) has a number of solder pads (12), and each solder pad is preclad with a layer of solder (14) between 0.02 and 0.3 mm thick. A plastic film (16) is temporarily adhered to the printed circuit board by a pressure sensitive adhesive. The plastic film has a number of apertures (22) that correspond to the solder pads, and is positioned so that the apertures in the film expose the solder coated pads. There is a breakaway tab (20) on the plastic film that is used to peel the film from the printed circuit board in a later operation. The film is roller coated with a high viscosity tacking agent (30) so that a layer of the tacking agent is applied to the exposed interconnect pads. The plastic film is then peeled cleanly away from the printed circuit board using the breakaway tab, leaving the tacking agent only on the solder pads.

Abstract: A printed-circuit substrate is provided with: a film-shaped support base having an electrical insulating property and elasticity, which includes a resin mold section for supporting an IC; a plurality of foil-shaped electrodes which are connected to the IC and supported by the support base in such a manner as to extend toward the periphery of the support base; and an exposed portion which is provided by removing the support base in the direction orthogonal to the foil-shaped electrodes over an entire area of the support base between the IC chip and the periphery thereof so as to expose one portion of each foil-shaped electrode. In the case of connecting the foil-shaped electrodes to electrodes of a printed-circuit substrate by means of soldering, the tips of the foil-shaped electrodes are soldered to the respective electrodes by applying heat and pressure to a part of the support base located on the tip-side of the exposed portions of the foil-shaped electrodes.

Abstract: An electric cable is soldered to an electronic circuit board by sticking the heat-resistive adhesive tape on the end portion of the insulating ocating and the end portion of the core conductor of the cable, and melting solder by contacting the heater tip on the heat-resistive adhesive tape. Therefore, the coating of the electric cable is prevented from being peeled off when heated and the heater tip is free from solder dregs.